A power management chip with an active cooling mechanism

Abstract

This utility model relates to a power management chip with an active cooling mechanism, belonging to the field of chip cooling technology. The power management chip with an active cooling mechanism includes: a chip, which is disposed on one side of a motherboard and fixedly connected to the motherboard; and a cooling and heat dissipation mechanism for actively cooling the chip. The cooling and heat dissipation mechanism includes a cooling plate disposed on the top of the chip, and a heat dissipation component disposed on the outer side of the cooling plate. The cooling plate, disposed on the top of the chip, acts as a heat conduction medium, efficiently conducting the heat generated during chip operation to the heat dissipation component, forming a stable heat dissipation path. When the chip temperature reaches a set threshold, the active cooling mechanism is activated, improving instantaneous heat dissipation efficiency and ensuring stable chip operation under high load conditions. A protective component is disposed on the outside of the heat dissipation component to prevent dust and foreign objects from entering, ensuring long-term efficient operation of the heat dissipation system.

Description

Technical Field

[0001] This utility model relates to the field of chip cooling technology, and in particular to a power management chip with an active cooling mechanism. Background Technology

[0002] Power management chips, as key components in electronic devices used for voltage regulation, power distribution, and voltage stabilization, are widely used in mobile terminals, communication equipment, industrial control, and automotive systems. With the increasing integration and power density of electronic products, the heat generated by power management chips during operation increases significantly, necessitating the use of heat dissipation components to cool the chips.

[0003] Currently, common heat dissipation methods mainly include natural heat dissipation and passive heat dissipation, such as using PCB copper foil to draw heat and heat sinks to conduct heat to reduce chip temperature. However, due to factors such as small chip package size, compact surrounding space, and overall power consumption limitations of the device, these traditional heat dissipation methods are no longer sufficient to meet the heat dissipation requirements of medium and high power chips during continuous operation or under high ambient temperatures. Utility Model Content

[0004] Therefore, it is necessary to address the common heat dissipation methods, which mainly include natural and passive heat dissipation, such as heat conduction through PCB copper foil and heat sinks, to reduce chip temperature. However, due to limitations such as small chip package size, compact surrounding space, and overall device power consumption, these traditional heat dissipation methods are insufficient to meet the heat dissipation requirements of medium- and high-power chips under continuous operation or high ambient temperatures. Therefore, a power management chip with an active cooling mechanism is provided, comprising: a chip disposed on one side of a motherboard and fixedly connected to the motherboard; and a cooling mechanism for actively cooling the chip; wherein the cooling mechanism includes a cooling plate disposed on the top of the chip, a heat dissipation component disposed on the outer side of the cooling plate, and a protective component disposed on the outer side of the heat dissipation component.

[0005] The heat dissipation assembly includes a contact groove formed on one side of the cooling plate, the contact groove being located on the side of the cooling plate closer to the chip, and the cooling plate being sleeved on the outside of the chip through the contact groove.

[0006] The cooling plate is fixedly mounted on the outside of a fixed frame, which is located on top of the cooling plate. A cooling fan is fixedly mounted inside the fixed frame, which is also located on top of the cooling plate.

[0007] A guide frame is fixedly installed inside the fixed frame. The guide frame is located between the cooling fan and the cooling plate. One side of the guide frame is in contact with the cooling plate. A temperature sensing element is fixedly installed inside the guide frame.

[0008] Multiple fins are provided on both sides of the guide frame, one side of each fin is in contact with the cooling plate, and each fin is fixedly connected to the fixed frame.

[0009] The surfaces of the multiple fins are provided with ventilation holes, which are configured as strip-shaped holes.

[0010] The protective component includes a placement slot formed at the top of the fixed frame, and a filter plate is fixedly installed inside the placement slot.

[0011] A support frame is fixedly installed at the bottom of the placement slot, and the support frame is configured in a cross shape.

[0012] Beneficial effects

[0013] 1. A cooling plate is positioned on top of the chip, serving as a heat conduction medium to efficiently transfer the heat generated during chip operation to the heat dissipation components, forming a stable heat dissipation path. When the chip temperature reaches a set threshold, an active cooling mechanism is activated to improve instantaneous heat dissipation efficiency and ensure stable chip operation under high load conditions. Protective components are located on the outside of the heat dissipation components to prevent dust and foreign objects from entering, ensuring the long-term efficient operation of the heat dissipation system.

[0014] 2. The filter plate is installed inside the placement slot, which can effectively filter impurities in the air without affecting the air intake of the cooling fan, prevent dust from entering the cooling fan and guide frame, avoid airflow blockage or fan jamming, and at the same time, it does not affect the cooling effect and electrical connection of the chip. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the cooling and heat dissipation mechanism of this utility model;

[0018] Figure 3 This is a schematic diagram of the contact groove and cooling plate structure of this utility model;

[0019] Figure 4 This is a schematic diagram of the guide frame and fin structure of this utility model;

[0020] Figure 5 This is a schematic diagram of the protective component structure of this utility model.

[0021] Figure label:

[0022] 100. Chip; 200. Motherboard; 300. Cooling and heat dissipation mechanism; 310. Cooling plate; 320. Heat dissipation component; 321. Contact groove; 322. Fixing frame; 323. Guide frame; 324. Fin; 325. Ventilation hole; 326. Cooling fan; 327. Temperature sensing element; 330. Protective component; 331. Placement slot; 332. Filter plate; 333. Support frame. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0024] The following is combined Figures 1-5 This invention describes a power management chip with an active cooling mechanism.

[0025] In one embodiment, a power management chip with an active cooling mechanism includes: a chip 100 disposed on one side of a motherboard 200 and fixedly connected to the motherboard 200; and a cooling and heat dissipation mechanism 300 for actively cooling the chip 100. The cooling and heat dissipation mechanism 300 includes a cooling plate 310 disposed on the top of the chip 100, a heat dissipation component 320 disposed on the outer side of the cooling plate 310, and a protective component 330 disposed on the outer side of the heat dissipation component 320.

[0026] In this embodiment, the cooling plate 310 is located on top of the chip 100 and can serve as a heat conduction medium to quickly transfer the heat generated during the operation of the chip 100 to the cooling plate 310 and further to the heat dissipation component 320, thereby achieving a stable heat conduction path. When the temperature of the chip 100 reaches a set threshold, the active heat dissipation mechanism is activated to improve the instantaneous heat transfer efficiency, significantly reduce the thermal load of the chip 100, and ensure its operational stability under high load or high temperature environments. The protective component 330 is located on the outside of the heat dissipation component 320 and can provide physical protection to prevent foreign objects such as dust and metal shavings from entering the interior of the heat dissipation component 320.

[0027] It should be noted that existing chip 100 cooling mechanisms typically include heat sinks, thermal pads, or heat pipe assemblies mounted on top of the chip 100. These cooling elements, through close contact with the surface of the chip 100, rapidly conduct the heat generated during chip 100 operation to the heat dissipation medium. The cooling plate 310 is connected to the chip 100 via a thermally conductive material, without interfering with the electrical contact surfaces or peripheral pin wiring of the chip 100. Simultaneously, the cooling plate 310, along with the heat dissipation assembly 320 and the protective assembly 330, are positioned above the chip 100 and within the reserved space of the motherboard 200, without affecting the normal layout and heat dissipation of other circuit components on the motherboard 200. The protective assembly 330 is made of non-conductive materials, has no direct electrical connection to the chip 100, and will not adversely affect the signal integrity, power consumption path, or EMI performance of the chip 100; therefore, it will not interfere with the normal operation of the chip 100.

[0028] like Figure 2 , Figure 3 and Figure 4 As shown, the heat dissipation assembly 320 includes a contact groove 321 formed on one side of the cooling plate 310. The contact groove 321 is located on the side of the cooling plate 310 close to the chip 100, and the cooling plate 310 is sleeved on the outside of the chip 100 through the contact groove 321.

[0029] In this embodiment, the cooling plate 310 can be stably fitted onto the outside of the chip 100 through the contact groove 321 to form a stable thermally conductive bonding structure, which effectively improves the thermal conductivity between the cooling plate 310 and the chip 100 and reduces thermal resistance. Thus, when the chip 100 generates a high heat load, the heat can be transferred to the cooling plate 310 more quickly, and then diffused by the subsequent heat dissipation component 320.

[0030] The outer side of the cooling plate 310 is fixedly mounted on the fixing frame 322, which is located on top of the cooling plate 310. The cooling fan 326 is fixedly mounted inside the fixing frame 322, which is located on top of the cooling plate 310.

[0031] In this embodiment, by fixing a frame 322 to the outside of the cooling plate 310 and setting a cooling fan 326 inside the frame 322, the cooling fan 326 can be directly located on the top of the cooling plate 310. When the operating temperature of the chip 100 rises, the cooling fan 326 can be actively started and form a vertical downward airflow, which directly acts on the surface of the cooling plate 310, thereby accelerating the heat dissipation of the surface of the cooling plate 310 and improving the overall heat dissipation efficiency of the chip 100.

[0032] A guide frame 323 is fixedly installed inside the fixed frame 322. The guide frame 323 is located between the cooling fan 326 and the cooling plate 310. One side of the guide frame 323 is in contact with the cooling plate 310. A temperature sensing element 327 is fixedly installed inside the guide frame 323.

[0033] In this embodiment, the temperature sensing sheet 327 is disposed inside the guide frame 323, which can sense the temperature status of the cooling plate 310 in real time and serve as the control signal source for the start and stop of the cooling fan 326, thereby realizing the automatic heat dissipation function triggered by the temperature rise of the chip 100, enhancing the intelligence and response speed of the cooling system, and avoiding energy waste.

[0034] It should be noted that the temperature sensing element 327 is a thermistor or thermocouple element widely used in the prior art, which can sense the surface temperature change of the cooling plate 310 in real time and feed the temperature signal back to the motherboard 200 or control unit for processing. When the continuous operation of the chip 100 causes the temperature of the cooling plate 310 to rise to a set threshold, the temperature sensing element 327 will output a start signal to control the cooling fan 326 to start, thereby achieving active heat dissipation; when the temperature drops to a safe range, the temperature sensing element 327 can control the fan to automatically stop, avoiding excessive heat dissipation and energy waste.

[0035] Multiple fins 324 are provided on both sides of the guide frame 323. One side of each fin 324 is in contact with the cooling plate 310, and each fin 324 is fixedly connected to the fixing frame 322.

[0036] In this embodiment, multiple fins 324 effectively expand the heat conduction area of ​​the cooling plate 310, enhance the rapid diffusion of heat to the fins 324, and improve the overall heat dissipation efficiency. All fins 324 are fixedly connected to the fixed frame 322, forming a stable heat conduction and dissipation structure. This helps to further conduct the heat absorbed by the cooling plate 310 to the fixed frame 322 and release it through external air convection. Especially when the cooling fan 326 is turned on, the guided airflow can pass through the gaps between the fins 324, forming a continuous and directional heat dissipation channel, further enhancing the active heat dissipation capability of the chip 100.

[0037] Ventilation holes 325 are provided on the surface of multiple fins 324, and the ventilation holes 325 are set as strip holes.

[0038] In this embodiment, ventilation holes 325 are formed on the surface of multiple fins 324, and the ventilation holes 325 are set as strip-shaped holes, which can effectively improve air circulation efficiency while ensuring structural strength. When the cooling fan 326 is running, the airflow can quickly pass through the fins 324 through the ventilation holes 325, enhancing the heat exchange process between the air and the surface of the fins 324, thereby improving the overall heat dissipation rate. At the same time, the strip-shaped hole structure has guiding properties, which can make the airflow form a stable channel, avoid turbulence or airflow loss, and improve the uniformity and stability of active heat dissipation.

[0039] like Figure 2 , Figure 3 and Figure 5 As shown, the protective component 330 includes a placement groove 331 formed on the top of the fixed frame 322, and a filter plate 332 is fixedly installed inside the placement groove 331.

[0040] In this embodiment, a filter plate 332 is fixedly installed inside the placement slot 331. This effectively blocks dust, fibers, and other minute impurities carried in the air without affecting the normal air intake of the cooling fan 326, preventing them from entering the cooling fan 326 and the guide frame 323. This avoids dust accumulation affecting airflow efficiency or causing fan jamming. As a passive protective structure, the filter plate 332 does not directly contact the chip 100 or the cooling plate 310, therefore it will not interfere with the cooling efficiency or electrical connections of the chip 100.

[0041] A support frame 333 is fixedly installed at the bottom of the placement slot 331. The support frame 333 is set in a cross shape.

[0042] In this embodiment, the support frame 333 is set in a cross shape, so that the filter plate 332 can obtain more stable support during installation, avoiding problems such as warping or loosening caused by heat deformation or airflow impact of the filter plate 332, ensuring that it is always tightly attached to the inside of the placement groove 331, and improving the reliability of the protective component 330.

[0043] Working principle: The heat generated by the chip 100 during operation is initially transferred by the cooling plate 310, and then further transferred to the multiple fins 324 and the fixing frame 322. When the temperature of the cooling plate 310 rises to a set threshold, the temperature sensing element 327 inside the guide frame 323 outputs a control signal to drive the cooling fan 326 to start. The cooling fan 326 is located on top of the cooling plate 310. The airflow is guided by the guide frame 323 through the multiple fins 324 and the ventilation holes 325 on their surfaces, enhancing the heat exchange efficiency between the air and the fins 324 and accelerating the dissipation of heat from the cooling plate 310. The multiple fins 324, the cooling plate 310, and the fixing frame 322 form a heat conduction channel. The ventilation holes 325 adopt a strip design to ensure airflow guidance and heat exchange uniformity, avoiding turbulence and heat retention. Once the temperature of the cooling plate 310 drops to a safe range, the temperature sensor 327 controls the cooling fan 326 to stop operating, achieving temperature control linkage and avoiding unnecessary energy consumption. Simultaneously, the filter plate 332 in the protective assembly 330, located inside the placement slot 331, effectively filters dust and impurities from the outside air, preventing the cooling fan 326 from sucking in foreign objects. The filter plate 332 is securely supported by the cross-shaped support frame 333 at the bottom, ensuring that it does not warp or shift during long-term operation, thus improving the reliability and stability of the overall cooling and heat dissipation mechanism 300.

[0044] It should be noted that the chips, temperature sensors, and cooling fans mentioned above are all devices with relatively mature existing technologies. Specific models can be selected according to actual needs. At the same time, the power supply methods for the chips, temperature sensors, and cooling fans can be selected according to the situation, such as built-in power supply, which will not be elaborated here.

[0045] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A power management chip with an active cooling mechanism, characterized in that, include: A chip (100) is disposed on one side of a motherboard (200) and is fixedly connected to the motherboard (200); Cooling and heat dissipation mechanism (300), the cooling and heat dissipation mechanism (300) for actively cooling the chip; The cooling and heat dissipation mechanism (300) includes a cooling plate (310) disposed on the top of the chip (100), a heat dissipation component (320) disposed on the outside of the cooling plate (310), and a protective component (330) disposed on the outside of the heat dissipation component (320).

2. The power management chip with an active cooling mechanism according to claim 1, characterized in that, The heat dissipation assembly (320) includes a contact groove (321) formed on one side of the cooling plate (310). The contact groove (321) is located on the side of the cooling plate (310) close to the chip (100). The cooling plate (310) is sleeved on the outside of the chip (100) through the contact groove (321).

3. The power management chip with an active cooling mechanism according to claim 1, characterized in that, The outer side of the cooling plate (310) is fixedly installed in the fixing frame (322), the fixing frame (322) is located on the top of the cooling plate (310), and a cooling fan (326) is fixedly installed inside the fixing frame (322), the cooling fan (326) is located on the top of the cooling plate (310).

4. The power management chip with an active cooling mechanism according to claim 3, characterized in that, A guide frame (323) is fixedly installed inside the fixed frame (322). The guide frame (323) is located between the cooling fan (326) and the cooling plate (310). One side of the guide frame (323) is in contact with the cooling plate (310). A temperature sensing element (327) is fixedly installed inside the guide frame (323).

5. The power management chip with an active cooling mechanism according to claim 4, characterized in that, Multiple fins (324) are provided on both sides of the guide frame (323). One side of each of the multiple fins (324) is in contact with the cooling plate (310), and each of the multiple fins (324) is fixedly connected to the fixing frame (322).

6. The power management chip with an active cooling mechanism according to claim 5, characterized in that, Ventilation holes (325) are provided on the surface of each of the multiple fins (324), and the ventilation holes (325) are configured as strip holes.

7. The power management chip with an active cooling mechanism according to claim 5, characterized in that, The protective component (330) includes a placement slot (331) formed on the top of the fixed frame (322), and a filter plate (332) is fixedly installed inside the placement slot (331).

8. The power management chip with an active cooling mechanism according to claim 7, characterized in that, A support frame (333) is fixedly installed at the bottom of the placement slot (331), and the support frame (333) is configured in a cross shape.

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