TFT heat dissipation structure and vehicle-mounted head-up display

Abstract

The utility model relates to a TFT heat dissipation structure and vehicle-mounted head-up display, including imaging source, heat conduction silica gel layer, heat dissipation support, heat dissipation shell and fastener, imaging source includes TFT module and backlight part, and TFT module has backplate uneven structure, and the heat conduction silica gel layer appearance and TFT module's backplate uneven structure are in accord with and directly adhere to each other, and heat dissipation support is metal material, has first surface and second surface, and first surface is closely adhered with heat conduction silica gel layer, and heat dissipation shell is metal material, and fastener is connected tightly with the second surface of heat dissipation support and heat dissipation shell, so that heat dissipation support constitutes the mechanical support to TFT module, and the heat conduction path from TFT module to heat dissipation shell is formed in common. The utility model provides a TFT heat dissipation structure and vehicle-mounted head-up display, and through the synergies of multiple components realize efficient thermal management and mechanical stability.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for vehicle electronic devices, and more specifically, to a TFT heat dissipation structure and a vehicle head-up display. Background Technology

[0002] With the continuous improvement of automotive intelligence, head-up displays (HUDs) have become an important component of modern vehicle human-machine interfaces. To meet the demands for better visual effects and information presentation, in-vehicle HUDs are constantly evolving towards higher display brightness, wider field of view, and higher image resolution. This development trend leads to a corresponding increase in the power consumption of the TFT LCD screen, which is the core imaging source of the system, resulting in a significant increase in the heat generated during its operation.

[0003] TFT LCD screens are inherently sensitive to ambient temperature. When temperatures remain high, display performance and long-term reliability may be affected. Specifically, sustained high temperatures can cause changes in the response characteristics of the liquid crystal material, leading to decreased display contrast or image retention. Simultaneously, critical optical components within the screen, such as polarizers, may show signs of aging under prolonged heat loads, affecting optical performance and display uniformity. Furthermore, the luminous efficiency of the backlight components may also change with increasing temperature; maintaining stable display output may require increasing the drive current, which could further exacerbate internal temperature rise.

[0004] In practical applications of automotive head-up displays (HUDs), the internal space is typically extremely limited, imposing strict constraints on the size and thickness of the heat dissipation solution. Traditional heat dissipation designs often face inherent challenges when dealing with TFT display modules. In particular, the backplane surface of a TFT display is often not flat, but rather has protrusions and height differences formed by various electronic components and circuit traces. This uneven backplane structure makes it difficult for conventional planar heat sinks to achieve sufficient and uniform physical contact, resulting in gaps at the heat conduction interface, increased thermal resistance, and reduced heat dissipation efficiency. Existing heat dissipation solutions may rely on thermal management at the backlight module side or the introduction of active cooling components such as fans. The former has limited direct heat dissipation effect on the TFT display body, while the latter may introduce additional energy consumption, operating noise, and potential reliability issues due to wear of moving parts. Therefore, the industry desires a heat dissipation structure that can effectively fill and tightly fit to adapt to the uneven characteristics of the TFT display backplane, achieving efficient and uniform thermal management within a compact space to ensure stable display performance and long-term system reliability. Utility Model Content

[0005] In view of this, the present invention provides a TFT heat dissipation structure that achieves efficient thermal management and mechanical stability through the synergistic effect of multiple components.

[0006] The objective of this utility model is achieved through the following technical solution: A TFT heat dissipation structure, comprising: The imaging source includes a TFT module and a backlight component. The TFT module has a non-flat backplate structure. The thermally conductive silicone layer has a shape that matches the non-flat structure of the backplate of the TFT module and is directly bonded to it; The heat dissipation bracket is made of metal and has a first surface and a second surface, wherein the first surface is in close contact with the thermally conductive silicone layer. The heat dissipation housing is made of metal. And fasteners, which fasten the second surface of the heat sink bracket to the heat sink housing, so that the heat sink bracket provides mechanical support for the TFT module and together forms a heat conduction path from the TFT module to the heat sink housing.

[0007] Non-flat backplane structures are common in TFT modules in practical applications. Due to the protrusions of components and circuits, traditional heat dissipation solutions often struggle to achieve sufficient contact, leading to increased thermal resistance and uneven heat dissipation. The morphology of the thermally conductive silicone layer conforms to the non-flat backplane structure, filling irregular gaps and ensuring a tight fit between the heat source and the heat dissipation path, thereby reducing thermal resistance and improving heat transfer efficiency. The heat sink bracket is made of metal with high thermal conductivity. Its first surface is tightly bonded to the thermally conductive silicone layer, further promoting heat diffusion from the TFT module outwards; the second surface is connected to the heat sink housing via fasteners, forming a stable mechanical fixation and thermal interface. This connection method allows the heat sink bracket to not only act as a heat conduction medium but also provide mechanical support, enhancing the rigidity of the overall structure and preventing loosening or deformation under vehicle vibration environments. The heat sink housing is also made of metal, expanding the heat dissipation area and dissipating heat to a wider area, such as the HUD's internal space or the external environment, thus preventing heat accumulation in localized areas. The entire heat conduction path extends from the TFT module through the thermally conductive silicone layer and the heat sink bracket to the heat sink housing, achieving continuous and efficient heat transfer and significantly reducing the operating temperature of the TFT module. This integrated design reduces the need for additional heat dissipation components, optimizes space utilization, and is particularly suitable for the ultra-thin installation environment of automotive HUDs.

[0008] The thermally conductive silicone layer must simultaneously possess the following characteristics to optimize thermal management and structural compatibility: 1) High thermal conductivity: Its thermal conductivity is not less than 1.0 W / (m·K), preferably in the range of 1.5 W / (m·K) to 3.0 W / (m·K), to ensure that heat can be efficiently dissipated from the TFT module; 2) Suitable softness and compressibility: Its hardness tester reading (Shore 00 scale) is between 30 and 60, and its compression set (tested according to standard methods, such as 70℃×22h) is not greater than 30%, thereby ensuring that it can fully deform under installation pressure to fill all gaps and form the maximum effective contact area with the contact surface, while maintaining resilience and contact pressure during long-term use. 3) Good insulation: Its volume resistivity is not less than 1.0×10¹²Ω·cm to ensure electrical isolation between the circuit on the back of the TFT module and the metal heat sink bracket.

[0009] Preferably, the first surface of the heat dissipation bracket is provided with a groove, and the thermally conductive silicone layer is attached to the groove.

[0010] The positioning and fixation of the thermally conductive silicone layer are optimized through the groove structure on the first surface of the heat sink bracket. The groove provides precise accommodating space, ensuring stable alignment of the thermally conductive silicone layer during installation, preventing displacement or deformation, and thus maintaining continuous and tight contact with the TFT module backplane. This design reduces the need for adjustments during assembly, simplifies the manufacturing process, and enhances the reliability of the thermal interface. Because the shape of the groove matches the thermally conductive silicone layer, the heat conduction path is more uniform, avoiding the formation of localized hot spots and improving overall heat dissipation efficiency.

[0011] Preferably, the TFT module is fixed to the heat sink bracket by adhesive.

[0012] The TFT module is fixed to the heat sink using adhesive bonding, achieving uniform stress distribution and stable mechanical connection. The adhesive fills the microscopic gaps between the TFT module and the heat sink, forming a continuous bonding surface. This not only enhances the overall structural integrity but also facilitates lateral heat conduction, reducing thermal resistance. This fixing method avoids localized stress concentrations that can occur with rigid fasteners, reducing the risk of damage to the TFT module under temperature changes or mechanical vibration. The adhesive installation process is simple and efficient, suitable for automated production, and improves assembly accuracy and consistency.

[0013] Preferably, the heat dissipation housing is the main frame of the vehicle head-up display.

[0014] Defining the heat sink housing as the main frame of the vehicle head-up display achieves functional integration and space optimization. By utilizing the existing structure as a heat sink, the need for additional heat dissipation components is reduced, lowering the overall system complexity and weight. The main frame typically has a large surface area and structural strength, effectively dissipating heat and distributing mechanical loads, thereby improving heat dissipation efficiency and reliability. This integrated design simplifies the assembly process, reduces connection interfaces, and lowers thermal resistance and potential failure points.

[0015] Preferably, the fastener is a screw.

[0016] Using screws as fasteners provides a reliable and adjustable mechanical connection. Screw connections generate uniform clamping force, ensuring tight contact between the heatsink bracket and the heatsink housing, thereby reducing contact thermal resistance and promoting efficient heat transfer. This connection method facilitates installation and disassembly, supports maintenance and commissioning processes, and allows for adjustments to the tightening force to accommodate different thermal expansion or vibration conditions. Screws, as standardized components, are inexpensive and widely available, helping to reduce production costs and improve manufacturing efficiency.

[0017] Preferably, the thickness of the thermally conductive silicone layer is 0.5 mm to 1.5 mm.

[0018] The thickness range of the thermally conductive silicone layer is limited to achieve a balance between thermal management and structural compatibility. An appropriate thickness can fully fill the uneven areas of the TFT module backplane, ensuring a gap-free fit, thereby maximizing the effective contact area, reducing thermal resistance, and improving heat conduction efficiency. At the same time, this thickness range avoids redundant space occupation or increased thermal inertia caused by excessive material thickness, supporting ultra-thin design requirements.

[0019] Preferably, the heat dissipation bracket is made of aluminum alloy or copper alloy.

[0020] Aluminum or copper alloys are selected as the materials for the heat sink bracket, taking full advantage of their high thermal conductivity and lightweight properties. These metals can quickly absorb and dissipate heat, transferring it from the TFT module through the thermally conductive silicone layer to the heat sink bracket, reducing heat accumulation and effectively controlling temperature rise. Aluminum and copper alloys also have good mechanical strength, capable of withstanding vibrations and impacts in the automotive environment, ensuring that the heat sink bracket maintains structural integrity and functional stability during long-term use.

[0021] Preferably, the heat dissipation housing is made of aluminum alloy or copper alloy.

[0022] The heat sink housing is specified to be made of aluminum or copper alloy, whose high thermal conductivity promotes rapid heat dissipation. By conducting heat from the heat sink bracket to the housing and utilizing its large surface area for radiation or convection to the surrounding environment, overall heat dissipation efficiency is improved. The lightweight properties of aluminum and copper alloys help reduce system weight, aligning with the lightweight trend in automotive applications, while their durability ensures that the housing maintains its performance under high temperature, humidity, or vibration conditions.

[0023] Preferably, the heat dissipation structure is an all-solid-state passive heat dissipation structure, without any moving parts.

[0024] The design emphasizes a fully solid-state, passive cooling structure with no moving parts, thus eliminating the risks associated with mechanical movement. This design avoids noise and vibration from components such as fans or pumps, improving the user experience, and is particularly suitable for quiet automotive environments. Passive cooling relies on material conduction and natural convection, reducing energy consumption and complex control systems, and improving energy efficiency and reliability. The absence of moving parts means lower wear and failure rates, extending overall lifespan and reducing maintenance requirements.

[0025] Preferably, an in-vehicle head-up display includes the TFT heat dissipation structure described above.

[0026] Integrating the aforementioned TFT heat dissipation structure into the automotive head-up display (HUD) allows the entire display to benefit from efficient thermal management. By employing this heat dissipation structure, the operating temperature of the TFT module is effectively controlled, reducing display problems caused by high temperatures, such as brightness degradation, color deviation, or image retention, thereby improving image quality and visual consistency. The display's reliability is also enhanced, as the stable temperature environment slows down the aging of the liquid crystal material and optical components, extending the lifespan of critical components. This integration supports a compact and lightweight design, adapting to the constraints of automotive space and simplifying the production and assembly process.

[0027] The advantages of this utility model compared to the prior art are: Compared with some existing technical solutions, the TFT heat dissipation structure of this utility model exhibits many beneficial effects.

[0028] The core of this structure lies in the use of a thermally conductive silicone layer whose morphology conforms to the non-flat structure of the TFT module backplane. This layer adaptively fills the physical gaps caused by component and circuit layout, achieving a tight fit between the thermal interface and the heat source surface. This core thermal conduction mechanism works effectively regardless of whether the heat sink surface has auxiliary positioning grooves. This adaptable design helps reduce contact thermal resistance, creating conditions for efficient heat dissipation from the TFT module to subsequent heat dissipation components.

[0029] The metal heat sink bracket maintains close contact with the aforementioned thermally conductive silicone layer and is securely connected to the metal heat sink housing via fasteners. This construction method ensures that the heat sink bracket not only serves as a crucial link in the heat conduction path, rapidly dissipating heat laterally to prevent localized overheating, but also provides stable mechanical support for the TFT module. This design, which integrates an efficient heat conduction path with reliable mechanical support, helps improve the structural integrity and long-term operational stability of the entire component under automotive vibration environments.

[0030] The entire heat dissipation path starts from the TFT module, passes through the thermally conductive silicone layer and the heat sink bracket, and finally reaches the heat sink housing, forming a continuous heat transfer channel with low thermal resistance. The heat sink housing can utilize its relatively large surface area to dissipate heat into the surrounding space. This integrated thermal management approach helps to effectively control the operating temperature of the TFT module within a limited installation space.

[0031] This heat dissipation structure does not rely on moving parts such as fans and pumps during operation, and is a form of all-solid-state passive cooling. This helps to avoid audible noise caused by the operation of moving parts, reduces the impact of mechanical vibration, and eliminates related wear problems, thus giving the system advantages in terms of quiet operation and long-term reliability.

[0032] This structure's adaptability to non-flat TFT module backplanes allows it to handle potential backplane contour differences between different models or batches of TFT modules. This provides a feasible solution to the common problem of poor heat sink contact caused by irregular backplane structures, helping to ensure the uniformity and consistency of heat dissipation performance, thereby supporting stable display quality.

[0033] In summary, the design of this heat dissipation structure aims to address the heat dissipation requirements of TFT modules in automotive head-up displays under specific space and structural constraints. Its compactness, adaptability, passive heat dissipation characteristics, and integrated structural design make it likely to play a positive role in improving the overall performance and reliability of the display system. Attached Figure Description

[0034] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a structural diagram of a TFT heat dissipation structure according to an embodiment of the present invention.

[0036] Figure 2 This is a structural diagram of a TFT heat dissipation structure according to an embodiment of the present invention from another perspective.

[0037] Figure 3 This is an exploded view of a TFT heat dissipation structure according to an embodiment of the present invention.

[0038] Labeling explanation: 1 TFT module, 2 thermal conductive silicone layer, 3 heat dissipation bracket, 4 heat dissipation housing, 5 backlight part. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0040] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0041] It should be noted that similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. In the description of the embodiments of this application, it should be understood that the terms "upper," "lower," "left," "right," "vertical," "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the figures, or the orientation or positional relationship commonly used when the product of this application is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0042] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0043] The technical solutions in this application will now be described with reference to the accompanying drawings.

[0044] Example 1: A TFT heat dissipation structure for automotive head-up displays

[0045] This embodiment provides a TFT heat dissipation structure for an in-vehicle head-up display, including: The imaging source includes a TFT module 1 and a backlight portion 5. The TFT module 1 has a non-flat backplate structure. The thermally conductive silicone layer 2 is made of a thermally conductive material with good shaping ability. Its shape is customized to fit the non-flat structure of the back plate of the TFT module and directly adhere to it to fill irregular gaps. The heat dissipation bracket 3 is made of metal and has a first surface and a second surface. The first surface is in close contact with the thermally conductive silicone layer 2. Heat dissipation housing 4 is made of metal; In addition, fasteners are used to fasten the second surface of the heat sink bracket 3 to the heat sink housing 4, so that the heat sink bracket 3 constitutes a mechanical support for the TFT module 1 and together forms a heat conduction path from the TFT module 1 to the heat sink housing 4.

[0046] The non-flat backplane structure of TFT module 1 is common in practical applications. Due to the presence of component and circuit protrusions, traditional heat dissipation solutions often struggle to achieve sufficient contact, leading to increased thermal resistance and uneven heat dissipation. The morphology of the thermally conductive silicone layer 2 matches the non-flat backplane structure, filling irregular gaps and ensuring a tight fit between the heat source and the heat dissipation path, thereby reducing thermal resistance and improving heat conduction efficiency. The heat sink bracket 3 is made of metal with high thermal conductivity. Its first surface is tightly bonded to the thermally conductive silicone layer 2, further promoting heat diffusion from TFT module 1 outwards; the second surface is connected to the heat sink housing 4 via fasteners, forming a stable mechanical fixation and thermal interface. This connection method allows the heat sink bracket 3 to not only act as a heat conduction medium but also provide mechanical support, enhancing the rigidity of the overall structure and preventing loosening or deformation under vehicle vibration environments. The heat sink housing 4 is also made of metal, expanding the heat dissipation area and dissipating heat to a wider area, such as the HUD's internal space or the external environment, thus preventing heat accumulation in localized areas. The entire heat conduction path extends from the TFT module 1 through the thermally conductive silicone layer 2, the heat sink bracket 3, and the heat sink housing 4, achieving continuous and efficient heat transfer and significantly reducing the operating temperature of the TFT module 1. This integrated design reduces the need for additional heat dissipation components, optimizes space utilization, and is particularly suitable for the ultra-thin installation environment of automotive HUDs. Furthermore, this passive structure requires no external power source, improving system reliability and durability. By combining thermal management and mechanical support, this solution effectively mitigates the display performance degradation caused by high temperatures, such as liquid crystal material aging or brightness decay, while meeting the requirements of automotive-grade applications for compactness, quiet operation, and long lifespan.

[0047] In this embodiment, the selected thermally conductive silicone layer 2 is a thermally conductive silicone pad with a thickness of approximately 1.0 mm. Its specific material properties are as follows: Thermal conductivity: approximately 2.0 W / (m·K). This parameter ensures that heat can be quickly transferred from TFT module 1 to heat sink 3, effectively reducing interface thermal resistance.

[0048] Hardness: Approximately Shore 0045. This hardness range makes the silicone pad soft enough to adaptively fill the height difference (typically between 0.1mm and 0.5mm) caused by components and traces on the TFT module 1 backplane under the clamping force provided by screw fastening, while also having sufficient support strength to prevent it from being over-compressed and failing under long-term compression.

[0049] Compression set: ≤25% (test conditions: 70℃, 22h). The low compression set ensures that the silicone pad maintains good resilience and continuous clamping force on the contact interface under temperature fluctuations and long-term mechanical stress in the vehicle environment, thereby maintaining long-term stable thermal conductivity.

[0050] Volume resistivity: ≥1.0×10¹³Ω·cm. This characteristic provides reliable electrical insulation between the backplane circuit of TFT module 1 and the metal heat sink 3, preventing the risk of short circuit.

[0051] Through the synergistic effect of the above characteristics, the thermally conductive silicone layer 2 achieves low thermal resistance thermal conductivity, perfectly solves the contact problem caused by the non-flatness of the TFT backplane, and provides necessary electrical safety isolation.

[0052] As a further optimization of the above-mentioned basic solution to improve assembly convenience and interface stability, a groove may be provided on the first surface of the heat sink bracket, and the thermally conductive silicone layer is attached to the groove. It can be understood that, without providing a groove, close thermal contact with the first surface of the heat sink bracket can also be achieved through the deformation and adhesion of the thermally conductive silicone layer itself, or with the help of external clamping force.

[0053] The positioning and fixation of the thermally conductive silicone layer 2 are optimized through the groove structure on the first surface of the heat sink bracket 3. The groove provides precise accommodating space, ensuring that the thermally conductive silicone layer 2 remains stably aligned during installation, preventing displacement or deformation, thereby maintaining continuous and tight contact with the backplate of the TFT module 1. This design reduces the need for adjustments during assembly, simplifies the manufacturing process, and enhances the reliability of the thermal interface. Because the groove matches the shape of the thermally conductive silicone layer 2, the heat conduction path is more uniform, avoiding the formation of localized hot spots and improving overall heat dissipation efficiency. Simultaneously, the groove structure helps control the compression degree of the thermally conductive silicone layer 2, ensuring effective adhesion even under automotive vibration environments, further enhancing the durability and thermal performance consistency of the structure.

[0054] In this embodiment, the TFT module 1 is fixed to the heat sink bracket 3 by adhesive.

[0055] The TFT module 1 is fixed to the heat sink bracket 3 using adhesive bonding, achieving uniform stress distribution and stable mechanical connection. The adhesive fills the microscopic gaps between the TFT module 1 and the heat sink bracket 3, forming a continuous bonding surface. This not only enhances the overall structural integrity but also facilitates lateral heat conduction, reducing thermal resistance. This fixing method avoids localized stress concentration that can occur with rigid fasteners, reducing the risk of damage to the TFT module 1 under temperature changes or mechanical vibration. The adhesive installation process is simple and efficient, suitable for automated production, and improves assembly accuracy and consistency. Furthermore, the choice of adhesive balances thermal conductivity and bond strength, further optimizing thermal management and ensuring long-term reliability of the components in harsh automotive environments.

[0056] In this embodiment, the heat dissipation housing 4 is the main frame of the vehicle head-up display.

[0057] Defining the heat sink housing 4 as the main frame of the vehicle head-up display (HUD) achieves functional integration and space optimization. By utilizing the existing structure as a heat sink, the need for additional heat dissipation components is reduced, lowering the overall system complexity and weight. The main frame typically has a large surface area and structural strength, effectively dissipating heat and distributing mechanical loads, thereby improving heat dissipation efficiency and reliability. This integrated design simplifies the assembly process, reduces connection interfaces, and lowers thermal resistance and potential failure points. Simultaneously, it fully utilizes the internal space of the vehicle HUD, supports a compact layout, adapts to the stringent size and weight constraints of automotive applications, and enhances the overall stability and aesthetics of the system.

[0058] In this embodiment, the fastener is a screw.

[0059] The use of screws as fasteners provides a reliable and adjustable mechanical connection. Screw connections generate uniform clamping force, ensuring tight contact between the heat sink bracket 3 and the heat sink housing 4, thereby reducing contact thermal resistance and promoting efficient heat transfer. This connection method facilitates installation and disassembly, supports maintenance and adjustment processes, and allows for adjustments to the tightening force to accommodate different thermal expansion or vibration conditions. Screws, as standardized components, are inexpensive and widely available, helping to reduce production costs and improve manufacturing efficiency. Furthermore, screw connections offer high mechanical stability, maintaining long-term firmness in dynamic automotive environments and reducing thermal performance degradation or structural failure due to loosening.

[0060] In this embodiment, the thickness of the thermally conductive silicone layer 2 is 0.5 mm to 1.5 mm.

[0061] The thickness range of the thermally conductive silicone layer 2 is limited to achieve a balance between thermal management and structural compatibility. An appropriate thickness can fully fill the uneven areas of the TFT module 1 backplane, ensuring a gap-free fit, thereby maximizing the effective contact area, reducing thermal resistance, and improving heat conduction efficiency. Simultaneously, this thickness range avoids redundant space occupation or increased thermal inertia caused by excessive material thickness, supporting ultra-thin design requirements. It can also adapt to irregular variations in backplane contours, providing sufficient flexibility and compressibility to cope with temperature changes and mechanical stress, maintaining long-term performance stability. This optimized thickness helps control material costs and production consistency, ensuring reliable operation of the heat dissipation solution under various automotive conditions.

[0062] In this embodiment, the heat dissipation bracket 3 is made of aluminum alloy or copper alloy.

[0063] Aluminum or copper alloys are selected as the materials for the heat sink bracket 3, fully utilizing their high thermal conductivity and lightweight properties. These metals can quickly absorb and dissipate heat, transferring it from the TFT module 1 through the thermally conductive silicone layer 2 to the heat sink bracket 3, reducing heat accumulation and effectively controlling temperature rise. Aluminum and copper alloys also possess good mechanical strength, capable of withstanding vibrations and impacts in the automotive environment, ensuring the heat sink bracket 3 maintains structural integrity and functional stability during long-term use. Furthermore, these materials are easily processed into complex shapes, such as grooved designs, supporting customized production, and their corrosion resistance can be enhanced through surface treatment. Their widespread application reduces raw material costs and meets environmental requirements, achieving a good balance between economy and performance in the heat dissipation solution.

[0064] In this embodiment, the heat dissipation housing 4 is made of aluminum alloy or copper alloy.

[0065] The heat sink housing 4 is specified to be made of aluminum or copper alloy, whose high thermal conductivity promotes rapid heat dissipation. By conducting heat from the heat sink bracket 3 to the housing and utilizing its large surface area for radiation or convection to the surrounding environment, overall heat dissipation efficiency is improved. The lightweight properties of aluminum and copper alloys help reduce system weight, aligning with the lightweight trend in automotive applications, while their durability ensures the housing maintains performance under high temperature, humidity, or vibration conditions. This material choice also supports compatibility with other components, such as improving insulation or aesthetics through surface treatments, further optimizing the reliability and integration of the heat dissipation structure to meet diverse automotive HUD design requirements.

[0066] In this embodiment, the heat dissipation structure is an all-solid-state passive heat dissipation structure, which does not contain moving parts.

[0067] The design emphasizes a fully solid-state, passive cooling structure with no moving parts, thus eliminating the risks associated with mechanical movement. This design avoids noise and vibration from components such as fans or pumps, improving the user experience, and is particularly suitable for quiet automotive environments. Passive cooling relies on material conduction and natural convection, reducing energy consumption and complex control systems, improving energy efficiency and reliability. The absence of moving parts means lower wear and failure rates, extending overall lifespan and reducing maintenance requirements. This simplified system architecture reduces potential points of failure, enabling stable operation even under harsh conditions such as temperature fluctuations or dusty environments, meeting the stringent requirements of automotive-grade applications for high reliability and long lifespan.

[0068] Example 2: A TFT heat dissipation structure for automotive head-up displays (an alternative to groove-less designs)

[0069] This embodiment is an alternative to Embodiment 1. Its basic structure and component connection relationship are the same as those of Embodiment 1. The difference is that the first surface of the heat dissipation bracket 3 is a flat surface or has a slightly raised structure, and no groove is provided for accommodating the thermally conductive silicone layer 2.

[0070] In this embodiment, the thermally conductive silicone layer 2, due to its plasticity and adhesiveness, is directly attached between the non-flat backplate of the TFT module 1 and the flat first surface of the heat sink bracket 3. When the heat sink bracket 3 is locked to the heat sink housing 4 by fasteners (such as screws), the resulting clamping force forces the thermally conductive silicone layer 2 to deform sufficiently, so that it fully conforms to the non-flat structure of the backplate of the TFT module 1 on the one hand, and forms a large-area close contact with the flat surface of the heat sink bracket 3 on the other hand. Adhesive bonding of the TFT module 1 also helps to maintain this close contact.

[0071] This embodiment demonstrates that even without relying on the grooves on the heat sink support, an efficient heat conduction path from the TFT module to the heat sink housing can still be achieved through the inherent properties of the thermally conductive silicone layer material and the assembly pressure of the system, thus forming a stable mechanical support. This provides flexibility for implementing the present invention under different process and cost requirements.

[0072] Example 3: A vehicle-mounted head-up display

[0073] This embodiment provides a vehicle-mounted head-up display, including the TFT heat dissipation structure described above.

[0074] Integrating a TFT heat dissipation structure into the automotive head-up display (HUD) allows the entire display to benefit from efficient thermal management. By employing this heat dissipation structure, the operating temperature of TFT module 1 is effectively controlled, reducing display problems caused by high temperatures, such as brightness degradation, color deviation, or image retention, thereby improving image quality and visual consistency. The display's reliability is also enhanced, as the stable temperature environment slows down the aging of liquid crystal materials and optical components, extending the lifespan of critical components. This integration supports a compact and lightweight design, adapting to the constraints of automotive space and simplifying the production and assembly process. Ultimately, it contributes to a more stable, durable, and user-friendly HUD system, meeting the high-performance and long-life requirements of modern smart cars.

[0075] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A TFT heat dissipation structure, characterized in that, include: The imaging source includes a TFT module (1) and a backlight portion (5), wherein the TFT module (1) has a non-flat backplate structure; The thermally conductive silicone layer (2) has a shape that matches the non-flat structure of the back plate of the TFT module (1) and is directly attached to it; The heat dissipation bracket (3) is made of metal and has a first surface and a second surface. The first surface is in close contact with the thermally conductive silicone layer (2). The heat dissipation housing (4) is made of metal. And fasteners, to fasten the second surface of the heat sink bracket (3) to the heat sink housing (4), so that the heat sink bracket (3) constitutes a mechanical support for the TFT module (1) and together forms a heat conduction path from the TFT module (1) to the heat sink housing (4).

2. The TFT heat dissipation structure according to claim 1, characterized in that, The first surface of the heat dissipation bracket (3) is provided with a groove, and the thermally conductive silicone layer (2) is attached to the groove.

3. The TFT heat dissipation structure according to claim 1, characterized in that, The TFT module (1) is fixed to the heat sink bracket (3) by adhesive.

4. The TFT heat dissipation structure according to claim 1, characterized in that, The heat dissipation housing (4) is the main frame of the vehicle head-up display where the TFT heat dissipation structure is located.

5. The TFT heat dissipation structure according to claim 1, characterized in that, The fastener is a screw.

6. The TFT heat dissipation structure according to claim 1, characterized in that, The thickness of the thermally conductive silicone layer (2) is 0.5 mm to 1.5 mm.

7. The TFT heat dissipation structure according to claim 1, characterized in that, The heat dissipation bracket (3) is made of aluminum alloy or copper alloy.

8. The TFT heat dissipation structure according to claim 1, characterized in that, The heat dissipation housing (4) is made of aluminum alloy or copper alloy.

9. The TFT heat dissipation structure according to claim 1, characterized in that, The heat dissipation structure is an all-solid-state passive heat dissipation structure with no moving parts.

10. A vehicle-mounted head-up display, characterized in that, Includes the TFT heat dissipation structure as described in any one of claims 1 to 9.

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