Temperature uniformizing device and electric appliance

Abstract

The embodiment of the present application provides a temperature equalizing device and an electric equipment. The temperature equalizing device comprises: a shell with a containing cavity; and a liquid absorbing core arranged in the containing cavity, wherein the liquid absorbing core comprises a liquid absorbing layer, and the liquid absorbing layer is provided with a backflow groove, and the width of the backflow groove is less than or equal to 200 microns. The temperature equalizing device is used to improve the temperature equalizing performance and realize the effect of ultrathinning.

Description

Technical Field

[0001] This application relates to the field of battery technology, and in particular to a temperature equalization device and electrical equipment. Background Technology

[0002] As a thin and efficient two-phase heat transfer element, the temperature equalization device is widely used in high-performance computing chips, 5G communication base stations, new energy vehicle electronic control systems, high-density servers and other scenarios due to its high thermal conductivity (up to 5000 W / m·K), temperature equalization (temperature difference <1℃) and passive heat dissipation characteristics.

[0003] The temperature equalization device has an evaporation end near the heat source and a condensation end far from the heat source. The evaporation end absorbs heat, causing the liquid working fluid to vaporize rapidly, while also carrying away a large amount of heat. The vaporized working fluid diffuses from the high-pressure evaporation end to the low-pressure condensation end. The gaseous working fluid releases heat at the condensation end, causing it to condense and transform into a liquid working fluid. Under the action of the liquid suction core, it flows back to the evaporation zone, forming a gas-liquid cycle, which can effectively solve the heat dissipation problem of electronic equipment.

[0004] However, the temperature equalization effect of the temperature equalization device is not good, making it difficult to achieve ultra-thinness. Utility Model Content

[0005] This application provides a temperature equalization device and electrical equipment to improve the temperature equalization effect and achieve the effect of ultra-thin design.

[0006] In a first aspect, embodiments of this application provide a temperature equalization device, comprising:

[0007] The shell has a receiving cavity;

[0008] A liquid-absorbing core is disposed within the receiving cavity. The liquid-absorbing core includes a liquid-absorbing layer and a return groove provided thereon. The width of the return groove is less than or equal to 150 micrometers.

[0009] In one possible implementation, at least two liquid-absorbing layers are provided, and the at least two liquid-absorbing layers are stacked sequentially in a direction away from the bottom wall of the receiving cavity;

[0010] The width of the reflux groove of the liquid absorption layer adjacent to the bottom wall of the receiving cavity is less than or equal to 200 micrometers.

[0011] In one possible implementation, the width of the reflux groove of the suction core increases sequentially in the direction away from the bottom wall of the receiving cavity.

[0012] In one possible implementation, in two adjacent absorbent layers, the reflux groove of the absorbent layer away from the bottom wall of the receiving cavity is connected to at least two reflux grooves of the absorbent layer close to the bottom wall of the receiving cavity.

[0013] In one possible implementation, the included angle between the extending directions of the return channels of two adjacent liquid absorption layers is greater than or equal to 0° and less than or equal to 90°.

[0014] In one possible implementation, the angle between the extending directions of the return channels of two adjacent liquid absorption layers is greater than or equal to 30° and less than or equal to 60°.

[0015] In one possible implementation, at least two of the absorbent layers comprise:

[0016] The first absorbent layer is disposed on the bottom wall of the receiving cavity;

[0017] The second absorbent layer is disposed on the side of the first absorbent layer away from the bottom wall of the receiving cavity;

[0018] The first liquid-absorbing layer and the second liquid-absorbing layer are an integrated structure.

[0019] In one possible implementation, the first absorbent layer comprises:

[0020] Base plate;

[0021] The first sidewall is provided on the base plate to form a corresponding return channel;

[0022] Wherein, at least one of the width and height of the reflux groove of the first liquid absorption layer and the width of the first sidewall is less than or equal to 100 μm.

[0023] In one possible implementation, the width of the reflux groove in the first absorbent layer is greater than or equal to 10 μm and less than or equal to 80 μm; and / or,

[0024] The height of the reflux groove in the first liquid absorption layer is greater than or equal to 15 μm and less than or equal to 50 μm; and / or,

[0025] The width of the first sidewall is greater than or equal to 6 μm and less than or equal to 15 μm.

[0026] In one possible implementation, the second absorbent layer includes:

[0027] The second sidewall is provided on the first sidewall to form a corresponding return trench;

[0028] The width of the reflux groove in the second liquid absorption layer is greater than or equal to 50 μm and less than or equal to 150 μm.

[0029] In one possible implementation, the return channels of the first absorbent layer are arranged in parallel; or...

[0030] The first liquid-absorbing layer has an evaporation end, which is configured to be opposite to a heat source, and the reflux grooves of the first liquid-absorbing layer are radially distributed relative to the evaporation end.

[0031] In one possible implementation, the widths of the reflux grooves in the first absorbent layer are equal in their extending direction; or,

[0032] The width of at least a portion of the reflux grooves in the first absorbent layer gradually increases in the direction away from the evaporation end.

[0033] In one possible implementation, the liquid-absorbing layer is fabricated using photolithography and microelectroforming processes; and / or,

[0034] The extension direction of the return channels is a straight line.

[0035] Secondly, embodiments of this application provide an electrical device, including the temperature equalization device described above.

[0036] The temperature equalization device and electrical equipment provided in this application include a housing and a liquid-absorbing core, the housing having a receiving cavity. The liquid-absorbing core is disposed within the receiving cavity and includes a liquid-absorbing layer with reflux grooves. The width of the reflux grooves is less than or equal to 200 micrometers. The small width of the reflux grooves can be precisely controlled to construct a micro / nano structure, improve the capillary force and anti-gravity capability of the liquid-absorbing core, and allow for a greater number of grooves per unit area, providing more delivery channels, improving temperature equalization performance and efficiency, and achieving ultra-thin temperature equalization device. Attached Figure Description

[0037] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0038] Figure 1 A schematic diagram of the temperature equalization device provided in this application;

[0039] Figure 2 A schematic diagram of the suction core provided in this application;

[0040] Figure 3 A cross-sectional view of the first type of first absorbent layer provided in this application;

[0041] Figure 4 A top view of the first type of first absorbent layer provided in this application;

[0042] Figure 5 A cross-sectional view of the second absorbent layer provided in this application;

[0043] Figure 6Top view of the second absorbent layer provided in this application;

[0044] Figure 7 A schematic diagram of the intersection of the return channels of the first and second liquid absorption layers provided in this application;

[0045] Figure 8 A top view of the second type of first absorbent layer provided in this application;

[0046] Figure 9 A top view of the third type of first absorbent layer provided in this application;

[0047] Figure 10 A cross-sectional view of the fourth type of first absorbent layer provided in this application;

[0048] Figure 11 A cross-sectional view of the fifth type of first absorbent layer provided in this application;

[0049] Figure 12 A cross-sectional view of the sixth type of first absorbent layer provided in this application;

[0050] Figure 13 A cross-sectional view of the seventh type of first absorbent layer provided in this application.

[0051] Explanation of reference numerals in the attached figures:

[0052] 10-Shell; 11-Upper cover; 12-Lower cover; 13-Support column;

[0053] 20-Liquid suction core; 21-First liquid suction layer; 22-Second liquid suction layer; 23-Return groove; 24-First side wall; 25-Bottom plate; 26-Second side wall.

[0054] The accompanying drawings have illustrated specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to specific embodiments. Detailed Implementation

[0055] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0056] Temperature equalization devices typically include a liquid wick, the main types of which are sintered powder type and sintered wire mesh type. The sintered powder type uses copper / nickel powder sintering to form a porous structure with pore sizes ranging from 0.5μm to 500μm, thereby generating capillary force. This type of wick has tortuous pores, poor permeability, and slow working fluid reflux. Limited by the copper / nickel powder particle size (150μm) and high-temperature sintering deformation, the thickness after sintering is greater than 50μm, making ultra-thinning difficult.

[0057] Sintered wire mesh wicks consist of one or more layers of metal mesh (e.g., metal wire mesh) sintered with a base plate, utilizing the gaps (1-50 μm) between the metal mesh and the base plate, as well as the gaps (20-200 μm) in the metal mesh itself, to generate capillary force. These wicks have tortuous pores, poor permeability, and high thermal resistance. The base thickness of the metal mesh is also greater than 50 μm, making ultra-thinning difficult.

[0058] In the temperature equalization device provided in this application, the width of the reflux groove in the liquid absorption layer of the liquid absorption core is less than or equal to 200 micrometers. The small width of the reflux groove can be precisely controlled to construct a micro-nano structure, improve the capillary force and anti-gravity capability of the liquid absorption core, and allow for a greater number of grooves per unit area, providing more delivery channels, improving temperature equalization performance and efficiency, and achieving ultra-thin temperature equalization device.

[0059] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will be described below with reference to the accompanying drawings.

[0060] See Figures 1 to 13 This application provides a temperature equalization device for heat exchange, which ensures uniform heat distribution and avoids localized overheating. The temperature equalization device includes a housing 10 and a liquid absorption core 20. The housing 10 has a receiving cavity; the liquid absorption core 20 is disposed in the receiving cavity and includes a liquid absorption layer. Each liquid absorption layer is provided with a return groove 23, the width of which is less than or equal to 200 micrometers.

[0061] The housing 10 has a receiving cavity for accommodating the liquid-absorbing core 20 and the working fluid. The material of the housing 10 includes, but is not limited to, oxygen-free copper and aluminum alloy. In some possible examples, the housing 10 includes a lower cover 12 and an upper cover 11, which are disposed opposite each other along the thickness direction of the housing 10. The upper cover 11 is fastened to the lower cover 12 and is sealed to it, for example, by welding. The upper cover 11 and the lower cover 12 together form the receiving cavity.

[0062] like Figure 1As shown, both the lower cover 12 and the upper cover 11 can be rectangular. The lower cover 12 has a first groove, and the upper cover 11 is at least opposite to the first groove to seal it. For example, the upper cover 11 has a second groove, which is opposite to and communicates with the first groove to form a receiving cavity. Both the first and second grooves are, for example, rectangular grooves. A liquid-absorbing core 20 is disposed within the first groove, and the liquid-absorbing core 20 can also extend into the second groove. The liquid-absorbing core 20 can be directly machined onto the lower cover 12, forming an integral part of the lower cover 12.

[0063] In some possible examples, the housing 10 also includes a support post 13 disposed between the upper cover 11 and the liquid-absorbing core 20 to support the liquid-absorbing core 20 and improve the overall strength of the housing 10. The support post 13 can be a cylinder, elliptical cylinder, frustum cylinder, rectangular cylinder, pentagonal prism, hexagonal prism, elongated column, etc. The support post 13 is disposed in the second groove and can be integrally formed with the upper cover 11.

[0064] There may be one or more support columns 13. When there are multiple support columns 13, they are arranged at intervals, for example, in an array. The multiple support columns 13 are flush with the top surface of the liquid-absorbing core 20. The multiple support columns 13 can provide more uniform support for the liquid-absorbing core 20, improve the uniformity of the liquid absorption force, and prevent the liquid-absorbing core 20 from deforming due to excessive local stress. In addition, the space between the multiple support columns 13 can also allow the working fluid after evaporation to flow, improving the temperature uniformity of the shell 10.

[0065] The working fluid can be one of water, organic solvents, nanofluids, or refrigerants. Water has a high specific heat capacity and latent heat, exhibiting excellent heat transfer performance, and is one of the most commonly used working fluids. Organic solvents can be methanol, ethanol, or acetone, etc., and refrigerants can be hydrofluorocarbon (HFC) refrigerants, such as R134a. Nanofluids refer to suspensions formed by the stable suspension of nanoscale (1-100 nanometers) solid particles in a base liquid (such as water or alcohols). These liquid working fluids have low boiling points and good volatility, making them suitable for scenarios requiring rapid phase change heat transfer.

[0066] See Figure 1 and Figure 2 The liquid suction core 20 is disposed within the receiving cavity. As the core component of the temperature equalization device, it overcomes gravity and flow resistance through capillary pressure generated by surface tension, ensuring continuous reflux of the working fluid. The performance of the liquid suction core 20 directly affects the overall performance of the temperature equalization device.

[0067] Among them, the liquid absorption core 20 has an evaporation end (such as...) Figure 8 and Figure 9As shown at point A in the diagram, the evaporation end and condensation end are where energy conversion first occurs. The evaporation end is opposite the heat source; that is, it is the region in the wick 20 that is in direct or indirect contact with the heat source, where the liquid working fluid absorbs heat and boils, transforming into vapor. The condensation end is where the vapor recondenses into liquid, releasing the heat it carries to the external environment. After the working fluid absorbs heat and vaporizes at the evaporation end, the vapor carries heat to the condensation end. The condensed liquid flows back to the evaporation end through the capillary force of the wick 20, forming a closed loop.

[0068] Continue reading Figure 1 and Figure 2 The liquid-absorbing core 20 includes a liquid-absorbing layer, and at least one liquid-absorbing layer may be provided. When two or more liquid-absorbing layers are provided, these liquid-absorbing layers are stacked sequentially in a direction away from the bottom wall of the receiving cavity. The liquid-absorbing layer has a return groove 23. For example, at least one return groove 23 is provided on the top surface of the liquid-absorbing layer (i.e., the surface facing the upper cover 11). When two or more return grooves 23 are provided, the return grooves 23 are spaced apart.

[0069] The width of the reflux trench 23 is less than or equal to 200 micrometers. The width direction of the reflux trench 23 is perpendicular to its extension direction and its height direction. The height direction of the reflux trench 23 is consistent with the thickness direction (i.e., the height direction) of the absorbent layer. Along the extension direction of the reflux trench 23, the width of the reflux trench 23 can be equal, i.e., it is a constant-width trench; or the width of the reflux trench 23 can be unequal, i.e., it is a variable-width trench. When the reflux trench 23 is a variable-width trench, its maximum width is less than or equal to 200 micrometers.

[0070] Among them, the capillary force of the liquid absorption layer is negatively correlated with the width of the return groove 23. The width of the return groove 23 is small and can be precisely controlled to construct a micro-nano structure, improve the capillary force and anti-gravity ability of the liquid absorption core 20, and can also be set in more quantities per unit area to provide more delivery channels, improve the temperature uniformity performance and temperature uniformity efficiency, and realize the ultra-thinness of the temperature uniformity device.

[0071] In some possible examples, the reflux channel 23 extends in a straight line, meaning it is a straight channel along which the working fluid flows. This eliminates bends and twists in the reflux channel 23, thus reducing pore tortuosity and improving permeability. When there are multiple reflux channels 23, each extends in a straight line, and the extension directions of the reflux channels 23 within the same absorbent layer can be parallel or intersecting.

[0072] In some possible examples, the liquid-absorbing layer is fabricated using photolithography and microelectroforming processes, performed sequentially. Photolithography precisely transfers the pattern from a photomask to photoresist coated on the substrate surface. Microelectroforming, as an additive manufacturing process, deposits a metal layer in specific areas of the substrate (areas not covered by photoresist) through electrochemical reactions. By controlling the size and layout of the reflow trenches 23 using photolithography, precise control and ordered capillary paths can be achieved. Using microelectroforming, the liquid-absorbing layer structure is composed of atomic stacks, not limited by raw materials, and its height is highly controllable, achieving ultra-thinness below 50 μm.

[0073] Continue reading Figure 1 and Figure 2 The liquid-absorbing layer comprises at least two layers, which are stacked sequentially along the direction away from the bottom wall of the receiving cavity. The width of the return groove 23 of the liquid-absorbing layer adjacent to the bottom wall of the receiving cavity is less than or equal to 100 micrometers. By providing at least two stacked liquid-absorbing layers, each of which is provided with a return groove 23, the liquid-absorbing core 20 forms a stacked structure. By adjusting the size (height, width, etc.), shape, and arrangement of the return groove 23 in each liquid-absorbing layer, the spatial distribution of capillary force can be controlled, making the working fluid return path more closely match the heat source distribution and improving local heat dissipation efficiency.

[0074] The width of the reflux groove 23 of the liquid-absorbing layer adjacent to the bottom wall of the receiving cavity is less than or equal to 100 micrometers. This liquid-absorbing layer is the bottommost layer and closest to the heat source. The width of this reflux groove 23 is less than or equal to 100 micrometers, ensuring that the liquid-absorbing layer can provide high capillary force, thus having stronger reflux capability. The width of the reflux grooves 23 of other liquid-absorbing layers can be less than or equal to 100 micrometers or greater than 100 micrometers, flexibly set as needed to control the capillary force. For example, the width of the reflux grooves 23 of the remaining liquid-absorbing layers is greater than 100 micrometers to increase permeability and improve the overall permeability of the liquid-absorbing core 20.

[0075] Understandably, at least two liquid-absorbing layers are fabricated layer by layer along the direction away from the bottom wall of the receiving cavity, with each liquid-absorbing layer formed through photolithography and micro-electroforming processes. Specifically, photoresist is coated onto the bottom substrate, and then exposed and developed. Part of the photoresist is removed, exposing part of the substrate. The exposed substrate is then micro-electroformed to form the first liquid-absorbing layer. A seed layer is then grown, coated with photoresist, and exposed and developed. Part of the photoresist is removed, exposing part of the seed layer. The exposed seed layer is then micro-electroformed to form the second liquid-absorbing layer. This process is repeated until the desired structure is formed. Finally, the photoresist is completely removed, and the seed layer beneath it is also removed, yielding the liquid-absorbing core 20.

[0076] In some possible examples, such as Figure 2 As shown, the width of the reflux groove 23 of the wick 20 increases sequentially along the direction away from the bottom wall of the receiving cavity. The smaller the reflux groove 23, the greater the capillary force, and the larger the reflux groove 23, the smaller the capillary force. In this way, the gradient setting of the width of the reflux groove 23 along the direction away from the bottom wall of the receiving cavity makes the capillary force of each wicking layer gradually decrease and the permeability gradually increase, thereby achieving a balance between capillary force and permeability. This is beneficial for the reflux of the working fluid and can adapt to the heat dissipation requirements of different areas, thus improving the overall performance of the wick 20.

[0077] In some possible examples, such as Figure 2 As shown, in two adjacent absorbent layers, the return channel 23 of the absorbent layer furthest from the bottom wall of the receiving cavity is connected to at least two return channels 23 of the absorbent layer closest to the bottom wall of the receiving cavity. In this way, the return channels 23 of the two adjacent absorbent layers are connected, improving the uniformity of the working fluid and thus providing the temperature uniformity performance of the temperature equalization device.

[0078] In some possible implementations, the included angle between the extending directions of the return channels 23 in two adjacent absorbent layers is greater than or equal to 0° and less than or equal to 90°. For example, as Figure 7 As shown, the angle between the extension directions of the return channels 23 of two adjacent liquid absorption layers is greater than or equal to 30° and less than or equal to 60°. In this way, the extension directions of the return channels 23 in the two adjacent liquid absorption layers intersect and are connected, so as to improve the uniformity of capillary force distribution and increase the climbing height.

[0079] Among them, such as Figure 2 As shown, the extension directions of the return channels 23 in the same layer are parallel, while the extension directions of the return channels 23 in different layers intersect. Alternatively, in two adjacent liquid absorption layers, the extension directions of the return channels 23 in one liquid absorption layer are parallel, while the extension directions of the return channels 23 in the other liquid absorption layer are crisscrossed.

[0080] See Figures 1 to 6 The device comprises at least two absorbent layers, including a first absorbent layer 21 and a second absorbent layer 22. The first absorbent layer 21 is disposed on the bottom wall of the receiving cavity; the second absorbent layer 22 is disposed on the side of the first absorbent layer 21 away from the bottom wall of the receiving cavity; the first absorbent layer 21 and the second absorbent layer 22 are an integrated structure. That is, the first absorbent layer 21 and the second absorbent layer 22 are stacked sequentially along the direction away from the bottom wall of the receiving cavity. In this way, the absorbent core 20 forms a multi-layered and integrated structure, realizing the controllability and orderliness of the capillary path, comprehensively balancing capillary force and permeability, and improving the working fluid reflux efficiency and the overall performance of the temperature equalization device.

[0081] Among them, see Figure 2 , Figure 3 and Figure 4The first absorbent layer 21 includes a base plate 25 and first sidewalls 24. The first sidewalls 24 are disposed on the base plate 25, forming corresponding return channels 23. There is at least one first sidewall 24. When there is only one first sidewall 24, it is located in the middle region of the base plate 25, and a return channel 23 is formed on each side of the first sidewall 24. When there are two or more first sidewalls 24, they are arranged at intervals on the base plate 25, forming multiple return channels 23.

[0082] The width and height of the reflux groove 23 in the first absorbent layer 21, and the width of the first sidewall 24, are at least 100 μm or less. The first sidewall 24 and the base plate 25 can be an integral structure. In the first absorbent layer 21, the first sidewall 24 and the reflux groove 23 are arranged alternately, that is, in the first absorbent layer 21, a reflux groove 23 is formed between adjacent first sidewalls 24, and adjacent reflux grooves 23 are separated by the first sidewall 24. The first sidewall 24 and the reflux groove 23 can be arranged alternately along the width direction of the base plate 25.

[0083] The width and height of the reflux groove 23 of the first liquid absorption layer 21 and the width of the first sidewall 24 can all be adjusted as needed, i.e., controlled, to adjust the capillary force. One or more of these three dimensions are less than or equal to 100 μm to achieve ultra-thinness of the temperature equalization device and improve capillary force. For example, the width of the reflux groove 23 of the first liquid absorption layer 21 is less than or equal to 100 μm, the height of the reflux groove 23 of the first liquid absorption layer 21 is less than or equal to 100 μm, and the width and height of the first sidewall 24 are less than or equal to 100 μm.

[0084] In some possible examples, the width of the return groove 23 of the first absorbent layer 21 is greater than or equal to 10 μm and less than or equal to 80 μm; and / or, the height of the return groove 23 of the first absorbent layer 21 is greater than or equal to 15 μm and less than or equal to 50 μm; and / or, the width of the first sidewall 24 is greater than or equal to 6 μm and less than or equal to 15 μm.

[0085] The width of the reflux groove 23 in the first liquid absorption layer 21 is 10μm~80μm, which provides high capillary force and avoids excessive flow resistance, thus facilitating the reflux of the working fluid. The height of the reflux groove 23 in the first liquid absorption layer 21 is 15μm~50μm, which ensures sufficient water transport capacity and facilitates ultra-thin design. The width of the first sidewall 24 is 6μm~15μm, which improves the strength of the liquid absorption core 20 and increases the duty cycle, thereby enhancing its space utilization.

[0086] See some possible examples. Figure 4 and Figure 8The return channels 23 of the first liquid-absorbing layer 21 are arranged in parallel; or, the first liquid-absorbing layer 21 has an evaporation end, which is configured to be opposite to the heat source, and the return channels 23 of the first liquid-absorbing layer 21 are radially distributed relative to the evaporation end.

[0087] like Figure 3 and Figure 4 As shown, the return channels 23 of the first absorbent layer 21 are parallel to each other, that is, the extending directions of the first sidewalls 24 are parallel to each other. Figure 8 As shown, the reflux grooves 23 of the first liquid absorbing layer 21 are radially distributed relative to the evaporation end, which is opposite to the heat source. In this way, the reflux grooves 23 of the first liquid absorbing layer 21 can be customized with capillary paths according to the location of the heat source, so that the working fluid at the condensation end can flow back to the evaporation end through the shortest path, thereby improving the temperature uniformity.

[0088] See some possible examples. Figure 4 and Figure 9 The width of the reflux groove 23 of the first liquid absorption layer 21 is equal in its extending direction; or, the width of at least a portion of the reflux groove 23 of the first liquid absorption layer 21 gradually increases in the direction away from the evaporation end.

[0089] like Figure 4 and Figure 8 As shown, each return channel 23 of the first liquid absorption layer 21 can adopt an equal width structure, that is, the width of the same return channel 23 of the first liquid absorption layer 21 is equal at all points. The widths of different return channels 23 of the first liquid absorption layer 21 can be equal or unequal.

[0090] like Figure 9 As shown, at least a portion of the return channel 23 of the first liquid absorption layer 21 can also adopt a non-uniform width structure, with the width of at least a portion of the return channel 23 of the first liquid absorption layer 21 gradually increasing in the direction away from the evaporation end. In this way, in the return channel 23, the area adjacent to the heat source (i.e., the evaporation end) is narrower and has a larger capillary force, while the area away from the heat source is wider and has a smaller capillary force, forming a capillary gradient. This makes it easier for the working fluid to return to the evaporation end, improving the temperature uniformity and heat dissipation effect.

[0091] The distribution of the return grooves 23 in the first liquid absorption layer 21 and the width of the return grooves 23 can be coordinated. For example, as Figure 8 As shown, the return channels 23 of the first liquid absorption layer 21 are radially distributed, and the return channels 23 of the first liquid absorption layer 21 have a uniform width structure. For example, as... Figure 9 As shown, the return channels 23 of the first liquid absorption layer 21 are radially distributed, and the return channels 23 of the first liquid absorption layer 21 have a non-uniform width structure.

[0092] In some possible examples, the cross-section of the first sidewall 24 can be rectangular, taking a plane perpendicular to the extending direction of the first sidewall 24 as the cross-section (see [reference]). Figure 4 Trapezoid (see reference) Figure 10 ), concave trapezoid (see Figure 11 ), round (see Figure 12 ), oval, semi-circular, semi-oval, mushroom-shaped (see also) Figure 13 (e.g., I-shaped, fan-shaped, etc.) In this way, the cross-sectional shape of the first sidewall 24 can be adjusted as needed to optimize the flow boundary layer, thereby reducing flow resistance and increasing permeability.

[0093] See Figure 5 and Figure 6 The second absorbent layer 22 includes a second sidewall 26, which is disposed on the first sidewall 24 to form a corresponding reflux groove 23. The width of the reflux groove 23 in the second absorbent layer 22 is greater than or equal to 50 μm and less than or equal to 150 μm. The second sidewall 26 is disposed on the side of the first sidewall 24 facing away from the bottom wall of the receiving cavity and is integrally formed with the first sidewall 24. In the second absorbent layer 22, the second sidewall 26 and the reflux groove 23 are arranged alternately, i.e., a reflux groove 23 is formed between adjacent second sidewalls 26, and adjacent reflux grooves 23 are isolated by the second sidewall 26.

[0094] The number of second sidewalls 26 is at least one. When there is only one second sidewall 26, it is located in the middle region of the first liquid absorption layer 21, and a return groove 23 is formed on each side of the second sidewall 26. When there are two or more second sidewalls 26, they are arranged at intervals on the first liquid absorption layer 21 to form multiple return grooves 23.

[0095] The extension direction of the return groove 23 of the second liquid-absorbing layer 22 intersects the extension direction of the return groove 23 of the first liquid-absorbing layer 21, so that the return groove 23 of the second liquid-absorbing layer 22 connects to the multiple return grooves 23 of the first liquid-absorbing layer 21. For example, as Figure 2 As shown, the extension direction of the return groove 23 of the second liquid absorption layer 22 is perpendicular to the extension direction of the return groove 23 of the first liquid absorption layer 21. For example, as... Figure 7 As shown, the angle between the extension direction of the return groove 23 of the second liquid absorption layer 22 and the extension direction of the return groove 23 of the first liquid absorption layer 21 is greater than or equal to 30° and less than or equal to 60°.

[0096] The width of the reflux groove 23 in the second absorbent layer 22 can be greater than or equal to 10 μm and less than or equal to 200 μm, and the width of the reflux groove 23 in the second absorbent layer 22 is greater than the width of the reflux groove 23 in the first absorbent layer 21. This results in a higher permeability of the second absorbent layer 22 than the first absorbent layer 21, increasing the overall permeability of the absorbent core 20. The width of the reflux groove 23 in the second absorbent layer 22 is greater than or equal to 50 μm and less than or equal to 150 μm to balance capillary force and permeability. The height of the reflux groove 23 in the second absorbent layer 22 can be equal to or unequal to the height of the reflux groove 23 in the first absorbent layer 21; the width of the second sidewall 26 can be equal to or unequal to the width of the first sidewall 24.

[0097] The following describes the manufacturing process of the absorbent core 20, taking as an example a core 20 made of copper and including a first absorbent layer 21 and a second absorbent layer 22.

[0098] The incoming material is a 0.05mm copper alloy sheet. The first layer of photoresist is coated on the copper alloy sheet. This can be done by spraying, uniform coating, slot coating, etc. The coating height of the first layer of photoresist is 5-200μm, depending on the height required for the reflow trench of the working fluid.

[0099] A specific area of ​​the first layer of photoresist is exposed, and the first layer of photoresist undergoes a photolysis reaction opposite to the reflow trench of the working fluid. Exposure methods can include mask exposure, laser direct writing, and laser direct imaging (LDI).

[0100] The first layer of photoresist that has undergone photolysis is dissolved using a developer, exposing the corresponding area of ​​the copper alloy sheet.

[0101] The sample is placed in an electroforming tank for micro-electroforming. The electroforming metal is copper. Copper walls will grow in the exposed areas of the copper alloy sheet, forming the first sidewall and the corresponding reflow trench. The top surface of the first sidewall can be higher than or flush with the top surface of the first layer of photoresist.

[0102] A copper seed layer of 100nm-200nm is grown using physical vapor deposition (PVD). The copper seed layer covers the first sidewall and the first layer of photoresist.

[0103] Apply a second layer of photoresist. The height of the second layer of photoresist is 5-200μm. It can be applied by spraying, uniform coating, slit coating, etc., depending on the required height of the liquid wick.

[0104] A specific area of ​​the second photoresist layer is exposed, and the second photoresist layer undergoes a photolysis reaction opposite to the reflow trench of the working fluid. Exposure methods can include mask exposure, laser direct writing, and laser direct imaging.

[0105] The second layer of photoresist that has undergone photolysis is dissolved using a developer, exposing the corresponding area of ​​the copper seed layer.

[0106] The material is placed in an electroforming tank for micro-electroforming. The electroforming metal is copper. Copper walls will grow in the exposed areas of the copper seed layer, forming a second sidewall and a corresponding reflow trench. The top surface of the second sidewall can be higher than or flush with the top surface of the second layer of photoresist.

[0107] The photoresist is removed entirely, and the first and second layers of photoresist are removed using a wet process. Since the copper seed layer is thin, the copper seed layer covered by the second photoresist is also removed simultaneously, so that the reflow trenches of different layers can be connected.

[0108] The present application will be further described below through specific embodiments.

[0109] Example 1

[0110] The incoming material is a 0.05mm copper alloy sheet. A first layer of photoresist is sprayed onto the copper alloy sheet, and the coating height of the first layer of photoresist is 20μm.

[0111] The first layer of photoresist was exposed using a mask, and the mask image consisted of straight grating lines with a line width of 15 μm and a line spacing of 60 μm.

[0112] The first layer of photoresist that has undergone photolysis is dissolved using a developer, exposing part of the copper alloy sheet.

[0113] The metal is placed in an electroforming tank for micro-electroforming. The electroforming metal is copper, and the electroforming height is controlled at 20μm to obtain a structure with a wall width of 15μm and a tank width of 60μm, forming the first side wall and the corresponding return groove.

[0114] A 200nm copper seed layer was grown using PVD.

[0115] A second layer of photoresist is sprayed, with a coating height of 20 μm.

[0116] The second layer of photoresist was exposed using a mask. The mask image consisted of straight grating lines with a line width of 15 μm and a line spacing of 120 μm, forming a 10-degree angle with the first sidewall.

[0117] The metal is placed in an electroforming tank for micro-electroforming. The electroforming metal is copper, and the electroforming height is controlled at 20μm to obtain a structure with a wall width of 15μm and a tank width of 120μm, forming a second side wall and a corresponding return channel.

[0118] The first and second photoresist layers are removed as a whole, and the reflow trenches of the different layers are connected to form a liquid suction core.

[0119] Example 2

[0120] The incoming material is a 0.05mm copper alloy sheet. A first layer of photoresist is sprayed onto the copper alloy sheet, and the coating height of the first layer of photoresist is 20μm.

[0121] The first layer of photoresist was exposed using a mask, and the mask image consisted of straight grating lines with a line width of 15 μm and a line spacing of 60 μm.

[0122] The first layer of photoresist that has undergone photolysis is dissolved using a developer, exposing part of the copper alloy sheet.

[0123] The metal is placed in an electroforming tank for micro-electroforming. The electroforming metal is copper, and the electroforming height is controlled at 20μm to obtain a structure with a wall width of 15μm and a tank width of 60μm, forming the first side wall and the corresponding return groove.

[0124] A 200nm copper seed layer was grown using PVD.

[0125] A second layer of photoresist is sprayed, with a coating height of 20 μm.

[0126] The second layer of photoresist was exposed using a mask. The mask image consisted of straight grating lines with a line width of 15 μm and a line spacing of 120 μm, and was at a 45-degree angle to the first sidewall.

[0127] The metal is placed in an electroforming tank for micro-electroforming. The electroforming metal is copper, and the electroforming height is controlled at 20μm to obtain a structure with a wall width of 15μm and a tank width of 120μm, forming a second side wall and a corresponding return channel.

[0128] The first and second photoresist layers are removed as a whole, and the reflow trenches of the different layers are connected to form a liquid suction core.

[0129] Example 3

[0130] The incoming material is a 0.05mm copper alloy sheet. A first layer of photoresist is sprayed onto the copper alloy sheet, and the coating height of the first layer of photoresist is 20μm.

[0131] The first layer of photoresist was exposed using a mask, and the mask image consisted of straight grating lines with a line width of 15 μm and a line spacing of 60 μm.

[0132] The first layer of photoresist that has undergone photolysis is dissolved using a developer, exposing part of the copper alloy sheet.

[0133] The metal is placed in an electroforming tank for micro-electroforming. The electroforming metal is copper, and the electroforming height is controlled at 20μm to obtain a structure with a wall width of 15μm and a tank width of 60μm, forming the first side wall and the corresponding return groove.

[0134] A 200nm copper seed layer was grown using PVD.

[0135] A second layer of photoresist is sprayed, with a coating height of 20 μm.

[0136] The second layer of photoresist was exposed using a mask. The mask image consisted of straight grating lines with a line width of 15 μm and a line spacing of 120 μm, forming a 90-degree angle with the first sidewall.

[0137] The metal is placed in an electroforming tank for micro-electroforming. The electroforming metal is copper, and the electroforming height is controlled at 20μm to obtain a structure with a wall width of 15μm and a tank width of 120μm, forming a second side wall and a corresponding return channel.

[0138] The first and second photoresist layers are removed as a whole, and the reflow trenches of the different layers are connected to form a liquid suction core.

[0139] Example 4

[0140] The incoming material is a 0.05mm copper alloy sheet. A first layer of photoresist is sprayed onto the copper alloy sheet, and the coating height of the first layer of photoresist is 20μm.

[0141] The first layer of photoresist was exposed using a mask, and the mask image consisted of straight grating lines with a line width of 15 μm and a line spacing of 60 μm.

[0142] The first layer of photoresist that has undergone photolysis is dissolved using a developer, exposing part of the copper alloy sheet.

[0143] The metal is placed in an electroforming tank for micro-electroforming. The electroforming metal is copper, and the electroforming height is controlled at 20μm to obtain a structure with a wall width of 15μm and a tank width of 60μm, forming the first side wall and the corresponding return groove.

[0144] The first layer of photoresist is removed entirely to form a liquid-absorbing core.

[0145] Example 5

[0146] The incoming material is a 0.05mm copper alloy sheet. A first layer of photoresist is sprayed onto the copper alloy sheet, and the coating height of the first layer of photoresist is 20μm.

[0147] The first layer of photoresist was exposed using a mask, and the mask image consisted of straight grating lines with a line width of 15 μm and a line spacing of 120 μm.

[0148] The first layer of photoresist that has undergone photolysis is dissolved using a developer, exposing part of the copper alloy sheet.

[0149] The metal is placed in an electroforming tank for micro-electroforming. The electroforming metal is copper, and the electroforming height is controlled at 20μm to obtain a structure with a wall width of 15μm and a tank width of 120μm, forming the first sidewall and the corresponding return groove.

[0150] The first layer of photoresist is removed entirely to form a liquid-absorbing core.

[0151] Comparative Example 1

[0152] Copper mesh absorbent core

[0153] Comparative Example 2

[0154] Copper powder absorbent core

[0155] Water creep tests were conducted on the absorbent cores of Examples 1-5 and Comparative Examples 1-2, and the test results are shown in Table 1. During the water creep test, the absorbent core was inserted into pure water, and capillary creep was observed. The maximum creep height was recorded using a ruler, and the time taken to creep 50mm was recorded using a stopwatch. The thickness of the absorbent structure was measured using a micrometer; the thickness of the absorbent structure was the total thickness of the absorbent core minus the thickness of the substrate, i.e., the total height of the stacked return grooves.

[0156] Table 1 Test Results

[0157] Climb height (mm) Climb time s Thickness μm Example 1 196 5 39 Example 2 208 4.5 38 Example 3 187 5 41 Example 4 179 5 22 Example 5 136 6 23 Comparative Example 1 125 9 58 Comparative Example 2 181 15 56

[0158] As can be seen from the table above, the thickness of the suction cores in Examples 1-5 is less than that in Comparative Examples 1-2, which facilitates the ultra-thin design of the temperature equalization device. The rise time required for the suction cores in Examples 1-5 is less than that required for the suction cores in Comparative Examples 1-2, thus improving the reflux efficiency of the working fluid. Furthermore, the suction cores in Examples 1-3 have a double-layer structure, and their rise heights are all higher than those of the suction cores in Comparative Examples 1-2, indicating that the suction cores in Examples 1-3 have higher capillary force. The suction cores in Examples 4-5 have a single-layer structure, and their rise heights are all slightly higher than those of the suction cores in Comparative Examples 1-2, indicating that the suction cores in Examples 1-5 have better overall performance.

[0159] The temperature equalization device provided in this application embodiment includes a housing 10 and a liquid-absorbing core 20, with the housing 10 having a receiving cavity. The liquid-absorbing core 20 is disposed within the receiving cavity and includes a liquid-absorbing layer. The liquid-absorbing layer is provided with return grooves 23, the width of which is less than or equal to 200 micrometers. The small width of the return grooves 23 can be precisely controlled to construct a micro / nano structure, improve the capillary force and anti-gravity capability of the liquid-absorbing core 20, and allow for a greater number of grooves per unit area, providing more delivery channels, improving temperature equalization performance and efficiency, and achieving an ultra-thin temperature equalization device.

[0160] This application embodiment also provides an electrical device including the aforementioned temperature equalization device. The temperature equalization device performs heat exchange and temperature equalization on the electrical device, regulating its temperature. For example, the temperature equalization device can dissipate heat from heat-generating components such as the CPU and SoC, preventing localized overheating and improving device stability. This electrical device includes the aforementioned temperature equalization device because it has at least the advantages of good temperature equalization and ease of achieving ultra-thin design; specific effects are described above and will not be repeated here.

[0161] The aforementioned electrical equipment includes, but is not limited to, mobile phones, portable devices, laptops, electric toys, power tools, vehicles, ships, and spacecraft. Vehicles can be gasoline-powered vehicles, natural gas-powered vehicles, or electric vehicles, and electric vehicles can be pure electric vehicles, hybrid electric vehicles, or range-extended electric vehicles. Correspondingly, the electrical device can be the vehicle's drive mechanism or its control system. Spacecraft can include airplanes, rockets, space shuttles, or spacecraft.

[0162] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," "front," "rear," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0163] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0164] Finally, it should be noted that other embodiments of this utility model will readily occur to those skilled in the art upon consideration of the specification and practice of the utility model disclosed herein. This utility model is intended to cover any variations, uses, or adaptations of this utility model that follow the general principles of this utility model and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this utility model is limited only by the appended claims.

Claims

1. A temperature equalization device, characterized in that, include: The housing (10) has a receiving cavity; A liquid-absorbing core (20) is disposed in the receiving cavity. The liquid-absorbing core (20) includes a liquid-absorbing layer and a return groove (23) is provided in the liquid-absorbing layer. The width of the return groove (23) is less than or equal to 200 micrometers.

2. The temperature equalization device according to claim 1, characterized in that, At least two liquid-absorbing layers are provided, and the at least two liquid-absorbing layers are stacked sequentially along the direction away from the bottom wall of the receiving cavity. The width of the reflux groove (23) of the liquid absorption layer adjacent to the bottom wall of the receiving cavity is less than or equal to 100 micrometers.

3. The temperature equalization device according to claim 2, characterized in that, Along the direction away from the bottom wall of the receiving cavity, the width of the reflux groove (23) of the liquid suction core (20) increases sequentially.

4. The temperature equalization device according to claim 2, characterized in that, In two adjacent absorbent layers, the reflux groove (23) of the absorbent layer away from the bottom wall of the receiving cavity is connected to at least two reflux grooves (23) of the absorbent layer near the bottom wall of the receiving cavity.

5. The temperature equalization device according to claim 4, characterized in that, The included angle between the extension directions of the return grooves (23) of two adjacent liquid absorption layers is greater than or equal to 0° and less than or equal to 90°.

6. The temperature equalization device according to claim 5, characterized in that, The included angle between the extension directions of the return grooves (23) of two adjacent liquid absorption layers is greater than or equal to 30° and less than or equal to 60°.

7. The temperature equalization device according to any one of claims 2-6, characterized in that, At least two of the said absorbent layers include: The first liquid-absorbing layer (21) is disposed on the bottom wall of the receiving cavity; The second absorbent layer (22) is disposed on the side of the first absorbent layer (21) away from the bottom wall of the receiving cavity; The first liquid-absorbing layer (21) and the second liquid-absorbing layer (22) are an integrated structure.

8. The temperature equalization device according to claim 7, characterized in that, The first absorbent layer (21) includes: Base plate (25); The first sidewall (24) is provided on the bottom plate (25) to form the corresponding return groove (23); Wherein, at least one of the width and height of the return groove (23) of the first liquid absorption layer (21) and the width of the first sidewall (24) is less than or equal to 100 μm.

9. The temperature equalization device according to claim 8, characterized in that, The width of the reflux groove (23) of the first absorbent layer (21) is greater than or equal to 10 μm and less than or equal to 80 μm; and / or, The height of the reflux groove (23) of the first liquid absorption layer (21) is greater than or equal to 15 μm and less than or equal to 50 μm; And / or, The width of the first sidewall (24) is greater than or equal to 6 μm and less than or equal to 15 μm.

10. The temperature equalization device according to claim 8, characterized in that, The second absorbent layer (22) includes: The second sidewall (26) is disposed on the first sidewall (24) to form the corresponding return trench (23); The width of the reflux groove (23) of the second liquid absorption layer (22) is greater than or equal to 50 μm and less than or equal to 150 μm.

11. The temperature equalization device according to claim 7, characterized in that, The return channels (23) of the first absorbent layer (21) are arranged in parallel; or, The first liquid-absorbing layer (21) has an evaporation end, which is configured to be opposite to a heat source, and the reflux grooves (23) of the first liquid-absorbing layer (21) are radially distributed relative to the evaporation end.

12. The temperature equalization device according to claim 11, characterized in that, The widths of the return grooves (23) of the first absorbent layer (21) are equal in their extending direction; or, The width of at least a portion of the reflux groove (23) of the first liquid absorption layer (21) gradually increases in the direction away from the evaporation end.

13. The temperature equalization device according to any one of claims 1-6, characterized in that, The liquid-absorbing layer is fabricated using photolithography and micro-electroforming processes; and / or, The extension direction of the return groove (23) is a straight line.

14. An electrical appliance, characterized in that, Includes the temperature equalization device according to any one of claims 1-13.

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