A power supply and heat dissipation system

Abstract

The utility model relates to direct current power supply technical field especially a kind of power supply and heat dissipation system, including shell, the shell is composed of base and upper cover, the upper cover is fixedly connected at the top of the base, the both sides of the shell are respectively fixedly connected with rear panel and control panel, first heat dissipation structure is equipped between the rear panel and the shell;Wherein, the inside fixed connection of the shell has PCB board, second heat dissipation structure is equipped on the PCB board, the second heat dissipation structure includes several radiating fins, the radiating fin with the PCB board is detachably connected, on the one hand, the heat generated by several heat sinks to PCB board and component on PCB board is absorbed, on the other hand, DC fan cooperates air inlet and air outlet and exports the heat absorbed by heat sink to the outside of power supply shell, effectively improve the heat dissipation efficiency and ensure that the working temperature in the shell is in the appropriate range, in turn improve the service life of device and the reliability of power supply.

Description

Technical Field

[0001] This utility model relates to the field of DC power supply technology, and in particular to a power supply and heat dissipation system. Background Technology

[0002] An adjustable DC power supply is a type of DC power supply whose output voltage and current are adjustable. It is usually equipped with a knob or digital keypad for setting output parameters and is connected to the load via terminals (also called wiring terminals).

[0003] When a power supply is in use, various internal components and other parts generate heat, so a heat dissipation system needs to be installed inside the power supply to prevent heat accumulation. For example, the existing technology disclosed in Chinese Patent Publication No. "CN220123313U" is a power supply heat dissipation structure, which includes heat dissipation aluminum alloy parts, intake fan, exhaust fan, intake grille, exhaust grille and auxiliary fan. The power supply heat dissipation structure includes a housing containing a motherboard. The motherboard houses a PQ5050 transformer and a resonant inductor. Symmetrical heat dissipation aluminum alloy components are arranged on both sides of the PQ5050 transformer and the resonant inductor. An intake fan is located on one side of the motherboard, and an exhaust fan is located on the other side. An intake grille is located on the housing corresponding to the intake fan, and an exhaust grille is located on the housing corresponding to the exhaust fan. Auxiliary fans are located on the heat dissipation aluminum alloy components corresponding to the PQ5050 transformer and the resonant inductor. This allows the intake and exhaust fans to create a through-flow effect, effectively dissipating heat from the PQ5050 transformer and the resonant inductor. The heat dissipation aluminum alloy components provide auxiliary cooling, and the auxiliary fans further enhance heat dissipation, thereby improving the overall heat dissipation effect of the PQ5050 transformer and the resonant inductor.

[0004] In actual operation, the heat sink is fixedly connected to the motherboard. Therefore, if a component on the heat sink (such as a capacitor or MOSFET) is damaged, the heat sink will affect the maintenance of the motherboard because it will block the component and make it inconvenient to disassemble and reassemble. Utility Model Content

[0005] The purpose of this utility model is to solve the shortcomings of the existing technology, such as the inconvenience of disassembling and assembling the heat sink components, and to propose a power supply and heat dissipation system.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: Design a power supply and heat dissipation system, including a housing, the housing being composed of a base and a top cover, the top cover being fixedly connected to the top of the base, a rear panel and a control panel being fixedly connected to both sides of the housing respectively, and a first heat dissipation structure being provided between the rear panel and the housing; A PCB board is fixedly connected inside the housing. The PCB board is provided with a second heat dissipation structure, which includes a plurality of heat sinks. The heat sinks are detachably connected to the PCB board.

[0007] Furthermore, the first heat dissipation structure includes a DC fan and an air inlet, and an air outlet is provided on the rear panel, in which the DC fan is fixedly connected. The base connects to the bottom edge to form the air inlet, and the base is fixedly connected to a foot at the bottom.

[0008] Furthermore, a switch button is also connected to the PCB board, and the switch button, the rear panel, the DC fan, and the control panel are all electrically connected to the PCB board.

[0009] Furthermore, the heat sink has at least two positioning protrusions on both sides of the bottom, and the positioning protrusion located at the bottom edge has a recess.

[0010] Furthermore, the second heat dissipation structure also includes a bracket, which is an elastic structure and is fixedly connected to the PCB board. The end face of the bracket has two slots, one of which has an elastic part at the bottom. The positioning protrusion engages with the slot by contact, and the elastic part stops in the recess by contact deformation.

[0011] Furthermore, the heat sink is attached to the PCB board and the components on the PCB board.

[0012] The present invention provides a power supply and heat dissipation system with the following advantages: On the one hand, the present invention uses several heat dissipation plates to absorb the heat generated by the PCB board and the components on the PCB board; on the other hand, a DC fan, in conjunction with the air inlet and outlet, discharges the heat absorbed by the heat dissipation plates to the outside of the power supply housing, effectively improving the heat dissipation efficiency and ensuring that the internal working temperature of the housing is within a suitable range, thereby improving the service life of the device and the reliability of the power supply. In addition, when installing the bracket and the heat sink, the heat sink can be installed quickly and easily by using two slots to engage the positioning protrusion and by using the elastic part to lock in the recess. Afterwards, the heat sink can be removed by the elastic part being deformed under the action of external force, which prevents it from affecting PCB board testing or maintenance. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is an exploded view of the present invention; Figure 3This is a schematic diagram of the structure of the heat sink and bracket of this utility model; Figure 4 for Figure 3 A magnified structural diagram of area A.

[0014] In the diagram: 1. Housing; 11. Base; 12. Top cover; 2. Rear panel; 3. Control panel; 4. First heat dissipation structure; 41. DC fan; 42. Air inlet; 5. PCB board; 6. Second heat dissipation structure; 61. Heat sink; 62. Positioning protrusion; 63. Recess; 64. Bracket; 65. Slot; 66. Elastic part; 7. Foot; 8. Switch button. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0016] Reference Figure 1-4 A power supply and heat dissipation system includes a housing 1, which is composed of a base 11 and a top cover 12. The top cover 12 is fixedly connected to the top of the base 11. A rear panel 2 and a control panel 3 are fixedly connected to both sides of the housing 1, and a first heat dissipation structure 4 is provided between the rear panel 2 and the housing 1. A PCB board 5 is fixedly connected inside the housing 1. The PCB board 5 is provided with a second heat dissipation structure 6, which includes a plurality of heat sinks 61. The heat sinks 61 are detachably connected to the PCB board 5.

[0017] In some embodiments, the rear panel 2 is used to fix the power input interface, and the control panel 3 includes a display screen, buttons, knobs and output terminals. The power supply of this application is an adjustable DC power supply in the prior art, which consists of an input section, a rectification and filtering section, a conversion and adjustment section, an output section and a display section, etc. The specific internal structure and connection method have not been improved, and are all common knowledge known to those skilled in the art, so they will not be described in detail here.

[0018] Furthermore, the first heat dissipation structure 4 includes a DC fan 41 and an air inlet 42. The rear panel 2 is provided with an air outlet, and the DC fan 41 is fixedly connected inside the air outlet. The base 11 connects to the bottom edge to form the air inlet 42, and the base 11 is fixedly connected to the bottom with a foot 7.

[0019] In this embodiment, the foot 7 is used to raise the height between the base 11 and the support unit, ensuring that outside air can enter the housing 1 under negative pressure. The foot 7 is also used to protect the power supply.

[0020] Specifically, the air outlet and air inlet 42, under the action of the DC fan 41, form a negative pressure inside the housing 1, and conduct the heat absorbed on the heat sink 61 through air conduction by exchanging internal and external air.

[0021] Furthermore, a switch button 8 is also connected to the PCB board 5. The switch button 8, the rear panel 2, the DC fan 41, and the control panel 3 are all electrically connected to the PCB board 5.

[0022] More specifically, the heat sink 61 has at least two positioning protrusions 62 on both sides of the bottom, and the positioning protrusion 62 located at the bottom edge has a recess 63.

[0023] In general, the second heat dissipation structure 6 also includes a bracket 64, which is an elastic structure and is fixedly connected to the PCB board 5. The end face of the bracket 64 has two slots 65, and one of the slots 65 has an elastic part 66 at the bottom. The positioning protrusion 62 engages with the slot 65 by contact, and the elastic part 66 stops in the recess 63 by contact deformation.

[0024] In this embodiment, the bracket 64 is preferably made of a material with deformation capabilities such as rubber or plastic, and can be fixed to the PCB board 5 by means of adhesive. In the prior art, heavy components with few or tall pins, such as large electrolytic capacitors and inductors, are fixed to the PCB board by adhesive. Organic silicone, epoxy resin, etc. can be used for bonding to prevent melting at high temperatures and unstable fixation. This technical means is common knowledge to those skilled in the art and will not be described in detail here. Specifically, under normal circumstances, the two positioning protrusions 62 can be directly accommodated in the slot 65 by snapping together, but if Figure 4 As shown, a small portion of the movable end of the elastic part 66 extends into the corresponding slot 65, and the positioning protrusion 62 will encounter resistance during installation. More specifically, by slightly tilting the heat sink 61, the positioning protrusion 62 at the top can be driven to engage in the slot 65. Then, when the heat sink 61 is straightened, the positioning protrusion 62 at the bottom abuts against the movable end of the elastic part 66, and the elastic part 66 deforms under force and gets stuck in the recess 63. Therefore, because the two side walls of the heat sink 61 abut against the elastic part 66 and the bracket 64 respectively, the fixing function is achieved; It is worth mentioning that by slightly bending the heat sink 61, the heat sink 61 can be removed after the elastic part 66 deforms under force and disengages from the recessed part 63.

[0025] Finally, the heat sink 61 is attached to the PCB board 5 and the components on the PCB board 5.

[0026] Heat sink 61 is a heat dissipation fin in the prior art, used to absorb the heat generated by the PCB board 5 and the components on the PCB board; Of course, under normal circumstances, the disassembly and assembly of heat sink 61 should be carried out without affecting the components.

[0027] Operating mode: When the power supply is running normally, the DC fan 41 can be switched on and off through the control panel 3. The DC fan 41, together with the air inlet 42 and the air outlet, transmits the heat absorbed on the heat sink 61 through the exchange of internal and external air to achieve the purpose of heat dissipation and cooling. When assembling or disassembling the heat sink 61, the positioning protrusion 62 on the top can be driven to engage in the slot 65 by tilting the heat sink 61 slightly. Then, when the heat sink 61 is straightened, the positioning protrusion 62 on the bottom abuts against the movable end of the elastic part 66. The elastic part 66 deforms under force and gets stuck in the recessed part 63, thus fixing it. Furthermore, by slightly bending the heat sink 61, once the elastic part 66 deforms under force and disengages from the recessed part 63, the heat sink 61 can be removed.

[0028] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A power supply and heat dissipation system, comprising a housing (1), characterized in that: The housing (1) is composed of a base (11) and a top cover (12). The top cover (12) is fixedly connected to the top of the base (11). A rear panel (2) and a control panel (3) are fixedly connected to both sides of the housing (1). A first heat dissipation structure (4) is provided between the rear panel (2) and the housing (1). A PCB board (5) is fixedly connected inside the housing (1). A second heat dissipation structure (6) is provided on the PCB board (5). The second heat dissipation structure (6) includes a plurality of heat sinks (61). The heat sinks (61) are detachably connected to the PCB board (5).

2. The power supply and heat dissipation system according to claim 1, characterized in that: The first heat dissipation structure (4) includes a DC fan (41) and an air inlet (42). The rear panel (2) is provided with an air outlet, and the DC fan (41) is fixedly connected inside the air outlet. The base (11) is connected to the bottom edge to form the air inlet (42), and the base (11) is fixedly connected to the bottom with a foot (7).

3. The power supply and heat dissipation system according to claim 2, characterized in that: The PCB board (5) is also connected to a switch button (8), and the switch button (8), the rear panel (2), the DC fan (41) and the control panel (3) are all electrically connected to the PCB board (5).

4. The power supply and heat dissipation system according to claim 1, characterized in that: The heat sink (61) has at least two positioning protrusions (62) on both sides of the bottom, and the positioning protrusion (62) located at the bottom has a recess (63) at the bottom edge.

5. The power supply and heat dissipation system according to claim 4, characterized in that: The second heat dissipation structure (6) also includes a bracket (64), which is an elastic structure and is fixedly connected to the PCB board (5). The end face of the bracket (64) has two slots (65), and one of the slots (65) has an elastic part (66) at the bottom. The positioning protrusion (62) engages with the slot (65) by contact, and the elastic part (66) stops in the recess (63) by contact deformation.

6. The power supply and heat dissipation system according to claim 1, characterized in that: The heat sink (61) is attached to the PCB board (5) and the components on the PCB board (5).

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