Heat plate and electronic device

Abstract

The application provides a vapor chamber and an electronic device. The vapor chamber comprises a polymer metal composite shell and a wick. The polymer metal composite shell has a receiving cavity, and the wick is arranged in the receiving cavity. The thermal conductivity of the polymer metal composite shell is greater than or equal to 2 W / (m*K). The vapor chamber is light and thin, and has good thermal conductivity.

Description

Technical Field

[0001] This application relates to the field of heat exchange equipment technology, and more particularly to a heat spreader and electronic equipment. Background Technology

[0002] Existing vapor chambers typically consist of a shell and a wick. Their working principle is as follows: the working fluid (such as water or ethanol) in the heating zone evaporates into vapor, diffuses through the cavity to the condensation zone, and after condensation, flows back to the evaporation zone through the capillary force of the wick, forming a phase change cycle.

[0003] Existing vapor chambers use metals such as copper and aluminum as the shell, which have high thermal conductivity and structural strength, but the high density of metals makes the vapor chamber heavy, making it difficult to meet the lightweight requirements of ultra-thin electronic devices. If polymer materials (such as PI and PET) are used to replace metal materials to make the shell, the low intrinsic thermal conductivity of polymer materials limits the rapid conduction of heat, thus reducing the thermal conductivity of the shell. Utility Model Content

[0004] Based on this, this application provides a heat spreader and an electronic device to address the shortcomings of related technologies.

[0005] In a first aspect, this application provides a heat spreader, comprising:

[0006] A polymer-metal composite shell having a receiving cavity, wherein the thermal conductivity of the polymer-metal composite shell is greater than or equal to 2 W / (m*K);

[0007] A liquid-absorbing core is disposed in the receiving cavity.

[0008] In one possible implementation, the thickness of the polymer-metal composite shell is between 0.04 mm and 0.2 mm;

[0009] And / or, the thickness of the heat spreader is less than or equal to 0.35 mm.

[0010] In one possible implementation, the absorbent core has a groove located on one side of the absorbent core in the thickness direction;

[0011] The trench includes a first branch, a second branch, and a third branch. The first branch connects to multiple second branches, and each second branch connects to multiple third branches. The widths of the first branch, the second branch, and the third branch decrease sequentially.

[0012] In one possible implementation, the width of the first branch is between 600-800 μm, the width of the second branch is between 200-500 μm, and the width of the third branch is between 30-100 μm.

[0013] In one possible implementation, the thickness of the absorbent core is between 40-100 μm, and the depth of the groove is between 10-40 μm.

[0014] In one possible implementation, the polymer-metal composite housing includes a first housing and a second housing, which are connected to define the receiving cavity, and the liquid-absorbing core is connected to the first housing.

[0015] In one possible implementation, the heat spreader further includes a plurality of support columns, which connect the liquid-absorbing core and the second housing.

[0016] In one possible implementation, the support column is integrally formed with the liquid-absorbing core.

[0017] In one possible implementation, both the support column and the liquid-absorbing core are made of copper.

[0018] Secondly, this application provides an electronic device, comprising:

[0019] The heat spreader provided in the first aspect above;

[0020] An electronic device, wherein the heat spreader is adapted to dissipate heat from the electronic device.

[0021] The heat spreader in this embodiment includes a polymer-metal composite shell and a liquid wick. The polymer-metal composite shell includes a receiving cavity. The shell is positioned to contact electronic devices, absorbing their heat and transferring it to the phase change medium. The cavity encapsulates the liquid wick and the phase change medium. The wick provides capillary force to the medium, promoting phase change circulation within the cavity, thus dissipating heat from the electronic devices. Because the polymer-metal composite shell is composed of polymer and metal, its thermal conductivity is greater than or equal to 2 W / (m*K), improving its thermal conductivity. Furthermore, the shell can be made lighter, allowing for a thinner heat spreader while maintaining high thermal conductivity.

[0022] In addition to the technical problems solved by the embodiments of this application, the technical features constituting the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that can be solved by the heat spreader and electronic device provided by this application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific embodiments. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of the heat spreader provided in the embodiments of this application;

[0025] Figure 2 Another schematic diagram of the heat spreader provided in the embodiments of this application;

[0026] Figure 3 This is a schematic diagram of the liquid absorption core in the heat spreader provided in the embodiments of this application;

[0027] Figure 4 This is another schematic diagram of the liquid absorption core in the heat spreader provided in the embodiments of this application.

[0028] Explanation of reference numerals in the attached figures:

[0029] 100 - Polymer-metal composite shell; 110 - First shell; 120 - Second shell; 200 - Liquid suction core; 210 - Groove; 211 - First branch; 212 - Second branch; 213 - Third branch; 300 - Support column. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be described in more detail below with reference to the accompanying drawings. In the drawings, the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The described embodiments are some, but not all, embodiments of this application. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application. The embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0031] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0032] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0033] The terms "first," "second," and "third" (if any) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein.

[0034] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or display that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or display.

[0035] Existing vapor chambers typically consist of a shell and a wick. Their working principle is as follows: the working fluid (such as water or ethanol) in the heating zone evaporates into vapor, diffuses through the cavity to the condensation zone, and then condenses back to the evaporation zone via capillary force from the wick, forming a phase change cycle. While vapor chambers using metals such as copper or aluminum offer high thermal conductivity and structural strength, their high density results in a heavy vapor chamber, making it difficult to meet the lightweight requirements of ultra-thin electronic devices. If polymer materials (such as PI or PET) are used instead of metals for the shell, the low intrinsic thermal conductivity of polymers limits rapid heat transfer, reducing the shell's thermal conductivity. Furthermore, the shell suffers from poor structural strength and is prone to water and oxygen permeation, thus reducing the reliability of the vapor chamber.

[0036] In view of the above problems, this application provides a heat spreader and an electronic device. The heat spreader adopts a polymer-metal composite shell formed by polymer and metal composite. The thermal conductivity of the polymer-metal composite shell is greater than or equal to 2W / (m*K), which can effectively improve the thermal conductivity of the heat spreader and reduce the thickness and weight of the heat spreader to better meet the needs of ultra-thin electronic devices.

[0037] The following describes in detail the specific implementation of the heat spreader and electronic device according to the embodiments of this application with reference to the accompanying drawings.

[0038] Reference Figure 1 As shown in the figure, an embodiment of this application provides an electronic device, which includes electronic components and a heat spreader plate, the heat spreader plate being adapted to dissipate heat from the electronic components.

[0039] For example, electronic devices can be terminal devices such as mobile phones, tablets, and laptops, and electronic components can be CPU chips, GPU chips, etc.

[0040] Electronic devices may also include heat sinks, vapor chambers that are in direct contact with electronic components, or indirect contact via thermally conductive adhesive. The area where the vapor chamber contacts the electronic component is the evaporation end, and the area where the vapor chamber connects to the heat sink is the condensation end. The phase change medium absorbs heat from the evaporation end, evaporates, and flows towards the condensation end. Upon contact with the condensation end, the phase change medium releases its latent heat of vaporization, re-condenses into a liquid, and the released heat is transferred to the heat sink. In this way, the phase change medium continuously undergoes phase change cycles between the evaporation and condensation ends to remove heat from the electronic components.

[0041] Reference Figure 1 , Figure 2 As shown, based on the above embodiments, the heat spreader provided in this application includes a polymer-metal composite shell 100 and a liquid absorbent core 200. The polymer-metal composite shell 100 has a receiving cavity, and the thermal conductivity of the polymer-metal composite shell 100 is greater than or equal to 2W / (m*K). The liquid absorbent core 200 is disposed in the receiving cavity.

[0042] The heat spreader in this embodiment can be used in electronic devices to dissipate heat from the electronic components, thereby preventing the electronic components from overheating and affecting the normal operation of the electronic devices.

[0043] In the application, the polymer-metal composite housing 100 is used to encapsulate the phase change medium and the liquid wick 200. The containment cavity inside the polymer-metal composite housing 100 can be evacuated to lower the boiling point of the phase change medium, making it easier for the phase change medium to evaporate. In this way, the phase change medium can undergo a phase change cycle of liquefaction-vaporization-liquefaction in the heat spreader, thereby absorbing the heat of the electronic device and dissipating heat for the electronic device.

[0044] The wick 200 is used to form a capillary structure, thereby generating capillary force, which in turn causes the phase change medium to flow back from the condensation end to the evaporation end under the drive of the capillary force.

[0045] Because the heat spreader in this embodiment uses a polymer-metal composite shell 100 formed by combining polymer and metal, compared to a shell made only of metal, the mass of the polymer-metal composite shell 100 can be reduced for the same thickness, which is beneficial for the application of the heat spreader in ultra-thin electronic devices. Compared to a shell made only of polymer, the polymer-metal composite shell 100 has higher thermal conductivity and compressive strength, and is less prone to water and oxygen permeation. Therefore, the polymer-metal composite shell 100 can improve the thermal conductivity and structural performance of the heat spreader, and is conducive to the thinning of the heat spreader.

[0046] The polymer-metal composite shell 100 can use a polymer as the main material and incorporate nano-metal particles into the polymer to form a polymer-metal composite shell 100. The polymer can include one or more of PI (polyimide), PET (polyethylene terephthalate), PE (polyethylene), PP (polypropylene), and EVA (ethylene-vinyl acetate copolymer), and the nano-metal particles can include one or more of nano-copper, nano-silver, nano-nickel, and nano-titanium.

[0047] For example, the preparation method of the polymer-metal composite shell 100 is as follows:

[0048] S101. In a nitrogen-protected three-necked flask, add DMF (N,N-dimethylformamide) solvent and slowly add ODA (4,4'-diaminodiphenyl ether) while stirring. After complete dissolution, add PMDA (pyromellitic dianhydride) in batches. The system temperature is controlled at about 5°C using a cold water bath. Continue stirring for 4-6 hours to obtain viscous PAA (polyamic acid).

[0049] S102. Take the above PAA solution, calculate the amount of nano-metal precursor required for doping according to the target doping amount, dissolve the precursor in a small amount of DMF, slowly drop it into the PAA solution, and stir magnetically for 30 minutes to make the metal particles uniformly dispersed.

[0050] S103. Calculate the amount of reducing agent according to the molar ratio of DMAB (dimethylaminoborane) to metal ions of 1.2:1. Dissolve DMAB in a small amount of DMF and add it dropwise to the above mixture. Control the reaction temperature at 30-40℃ and stir for 1-2 hours.

[0051] S104. A PAA mixture containing nano-metals is uniformly coated onto a clean glass substrate (or injected into a mold), the thickness is controlled, and it is vacuum dried at 60°C for 2 hours to remove some of the solvent.

[0052] S105. Place the dried preform into an oven and cure it according to the stepped temperature increase program. Specifically, this includes:

[0053] S1051, 100℃ / 1 hour, to further remove solvent.

[0054] S1052, 200℃ / 1 hour, preliminary cyclization.

[0055] S1053, 300-350℃ / 2 hours, complete imidization.

[0056] S106. After naturally cooling to room temperature, demold to obtain PI-doped nano-metal sheet;

[0057] S107, use ethanol to ultrasonically clean the surface of the board for residual small molecule impurities, and then dry at 60℃.

[0058] In step S102, the metal precursor used can be silver nitrate, copper nitrate, or nickel nitrate solution, the total mass fraction of the nano-metal particles is 5%-25%, and the diameter of the nanoparticles is 10-100 nm.

[0059] Since titanium ions cannot be chemically reduced by DMAB in step S103, in-situ polymerization can be used for preparation. Nano-titanium powder is mechanically stirred and sonicated in DMF for 1 hour to obtain a filler dispersion. Under nitrogen, cold water bath, and mechanical stirring conditions, ODA and PMDA are added to the dispersion according to the PAA preparation steps in step S101 to obtain a mixed solution of PAA and nano-titanium. Then, preparation is carried out according to steps S103 to S107.

[0060] It should be noted that the in-situ polymerization method is not limited to nano-titanium powder, but is also applicable to nano-copper, nano-silver, and nano-nickel.

[0061] The heat spreader of this embodiment includes a polymer-metal composite shell 100 and a liquid absorbent core 200. The polymer-metal composite shell 100 includes a receiving cavity. By being configured to contact electronic devices, the polymer-metal composite shell 100 absorbs heat from the electronic devices and conducts the heat to the phase change medium. The receiving cavity encapsulates the liquid absorbent core 200 and the phase change medium. The liquid absorbent core 200 provides capillary force to the phase change medium, thereby promoting phase change circulation of the phase change medium within the receiving cavity, thus allowing the phase change medium to dissipate heat for the electronic devices. Because the polymer-metal composite shell 100 is composed of polymer and metal, its thermal conductivity is greater than or equal to 2 W / (m*K), which improves its thermal conductivity. Furthermore, the polymer-metal composite shell 100 can be made lighter, thus enabling the heat spreader to be thinner and lighter while maintaining high thermal conductivity.

[0062] In one possible implementation, the thickness of the polymer-metal composite shell 100 is between 0.04 mm and 0.2 mm. The thickness of the heat spreader is less than or equal to 0.35 mm.

[0063] It should be understood that if the thickness of the polymer-metal composite shell 100 is greater, the thermal resistance of the polymer-metal composite shell 100 will be greater, which will be detrimental to improving the thermal conductivity of the polymer-metal composite shell 100. If the thickness of the polymer-metal composite shell 100 is smaller, the mechanical strength of the polymer-metal composite shell 100 will be lower, which will be detrimental to improving the compressive strength of the polymer-metal composite shell 100. Therefore, the thickness of the polymer-metal composite shell 100 is between 0.04mm and 0.2mm, which allows the polymer-metal composite shell 100 to have good thermal conductivity and structural strength while being relatively thin.

[0064] When the thickness of the polymer-metal composite shell 100 is between 0.04mm and 0.2mm, the polymer-metal composite shell 100 can achieve a thinner thickness and a lighter weight, thereby enabling the thickness of the heat spreader to be less than or equal to 0.35mm, which is beneficial for the thinning of the heat spreader.

[0065] For example, the thickness of the polymer-metal composite shell 100 can be 0.04mm, 0.08mm, 0.1mm, 0.15mm, 0.2mm, etc., and the thickness of the heat spreader can be 0.2mm, 0.25mm, 0.3mm, 0.35mm, etc.

[0066] It should be understood that when designing the wick 200, high capillary force can enhance the reflux capacity of the phase change medium, but it will increase the flow resistance. Low resistance design will reduce capillary force, resulting in insufficient reflux efficiency of the phase change medium. The existing wick 200 uses a fiber mesh structure or a single groove 210, which makes it difficult to achieve efficient reflux under ultra-thin conditions, resulting in limited overall heat dissipation performance of the heat spreader.

[0067] Reference Figure 3 , Figure 4 As shown, to solve this problem, the absorbent core 200 of this embodiment is provided with a groove 210, which is located on one side of the absorbent core 200 in the thickness direction. The groove 210 includes a first branch 211, a second branch 212, and a third branch 213. The first branch 211 connects to a plurality of second branches 212, and each second branch 212 connects to a plurality of third branches 213. The widths of the first branch 211, the second branch 212, and the third branch 213 decrease sequentially.

[0068] In this way, the grooves 210 are distributed radially, forming a structure similar to the bronchi of a lung, and extending to various areas of the heat spreader. The first branch 211 has a larger width and lower flow resistance, which is conducive to improving the liquid transport efficiency and allowing the collected liquid to be quickly transported to the evaporation end. The third branch 213 has a smaller width and greater capillary force, which can quickly adsorb and collect dispersed liquid. Furthermore, since steam is more difficult to penetrate in the narrow third branch 213, it can reduce the interference of steam on the return liquid, which is conducive to the liquid return of the third branch 213. Thus, the liquid suction core 200 can achieve the purpose of narrow-channel liquid collection and wide-channel transport.

[0069] In some implementations, the width of the first branch 211 is between 600-800 μm, the width of the second branch 212 is between 200-500 μm, and the width of the third branch 213 is between 30-100 μm.

[0070] This configuration allows the widths of the first branch 211, the second branch 212, and the third branch 213 to decrease sequentially, thereby reducing the flow resistance of the first branch 211 and increasing the capillary force of the third branch 213. This facilitates the recirculation of the phase change medium along the third branch 213, the second branch 212, and the first branch 211, thus improving the circulation performance of the phase change medium and consequently enhancing the heat dissipation effect of the heat spreader.

[0071] For example, the width of the first branch 211 can be 600μm, 620μm, 650μm, 700μm, 760μm, 800μm, etc., the width of the second branch 212 can be 200μm, 250μm, 300μm, 380μm, 400μm, 500μm, etc., and the width of the third branch 213 can be 30μm, 50μm, 80μm, 90μm, 100μm, etc.

[0072] In some embodiments, the thickness of the absorbent core 200 is between 40-100 μm, and the depth of the groove 210 is between 10-40 μm.

[0073] In other words, as the thickness of the wick 200 increases, the depth of the groove 210 can also increase accordingly. The groove 210 does not penetrate the wick 200, but is located on the side of the wick 200 facing the first housing 110. Thus, when the thickness of the wick 200 is between 40-100μm, it is beneficial to reduce the overall thickness of the heat spreader. And when the depth of the groove 210 is between 10-40μm, the groove 210 has a certain depth to guide the flow of the phase change medium. Furthermore, the groove 210 does not completely penetrate the opposite sides of the wick 200.

[0074] For example, the thickness of the absorbent core 200 can be 40μm, 50μm, 70μm, 80μm, 100μm, etc., and the depth of the groove 210 can be 10μm, 20μm, 30μm, 40μm, etc.

[0075] In some embodiments, the polymer-metal composite housing 100 includes a first housing 110 and a second housing 120, which are connected to define a receiving cavity, and the liquid-absorbing core 200 is connected to the first housing 110.

[0076] Thus, the first shell 110 and the second shell 120 can be prepared separately using polymer and metal as raw materials, and then the first shell 110 and the second shell 120 can be pressed together with the liquid-absorbing core 200 through a hot pressing process to form an integral heat spreader. The heat spreader is relatively easy to process. The first shell 110, the liquid-absorbing core 200 and the second shell 120 are arranged along the thickness direction of the heat spreader.

[0077] Reference Figure 1 , Figure 2 As shown, in one possible implementation, the heat spreader also includes several support columns 300, which connect the liquid absorption core 200 and the second housing 120.

[0078] It is understandable that, since the inside of the heat spreader is a vacuum environment and under negative pressure, while the outside of the heat spreader is an atmospheric environment and under positive pressure, in order to prevent the heat spreader from being crushed under the action of external atmospheric pressure, and in order to enable the heat spreader to withstand a certain pressure, support columns 300 can be set in the containment cavity. Multiple support columns 300 are distributed and then supported between the liquid absorption core 200 and the second shell 120, thereby maintaining the structural stability of the containment cavity. Furthermore, channels can be formed between adjacent support columns 300, which facilitates the reflux of the phase change medium.

[0079] In some embodiments, the support column 300 and the liquid absorbent core 200 are integrally formed. Thus, compared to separately fabricating the support column 300 and the liquid absorbent core 200 and then connecting them, the support column 300 and the liquid absorbent core 200 can be integrally formed by sintering. This one-step forming reduces processes, lowers production costs, and improves the connection strength between the support column 300 and the liquid absorbent core 200, thereby increasing the compressive strength of the heat spreader and preventing deformation of the liquid absorbent core 200.

[0080] In one possible implementation, both the support column 300 and the liquid-absorbing core 200 are made of copper. That is, the support column 300 and the liquid-absorbing core 200 can be integrally formed by sintering copper powder, thereby enabling the liquid-absorbing core 200 to form a microporous network, and the support column 300 to stably support the receiving cavity.

[0081] The preparation and testing of the heat spreader in Embodiment 1 of this application will be described below.

[0082] 1. Preparation of polymer-metal composite shell 100: The preparation process is the same as steps S101 to S107 in the previous embodiments. The difference is that 5% by mass of nano-silver particles are used for mixing, and the thickness of the first shell 110 is 0.07 mm.

[0083] 2. Preparation of liquid-absorbing core 200 and support column 300: The liquid-absorbing core 200 with support column 300 is prepared by pre-forming with mold. The groove 210 and support column 300 are pre-reserved by the mold. Copper powder with a particle size of 0.1 mm is used for sintering to obtain liquid-absorbing core 200 with support column 300 and groove 210.

[0084] Third, the lower surface of the first shell 110 is treated with oxygen plasma to enhance its bonding ability with the liquid-absorbing core 200.

[0085] Fourth, use a hot press to press the first housing 110, the second housing 120 and the liquid suction core 200 together, and leave a liquid injection port. The hot pressing temperature is 140℃.

[0086] 5. Fill the injection port with deionized water, draw a vacuum, and finally seal the port.

[0087] Example 2

[0088] Unlike Example 1, 5% by mass of nano-copper metal particles were incorporated into the polymer PI.

[0089] Example 3

[0090] Unlike Example 1, 15% by mass of nano-copper metal particles were incorporated into the polymer PI.

[0091] Example 4

[0092] Unlike Example 1, 10% by mass of nano-silver was incorporated into polymer PI.

[0093] Example 5

[0094] Unlike Example 1, this method uses a mixture of 6% by mass of nano-copper and 4% by mass of nano-silver metal particles incorporated into polymer PI.

[0095] Example 6

[0096] Unlike Example 1, this method uses a mixture of 10% by mass of nano-silver and 5% by mass of nano-nickel metal particles incorporated into polymer PI.

[0097] Example 7

[0098] Unlike Example 1, this method uses a mixture of 12% by mass of nano-copper and 8% by mass of nano-titanium metal particles incorporated into polymer PI.

[0099] Example 8

[0100] Unlike Example 1, this method uses a mixture of 8% by mass of nano-silver, 5% by mass of nano-copper, and 2% by mass of nano-nickel metal particles incorporated into polymer PI.

[0101] Example 9

[0102] Unlike Example 1, this method uses a mixture of 10% by mass of nano-copper, 10% by mass of nano-silver metal, and 5% by mass of nano-titanium particles incorporated into polymer PI.

[0103] Example 10

[0104] Unlike Example 1, this method uses a mixture of 7% by mass of nano-silver, 6% by mass of nano-copper, 5% by mass of nano-nickel, and 2% by mass of nano-titanium particles incorporated into polymer PI.

[0105] Comparative Example

[0106] Unlike Example 1, when preparing the polymer-metal composite shell 100, no nano-metal particles were mixed in.

[0107] Table 1 Performance parameters of polymer-metal composite shell

[0108] Serial Number Thermal conductivity (W / (m*K)) Example 1 2.6 Example 2 2 Example 2 10 Example 4 6.5 Example 5 8 Example 6 13.5 Example 7 10 Example 8 14 Example 9 20 Example 10 15 Comparative Example 0.3

[0109] As shown in Table 1 above, the thermal conductivity of the polymer-metal composite shell 100 formed by polymer and metal composite can be increased from 0.3 W / (m*K) to more than 2 W / (m*K).

[0110] Table 2. Correspondence between thermal conductivity of polymer-metal composite housing and temperature of electronic devices

[0111] Thermal conductivity (W / (m*K)) Electronic device temperature (°C) 0.3 48.45 0.5 44.19 0.7 42.33 0.9 41.27 1.1 40.60 1.3 40.12 2.3 38.97 3.3 38.51 4.3 38.26 5.3 38.11 6.3 38.00 7.3 37.93 8.3 37.87 9.3 37.82 10.3 37.78 11.3 37.75 12.3 37.73 13.3 37.70 14.3 37.69 15.3 37.67 16.3 37.65 17.3 37.64 18.3 37.63 19.3 37.62

[0112] The power of the electronic device is 3.5W. As shown in Table 2 above, when the thermal conductivity of the polymer-metal composite shell 100 is greater than or equal to 2W / (m*K), the temperature of the electronic device can be reduced to below 40℃. The higher the thermal conductivity of the polymer-metal composite shell 100, the more significant the temperature reduction of the electronic device, and the heat can be dissipated well. When the thermal conductivity increases to about 20W / (m*K), the temperature of the electronic device can be reduced by about 11℃.

[0113] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat spreader, characterized in that, include: A polymer-metal composite shell (100) having a receiving cavity, wherein the thermal conductivity of the polymer-metal composite shell (100) is greater than or equal to 2 W / (m*K); A liquid suction core (200) is disposed in the receiving cavity.

2. The heat spreader according to claim 1, characterized in that, The thickness of the polymer-metal composite shell (100) is between 0.04 mm and 0.2 mm; And / or, the thickness of the heat spreader is less than or equal to 0.35 mm.

3. The heat spreader according to claim 1 or 2, characterized in that, The absorbent core (200) has a groove (210) located on one side of the absorbent core (200) in the thickness direction; The trench (210) includes a first branch (211), a second branch (212) and a third branch (213). The first branch (211) connects to a plurality of second branches (212), and each second branch (212) connects to a plurality of third branches (213). The widths of the first branch (211), the second branch (212) and the third branch (213) decrease sequentially.

4. The heat spreader according to claim 3, characterized in that, The width of the first branch (211) is between 600-800μm, the width of the second branch (212) is between 200-500μm, and the width of the third branch (213) is between 30-100μm.

5. The heat spreader according to claim 4, characterized in that, The thickness of the liquid-absorbing core (200) is between 40-100 μm, and the depth of the groove (210) is between 10-40 μm.

6. The heat spreader according to claim 1 or 2, characterized in that, The polymer-metal composite housing (100) includes a first housing (110) and a second housing (120), which are connected to define the receiving cavity, and the liquid-absorbing core (200) is connected to the first housing (110).

7. The heat spreader according to claim 6, characterized in that, It also includes several support columns (300), which connect the liquid-absorbing core (200) and the second housing (120).

8. The heat spreader according to claim 7, characterized in that, The support column (300) and the liquid absorption core (200) are integrally formed.

9. The heat spreader according to claim 7 or 8, characterized in that, The support column (300) and the liquid-absorbing core (200) are both made of copper.

10. An electronic device, characterized in that, include: The heat spreader as described in any one of claims 1-9; An electronic device, wherein the heat spreader is adapted to dissipate heat from the electronic device.

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