A heat sink
Patent Information
- Application Number
- CN202522041856.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-23
- Publication Date
- 2026-10-09
- Estimated Expiration
- 2035-09-23
AI Technical Summary
[0004]本实用新型提供一种散热器,以解决散热器的组装工序复杂且结构强度差的技术问题
[0015]本实用新型提供的上述散热器,通过将散热器的散热鳍片、底板以及用于和单板组装的预埋嵌件一体压铸成型,一方面省去了传统组装方式中表贴螺母的组装步骤,简化了散热器的组装工艺,另一方面增强了整体的结构强度,使散热器整体刚性更高。本实用新型提供的散热器通过预先压铸成一体的预埋嵌件与发热单板进行连接,使得连接结构更稳固,还能减少机加工和人工组装成本,散热鳍片与底板的垂直设计还能改善散热性能。
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Figure CN224844449U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of heat dissipation technology for heat-generating devices, and more particularly to a radiator. Background Technology
[0002] Currently, the main method for heat dissipation of single boards is to use heat sinks to dissipate heat. When the heat sink is connected to the single board, it is physically connected to the single board through surface mount nuts with protrusions on the heat sink. The surface mount nuts are connected to the single board through reflow soldering of SMT (Surface Mount Technology) chip mounting technology. During assembly, the heat sink is mechanically connected to the pre-installed surface mount nuts and single board using screws.
[0003] In practice, we have found that this method has at least the following problems: it requires multiple connections, the assembly process is complicated, and the labor cost is high; the strength of the connection structure between the heat sink and the single board is generally weak, and if the surface-mount nuts are loose, the heat sink may fall off. Summary of the Invention
[0004] This utility model provides a radiator to solve the technical problems of complex assembly process and poor structural strength of radiators.
[0005] This application provides a heat sink, including a base plate. The upper surface of the base plate is provided with a plurality of heat dissipation fins, each heat dissipation fin being perpendicular to the upper surface of the base plate. The heat dissipation fins are integrally die-cast with the base plate. The lower surface of the base plate is provided with a plurality of embedded inserts for assembly with a single board. The embedded inserts are integrally die-cast with the base plate.
[0006] Furthermore, the bottom of the embedded insert has an internal threaded hole.
[0007] Furthermore, the diameter of the internal threaded hole is between 2.8 mm and 3.2 mm.
[0008] Furthermore, the heat dissipation fins are arranged parallel to each other on the upper surface of the base plate.
[0009] Furthermore, the spacing between adjacent heat dissipation fins gradually increases from the air inlet end to the air outlet end.
[0010] Furthermore, the spacing between adjacent heat dissipation fins is between 3mm and 6mm.
[0011] Furthermore, the base plate includes a first heat dissipation area and a second heat dissipation area, which are integrally die-cast in an L-shape.
[0012] Furthermore, the height of the heat dissipation fins located in the first heat dissipation area is higher than that of the heat dissipation fins located in the second heat dissipation area.
[0013] Furthermore, all heat dissipation fins have the same thickness.
[0014] Furthermore, both the base plate and the heat dissipation fins are made of aluminum alloy.
[0015] The radiator provided by this utility model integrates the heat dissipation fins, base plate, and pre-embedded inserts for assembly with the single-panel by die casting. This eliminates the need for surface-mount nuts in traditional assembly methods, simplifying the radiator assembly process. Furthermore, it enhances the overall structural strength, resulting in higher overall rigidity. The radiator's connection to the heat-generating single-panel via pre-cast, integrally formed inserts makes the connection structure more stable, reduces machining and manual assembly costs, and the vertical design of the heat dissipation fins and base plate further improves heat dissipation performance. Attached Figure Description
[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is the front view of the heat sink in one embodiment of this application. Figure 2
[0018] Figure 2 This is a schematic diagram showing the distribution of heat dissipation fins of a heat sink in one embodiment of this application.
[0019] The components represented by each label in the diagram are as follows:
[0020] 1. Base plate 2. Heat dissipation fins 2. Embedded inserts 2. A. First heat dissipation area 2. B. Second heat dissipation area 2. M. Air inlet 2. N. Air outlet. Detailed Implementation
[0021] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.
[0022] The implementation of this application will be described in detail below with reference to the specific accompanying drawings:
[0023] This utility model provides a heat sink. Figure 1 This is a front view of a heat sink in one embodiment of this application, as shown below. Figure 1As shown, the radiator includes a base plate 1, and the upper surface of the base plate 1 is provided with a plurality of heat dissipation fins 2. Each heat dissipation fin 2 is arranged perpendicularly to the upper surface of the base plate 1. The heat dissipation fins 2 and the base plate 1 are integrally die-cast. The lower surface of the base plate 1 is provided with a plurality of embedded inserts 3 for assembly with single boards. The embedded inserts 3 and the base plate 1 are integrally die-cast.
[0024] The radiator provided in this embodiment is integrally die-cast, consisting of the heat dissipation fins 2, the base plate 1, and the pre-embedded inserts 3 for assembly with the single-panel. This eliminates the need for surface-mount nuts in traditional assembly methods, simplifying the radiator assembly process. Furthermore, it enhances the overall structural strength, resulting in higher overall rigidity. The radiator provided by this invention connects to the heat-generating single-panel via pre-cast, integrally formed inserts, making the connection structure more stable and reducing machining and manual assembly costs. The vertical design of the heat dissipation fins and the base plate also improves heat dissipation performance.
[0025] In one embodiment, the bottom of the embedded insert 3 has an internal threaded hole.
[0026] In this embodiment, the internal threaded hole at the bottom of the pre-embedded insert 3 facilitates assembly and fixation with heating devices, such as single boards. Figure 1 As shown, there are five die-cast embedded inserts, four of which are located around the perimeter of the base plate 1, and one is located in the center of the base plate 1, facilitating secure fixing to the single panel. It is understood that the number and position of these embedded inserts can be adjusted as needed.
[0027] In one embodiment, the diameter of the internally threaded hole is between 2.8 mm and 3.2 mm.
[0028] In this embodiment, the diameter of the internal threaded hole is set between 2.8mm and 3.2mm so that the radiator can be adapted to screws of different sizes, thereby improving the practicality of the radiator.
[0029] In one embodiment, the heat dissipation fins 2 are arranged parallel to each other on the upper surface of the base plate 1.
[0030] In this embodiment, the heat dissipation fins are die-cast in a parallel and distributed manner, which can avoid contact between different heat dissipation fins, thereby increasing the contact area between the heat dissipation fins and the air and improving heat dissipation efficiency.
[0031] Figure 2 This is a schematic diagram of the heat dissipation fins of a heat sink in one embodiment of this application, as shown below. Figure 2 As shown, in this embodiment, the spacing between adjacent heat dissipation fins 2 gradually increases from the air inlet M to the air outlet N.
[0032] In this designation, the air inlet (M) represents the area near the fan on the board, while the air outlet (N) represents the area furthest from the fan. Generally, the area near the fan on the board requires the most heat dissipation. The heat sink provided by this invention has the densest arrangement of heat dissipation fins in this area, which helps to dissipate heat from the board as quickly as possible.
[0033] In one embodiment, the spacing between adjacent heat dissipation fins 2 is between 3 mm and 6 mm.
[0034] Considering the overall size of the single board, the overall size of the heat sink needs to be controlled within a suitable range. Through practice, we have found that controlling the spacing between adjacent heat dissipation fins 2 between 3mm and 6mm in this embodiment is beneficial to achieving this without reducing the overall heat dissipation effect.
[0035] In one embodiment, the base plate 1 includes a first heat dissipation area A and a second heat dissipation area B, the first heat dissipation area A and the second heat dissipation area B are integrally die-cast in an L-shape, wherein the height of the heat dissipation fin located in the first heat dissipation area A is higher than that of the heat dissipation fin located in the second heat dissipation area B.
[0036] In this embodiment, when the heat sink is assembled with the single board, the first heat dissipation area A is close to the CPU (Central Processing Unit) chip on the single board. The CPU on the single board generates the most heat. In this embodiment, the height of the heat dissipation fins located in the first heat dissipation area A is set higher than the height of the heat dissipation fins in other areas, so as to increase the surface area of the heat dissipation fins in the first heat dissipation area A and improve the heat dissipation effect.
[0037] In one embodiment, each heat dissipation fin 2 has the same thickness to achieve an aesthetically pleasing appearance.
[0038] In one embodiment, both the base plate 1 and the heat dissipation fins 2 are made of aluminum alloy.
[0039] Preferably, both the base plate 1 and the heat dissipation fins 2 are made of A16063 aluminum alloy. A16063 aluminum alloy is a wrought aluminum alloy with magnesium and silicon as the main alloying elements. It has good thermal conductivity and is very suitable for manufacturing heat sinks.
[0040] In this embodiment, the embedded insert 3 is a conductive metal insert, preferably a copper alloy insert. This embodiment improves upon the traditional method, which requires reflow soldering to connect the heat sink to the board. This embodiment achieves electrical connection simultaneously by connecting the conductive metal insert to the board during physical connection, simplifying the assembly process.
[0041] This utility model improves the traditional three-stage assembly structure of surface-mount nuts and screws in profile radiators into a die-cast integrated structure, achieving the goal of integrating the radiator body with the threaded connection structure. During the die-casting process, copper alloy inserts are embedded to replace the surface-mount nuts, which are at risk of loosening. This improves the tensile strength of the threads and enhances heat dissipation performance, while also simplifying the production process and reducing machining and labor costs.
[0042] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is used as an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above.
[0043] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.
Claims
1. A radiator, comprising a base plate, characterized in that, The upper surface of the base plate is provided with a plurality of heat dissipation fins, each heat dissipation fin being arranged perpendicularly to the upper surface of the base plate. The heat dissipation fins are integrally die-cast with the base plate. The lower surface of the base plate is provided with a plurality of embedded inserts for assembly with single boards. The embedded inserts are integrally die-cast with the base plate.
2. The radiator according to claim 1, characterized in that, The bottom of the pre-embedded insert has an internal threaded hole.
3. The radiator according to claim 2, characterized in that, The diameter of the internal threaded hole is between 2.8 mm and 3.2 mm.
4. The radiator according to claim 1, characterized in that, The heat dissipation fins are arranged parallel to each other on the upper surface of the base plate.
5. The radiator according to claim 4, characterized in that, The spacing between adjacent heat dissipation fins gradually increases from the air inlet end to the air outlet end.
6. The radiator according to claim 5, characterized in that, The spacing between adjacent heat dissipation fins is between 3mm and 6mm.
7. The radiator according to claim 1, characterized in that, The base plate includes a first heat dissipation area and a second heat dissipation area, which are integrally die-cast in an L-shape.
8. The radiator according to claim 7, characterized in that, The height of the heat dissipation fins located in the first heat dissipation area is higher than that of the heat dissipation fins located in the second heat dissipation area.
9. The radiator according to any one of claims 1 to 8, characterized in that, All of the heat dissipation fins have the same thickness.
10. The radiator according to any one of claims 1 to 8, characterized in that, Both the base plate and the heat dissipation fins are made of aluminum alloy.