Heat dissipation assembly, DCDC integrated device

CN224844488UActive Publication Date: 2026-10-09SHINRY TECH
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Patent Information

Application Number
CN202522245371.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-23
Publication Date
2026-10-09
Estimated Expiration
2035-10-23

AI Technical Summary

Technical Problem

[0003]本实用新型的目的是提供一种散热组件、DCDC集成装置,解决散热器容易漏液而损坏电子器件的问题

Benefits of technology

[0014]通过设置散热组件包括第一换热件,第一换热件具有第一空间、第二空间和多个液体流道,多个液体流道沿第一方向延伸,第一空间和第二空间均设置于第一换热件在第一方向上的端部,多个液体流道的一端与第一空间连通,另一端与第二空间连通,第一空间用于输入流体,第二空间用于输出流体,第一换热件用于与功率器件连接以进行换热,使得第一换热件各处的材质的致密性一致,降低了漏液而导致功率器件损坏的风险,且加工方式简单,制造成本低。

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Abstract

A heat dissipation assembly and a DCDC integrated device, the heat dissipation assembly comprises a first heat exchange member, the first heat exchange member has a first space, a second space and a plurality of liquid flow channels, the plurality of liquid flow channels extend along a first direction, the first space and the second space are arranged at the end of the first heat exchange member in the first direction, one end of the plurality of liquid flow channels communicates with the first space, and the other end communicates with the second space, the first space is used for inputting fluid, the second space is used for outputting fluid, and the first heat exchange member is used for being connected with a power device to exchange heat, so that the compactness of the material at each part of the first heat exchange member is consistent, the risk of damage of the power device caused by liquid leakage is reduced, and the processing mode is simple and the manufacturing cost is low.
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Description

Technical Field

[0001] This utility model relates to the field of liquid cooling technology, specifically to a heat dissipation component and a DC-DC integrated device. Background Technology

[0002] Currently, most vehicle power supply radiators use liquid cooling to dissipate heat from power devices and magnetic components. Commonly used liquid cooling radiators are usually formed by high-pressure casting or precision machining. However, due to the complexity of mold forming and other factors, it is difficult to maintain consistent material density, and the radiator is prone to leakage, which can damage electronic components. Utility Model Content

[0003] The purpose of this invention is to provide a heat dissipation component and a DC-DC integrated device to solve the problem of heat sinks easily leaking and damaging electronic components.

[0004] To achieve the objectives of this utility model, the following technical solution is provided: In a first aspect, the present invention provides a heat dissipation component, comprising: a first heat exchanger having a first space, a second space, and a plurality of liquid channels extending along a first direction; the first space and the second space being disposed at the ends of the first heat exchanger in the first direction; one end of the plurality of liquid channels communicating with the first space and the other end communicating with the second space; the first space being used for inputting fluid and the second space being used for outputting fluid; and the first heat exchanger being used for connecting to a power device for heat exchange.

[0005] In one embodiment, the first heat exchanger includes a first heat exchange surface and a second heat exchange surface opposite to each other in a second direction, the first heat exchange surface and / or the second heat exchange surface being used to connect to a power device for heat exchange.

[0006] In one embodiment, the first heat exchanger (10) includes a third heat exchange surface (1010) and a fourth heat exchange surface (1011) opposite to each other in a third direction (Z), the third heat exchange surface (1010) and / or the fourth heat exchange surface (1011) being used to connect to a power device (301) for heat exchange.

[0007] In one embodiment, the first heat exchanger includes a main body and a partition, the partition being connected to the main body and forming a plurality of liquid flow channels, at least one end face of the partition being an inclined surface in the first direction, and the main body being used to connect to a power device.

[0008] In one embodiment, a plurality of liquid channels are arranged sequentially in a second direction, and each liquid channel includes a plurality of sub-liquid channels arranged sequentially in a third direction.

[0009] In one embodiment, the first heat exchanger has an inlet and an outlet, the inlet being connected to the first space and the outlet being connected to the second space; the inlet and the outlet are respectively located at opposite ends of the first heat exchanger in the first direction, or the inlet and the outlet are respectively located at the same end of the first heat exchanger in the first direction.

[0010] In one embodiment, the heat dissipation assembly further includes a second heat exchanger, which includes an inlet connector and an outlet connector. The inlet connector is connected to the first space, and the outlet connector is connected to the second space.

[0011] In one embodiment, the second heat exchanger includes a first surface having a first flow channel, a second flow channel, a third flow channel, and a fourth flow channel connected in sequence. The first flow channel is also connected to the third flow channel, the first flow channel is connected to the liquid inlet connector, and the fourth flow channel is connected to the liquid outlet connector. The second heat exchanger also includes a second surface opposite to the first surface. The second surface is used to mount the converter core, the air compressor controller, the hydrogen pump controller, the current sensor, and the common mode inductor. The first flow channel is configured to correspond to the air compressor controller, the second flow channel is configured to correspond to the hydrogen pump controller, the third flow channel is configured to correspond to the current sensor and the common mode inductor, and the fourth flow channel is configured to correspond to the converter core.

[0012] In one embodiment, the second heat exchanger further has a first through hole and a second through hole, both of which penetrate the first surface and the second surface. The first through hole is connected to the first flow channel, the second flow channel, and the third flow channel. The second through hole is connected to the fourth flow channel. The third flow channel is fluidized through the first through hole and the second through hole. The first through hole is connected to the first space, and the second through hole is connected to the second space.

[0013] Secondly, this utility model also provides a DC-DC integrated device, including a DC-DC converter, an air compressor controller, a hydrogen pump controller, and a heat dissipation component as described in the first aspect. The DC-DC converter includes a power device and a converter core. The power device is connected to a first heat exchanger of the heat dissipation component for heat exchange. The converter core, the air compressor controller, and the hydrogen pump controller are connected to a second heat exchanger of the heat dissipation component for heat exchange.

[0014] By setting a heat dissipation component including a first heat exchanger, the first heat exchanger having a first space, a second space and multiple liquid channels, the multiple liquid channels extending along a first direction, the first space and the second space both being located at the ends of the first heat exchanger in the first direction, one end of the multiple liquid channels communicating with the first space and the other end communicating with the second space, the first space being used for fluid input and the second space being used for fluid output, the first heat exchanger being used to connect with a power device for heat exchange, making the material density of the first heat exchanger uniform throughout, reducing the risk of power device damage due to leakage, and the processing method is simple and the manufacturing cost is low. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a structural diagram of the first heat exchanger in the first embodiment; Figure 2 This is an exploded view of the first heat exchanger in the first embodiment; Figure 3 This is a structural diagram of the first heat exchanger in the first embodiment; Figure 4 This is an exploded view of the first heat exchanger in the first embodiment; Figure 5 This is a cross-sectional view of the first heat exchanger in the first embodiment; Figure 6 This is a side view of the first heat exchanger in the first embodiment; Figure 7 This is a structural diagram of the first heat exchanger in the second embodiment; Figure 8 This is an exploded view of the first heat exchanger in the second embodiment; Figure 9 This is a structural diagram of the first heat exchanger in the second embodiment; Figure 10 This is a cross-sectional view of the first heat exchanger in the second embodiment from one perspective; Figure 11 This is a cross-sectional view of the first heat exchanger in the second embodiment from a second perspective; Figure 12 This is a cross-sectional view of the first heat exchanger in the second embodiment from yet another perspective; Figure 13 This is a structural diagram of the first heat exchanger in the third embodiment; Figure 14 This is an exploded view of the first heat exchanger in the third embodiment; Figure 15 This is a structural diagram of the first heat exchanger in the third embodiment; Figure 16 This is a cross-sectional view of the first heat exchanger in the third embodiment from one perspective; Figure 17 This is a cross-sectional view of the first heat exchanger in the third embodiment from a second perspective; Figure 18 This is a cross-sectional view of the first heat exchanger in the third embodiment from a third perspective; Figure 19 This is a structural diagram of a DC-DC integrated device according to one embodiment; Figure 20 This is a structural diagram of a DC-DC integrated device according to another embodiment; Figure 21 An exploded view of a DC-DC integrated device according to one embodiment; Figure 22 This is an exploded view of a DC-DC integrated device according to another embodiment; Figure 23 This is a bottom view of a DC-DC integrated device according to one embodiment.

[0017] Explanation of reference numerals in the attached figures: 1000-DC-CDC integrated device; 100 - Heat dissipation components; 10-First heat exchanger, 101-First space, 102-Second space, 103-Liquid flow channel, 1031-Sub-liquid flow channel, 104-First heat exchange surface, 105-Second heat exchange surface, 106-First opening, 107-Second opening, 108-Liquid inlet, 109-Liquid outlet, 1010-Third heat exchange surface, 1011-Fourth heat exchange surface, 11-Main body, 111-Cavity, 12-Separation part, 121-First plate, 122-Second plate, 123-Third plate, 124-Fourth plate, 13-Connecting part, 14-First end plate, 15-Second end plate, 16-Clamping part, 17-Thermal conductive adhesive, 18-Sealing ring, 19-Top surface; 20-Second heat exchanger, 211-First surface, 212-First flow channel, 213-Second flow channel, 214-Third flow channel, 215-Fourth flow channel, 216-Second surface, 217-First through hole, 218-Second through hole, 22-Heat dissipation fin, 23-Heat dissipation column, 24-Cover plate, 25-Liquid inlet connector, 26-Liquid outlet connector; 30 - Housing; 40 - Liquid inlet assembly; 50 - Liquid outlet assembly; 200 - Outer shell, 201 - Side panel, 202 - Top panel, 300 - DC-DC converter, 301 - Power device, 302 - Converter core, 400 - Low-voltage control plug-in interface, 500 - Power distribution output interface, 600 - Hydrogen pump controller output interface, 700 - Multi-in-one converter input copper busbar interface, 800 - Multi-in-one converter output interface, 900 - Air compressor controller output interface; X - First direction, Y - Second direction, Z - Third direction. Detailed Implementation

[0018] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] It should be noted that when a component is said to be "fixed" to another component, it can be directly on the other component or it can be in a middle component. When a component is said to be "connected" to another component, it can be directly connected to the other component or it may be in a middle component.

[0020] Unless otherwise defined, all technical and scientific terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used in this invention includes any and all combinations of one or more of the associated listed items.

[0021] The following detailed description, in conjunction with the accompanying drawings, outlines some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0022] Please refer to Figures 1 to 16 This utility model provides a heat dissipation component 100, including a first heat exchanger 10. The first heat exchanger 10 has a first space 101, a second space 102 and a plurality of liquid channels 103. The plurality of liquid channels 103 extend along a first direction X. The first space 101 and the second space 102 are both disposed at the ends of the first heat exchanger 10 in the first direction X. One end of the plurality of liquid channels 103 is connected to the first space 101 and the other end is connected to the second space 102. The first space 101 is used for fluid input and the second space 102 is used for fluid output. The first heat exchanger 10 is used to connect with a power device 301 for heat exchange.

[0023] In this process, fluid enters the first heat exchanger 10 from the first space 101, flows through multiple liquid channels 103 into the second space 102, and finally exits the first heat exchanger 10 from the second space 102. During this process, the fluid exchanges heat with the power device 301 through the first heat exchanger 10 to reduce the temperature of the power device 301. Optionally, the power device 301 can be connected to the first heat exchanger 10 by means of snap-fit, screw-fit, adhesive, etc., without limitation. Optionally, the fluid can be a low-boiling-point liquid such as acetone or water, or a low-boiling-point solid-liquid mixture, without limitation.

[0024] In a specific embodiment, the first heat exchanger 10 is an integral component formed by profile molding, so as to further improve the sealing and tightness of the first heat exchanger 10.

[0025] By setting the heat dissipation assembly 100 to include a first heat exchanger 10, the first heat exchanger 10 has a first space 101, a second space 102 and a plurality of liquid channels 103, the plurality of liquid channels 103 extend along a first direction X, the first space 101 and the second space 102 are both disposed at the ends of the first heat exchanger 10 in the first direction X, one end of the plurality of liquid channels 103 is connected to the first space 101 and the other end is connected to the second space 102, the first space 101 is used for fluid input and the second space 102 is used for fluid output, the first heat exchanger 10 is used to connect with the power device 301 for heat exchange, so that the material density of the first heat exchanger 10 is consistent throughout, reducing the risk of liquid leakage causing damage to the power device 301, and the processing method is simple and the manufacturing cost is low.

[0026] In one embodiment, please refer to Figures 3 to 6 The first heat exchanger 10 includes a first heat exchange surface 104 and a second heat exchange surface 105 facing away from each other in the second direction Y. The first heat exchange surface 104 and / or the second heat exchange surface 105 are used to connect with the power device 301 for heat exchange. The first direction X and the second direction Y intersect. Optionally, the first heat exchange surface 104 and the second heat exchange surface 105 are both the surfaces with the largest area of ​​the first heat exchanger 10 to ensure high heat exchange efficiency between the first heat exchanger 10 and the power device 301. In a specific embodiment, both the first heat exchange surface 104 and the second heat exchange surface 105 are used to connect to the power device 301. Optionally, the first heat exchanger 10 further includes a top surface 19 located at one end of the first heat exchanger 10 in the third direction Z and between the first heat exchange surface 104 and the second heat exchange surface 105. At least one of the first heat exchange surface 104, the second heat exchange surface 105 and the top surface 19 is used to connect the power device 301 to further increase the available heat exchange area of ​​the first heat exchanger 10.

[0027] In another embodiment, please refer to Figure 7 and Figure 8The first heat exchanger 10 includes a third heat exchange surface 1010 and a fourth heat exchange surface 1011 facing away from each other in the Z direction. The third heat exchange surface 1010 and / or the fourth heat exchange surface 1011 are used to connect to the power device 301 for heat exchange. In a specific embodiment, both the third heat exchange surface 1010 and the fourth heat exchange surface 1011 are used to connect to the power device 301.

[0028] In yet another embodiment, please refer to Figure 14 The first heat exchanger 10 includes a third heat exchange surface 1010 and a fourth heat exchange surface 1011 facing away from each other in the Z direction. The third heat exchange surface 1010 and / or the fourth heat exchange surface 1011 are used to connect to the power device 301 for heat exchange. In a specific embodiment, the third heat exchange surface 1010 is used to connect the power device 301.

[0029] By providing the first heat exchanger 10 with a first heat exchange surface 104 and a second heat exchange surface 105 opposite to each other in the second direction Y, or by providing the first heat exchanger 10 with a third heat exchange surface 1010 and a fourth heat exchange surface 1011 opposite to each other in the third direction Z, the heat dissipation assembly 100 can install the power devices 301 according to the number, size and layout requirements of the power devices 301, thereby improving the space utilization and heat exchange performance utilization of the heat dissipation assembly 100.

[0030] Please refer to Figure 5 , Figure 10 and Figure 16 The first heat exchanger 10 includes a main body 11 and a partition 12. The partition 12 is connected to the main body 11 and forms a plurality of liquid flow channels 103. At least one end face of the partition 12 in the first direction X is an inclined surface. The main body 11 is used to connect to the power device 301.

[0031] Specifically, the main body 11 has a cavity 111, and the partition 12 is housed in the cavity 111 and connected to the inner wall of the cavity 111. The partition 12 includes a plurality of first plates 121 arranged at intervals in the second direction Y. The plurality of first plates 121 and the inner wall of the cavity 111 enclose a plurality of liquid channels 103 arranged in sequence in the second direction Y. The main body 11 is used to connect to the power device 301.

[0032] For a detailed implementation, please refer to Figure 5 , Figure 10 and Figure 16 At least one end face of the partition 12 in the first direction X is an inclined surface, so that when the fluid flows at both ends of the liquid flow channel 103 in the first direction X, the resistance encountered by the fluid flow is low under the guiding effect of the inclined surface of the partition 12.

[0033] By setting the first heat exchanger 10 to include a main body 11 and a partition 12, the partition 12 is connected to the main body 11 and encloses to form a plurality of liquid flow channels 103. At least one end face of the partition 12 in the first direction X is an inclined surface. The main body 11 is used to connect with the power device 301, which increases the contact area between the fluid and the first heat exchanger 10 and improves the heat dissipation capacity of the first heat exchanger 10 for the power device 301. At the same time, when the fluid flows at both ends of the liquid flow channel 103 in the first direction X, the resistance encountered by the fluid flow is low under the guiding effect of the inclined surface of the partition 12.

[0034] Please refer to Figure 5 , Figure 10 and Figure 16 The first heat exchanger 10 also has a first opening 106 and a second opening 107. The first opening 106 and the second opening 107 are respectively located at both ends of the first heat exchanger 10 in the first direction X. The heat dissipation assembly 100 also includes a first end plate 14 and a second end plate 15. The first end plate 14 is connected to one end of the first heat exchanger 10 in the first direction X and closes the first opening 106. The second end plate 15 is connected to the other end of the first heat exchanger 10 in the first direction X and closes the second opening 107.

[0035] Optionally, the first end plate 14, the second end plate 15, and the first heat exchanger 10 can be connected by welding or other means to improve the airtightness of the liquid flow channel 103 and prevent leakage.

[0036] The first heat exchanger 10 provided by this utility model is formed by extrusion or cutting profiles to form a first opening 106 and a second opening 107. Then, the first end plate 14 and the second end plate 15 are connected to the first heat exchanger 10 to close the first opening 106 and the second opening 107. Compared with die casting and precision machining, the material density of the first heat exchanger 10 in this solution is consistent, which reduces the risk of leakage and damage to the power device 301. Moreover, the processing method is simple and the manufacturing cost is low.

[0037] In one implementation, please refer to Figures 1 to 6 , Figures 1 to 6 The first embodiment of the first heat exchanger 10 is shown.

[0038] In a specific embodiment, the first heat exchanger 10 further includes a connecting portion 13, which is connected to the main body 11. The heat dissipation assembly 100 also includes a clamping member 16, one end of which is connected to the connecting portion 13, and the other end of which is used to elastically abut against the power device 301 to press the power device 301 and the main body 11 together. Specifically, the connecting portion 13 is connected to one end of the main body 11 in the second direction Y. One end of the clamping member 16 is connected to the connecting portion 13 by means of screwing, snapping, or riveting. The other end of the clamping member 16 extends to the surface of the main body 11 used to connect the power device 301, and presses the power device 301 onto the main body 11. Optionally, there are multiple clamping members 16, and each of the multiple clamping members 16 is provided in a one-to-one correspondence with a multiple power device 301.

[0039] By setting the first heat exchanger 10 to include a main body 11, a partition 12, and a connecting part 13, with the connecting part 13 connected to the main body 11, the heat dissipation assembly 100 also includes a clamping member 16. One end of the clamping member 16 is connected to the connecting part 13, and the other end of the clamping member 16 is used to elastically abut against the power device 301 to press the power device 301 and the main body 11 together, so that the connection between the power device 301 and the first heat exchanger 10 is tight, which is beneficial to improving the heat exchange capacity of the first heat exchanger 10. At the same time, the part of the clamping member 16 connected to the connecting part 13 has a distance from the main body 11, and the mounting hole opened on the connecting part 13 will not affect the structural integrity of the main body 11, thus reducing the risk of leakage of the first heat exchanger 10.

[0040] In a specific embodiment, multiple liquid channels 103 are arranged sequentially in the second direction Y, and each liquid channel 103 includes multiple sub-liquid channels 1031 arranged sequentially in the third direction Z. The first direction X, the second direction Y, and the third direction Z intersect each other. Specifically, the separator also includes a second plate 122, which is alternately connected to the aforementioned multiple first plates 121 to divide each liquid channel 103 into multiple sub-liquid channels 1031.

[0041] By setting multiple liquid channels 103 arranged sequentially in the second direction Y, each liquid channel 103 includes multiple sub-liquid channels 1031 arranged sequentially in the third direction Z. The first direction X, the second direction Y and the third direction Z intersect each other, which further increases the contact area between the first heat exchanger 10 and the fluid, which is beneficial to improving the heat exchange capacity of the first heat exchanger 10. At the same time, when the thickness of the wall connecting the first heat exchanger 10 and the power device 301 is small, the first heat exchanger 10 still has the structural strength to meet the preset requirements and is not easily damaged or leaked.

[0042] In a specific embodiment, the first heat exchanger 10 has a liquid inlet 108 and a liquid outlet 109. The liquid inlet 108 communicates with the first space 101, and the liquid outlet 109 communicates with the second space 102. In a specific embodiment, both the liquid inlet 108 and the liquid outlet 109 pass through the connecting portion 13 in the second direction Y. The liquid inlet 108 is used to input fluid, and the liquid outlet 109 is used to output fluid, so that the fluid can quickly exchange heat with the first heat exchanger 10 when flowing, thereby improving the heat exchange capacity of the first heat exchanger 10.

[0043] In a specific embodiment, the liquid inlet 108 and the liquid outlet 109 are located at opposite ends of the first heat exchanger 10 in the first direction X, and the first space 101 and the second space 102 are located at opposite ends of the first heat exchanger 10 in the first direction X. This arrangement makes the structure of the first heat exchanger 10 relatively simple, facilitates the processing of the liquid flow channel 103 during the profile processing, and reduces manufacturing costs.

[0044] In a specific embodiment, the end faces of both ends of the partition 12 in the first direction X are both inclined surfaces. Specifically, the end faces of both ends of the partition 12 in the first direction X face the inlet 108 and the outlet 109, respectively, so that when the fluid enters the liquid flow channel 103 through the first space 101 from the inlet 108, and enters the outlet 109 through the second space 102 from the liquid flow channel 103, the resistance encountered by the fluid flow is low under the guiding effect of the inclined surfaces of the partition 12.

[0045] In a specific embodiment, the heat dissipation assembly 100 further includes thermally conductive adhesive 17. The thermally conductive component is connected to the first heat exchange component 10, and the thermally conductive adhesive 17 is disposed between the first heat exchange component 10 and the power device 301. Specifically, the thermally conductive adhesive 17 is connected to the first heat exchange surface 104 and the second heat exchange surface 105, and the power device 301 is pressed onto the thermally conductive adhesive 17 under the force of the aforementioned clamping member 16. Optionally, the thermally conductive adhesive 17 can be made of a chemically stable material with low thermal resistance and good insulation properties, such as an organosilicon thermally conductive pad, thermally conductive sealant, phase change thermally conductive interface material, and epoxy resin thermally conductive adhesive 17, etc., without limitation.

[0046] In a specific embodiment, the heat dissipation assembly 100 further includes a housing 30, a liquid inlet assembly 40, and a liquid outlet assembly 50. The first heat exchanger 10 and the power device 301 are both housed inside the housing 30. The liquid inlet assembly 40 and the liquid outlet assembly 50 are connected to the outside of the housing 30 and are respectively connected to the liquid inlet 108 and the liquid outlet 109 of the first heat exchanger 10 through a sealing ring 18.

[0047] By setting thermally conductive adhesive 17, the thermally conductive component is connected to the first heat exchange component 10. The thermally conductive adhesive 17 is used to be placed between the first heat exchange component 10 and the power device 301, so that the micro gap between the first heat exchange component 10 and the power device 301 is filled by the thermally conductive adhesive 17, thereby reducing the thermal resistance and improving the heat exchange efficiency.

[0048] In another implementation, please refer to Figures 7 to 12 , Figures 7 to 12 The image shows a second embodiment of the first heat exchanger 10.

[0049] In a specific embodiment, the first heat exchanger 10 has a liquid inlet 108 and a liquid outlet 109. The liquid inlet 108 communicates with the first space 101, and the liquid outlet 109 communicates with the second space 102. Specifically, the liquid inlet 108 and the liquid outlet 109 are located on the first heat exchange surface 104 or the second heat exchange surface 105. The liquid inlet 108 is used to input fluid, and the liquid outlet 109 is used to output fluid, so that the fluid can quickly exchange heat with the first heat exchanger 10 during flow, thereby improving the heat exchange capacity of the first heat exchanger 10.

[0050] In a specific embodiment, the liquid inlet 108 and the liquid outlet 109 are both located at the same end of the first heat exchanger 10 in the first direction X, and the first space 101 and the second space 102 are located at the same end of the first heat exchanger 10 in the first direction X.

[0051] In a specific embodiment, the liquid inlet 108 and the liquid outlet 109 are both located at one end of the first heat exchange surface 104 in the first direction X, close to the aforementioned first end plate 14, and are spaced apart from each other in the second direction Y.

[0052] In a specific embodiment, the partition 12 further includes a third plate 123 and a plurality of fourth plates 124. The third plate 123 extends along the first direction X and is located between the inlet 108 and the outlet 109. One end of the third plate 123 in the first direction X is connected to the first end plate 14, and the other end of the third plate 123 in the first direction X is spaced apart from the second end plate 15. The plurality of first plates 121 are disposed on one side of the third plate 123 in the second direction Y, and the plurality of fourth plates 124 are disposed on the other side of the third plate 123 in the second direction Y. The plurality of first plates 121 and the plurality of fourth plates 124 are symmetrically arranged relative to the third plate 123 in a one-to-one correspondence, so that the fluid can flow from the inlet 108 to the second end plate 15 under the guidance of the partition 12, and then flow from the second end plate 15 to the outlet 109.

[0053] By setting the inlet 108 and outlet 109 to be located at the same end of the first heat exchanger 10 in the first direction X, and the first space 101 and the second space 102 to be located at the same end of the first heat exchanger 10 in the first direction X, the pipes connected to the first heat exchanger 10 are all located on the same side of the heat dissipation assembly 100, which is beneficial to improve integration and simplify pipe layout.

[0054] In a specific embodiment, the end face of the partition 12 at one end in the first direction X is an inclined surface. Specifically, the end face of the partition 12 near the second end plate 15 in the first direction X includes a first inclined surface and a second inclined surface. The first inclined surface and the second inclined surface are opposite each other in the second direction Y, so that when the fluid flows at the second end plate 15, the resistance encountered by the fluid flow is low under the guiding effect of the inclined surface of the partition 12.

[0055] In yet another implementation, please refer to Figures 13 to 18 , Figures 13 to 18 The image shows a third embodiment of the first heat exchanger 10.

[0056] In a specific embodiment, the liquid inlet 108 and the liquid outlet 109 are both located at the same end of the first heat exchanger 10 in the first direction X. Specifically, the first end plate 14 is provided with a liquid inlet 108 and a liquid outlet 109. The liquid inlet 108 is connected to the first space 101, and the liquid outlet 109 is connected to the second space 102.

[0057] In a specific embodiment, the partition 12 further includes a third plate 123 and a plurality of fourth plates 124. The third plate 123 extends along the first direction X and is located between the inlet 108 and the outlet 109. One end of the third plate 123 in the first direction X is connected to the first end plate 14, and the other end of the third plate 123 in the first direction X is spaced apart from the second end plate 15. The plurality of first plates 121 are disposed on one side of the third plate 123 in the second direction Y, and the plurality of fourth plates 124 are disposed on the other side of the third plate 123 in the second direction Y. The plurality of first plates 121 and the plurality of fourth plates 124 are symmetrically arranged relative to the third plate 123 in a one-to-one correspondence, so that the fluid can flow from the inlet 108 to the second end plate 15 under the guidance of the partition 12, and then flow from the second end plate 15 to the outlet 109.

[0058] In a specific embodiment, the end face of the partition 12 near the second end plate 15 in the first direction X is an inclined surface. Specifically, the end face of the partition 12 near the second end plate 15 in the first direction X includes a first inclined surface and a second inclined surface, which are opposite to each other in the second direction Y, so that when the fluid flows at the second end plate 15, the resistance encountered by the fluid flow is low under the guiding effect of the inclined surface of the partition 12.

[0059] In a specific embodiment, a plurality of first plates 121 are configured as liquid inlet sides, and a plurality of fourth plates 124 are configured as liquid outlet sides. The end face of the liquid inlet side near the first end plate 14 in the first direction X includes a third inclined surface and a fourth inclined surface. The third inclined surface and the fourth inclined surface are opposite to each other in the second direction Y. The liquid outlet side and the liquid inlet side are symmetrical with respect to the third plate 123, so that when the fluid flows at the first end plate 14, the resistance encountered by the fluid flow is low under the guiding effect of the inclined surface of the partition 12.

[0060] In a specific embodiment, the heat dissipation assembly 100 further includes a housing 30, a liquid inlet assembly 40, and a liquid outlet assembly 50. The first heat exchanger 10 is connected to one side of the housing 30, and the power device 301 is housed inside the housing 30. The liquid inlet assembly 40 and the liquid outlet assembly 50 are both connected to the first end plate 14 of the heat dissipation assembly 100 and are respectively connected to the liquid inlet 108 and the liquid outlet 109 of the first heat exchanger 10.

[0061] Please refer to Figures 19 to 23 The heat dissipation assembly 100 also includes a second heat exchanger 20, which includes an inlet connector 25 and an outlet connector 26. The inlet connector 25 is connected to the first space 101, and the outlet connector 26 is connected to the second space 102.

[0062] In a specific embodiment, the second heat exchanger 20 includes a first surface 211, which has a first flow channel 212, a second flow channel 213, a third flow channel 214 and a fourth flow channel 215 connected in sequence. The first flow channel 212 is also connected to the third flow channel 214. The first flow channel 212 is connected to the liquid inlet connector 25 and the fourth flow channel 215 is connected to the liquid outlet connector 26.

[0063] The second heat exchanger 20 also includes a second surface 216 opposite to the first surface 211. The second surface 216 is used to mount heat-generating devices such as the converter core 302, air compressor controller, hydrogen pump controller, current sensor, and common mode inductor. Optionally, the first flow channel 212 is configured to correspond with the air compressor controller for heat exchange, the second flow channel 213 is configured to correspond with the hydrogen pump controller for heat exchange, the third flow channel 214 is configured to correspond with the current sensor and common mode inductor for heat dissipation, and the fourth flow channel 215 is configured to correspond with the converter core 302.

[0064] In a specific embodiment, the first flow channel 212, the second flow channel 213, the third flow channel 214 and the fourth flow channel 215 are all meandering flow channels. Specifically, each of the first flow channel 212, the second flow channel 213, the third flow channel 214 and the fourth flow channel 215 includes multiple parallel sections connected in sequence, so as to extend the heat exchange time between the fluid and the bottom plate 21 and thereby improve the heat dissipation capacity.

[0065] In a specific embodiment, a plurality of heat dissipation fins 22 or heat dissipation columns 23 are also provided in the first flow channel 212, the second flow channel 213, the third flow channel 214 and the fourth flow channel 215 to increase the heat exchange area between the second heat exchanger 20 and the fluid.

[0066] In a specific embodiment, the second heat exchanger 20 further includes a cover plate 24, which is connected to the first surface 211 to isolate the first flow channel 212, the second flow channel 213, the third flow channel 214, the fourth flow channel 215 from the outside world and prevent leakage.

[0067] Since the first flow channel 212 is connected to the inlet connector 25 and the fourth flow channel 215 is connected to the outlet connector 26, the flow rate of the fluid from the inlet connector 25 to the first flow channel 212, the second flow channel 213, the third flow channel 214 and the fourth flow channel 215 can be controlled by setting the size of the openings of the second flow channel 213 and the third flow channel 214 that are connected to the first flow channel 212. This achieves flow distribution among the various flow channels, and the second heat exchanger 20 can exchange heat with multiple heat-generating devices with different heat outputs to different degrees, improving the utilization rate of the fluid and the heat dissipation efficiency of the second heat exchanger 20.

[0068] To provide corresponding heat dissipation for multiple heat-generating devices with different heat outputs, and to simplify the external piping connection of the heat dissipation assembly 100, reducing the complexity of the heat dissipation assembly 100, in a specific embodiment, the base plate 21 also has a first through hole 217 and a second through hole 218. Both the first through hole 217 and the second through hole 218 penetrate the first surface 211 and the second surface 216. The first through hole 217 is connected to the first flow channel 212, the second flow channel 213, and the third flow channel 214. The second through hole 218 is connected to the fourth flow channel 215. The third flow channel 214 flows through the first through hole 217 and the second through hole 218 to the fourth flow channel 215. The first through hole 217 is connected to the first space 101, and the second through hole 218 is connected to the second space 102.

[0069] Specifically, the first through hole 217 is connected to the liquid inlet 108 of the first heat exchanger 10, the second through hole 218 is connected to the liquid outlet 109 of the first heat exchanger 10, and the liquid flow channels 103 of the heat dissipation assembly 100 are connected in series between the fourth flow channel 215 and the first flow channel 212, the second flow channel 213 and the third flow channel 214, so as to simplify the external pipeline connection of the heat dissipation assembly 100 and reduce the complexity of the heat dissipation assembly 100.

[0070] Please refer to Figures 19 to 23The present invention also provides a DC-DC integrated device 1000, including a DC-DC converter (300), an air compressor controller, a hydrogen pump controller, and a heat dissipation assembly (100). The DC-DC converter (300) includes a power device (301) and a converter core (302). The power device (301) is connected to the first heat exchange element (10) of the heat dissipation assembly (100) for heat exchange. The converter core (302), the air compressor controller, and the hydrogen pump controller are connected to the second heat exchange element (20) of the heat dissipation assembly (100) for heat exchange. In a specific embodiment, the DC-DC integrated device 1000 also includes a housing 200, which includes a side panel 201 and a top panel 202. The top panel 202 and the second heat exchanger 20 are respectively connected to the two far apart sides of the side panel 201 and close the two openings of the side panel 201 to form a space for accommodating the devices. The converter core 302, the air compressor controller, the hydrogen pump controller, the current sensor and the common mode inductor and other heat-generating devices are housed in the housing 200.

[0071] In a specific embodiment, the DC-DC integrated device 1000 also includes a low-voltage control plug-in interface, a power distribution output interface, a hydrogen pump controller output interface, a multi-in-one converter input copper bus interface, a multi-in-one converter output interface, and an air compressor controller output interface extending out of the housing 200, for connecting electronic devices and voltage power supplies, control power supplies, or electrical devices within the DC-DC integrated device 1000.

[0072] The first heat exchanger 10 and the power device 301 connected to the first heat exchanger 10 are disposed inside or outside the housing 200.

[0073] In one implementation method, please refer to Figures 7 to 22 The first heat exchanger 10 and the power device 301 connected to the first heat exchanger 10 are disposed inside the housing 200. Specifically, the first through hole 217 and the second through hole 218 are disposed close to each other. The first heat exchanger 10 is disposed on the second surface 216 of the second heat exchanger 20, and the liquid inlet 108 and the liquid outlet 109 of the first heat exchanger 10 are directly connected to the first through hole 217 and the second through hole 218 through sealing members, which improves the compactness and space utilization of the heat dissipation assembly 100, while reducing the complexity of the pipeline.

[0074] In another implementation, Figure 3 The first heat exchanger 10 and the power device 301 connected to the first heat exchanger 10 are disposed inside the housing 200, because Figure 3 The liquid inlet 108 and liquid outlet 109 of the first heat exchanger 10 shown are located at both ends in the first direction X, so the first through hole 217 and the second through hole 218 of the second heat exchanger 20 are arranged far apart from each other.

[0075] In another embodiment, please refer to Figure 1 and Figure 13 , Figure 1 and Figure 13 The first heat exchanger 10 and the power device 301 connected to the first heat exchanger 10 are disposed outside the housing 200. Specifically, the liquid inlet assembly 40 and the liquid outlet assembly 50 of the first heat exchanger 10 are connected to the first through hole 217 and the second through hole 218 through different pipelines, so that the second heat exchanger 20 has sufficient installation space, which is beneficial to increase the gap between the devices, reduce the risk of heat accumulation, and facilitate the installation and disassembly of the first heat exchanger 10.

[0076] Please refer to Figures 19 to 23 This invention also provides a hydrogen fuel cell system, including a fuel cell stack and a DC-DC integrated device 1000 as described in this embodiment. The fuel cell stack and the DC-DC integrated device 1000 are electrically connected. The fuel cell stack directly converts the chemical energy of hydrogen and oxygen into direct current (DC) electrical energy, and supplies power to all electrical equipment, including the DC-DC converter 300, air compressor controller, and hydrogen pump controller. The DC-DC converter 300 converts the unstable voltage output from the fuel cell stack into a higher and more stable DC voltage, and can control the output power of the fuel cell stack according to instructions from a computer controller. The air compressor controller controls the pressure of the oxygen entering the fuel cell stack, and the hydrogen pump controller controls the operation of the hydrogen circulation pump or hydrogen injector to regulate hydrogen flow and pressure. A current sensor measures the current value output by the fuel cell stack or the hydrogen fuel cell system to achieve precise power control and protection, and calculates the required fuel quantity and air intake based on the real-time power of the fuel cell stack. A common-mode inductor is used to suppress common-mode electromagnetic interference.

[0077] This utility model also provides a hydrogen fuel cell system. By setting up a fuel cell stack and the DC-DC integrated device 1000 in the embodiment of this utility model, the fuel cell stack and the DC-DC integrated device 1000 are electrically connected, which realizes efficient heat dissipation of the DC-DC integrated device 1000 of the hydrogen fuel cell system, while preventing leakage and reducing the risk of device damage.

[0078] In the description of the embodiments of this utility model, it should be noted that the orientation or positional relationship of the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and other indicators are based on the orientation or positional relationship of the drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0079] The above-disclosed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Those skilled in the art can understand that implementing all or part of the above-described embodiments and making equivalent changes in accordance with the claims of the present utility model are still within the scope of the present utility model.

Claims

1. A heat dissipation component (100), characterized in that, include: A first heat exchanger (10) has a first space (101), a second space (102), and a plurality of liquid channels (103). The plurality of liquid channels (103) extend along a first direction (X). The first space (101) and the second space (102) are both disposed at the ends of the first heat exchanger (10) in the first direction (X). One end of the plurality of liquid channels (103) is connected to the first space (101), and the other end is connected to the second space (102). The first space (101) is used for inputting fluid, and the second space (102) is used for outputting fluid. The first heat exchanger (10) is used to connect with a power device (301) for heat exchange.

2. The heat dissipation assembly (100) according to claim 1, characterized in that, The first heat exchanger (10) includes a first heat exchange surface (104) and a second heat exchange surface (105) opposite to each other in a second direction (Y), the first heat exchange surface (104) and / or the second heat exchange surface (105) being used to connect to the power device (301) for heat exchange.

3. The heat dissipation assembly (100) according to claim 1, characterized in that, The first heat exchanger (10) includes a third heat exchange surface (1010) and a fourth heat exchange surface (1011) opposite to each other in a third direction (Z), the third heat exchange surface (1010) and / or the fourth heat exchange surface (1011) being used to connect to a power device (301) for heat exchange.

4. The heat dissipation assembly (100) according to claim 1, characterized in that, The first heat exchanger (10) includes a main body (11) and a partition (12). The partition (12) is connected to the main body (11) and forms a plurality of liquid flow channels (103). At least one end face of the partition (12) in the first direction (X) is an inclined surface. The main body (11) is used to connect to the power device (301).

5. The heat dissipation assembly (100) according to claim 1, characterized in that, Multiple liquid channels (103) are arranged sequentially in the second direction (Y), and each liquid channel (103) includes multiple sub-liquid channels (1031) arranged sequentially in the third direction (Z).

6. The heat dissipation assembly (100) according to any one of claims 1-5, characterized in that, The first heat exchanger (10) has a liquid inlet (108) and a liquid outlet (109). The liquid inlet (108) is connected to the first space (101), and the liquid outlet (109) is connected to the second space (102). The liquid inlet (108) and the liquid outlet (109) are respectively located at both ends of the first heat exchanger (10) in the first direction (X), or the liquid inlet (108) and the liquid outlet (109) are respectively located at the same end of the first heat exchanger (10) in the first direction (X).

7. The heat dissipation assembly (100) according to claim 1, characterized in that, The heat dissipation assembly (100) further includes a second heat exchanger (20), which includes an inlet connector (25) and an outlet connector (26). The inlet connector (25) is connected to the first space (101), and the outlet connector (26) is connected to the second space (102).

8. The heat dissipation assembly (100) according to claim 7, characterized in that, The second heat exchanger (20) includes a first surface (211), the first surface (211) having a first flow channel (212), a second flow channel (213), a third flow channel (214) and a fourth flow channel (215) connected in sequence, the first flow channel (212) also being connected to the third flow channel (214), the first flow channel (212) being connected to the liquid inlet connector (25), and the fourth flow channel (215) being connected to the liquid outlet connector (26); The second heat exchanger (20) also includes a second surface (216) opposite to the first surface (211). The second surface (216) is used to mount the converter core (302), the air compressor controller, the hydrogen pump controller, the current sensor, and the common mode inductor. The first flow channel (212) is configured to correspond to the air compressor controller, the second flow channel (213) is configured to correspond to the hydrogen pump controller, the third flow channel (214) is configured to correspond to the current sensor and the common mode inductor, and the fourth flow channel (215) is configured to correspond to the converter core (302).

9. The heat dissipation assembly (100) according to claim 8, characterized in that, The second heat exchanger (20) also has a first through hole (217) and a second through hole (218). The first through hole (217) and the second through hole (218) both penetrate the first surface (211) and the second surface (216). The first through hole (217) is connected to the first flow channel (212), the second flow channel (213) and the third flow channel (214). The second through hole (218) is connected to the fourth flow channel (215). The third flow channel (214) is connected to the fourth flow channel (215) through the first through hole (217) and the second through hole (218). The first through hole (217) is connected to the first space (101), and the second through hole (218) is connected to the second space (102).

10. A DC-DC integrated device (1000), characterized in that, The device includes a DC-DC converter (300), an air compressor controller, a hydrogen pump controller, and a heat dissipation assembly (100) as described in any one of claims 1-9. The DC-DC converter (300) includes a power device (301) and a converter core (302). The power device (301) is connected to a first heat exchanger (10) of the heat dissipation assembly (100) for heat exchange. The converter core (302), the air compressor controller, and the hydrogen pump controller are connected to a second heat exchanger (20) of the heat dissipation assembly (100) for heat exchange.