Refrigeration fan for mobile phone heat dissipation

Abstract

The utility model discloses a refrigeration fan can be used for mobile phone heat dissipation, it includes: fan main part, be used for with mobile phone fixed connection's fixed structure, set up in the fan main part lower extreme, refrigeration plant, it includes set up in the fixed structure surface and be used for with mobile phone back contact's cold -conducting sheet and be used for the semiconductor refrigeration module of cold -conducting sheet refrigeration, power supply, it is electrically connected fan main part and semiconductor refrigeration module to power supply fan main part and semiconductor refrigeration module, the utility model discloses when using, through fixed structure with mobile phone fixed connection, make fan main part place in mobile phone top, power supply power supply fan main part, it is convenient for user when using mobile phone, can produce wind through fan main part to blow to human body, it can use mobile phone under cool condition, use more convenient, on this basis, the utility model still added refrigeration plant, through low temperature's cold -conducting sheet contact mobile phone back, and then realize the cooling of mobile phone, heat dissipation, make mobile phone not scorching.

Description

Technical Field

[0001] This utility model relates to the field of fan product technology, and specifically to a cooling fan that can be used for heat dissipation in mobile phones. Background Technology

[0002] Chinese utility model patent application number 202421000853.0 discloses a multifunctional mobile phone fan. This multifunctional mobile phone fan includes: a main body containing a battery and a circuit board electrically connected to the battery; a fan located at the top of the main body and electrically connected to the circuit board; a hook located on the upper part of the main body, with a hanging part at the front for clamping and fixing a mobile phone; and a suction cup located at the lower part of the main body. This multifunctional mobile phone fan uses the hook to fix the fan to flat products such as mobile phones or tablets. Combined with the suction cup at the bottom of the fan, it achieves both clamping and suction functions to simultaneously fix the fan and the mobile phone, greatly improving the fan's stability and reducing the risk of the fan falling during use. It is suitable for various indoor and outdoor occasions, and can even be used during exercise such as running, providing convenience and stability.

[0003] However, the aforementioned multi-functional mobile phone fan uses hooks and suction cups to fix the phone in place, and its contact parts lack heat dissipation structures, which means it cannot dissipate heat from the phone and therefore cannot meet the user's requirements.

[0004] In view of the above, the inventors propose the following technical solution. Utility Model Content

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a cooling fan that can be used for heat dissipation in mobile phones.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: The cooling fan that can be used for mobile phone heat dissipation includes: a fan body; a fixing structure for fixed connection with the mobile phone, which is disposed at the lower end of the fan body; a cooling device, which includes a cooling sheet disposed on the surface of the fixing structure and for contacting the back of the mobile phone, and a semiconductor cooling module disposed inside the fixing structure for cooling the cooling sheet; and a power supply, which is electrically connected to the fan body and the semiconductor cooling module to supply power to the fan body and the semiconductor cooling module.

[0007] Furthermore, in the above technical solution, the fan body is connected to the fixed structure through a flexible metal tube, and its position relative to the fixed structure can be adjusted through the flexible metal tube.

[0008] Furthermore, in the above technical solution, a pipe joint is provided on the fixed structure, and the lower end of the flexible metal pipe is inserted and fixed in the pipe joint.

[0009] Furthermore, in the above technical solution, the fixing structure includes a housing and a magnet disposed on the surface of the housing for magnetic fixation with the mobile phone. The magnet is distributed around the cooling plate. The pipe joint is fixedly installed on the upper end of the housing, and the cooling device is disposed inside the housing.

[0010] Furthermore, in the above technical solution, a rectangular positioning piece is provided at the lower end of the pipe connector; the outer shell includes a front shell and a rear shell fixed together by buckles or screws, and the upper ends of the front shell and the rear shell are respectively provided with a first retaining groove and a second retaining groove. The rectangular positioning piece is embedded in the first retaining groove and the second retaining groove respectively, and after the front shell and the rear shell are connected, the first retaining groove and the second retaining groove are also connected to secure the rectangular positioning piece; the cooling plate is provided on the front end face of the front shell.

[0011] Furthermore, in the above technical solution, a decorative film is also provided on the surface of the outer shell, which covers the magnet and the installation gap between the magnet and the outer shell.

[0012] Furthermore, in the above technical solution, the semiconductor cooling module includes a semiconductor cooling chip fixed inside the housing, a heat dissipation fin holder in contact with the heat dissipation surface of the semiconductor cooling chip, and a cooling fan installed on the side of the heat dissipation fin holder where the fins are located. The housing is provided with an air inlet and an air outlet corresponding to the cooling fan. The cooling fin is in contact with the cooling surface of the semiconductor cooling chip. The main control board disposed inside the housing is electrically connected to the semiconductor cooling chip and the power supply.

[0013] Furthermore, in the above technical solution, the power source is a battery, which is disposed inside the housing. Alternatively, the power source includes a housing, a battery installed inside the housing, and a power board electrically connected to the battery. The electrodes on the power board are exposed on the outer surface of the housing. When the housing is fixedly assembled with the outer casing, the elastic pins disposed inside the housing and electrically connected to the main control board are electrically connected to the electrodes.

[0014] Furthermore, in the above technical solution, the housing is provided with a mating protrusion having a mating groove, and the electrode is exposed in the mating groove; the outer shell is provided with a limiting groove adapted to the mating protrusion, and the elastic pin is exposed in the limiting groove, the mating protrusion and the limiting groove are interlocked and positioned, and the elastic pin contacts the electrode after passing through the mating groove; the power board is provided with a first TEPY-C interface for power supply or charging, and the outer shell is provided with a second TEPY-C interface electrically connected to the main control board.

[0015] Furthermore, in the above technical solution, the housing and the outer shell are fixed together by magnetic attraction and / or snap-fit. The housing is provided with multiple docking cylinders, and a first magnetic attraction element is provided inside each docking cylinder. The outer shell is provided with a fitting groove adapted to the docking cylinder, and a second magnetic attraction element is provided inside each fitting groove. After the docking cylinder is embedded and positioned in the fitting groove, the first magnetic attraction element and the second magnetic attraction element are magnetically fixed together, so that the housing and the outer shell form a fixed assembly, and a gap is formed between the housing and the outer shell to connect the air inlet of the outer shell.

[0016] After adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art: When in use, the present invention is fixedly connected to the mobile phone through a fixed structure, so that the fan body is placed above the mobile phone and the power supply supplies power to the fan body. This allows the user to use the mobile phone while using it, as the fan body can generate airflow to blow onto the human body, making it more convenient to use the mobile phone in a cool environment. In addition, the present invention also adds a cooling device. The power supply supplies power to a semiconductor cooling module, which is used to cool the cooling plate. The low-temperature cooling plate contacts the back of the mobile phone, thereby achieving cooling and heat dissipation of the mobile phone, preventing it from getting hot, improving the user experience, meeting different usage requirements, and giving the present invention a strong market competitiveness. Attached Figure Description

[0017] Figure 1 This is a perspective view of the present invention; Figure 2 This is a perspective view of the present invention from another angle; Figure 3 This is a perspective view of the power supply after disassembly of this utility model; Figure 4 This is a perspective view of the power supply in this utility model; Figure 5 This is a cross-sectional view of the present invention; Figure 6 This is an exploded perspective view of the present invention; Figure 7 This is a perspective view of the rear shell of this utility model. Detailed Implementation

[0018] The present invention will be further described below with reference to specific embodiments and accompanying drawings.

[0019] See Figure 1-7 As shown, a cooling fan that can be used for heat dissipation in mobile phones includes: a fan body 1, a fixing structure 2, a cooling device 3, and a power supply 4.

[0020] The fan body 1 is a conventional fan. The fixing structure 2 is located at the lower end of the fan body 1 and is used to fix it to the mobile phone. The cooling device 3 includes a cooling plate 31 disposed on the surface of the fixing structure 2 and used to contact the back of the mobile phone, and a semiconductor cooling module 32 disposed inside the fixing structure 2 and used to cool the cooling plate 31. The power supply 4 is electrically connected to the fan body 1 and the semiconductor cooling module 32 to supply power to the fan body 1 and the semiconductor cooling module 32.

[0021] In use, this utility model is fixedly connected to the mobile phone via the fixing structure 2, placing the fan body 1 above the phone. The power supply 4 supplies power to the fan body 1. This allows the user to use the phone while the fan body 1 generates airflow to the user, enabling cool use and making it more convenient. This is a conventional technology. This utility model also adds a cooling device 3. The power supply 4 supplies power to a semiconductor cooling module 32, which cools the cooling plate 31. The low-temperature cooling plate 31 contacts the back of the phone, thereby cooling and dissipating heat, preventing the phone from overheating, improving the user experience, meeting different usage requirements, and giving this utility model strong market competitiveness.

[0022] In this embodiment, for greater ease of use, the following design is implemented: the fan body 1 is connected to the fixed structure 2 via a flexible metal tube 11, and its position relative to the fixed structure can be adjusted via the flexible metal tube 11. Of course, the flexible metal tube 11 can also be replaced with an inflexible plastic rod, etc., which would have a lower manufacturing cost.

[0023] To facilitate installation on the flexible metal tube 11, the following design was also made: a pipe joint 20 is provided on the fixing structure 2, and the lower end of the flexible metal tube 11 is inserted and fixed in the pipe joint 20, making it easier to assemble.

[0024] The structure of the fixing structure 2 is described in detail below: The fixing structure 2 includes a housing 21 and magnets 22 disposed on the surface of the housing 21 for magnetic fixation with the mobile phone. The back of the mobile phone has a first magnet for magnetic charging. When the back of the mobile phone is attached to the surface of the housing 21, the first magnet and magnets 22 are magnetically attracted and fixed, thus forming a fixed assembly between the fixing structure 2 and the mobile phone. The magnets 22 are distributed around the cooling fins 31. The pipe connector 20 is fixedly installed on the upper end of the housing 21, placing the fan body 1 above the housing 21. The cooling device 3 is disposed inside the housing 21.

[0025] In some other embodiments, the fixing structure 2 can be a clamp-type mobile phone holder, which clamps and fixes the mobile phone.

[0026] The assembly structure of the outer shell 21 and the pipe connector 20 is as follows: a rectangular positioning piece 201 is provided at the lower end of the pipe connector 20; the outer shell 21 includes a front shell 211 and a rear shell 212 fixed together by buckles or screws. The upper ends of the front shell 211 and the rear shell 212 are respectively provided with a first retaining groove 213 and a second retaining groove 214. The rectangular positioning piece 201 is embedded in the first retaining groove 213 and the second retaining groove 214 respectively. After the front shell 211 and the rear shell 212 are connected, the first retaining groove 213 and the second retaining groove 214 are also connected to hold and fix the rectangular positioning piece 201. The positioning effect is better, and the assembly structure is extremely simple. There is no need to tighten screws, etc., and the assembly efficiency is higher; the cooling plate 31 is provided on the front end face of the front shell 211.

[0027] To improve aesthetics and prevent wear and tear on the phone, the following design was also made: a decorative film 23 is provided on the surface of the outer shell 21, which covers the magnet 22 and the installation gap between the magnet 22 and the outer shell 21.

[0028] The semiconductor cooling module 32 includes a semiconductor cooling chip 321 fixed inside the housing 21, a heat dissipation fin seat 322 in contact with the heat dissipation surface of the semiconductor cooling chip 321, and a cooling fan 323 installed on the side of the heat dissipation fin seat 322 where fins 301 are provided. The housing 21 is provided with an air inlet 216 and an air outlet 217 corresponding to the cooling fan 323. The cooling plate 31 is in contact with the cooling surface of the semiconductor cooling chip 321. The main control board 24 disposed inside the housing 21 is electrically connected to the semiconductor cooling chip 321 and the power supply 4. When the semiconductor cooling chip 321 is working, its cooling surface achieves cooling to transfer the cold source to the heat-conducting plate 31, while its heat dissipation surface dissipates heat. This heat is then transferred to the fins 301 of the heat dissipation fin holder 322 and dissipated to the outside by the air generated by the cooling fan 323, thereby achieving the purpose of heat dissipation. This makes the cooling effect of the semiconductor cooling chip 321 better, and the heat-conducting plate 31 can continuously cool the back of the mobile phone from a distance, thus preventing the mobile phone from overheating.

[0029] In some embodiments, the power source 4 is a battery disposed within the housing 21.

[0030] In some embodiments, the power supply 4 includes a housing 41, a battery 42 installed in the housing 41, and a power board 43 electrically connected to the battery 42. Electrodes 431 provided on the power board 43 are exposed on the outer surface of the housing 41. When the housing 41 is fixedly assembled with the outer shell 21, the elastic pins 241 provided in the outer shell 21 and electrically connected to the main control board 24 are electrically connected to the electrodes 431.

[0031] The housing 41 is provided with a mating protrusion 411, which has a mating groove 412, and the electrode 431 is exposed in the mating groove 412. The outer shell 21 is provided with a limiting groove 219 adapted to the mating protrusion 411, and the elastic pin 241 is exposed in the limiting groove 219. The mating protrusion 411 and the limiting groove 219 are interlocked and positioned, and the elastic pin 241 contacts the electrode 431 after penetrating the mating groove 412, thus forming a stable electrical connection.

[0032] The power board 43 is provided with a first TEPY-C interface 432 for power supply or charging. By connecting the first TEPY-C interface 432 through a data cable, the battery 42 can be charged and the battery 42 can also be output to achieve the purpose of dual use.

[0033] The outer casing 21 is provided with a second TEPY-C interface 242 that is electrically connected to the main control board 24. By connecting the first TEPY-C interface 432 and the second TEPY-C interface 242 via a data cable, the power supply 4 can supply power to the main control board 24, the fan body, and the semiconductor cooling module 32.

[0034] The housing 41 and the outer shell 21 are fixed together by magnetic attraction and / or snap fasteners, making them extremely convenient to use.

[0035] The housing 41 is provided with a plurality of docking cylinders 413, and a first magnetic suction member 414 is provided inside the docking cylinder 413; the outer shell 21 is provided with a fitting groove 218 adapted to the docking cylinder 413, and a second magnetic suction member 215 is provided inside the fitting groove 218. After the docking cylinder 413 is fitted and positioned in the fitting groove 218, the first magnetic suction member 414 and the second magnetic suction member 215 are magnetically attracted and fixed together, so that the housing 41 and the outer shell 21 form a fixed assembly, and a gap is formed between the housing 41 and the outer shell 21, which connects to the air inlet 216 of the outer shell 21.

[0036] In this embodiment, both the first magnetic attractor 414 and the second magnetic attractor 215 are magnets.

[0037] In summary, when in use, this utility model is fixedly connected to the mobile phone via the fixing structure 2, so that the fan body 1 is placed above the mobile phone. The power supply 4 supplies power to the fan body 1. This allows the user to use the mobile phone while the fan body 1 generates airflow to the body, enabling the user to use the mobile phone in a cool environment, making it more convenient to use. In addition, this utility model also adds a cooling device 3. The power supply 4 supplies power to the semiconductor cooling module 32, which is used to cool the cooling plate 31. The low-temperature cooling plate 31 contacts the back of the mobile phone, thereby achieving cooling and heat dissipation, preventing the mobile phone from overheating, improving the user experience, meeting different usage requirements, and giving this utility model strong market competitiveness.

[0038] Of course, the above description is only a specific embodiment of the present utility model and is not intended to limit the scope of the present utility model. All equivalent changes or modifications made to the structure, features and principles described in the claims of the present utility model should be included in the scope of the claims of the present utility model.

Claims

1. A cooling fan that can be used for heat dissipation in mobile phones, characterized in that: It includes: Fan body (1); The fixing structure (2) for fixed connection with the mobile phone is located at the lower end of the fan body (1); The cooling device (3) includes a cooling sheet (31) disposed on the surface of the fixed structure (2) and used to contact the back of the mobile phone, and a semiconductor cooling module (32) disposed inside the fixed structure (2) and used to cool the cooling sheet (31). Power supply (4), which is electrically connected to fan body (1) and semiconductor cooling module (32) to supply power to fan body (1) and semiconductor cooling module (32).

2. The cooling fan for mobile phone heat dissipation according to claim 1, characterized in that: The fan body (1) is connected to the fixed structure (2) through a flexible metal tube (11), and its position relative to the fixed structure can be adjusted through the flexible metal tube (11).

3. The cooling fan for mobile phone heat dissipation according to claim 2, characterized in that: A pipe joint (20) is provided on the fixed structure (2), and the lower end of the flexible metal pipe (11) is inserted and fixed in the pipe joint (20).

4. The cooling fan for mobile phone heat dissipation according to claim 3, characterized in that: The fixing structure (2) includes a housing (21) and a magnet (22) disposed on the surface of the housing (21) for magnetic fixation with the mobile phone. The magnet (22) is distributed around the cooling plate (31). The pipe connector (20) is fixedly installed on the upper end of the housing (21). The cooling device (3) is disposed inside the housing (21).

5. The cooling fan for mobile phone heat dissipation according to claim 4, characterized in that: The lower end of the pipe connector (20) is provided with a rectangular positioning piece (201); the outer shell (21) includes a front shell (211) and a rear shell (212) fixed together by buckles or screws. The upper ends of the front shell (211) and the rear shell (212) are respectively provided with a first retaining groove (213) and a second retaining groove (214). The rectangular positioning piece (201) is embedded in the first retaining groove (213) and the second retaining groove (214) respectively. After the front shell (211) and the rear shell (212) are connected, the first retaining groove (213) and the second retaining groove (214) are also connected to hold and fix the rectangular positioning piece (201); the cooling plate (31) is provided on the front end face of the front shell (211).

6. The cooling fan for mobile phone heat dissipation according to claim 4, characterized in that: The surface of the outer casing (21) is also provided with a decorative film (23), which covers the magnet (22) and the installation gap between the magnet (22) and the outer casing (21).

7. The cooling fan for mobile phone heat dissipation according to any one of claims 1-4, characterized in that: The semiconductor cooling module (32) includes a semiconductor cooling chip (321) fixed inside the housing (21), a heat dissipation fin seat (322) in contact with the heat dissipation surface of the semiconductor cooling chip (321), and a cooling fan (323) installed on the side of the heat dissipation fin seat (322) with fins (301). The housing (21) is provided with an air inlet (216) and an air outlet (217) corresponding to the cooling fan (323). The cooling plate (31) is in contact with the cooling surface of the semiconductor cooling chip (321). The main control board (24) provided inside the housing (21) is electrically connected to the semiconductor cooling chip (321) and the power supply (4).

8. The cooling fan for mobile phone heat dissipation according to claim 7, characterized in that: The power source (4) is a battery, which is located inside the housing (21). Alternatively, the power source (4) includes a housing (41), a battery (42) installed inside the housing (41), and a power board (43) electrically connected to the battery (42). The electrodes (431) provided on the power board (43) are exposed on the outer surface of the housing (41). When the housing (41) is fixedly assembled with the housing (21), the elastic pins (241) provided inside the housing (21) and electrically connected to the main control board (24) are electrically connected to the electrodes (431).

9. The cooling fan for mobile phone heat dissipation according to claim 8, characterized in that: The housing (41) is provided with a mating protrusion (411), which has a mating groove (412), and the electrode (431) is exposed in the mating groove (412); the outer shell (21) is provided with a limiting groove (219) adapted to the mating protrusion (411), and the elastic pin (241) is exposed in the limiting groove (219). The mating protrusion (411) and the limiting groove (219) are interlocked and positioned, and the elastic pin (241) contacts the electrode (431) after passing through the mating groove (412); the power board (43) is provided with a first TEPY-C interface (432) for power supply or charging, and the outer shell (21) is provided with a second TEPY-C interface (242) electrically connected to the main control board (24).

10. The cooling fan for mobile phone heat dissipation according to claim 8, characterized in that: The housing (41) and the outer shell (21) are fixed together by magnetic attraction and / or snap fasteners. The housing (41) is provided with a plurality of docking cylinders (413), and a first magnetic attraction element (414) is provided inside the docking cylinder (413). The outer shell (21) is provided with a fitting groove (218) adapted to the docking cylinder (413), and a second magnetic attraction element (215) is provided inside the fitting groove (218). After the docking cylinder (413) is embedded and positioned in the fitting groove (218), the first magnetic attraction element (414) and the second magnetic attraction element (215) are magnetically attracted and fixed together, so that the housing (41) and the outer shell (21) form a fixed assembly, and a gap is formed between the housing (41) and the outer shell (21) to connect the air inlet (216) of the outer shell (21).

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