Intelligent terminal equipment heat dissipation device

Abstract

The utility model relates to intelligent terminal equipment heat dissipation technical field especially, and it is a kind of intelligent terminal equipment heat dissipation device, a kind of intelligent terminal equipment heat dissipation device, including shell, radial flow fan and heat dissipation subassembly, the first air cavity and the second air cavity that are connected are equipped in the shell, the first air cavity is located the below of the second air cavity, the shell is equipped with the first air port that is connected to the first air cavity and the second air port that is connected to the second air cavity, the first air port and the second air port are towards horizontal direction setting, the heat dissipation subassembly is located the first air cavity, the radial flow fan is located in the second air cavity;Summarized above, when intelligent terminal equipment is placed in desktop or support, air is taken in and discharged from the side of shell, desktop and support are less to the influence of air flow, and the heat dissipation efficiency of intelligent terminal equipment heat dissipation device cannot therefore significantly drop, so that intelligent terminal equipment heat dissipation device maintains with good heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for smart terminal devices, and in particular to a heat dissipation device for smart terminal devices. Background Technology

[0002] Currently, with the rapid development of mobile communication technology and the continuous upgrading of the functions of smart terminal devices, the power consumption of chips and core components of smart terminal devices has increased significantly in high-frequency scenarios such as 5G communication, high refresh rate displays, and large-scale game operation, resulting in a large amount of heat generation. If the heat cannot be dissipated in time, it will lead to problems such as frequency reduction, lag, and shortened battery life in smart terminal devices. Long-term high temperatures will also accelerate hardware aging and affect the lifespan of smart terminal devices. To address the heat dissipation issues of smart devices, some manufacturers have introduced external smart device heat sinks. These heat sinks are installed on the back of the smart device and use an internal axial fan to draw in air from the side and exhaust it from the back, accelerating airflow and creating air convection to dissipate heat. However, when users are working or watching movies, they often place the smart device with the external heat sink on a desktop or stand. In this situation, the back of the heat sink is close to the desktop or stand, sometimes even in contact, which obstructs the air outlet, preventing smooth airflow and significantly reducing heat dissipation efficiency. Utility Model Content

[0003] The purpose of this utility model is to provide a heat dissipation device for smart terminal devices, in order to solve the technical problem that the back of the heat sink of a smart terminal device is too close to the desktop or stand, or even in contact with it, which causes the air outlet to be blocked, the air cannot be discharged smoothly, the airflow convection channel is obstructed, and thus the heat dissipation efficiency is significantly reduced.

[0004] To achieve the above objectives, this utility model provides a heat dissipation device for a smart terminal device, including a housing, a radial fan, and a heat dissipation component. The housing has a first air cavity and a second air cavity that are connected to each other. The first air cavity is located below the second air cavity. The housing has a first air outlet connected to the first air cavity and a second air outlet connected to the second air cavity. The first air outlet and the second air outlet are arranged in a horizontal direction. The heat dissipation component is disposed in the first air cavity, and the radial fan is disposed in the second air cavity and is arranged corresponding to the second air outlet.

[0005] Optionally, the housing includes an outer shell and an inner shell, the inner shell being disposed inside the outer shell, the outer shell being surrounded to form the first air cavity, the inner shell being surrounded to form the second air cavity, the outer side wall of the outer shell being provided with a third air outlet corresponding to the second air outlet, and the inner side wall of the outer shell and the outer side wall of the inner shell being provided with an internal space.

[0006] Optionally, a partition plate is also included, which is disposed on the outside of the connection between the first air cavity and the second air cavity, and the partition plate is used to isolate the first air cavity and the internal space.

[0007] Optionally, the connection between the second air vent and the outer side of the housing, and / or the width of the second air vent in the vertical direction is less than 15mm; And / or, The second air vent and the connection point on the outside of the housing, and / or the second air vent is provided with a baffle net.

[0008] Optionally, the housing is provided with a tongue plate protruding in the horizontal direction, the tongue plate being located between the first air vent and the second air vent.

[0009] Optionally, the heat dissipation assembly also includes a thermoelectric cooler and a heat-conducting plate. The housing includes an outer shell and a bottom shell. The bottom of the outer shell is provided with a bottom hole. The bottom shell is installed in the bottom hole. The thermoelectric cooler and the heat-conducting plate are arranged sequentially from bottom to top on the top surface of the bottom shell.

[0010] Optionally, the heat dissipation assembly includes a plurality of first heat sinks, each of which is spaced apart. The plurality of first heat sinks extend from the first air outlet to the axis of the radial fan, and a first heat dissipation channel is formed between two adjacent first heat sinks.

[0011] Optionally, a plurality of first heat sinks are arranged around the axis of the radial flow fan. The heat dissipation assembly further includes a plurality of second heat sinks. The second heat sinks are disposed within the first heat dissipation channel. The second heat sinks extend from the first air outlet toward the axis of the radial flow fan. The second heat sinks are shorter than the first heat sinks. The second heat sinks are disposed close to the first heat dissipation channel and away from the radial flow fan on the outer side. A second heat dissipation channel is formed between the second heat sinks and the first heat sinks on both sides.

[0012] Optionally, the second air vent may be located at the connection point between the second air vent and the outer side of the housing, and / or the second air vent may be provided only on one side of the radial fan along the horizontal direction.

[0013] Optionally, the housing is further provided with a connecting hole, the two ends of which are respectively connected to the first air chamber and the second air chamber, and at least one end of the connecting hole is provided with an air guide.

[0014] Optionally, the diameter of the radial fan is larger than the diameter of the connecting hole.

[0015] Optionally, the length of the connecting hole is 2mm to 5mm.

[0016] Compared with the prior art, the heat dissipation device for intelligent terminal equipment implemented in this utility model has the following advantages: In the heat dissipation device for intelligent terminal equipment of this utility model, when the bottom surface of the housing is installed on the back of the intelligent terminal equipment, the heat emitted by the intelligent terminal equipment will be absorbed by the housing and conducted to the heat dissipation component. Furthermore, the radial fan set in the second air cavity allows air to enter from the first air inlet, pass through the first air cavity and the second air cavity in sequence, and finally be discharged from the second air inlet. When the air passes through the first air cavity, it will come into contact with the heat dissipation component and carry away the heat of the heat dissipation component. The radial fan continuously discharges air to achieve the function of continuous heat dissipation. Furthermore, both the first air inlet and the second air inlet are set in a horizontal direction. When the intelligent terminal equipment is placed on a table or stand, the air enters and exits from the side of the housing. The table and stand have little impact on the airflow, and the heat dissipation efficiency of the intelligent terminal equipment heat dissipation device will not decrease significantly as a result, so that the intelligent terminal equipment heat dissipation device maintains good heat dissipation efficiency. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the heat dissipation device for the intelligent terminal equipment of this utility model.

[0018] Figure 2 This is a front view of the heat dissipation device for the intelligent terminal equipment of this utility model.

[0019] Figure 3 for Figure 2 Sectional view of AA.

[0020] Figure 4 for Figure 2 A cross-sectional view of BB.

[0021] Figure 5 for Figure 2 A sectional view of CC.

[0022] Figure 6 This is a horizontal sectional view of the heat dissipation device of the intelligent terminal equipment of this utility model, cut along the radial fan (the second air outlet is only set on one side of the radial fan along the horizontal direction).

[0023] Reference numerals: 1. Shell; 11a. First air chamber; 11b. Second air chamber; 12a. First air outlet; 12b. Second air outlet; 12c. Third air outlet; 13. Outer shell; 131. Receiving cavity; 14. Inner shell; 15. Bottom shell; 16. Internal space; 17. Tongue plate; 18. Connecting hole; 19. Air guide; 2. Radial fan; 3. Heat dissipation assembly; 31. Semiconductor cooling chip; 32. Heat conduction plate; 33. First heat sink; 34. Second heat sink; 35. Third heat sink; 36. First heat dissipation channel; 37. Second heat dissipation channel; 38. Third heat dissipation channel; 4. Magnet; 5. Partition plate; 6. Connecting post; 7. Ear. Detailed Implementation

[0024] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0025] In the description of this utility model, it should be understood that the terms "top", "bottom", "inner", "outer", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0027] In the description of this utility model, the term "smart terminal device" refers to a mobile device with a display screen for user reading; specifically, it includes mobile phones, tablets, and portable mobile computers, etc. As technology continues to develop, it can cover other specific products that conform to the definition of smart terminal devices, and no further limitations are imposed here.

[0028] Example 1: Reference Figures 1 to 5A heat dissipation device for a smart terminal device includes a housing 1, a radial fan 2, and a heat dissipation assembly 3. The housing 1 has a first air cavity 11a and a second air cavity 11b that are connected to each other. The first air cavity 11a is located below the second air cavity 11b. The outer wall of the housing 1 has a first air outlet 12a that connects to the first air cavity 11a and a second air outlet 12b that connects to the second air cavity 11b. The first air outlet 12a and the second air outlet 12b are arranged in a horizontal direction. The heat dissipation assembly 3 is disposed in the first air cavity 11a, and the radial fan 2 is disposed in the second air cavity 11b and is arranged corresponding to the second air outlet 12b.

[0029] In the above technical solution, when the bottom surface of the housing 1 is installed on the back of the smart terminal device, the heat emitted by the smart terminal device will be absorbed by the housing 1 and conducted to the heat dissipation component 3. Furthermore, the radial fan 2 set in the second air cavity 11b allows air to enter from the first air vent 12a, pass through the first air cavity 11a and the second air cavity 11b in sequence, and finally be discharged from the second air vent 12b. When the air passes through the first air cavity 11a, it will come into contact with the heat dissipation component 3 and carry away the heat of the heat dissipation component 3. The radial fan 2 continuously discharges air to achieve the function of continuous heat dissipation. Furthermore, the first air vent 12a and the second air vent 12b are both set in the horizontal direction. When the smart terminal device is placed on a table or stand, the air enters and exits from the side of the housing 1. The table and stand have little impact on the airflow, and the heat dissipation efficiency of the smart terminal device heat dissipation device will not decrease significantly as a result, so that the smart terminal device heat dissipation device maintains good heat dissipation efficiency.

[0030] Specifically, the first air vent 12a and the second air vent 12b are disposed on the outer side wall of the housing 1. The first air vent 12a extends from the outer side wall of the housing 1 to the first air cavity 11a, and the second air vent 12b extends from the outer side wall of the housing 1 to the second air cavity 11b.

[0031] It should be noted that a radial flow fan includes a drive motor, a connecting shaft, an impeller, and multiple blades. The drive motor is connected to the impeller via the connecting shaft, and the multiple blades are distributed on the outer side wall of the impeller. Each instruction manual omits the drive motor and connecting shaft of the radial flow fan, only retaining the impeller and blades.

[0032] As an example of this embodiment, the width of the second air vent 12b in the vertical direction is less than 15mm, so as to reduce the probability of the user sticking his / her fingers into the housing 1 and touching the radial fan 2, thereby improving the safety of the product.

[0033] As an example of this embodiment, the second air vent 12b is provided with a barrier net to prevent the user from inserting their fingers into the housing 1 and touching the runoff fan 2, thereby improving the safety of the product.

[0034] As an example of this embodiment, refer to Figure 1 ,2 1, 2, and 3, the outer wall of the housing 1 is provided with a tongue plate 17 protruding in the horizontal direction. The tongue plate 17 is located between the first air vent 12a and the second air vent 12b to prevent the hot air discharged from the second air vent 12b from flowing back down to the first air vent 12a, thereby improving the heat dissipation efficiency.

[0035] As an example of this embodiment, refer to Figure 3 The heat dissipation assembly 3 also includes a semiconductor cooling chip 31 and a heat-conducting plate 32. The housing 1 includes an outer shell 13 and a bottom shell 15. The bottom of the outer shell 13 is provided with a bottom hole, and the bottom shell 15 is installed in the bottom hole. The semiconductor cooling chip 31 and the heat-conducting plate 32 are arranged sequentially from bottom to top on the top surface of the bottom shell 15.

[0036] Among them, the semiconductor cooling chip 31 is a component that achieves active cooling based on the Peltier effect. It can directly transfer heat from the housing 1 to the heat-conducting component through electrical energy, and then the heat-conducting plate 32 exchanges heat with the air, or the heat-conducting plate 32 transfers heat to the heat sink, and the heat sink exchanges heat with the air.

[0037] Additionally, the bottom shell 15 may be equipped with a magnet 4, which is used to connect to a smart terminal device. Furthermore, the magnet 4 may be snapped onto the bottom shell 15.

[0038] As an example of this embodiment, refer to Figure 4 The heat dissipation component 3 includes a plurality of first heat sinks 33, which are spaced apart. The plurality of first heat sinks 33 extend from the first air outlet 12a to the axis of the radial fan 2, and a first heat dissipation channel 36 is formed between two adjacent first heat sinks 33.

[0039] In this configuration, multiple first heat sinks 33 are arranged circumferentially at intervals, and the width of the first heat dissipation channel 36 gradually decreases. When air flows in the first air cavity 11a, the air flows through the first heat dissipation channel 36 and comes into contact with the side of the first heat sink 33. Since the contact area between the air and the first heat sink 33 is large, the air can quickly carry away the heat of the heat dissipation component 3. In addition, the heat sink can be an arc-shaped structure to further increase the contact area between the gas and the heat sink, thereby improving the heat dissipation efficiency.

[0040] In addition, the first heat sink 33 can be disposed on the top surface of the heat conduction plate 32.

[0041] As an example of this embodiment, refer to Figure 4Multiple first heat sinks 33 are arranged around the axis of the radial fan 2. The heat dissipation assembly 3 also includes multiple second heat sinks 34. The second heat sinks 34 are disposed in the first heat dissipation channel 36. The second heat sinks 34 extend from the first air outlet 12a toward the axis of the radial fan 2. The second heat sinks 34 are shorter than the first heat sinks 33. The second heat sinks 34 are located close to the first heat dissipation channel 36 and away from the radial fan. Second heat dissipation channels 37 are formed between the second heat sinks 34 and the first heat sinks 33 on both sides.

[0042] Multiple first heat sinks 33 are arranged around the axis of the radial fan 2, so that the multiple first heat sinks 33 are distributed radially in a circumferential manner. The two adjacent first heat sinks 33 are closer to the radial fan 2 and the distance between them is smaller. The width of the corresponding position of the first heat dissipation channel 36 is smaller, and the amount of air flowing through that position is less, so that it can fully contact the side of the first heat sink 33. The two adjacent first heat sinks 33 are farther away from the radial fan 2 and the distance between them is larger. The width of the corresponding position of the first heat dissipation channel 36 is larger, and the amount of air flowing through that position is more, so it is difficult to fully contact the side of the first heat sink 33. Furthermore, the second heat sink 34 is arranged between the two adjacent first heat sinks 33 and the two positions farther away from the radial fan 2, so as to divide the position of the first heat dissipation channel 36 with a larger width into a second heat dissipation channel 37, so that the air flowing through this position can contact the side of the first heat sink 33 and the side of the second heat sink 34 for heat exchange, thereby ensuring heat dissipation efficiency. In addition, following the above approach, a third heat sink 35, a fourth heat sink, and a fifth heat sink can be added to form a third heat dissipation channel 38, a fourth heat dissipation channel, and a fifth heat dissipation channel, in order to solve the problem that the heat dissipation channel width is too large, resulting in poor heat dissipation efficiency.

[0043] As an example of this embodiment, a plurality of first heat sinks 33 and a plurality of second heat sinks 34 are evenly distributed around the axis of the radial flow fan 2.

[0044] As an example of this embodiment, refer to Figure 6 The second air vent 12b is provided only on one side of the radial fan 2 along the horizontal direction, so that the housing 1 blocks a portion of the radial fan along the horizontal direction. When the radial fan 2 is operating, its horizontal side exhausts air from inside the second air chamber 11b to outside the second air vent 12b, while its other horizontal side is less likely to draw air from outside the second air vent 12b into the second air chamber 11b, thereby improving air circulation efficiency. Preferably, in order to maximize the aforementioned air circulation efficiency, one side wall of the second air vent 12b can be coplanar with the axis of the radial fan 2, so that the radial fan 2 only exhausts air through the second air vent 12b.

[0045] As an example of this embodiment, refer to Figure 3The housing 1 is also provided with a connecting hole 18, the two ends of which are connected to the first air chamber 11a and the second air chamber 11b respectively, and the opening at at least one end of the connecting hole 18 is provided with a guide part 19.

[0046] Among them, one or both of the upper and lower openings of the connecting hole are provided with air guides 19. The air guides can be chamfered or rounded to improve the airflow efficiency in the housing 1, thereby improving the heat dissipation efficiency. Specifically, when the upper opening of the connecting hole is provided with an air guide 19, when the air is discharged outward by the radial fan 2, some of the lower-positioned air will collide with the air guide 19. The air guide 19 can guide this air upward so that it can be quickly discharged from the second air outlet 12b. When the lower opening of the connecting hole is provided with an air guide 19, the air in the first air chamber 11a can be quickly and accurately guided into the second air chamber 11b to reduce the probability of turbulence in the air in the housing 1.

[0047] As an example of this embodiment, refer to Figure 3 The radial fan 2 is positioned corresponding to the connecting hole 18. The diameter of the radial fan 2 is larger than the diameter of the connecting hole 18, so that the air in the first air chamber 11a flows directly toward the radial fan 2, preventing the air in the first air chamber 11a from flowing toward the radial fan 2 in the horizontal direction, thereby improving the air circulation efficiency in the housing 1. The radial fan 2 being positioned corresponding to the connecting hole 18 means that the radial fan 2 is located above the connecting hole 18.

[0048] As an example of this embodiment, the first heat sink 33 can be set corresponding to the connecting hole 18. The end of the first heat sink 33 near the radial fan 2 is located below the connecting hole 18, which can also optimize the airflow path.

[0049] As an example of this embodiment, the length of the connecting hole 18 is 2mm to 5mm, so that the connecting hole 18 has sufficient length to ensure the efficiency of the radial fan 2 in drawing air from the first air chamber 11a into the second air chamber 11b.

[0050] As an example of this embodiment, fixed setting and fixed connection refer to the fixed relative positional relationship of two components, including but not limited to fixing by connectors, fixing by welding, fixing by adhesive, fixing by integral molding, and fixing by snap-fit ​​connection.

[0051] As an example of this embodiment, detachable connection and detachable setting refer to the fact that two components can be repeatedly and multiple times disassembled and assembled without damage or serious deformation, including but not limited to fixing by connectors and fixing by snap-fit ​​connection.

[0052] As an example of this embodiment, the connectors include, but are not limited to, fasteners, straps, ropes, pneumatic connectors, hydraulic connectors, flanges, Velcro, and buttons.

[0053] Example 2: Reference Figures 1 to 5 A heat dissipation device for a smart terminal device includes a housing 1, a radial fan 2, and a heat dissipation assembly 3. The housing 1 has a first air cavity 11a and a second air cavity 11b that are connected to each other. The first air cavity 11a is located below the second air cavity 11b. The outer wall of the housing 1 has a first air outlet 12a that connects to the first air cavity 11a and a second air outlet 12b that connects to the second air cavity 11b. The first air outlet 12a and the second air outlet 12b are arranged in a horizontal direction. The heat dissipation assembly 3 is disposed in the first air cavity 11a, and the radial fan 2 is disposed in the second air cavity 11b and is arranged corresponding to the second air outlet 12b.

[0054] In the above technical solution, when the bottom surface of the housing 1 is installed on the back of the smart terminal device, the heat emitted by the smart terminal device will be absorbed by the housing 1 and conducted to the heat dissipation component 3. Furthermore, the radial fan 2 set in the second air cavity 11b allows air to enter from the first air vent 12a, pass through the first air cavity 11a and the second air cavity 11b in sequence, and finally be discharged from the second air vent 12b. When the air passes through the first air cavity 11a, it will come into contact with the heat dissipation component 3 and carry away the heat of the heat dissipation component 3. The radial fan 2 continuously discharges air to achieve the function of continuous heat dissipation. Furthermore, the first air vent 12a and the second air vent 12b are both set in the horizontal direction. When the smart terminal device is placed on a table or stand, the air enters and exits from the side of the housing 1. The table and stand have little impact on the airflow, and the heat dissipation efficiency of the smart terminal device heat dissipation device will not decrease significantly as a result, so that the smart terminal device heat dissipation device maintains good heat dissipation efficiency.

[0055] As an example of this embodiment, refer to Figure 3 The housing 1 includes an outer shell 13 and an inner shell 14. The inner shell 14 is disposed inside the outer shell 13. The outer shell 13 is surrounded to form a first air cavity 11a, and the inner shell 14 is surrounded to form a second air cavity 11b. The outer side wall of the outer shell 13 is provided with a third air vent 12c corresponding to the second air vent 12b. The inner side wall of the outer shell 13 and the outer side wall of the inner shell 14 are provided with an internal space 16.

[0056] The aforementioned housing 1 structure allows the radial fan 2 to be installed inside the inner housing 14 first, and then the inner housing 14 to be installed on the outer housing 13 for easy assembly. Furthermore, the inner housing 14 is detachably connected to the outer housing 13. Specifically, the inner wall of the outer housing 13 may be provided with multiple connecting posts 6, and the outer wall of the inner housing 14 may be provided with multiple ears 7. The ears 7 are provided with connecting holes that extend in the vertical direction. The connecting posts 6 pass through the connecting holes to connect the outer housing 13 and the inner housing 14. A boss may also be provided inside the outer housing 13, which abuts against the bottom surface of the inner housing 14 through the boss or the third air vent 12c to help fix the inner housing 14.

[0057] In addition, the first air vent 12a extends from the outer wall of the outer shell to the first air cavity 11a, the second air vent 12b extends from the outer wall of the inner shell 14 to the second air cavity 11b, and the third air vent 12c extends from the outer wall of the outer shell 13 to the internal space 16.

[0058] As an example of this embodiment, refer to Figure 3 It also includes a partition plate 5, which is disposed on the outside of the connection between the first air cavity 11a and the second air cavity 11b. The partition plate 5 is used to isolate the first air cavity 11a from the internal space 16.

[0059] The partition plate 5 is used for heat insulation. Other heat insulation materials can be filled in the partition plate 5 to reduce the transfer of heat from the air to the upper half of the housing 1, thereby reducing the probability of the upper half of the housing 1 becoming too hot and preventing the user from feeling too hot when touching the upper half of the housing 1, thus improving the user experience. Furthermore, the partition plate 5 can also prevent the air flowing from the first air vent 12a to the first air cavity 11a from flowing into the internal space 16, thereby increasing the air circulation efficiency in the housing 1 and thus increasing the heat dissipation effect.

[0060] Furthermore, the bottom surface of the partition plate 5 can be connected to the heat dissipation component 3 (specifically, a heat sink), and the top surface of the partition plate 5 can be connected to the inner shell 14 or the top surface of the third air vent 12c; in addition, the connection includes abutment.

[0061] As an example of this embodiment, the connection between the second air vent 12b and the outer side of the housing 1, and the width of the second air vent 12b in the vertical direction, are less than 15mm. This reduces the likelihood of a user inserting their fingers into the housing 1 and touching the radial fan 2, thereby improving product safety. The heat dissipation device of this embodiment is not limited to the above-described example. In some heat dissipation devices, only the width of the connection between the second air vent 12b and the outer side of the housing 1 in the vertical direction is less than 15mm. In other heat dissipation devices, only the width of the second air vent 12b in the vertical direction is less than 15mm. The connection between the second air vent 12b and the outer side of the housing 1 can be a third air vent 12c.

[0062] As an example of this embodiment, a baffle is provided at the connection between the second air vent 12b and the outer side of the housing 1, and at the second air vent 12b itself, to prevent the user from inserting their fingers into the housing 1 and touching the radial fan 2, thereby improving product safety. The heat dissipation device of this embodiment is not limited to the above-described example. In some heat dissipation device structures, only the connection between the second air vent 12b and the outer side of the housing 1 is provided with a baffle, and in other heat dissipation device structures, only the second air vent 12b is provided with a baffle. The connection between the second air vent 12b and the outer side of the housing 1 can be a third air vent 12c.

[0063] As an example of this embodiment, refer to Figure 1 , 2 3 and 5, the housing 1 is provided with a tongue plate 17 protruding in the horizontal direction. The tongue plate 17 is located between the first air vent 12a and the second air vent 12b to prevent the hot air discharged from the second air vent 12b from flowing back down to the first air vent 12a, thereby improving the heat dissipation efficiency.

[0064] As an example of this embodiment, the tongue plate 17 can be provided on the outer side wall of the inner shell 14 and protrude through the third air vent 12c.

[0065] As an example of this embodiment, refer to Figure 3 The heat dissipation assembly 3 also includes a semiconductor cooling chip 31 and a heat-conducting plate 32. The housing 1 includes an outer shell 13 and a bottom shell 15. The bottom of the outer shell 13 is provided with a bottom hole, and the bottom shell 15 is installed in the bottom hole. The semiconductor cooling chip 31 and the heat-conducting plate 32 are arranged sequentially from bottom to top on the top surface of the bottom shell 15.

[0066] Among them, the semiconductor cooling chip 31 is a component that achieves active cooling based on the Peltier effect. It can directly transfer heat from the housing 1 to the heat-conducting component through electrical energy, and then the heat-conducting plate 32 exchanges heat with the air, or the heat-conducting plate 32 transfers heat to the heat sink, and the heat sink exchanges heat with the air.

[0067] Additionally, the bottom shell 15 may be equipped with a magnet 4, which is used to connect to a smart terminal device. Furthermore, the magnet 4 may be snapped onto the bottom shell 15.

[0068] As an example of this embodiment, refer to Figure 4 The heat dissipation component 3 includes a plurality of first heat sinks 33, which are spaced apart. The plurality of first heat sinks 33 extend from the first air outlet 12a to the axis of the radial fan 2, and a first heat dissipation channel 36 is formed between two adjacent first heat sinks 33.

[0069] In this configuration, multiple first heat sinks 33 are arranged circumferentially at intervals, and the width of the first heat dissipation channel 36 gradually decreases. When air flows in the first air cavity 11a, the air flows through the first heat dissipation channel 36 and comes into contact with the side of the first heat sink 33. Since the contact area between the air and the first heat sink 33 is large, the air can quickly carry away the heat of the heat dissipation component 3. In addition, the heat sink can be an arc-shaped structure to further increase the contact area between the gas and the heat sink, thereby improving the heat dissipation efficiency.

[0070] In addition, the first heat sink 33 can be disposed on the top surface of the heat conduction plate 32.

[0071] As an example of this embodiment, refer to Figure 4 Multiple first heat sinks 33 are arranged around the axis of the radial fan 2. The heat dissipation assembly 3 also includes multiple second heat sinks 34. The second heat sinks 34 are disposed in the first heat dissipation channel 36. The second heat sinks 34 extend from the first air outlet 12a toward the axis of the radial fan 2. The second heat sinks 34 are shorter than the first heat sinks 33. The second heat sinks 34 are located close to the first heat dissipation channel 36 and away from the radial fan 2 on the outside. Second heat dissipation channels 37 are formed between the second heat sinks 34 and the first heat sinks 33 on both sides.

[0072] Multiple first heat sinks 33 are arranged around the axis of the radial fan 2, so that the multiple first heat sinks 33 are distributed radially in a circumferential manner. The two adjacent first heat sinks 33 are closer to the radial fan 2 and the distance between them is smaller. The width of the corresponding position of the first heat dissipation channel 36 is smaller, and the amount of air flowing through that position is less, so that it can fully contact the side of the first heat sink 33. The two adjacent first heat sinks 33 are farther away from the radial fan 2 and the distance between them is larger. The width of the corresponding position of the first heat dissipation channel 36 is larger, and the amount of air flowing through that position is more, so it is difficult to fully contact the side of the first heat sink 33. Furthermore, the second heat sink 34 is arranged between the two adjacent first heat sinks 33 and the two positions farther away from the radial fan 2, so as to divide the position of the first heat dissipation channel 36 with a larger width into a second heat dissipation channel 37, so that the air flowing through this position can contact the side of the first heat sink 33 and the side of the second heat sink 34 for heat exchange, thereby ensuring heat dissipation efficiency. In addition, following the above approach, a third heat sink 35, a fourth heat sink, and a fifth heat sink can be added to form a third heat dissipation channel 38, a fourth heat dissipation channel, and a fifth heat dissipation channel, in order to solve the problem that the heat dissipation channel width is too large, resulting in poor heat dissipation efficiency.

[0073] As an example of this embodiment, a plurality of first heat sinks 33 and a plurality of second heat sinks 34 are evenly distributed around the axis of the radial flow fan 2.

[0074] As an example of this embodiment, refer to Figure 6The second air vent 12b is positioned at the connection point between itself and the outer side of the housing 1, and is only located on one side of the radial fan 2 along the horizontal direction, so that the housing 1 blocks a portion of the radial fan 2 along the horizontal direction. When the radial fan 2 operates, it exhausts air from the second air chamber 11b to the outside of the second air vent 12b on its horizontal side, while it is difficult for its other horizontal side to draw air from the outside of the second air vent 12b into the second air chamber 11b, thereby improving airflow efficiency. The heat dissipation device of this embodiment is not limited to the above-described example. In some heat dissipation devices, only the connection point between the second air vent 12b and the outer side of the housing 1 is present, and in other heat dissipation devices, only the second air vent 12b is located on one side of the radial fan 2 along the horizontal direction. The connection between the second air vent 12b and the outer side of the housing 1 can be a third air vent 12c. Preferably, in order to maximize the airflow efficiency, one side wall of the connection between the second air vent 12b and the outer side of the housing 1 can be coplanar with the axis of the radial fan 2, and one side hole wall of the second air vent 12b can be coplanar with the axis of the radial fan 2, so that the radial fan 2 exhausts only through the connection between the second air vent 12b and the outer side of the housing 1.

[0075] As an example of this embodiment, refer to Figure 3 The housing 1 is also provided with a connecting hole 18, the two ends of which are connected to the first air chamber 11a and the second air chamber 11b respectively, and the opening at at least one end of the connecting hole 18 is provided with a guide part 19.

[0076] Among them, one or both of the upper and lower openings of the connecting hole are provided with air guides 19. The air guides can be chamfered or rounded to improve the airflow efficiency in the housing 1, thereby improving the heat dissipation efficiency. Specifically, when the upper opening of the connecting hole is provided with an air guide 19, when the air is discharged outward by the radial fan 2, some of the lower-positioned air will collide with the air guide 19. The air guide 19 can guide this air upward so that it can be quickly discharged from the second air outlet 12b. When the lower opening of the connecting hole is provided with an air guide 19, the air in the first air chamber 11a can be quickly and accurately guided into the second air chamber 11b to reduce the probability of turbulence in the air in the housing 1.

[0077] As an example of this embodiment, refer to Figure 3 The radial fan 2 is positioned corresponding to the connecting hole 18. The diameter of the radial fan 2 is larger than the diameter of the connecting hole 18, so that the air in the first air chamber 11a flows directly toward the radial fan 2, preventing the air in the first air chamber 11a from flowing toward the radial fan 2 in the horizontal direction, thereby improving the air circulation efficiency in the housing 1. The radial fan 2 being positioned corresponding to the connecting hole 18 means that the radial fan 2 is located above the connecting hole 18.

[0078] As an example of this embodiment, the first heat sink 33 can be set corresponding to the connecting hole 18. The end of the first heat sink 33 near the radial fan 2 is located below the connecting hole 18, which can also optimize the airflow path.

[0079] As an example of this embodiment, the length of the connecting hole 18 is 2mm to 5mm, so that the connecting hole 18 has sufficient length to ensure the efficiency of the radial fan 2 in drawing air from the first air chamber 11a into the second air chamber 11b.

[0080] As an example of this embodiment, fixed setting and fixed connection refer to the fixed relative positional relationship of two components, including but not limited to fixing by connectors, fixing by welding, fixing by adhesive, fixing by integral molding, and fixing by snap-fit ​​connection.

[0081] As an example of this embodiment, detachable connection and detachable setting refer to the fact that two components can be repeatedly and multiple times disassembled and assembled without damage or serious deformation, including but not limited to fixing by connectors and fixing by snap-fit ​​connection.

[0082] As an example of this embodiment, the connectors include, but are not limited to, fasteners, straps, ropes, pneumatic connectors, hydraulic connectors, flanges, Velcro, and buttons.

[0083] In summary, this utility model embodiment provides a heat dissipation device for intelligent terminal devices, the technical effects of which are as follows: In the heat dissipation device for intelligent terminal equipment of this utility model, when the bottom surface of the housing 1 is installed on the back of the intelligent terminal equipment, the heat emitted by the intelligent terminal equipment will be absorbed by the housing 1 and conducted to the heat dissipation component 3. Furthermore, the radial fan 2 set in the second air cavity 11b allows air to enter from the first air outlet 12a, pass through the first air cavity 11a and the second air cavity 11b in sequence, and finally be discharged from the second air outlet 12b. When the air passes through the first air cavity 11a, it will come into contact with the heat dissipation component 3 and carry away the heat of the heat dissipation component 3. The radial fan 2 continuously discharges air to achieve the function of continuous heat dissipation. Furthermore, the first air outlet 12a and the second air outlet 12b are both set in the horizontal direction. When the intelligent terminal equipment is placed on a table or stand, the air enters and exits from the side of the housing 1. The table and stand have little impact on the airflow, and the heat dissipation efficiency of the intelligent terminal equipment heat dissipation device will not decrease significantly as a result, so that the intelligent terminal equipment heat dissipation device maintains good heat dissipation efficiency.

[0084] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present utility model, and these improvements and substitutions should also be considered within the protection scope of the present utility model.

Claims

1. A heat dissipation device for intelligent terminal equipment, characterized in that, The device includes a housing (1), a radial fan (2), and a heat dissipation assembly (3). The housing (1) has a first air chamber (11a) and a second air chamber (11b) that are connected to each other. The first air chamber (11a) is located below the second air chamber (11b). The housing (1) has a first air outlet (12a) connected to the first air chamber (11a) and a second air outlet (12b) connected to the second air chamber (11b). The first air outlet (12a) and the second air outlet (12b) are arranged in a horizontal direction. The heat dissipation assembly (3) is located in the first air chamber (11a). The radial fan (2) is located in the second air chamber (11b) and is arranged corresponding to the second air outlet (12b).

2. The heat dissipation device for intelligent terminal equipment according to claim 1, characterized in that, The housing (1) includes an outer shell (13) and an inner shell (14). The inner shell (14) is disposed inside the outer shell (13). The outer shell (13) is surrounded to form the first air cavity (11a), and the inner shell (14) is surrounded to form the second air cavity (11b). The outer side wall of the outer shell (13) is provided with a third air outlet (12c) corresponding to the second air outlet (12b). The inner side wall of the outer shell (13) and the outer side wall of the inner shell (14) are provided with an internal space (16).

3. The heat dissipation device for intelligent terminal equipment according to claim 2, characterized in that, It also includes a partition plate (5), which is disposed on the outside of the connection between the first air cavity (11a) and the second air cavity (11b), and the partition plate (5) is used to isolate the first air cavity (11a) and the internal space (16).

4. The heat dissipation device for intelligent terminal equipment according to claim 1, characterized in that, The connection between the second air vent (12b) and the outer side of the housing (1), and / or the width of the second air vent (12b) in the vertical direction is less than 15mm; And / or, The second air vent (12b) is connected to the outer side of the housing (1), and / or the second air vent (12b) is provided with a barrier net.

5. The heat dissipation device for intelligent terminal equipment according to claim 1, characterized in that, The housing (1) is provided with a tongue plate (17) protruding in the horizontal direction, the tongue plate (17) being located between the first air vent (12a) and the second air vent (12b).

6. The heat dissipation device for intelligent terminal equipment according to claim 1, characterized in that, The heat dissipation assembly (3) also includes a semiconductor cooling chip (31) and a heat-conducting plate (32). The housing (1) includes an outer shell (13) and a bottom shell (15). The bottom of the outer shell (13) is provided with a bottom hole. The bottom shell (15) is installed in the bottom hole. The semiconductor cooling chip (31) and the heat-conducting plate (32) are arranged sequentially from bottom to top on the top surface of the bottom shell (15).

7. The heat dissipation device for intelligent terminal equipment according to claim 1, characterized in that, The heat dissipation component (3) includes a plurality of first heat sinks (33), each of the first heat sinks (33) is spaced apart, the plurality of first heat sinks (33) extend from the first air outlet (12a) to the axis of the radial fan (2), and a first heat dissipation channel (36) is formed between two adjacent first heat sinks (33).

8. The heat dissipation device for intelligent terminal equipment according to claim 7, characterized in that, Multiple first heat sinks (33) are arranged around the axis of the radial fan (2). The heat dissipation assembly (3) also includes multiple second heat sinks (34). The second heat sinks (34) are disposed in the first heat dissipation channel (36). The second heat sinks (34) extend from the first air outlet (12a) toward the axis of the radial fan (2). The second heat sinks (34) are shorter than the first heat sinks (33). The second heat sinks (34) are located close to the first heat dissipation channel (36) and away from the radial fan (2) on the outside. The second heat sinks (34) and the first heat sinks (33) on both sides form a second heat dissipation channel (37).

9. The heat dissipation device for intelligent terminal equipment according to claim 1, characterized in that, The second air vent (12b) is connected to the outer side of the housing (1), and / or the second air vent (12b) is provided only on one side of the radial fan (2) in the horizontal direction.

10. The heat dissipation device for intelligent terminal equipment according to claim 1, characterized in that, The housing (1) is also provided with a connecting hole (18), the two ends of the connecting hole (18) are respectively connected to the first air cavity (11a) and the second air cavity (11b), and the opening of at least one end of the connecting hole (18) is provided with a guide part (19).

11. The heat dissipation device for intelligent terminal equipment according to claim 10, characterized in that, The runoff fan (2) is provided corresponding to the connecting hole (18), and the diameter of the runoff fan (2) is larger than the diameter of the connecting hole (18).

12. The heat dissipation device for intelligent terminal equipment according to claim 10, characterized in that, The length of the connecting hole (18) is 2 mm to 5 mm.

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