Liquid cooling heat dissipation assembly

Abstract

This utility model discloses a liquid cooling heat dissipation component, including a bottom heat exchange fixing board. Multiple microchannel flat tubes extending laterally and laterally are welded and fixed to the top surface of the bottom heat exchange fixing board, with adjacent sidewalls of every two adjacent microchannel flat tubes in close contact. The two ends of each microchannel flat tube extend out from the left and right sides of the bottom heat exchange fixing board and are bent upwards to form bends. All bends on the same side are connected to corresponding front-to-back extending liquid guide tubes. One liquid guide tube has an inlet connector on one end plate, and the other has an outlet connector on one end plate. It uses microchannel flat tubes as liquid cooling heat exchange tubes, which have a large contact area. By fixing the bottom surfaces of all microchannel flat tubes to the same bottom heat exchange fixing board, the heat exchange contact area is guaranteed. The bottom heat exchange fixing board contacts the surface of the component to be cooled, resulting in a large contact area and significantly improving the heat exchange effect.

Description

Technical fields:

[0001] This utility model relates to the field of hardware accessories technology, and more specifically to a liquid cooling heat dissipation component. Background technology:

[0002] In some existing processing equipment or electrical components, large-area cooling is generally required. Existing methods include liquid cooling and air cooling. For liquid cooling, the existing method is to place the heat exchange tubes in close contact with the contact surface of the equipment or electrical component for heat exchange and cooling. The cooling effect is good. However, the heat exchange tubes are generally circular pipes, and their contact area with the equipment or electrical component is small, which will affect the heat exchange efficiency and effect. Utility model content:

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a liquid cooling heat dissipation component. It uses microchannel flat tubes as liquid cooling heat exchange tubes, which have a large contact area. By fixing the bottom surfaces of all microchannel flat tubes on the same bottom heat exchange fixing board, the heat exchange contact area is guaranteed. The bottom heat exchange fixing board is in contact with the surface of the component that needs to be cooled, and its large contact area greatly improves its heat exchange effect.

[0004] The solution of this utility model to the aforementioned technical problem is:

[0005] A liquid cooling heat dissipation component includes a bottom heat exchange fixing motherboard, on the top surface of which are welded and fixed multiple microchannel flat tubes arranged front to back and extending left to right, with the adjacent sidewalls of each pair of adjacent microchannel flat tubes in close contact.

[0006] The two ends of the microchannel flat tube extend out to the left and right sides of the bottom heat exchange fixing main board and bend upward to form a bend. All the bends on the same side are connected to the corresponding front and rear extending liquid guide tubes. In the two liquid guide tubes, one end plate of the liquid guide tube is connected to the liquid inlet connector, and the other end plate of the liquid guide tube is connected to the liquid outlet connector.

[0007] All the microchannel flat tubes have the same upper fixed heat-conducting plate fixed to their top surface, and an air guide fan is installed on the upper fixed heat-conducting plate.

[0008] The top surface of the upper fixed heat-conducting plate is fixed with multiple heat dissipation strips extending forward and backward, and multiple notches are formed in the middle of the heat dissipation strips.

[0009] The top surfaces of the left and right sides of the upper fixed heat-conducting plate are both fixed with side fixing plates. The upper mounting plate is fixed on the top surfaces of the two side fixing plates, and the bottom surface of the upper mounting plate is close to the top surface of the corresponding heat dissipation strip.

[0010] The upper mounting plate has a central through hole formed in the middle, and a guide fan is fixed in the middle of the top surface of the upper mounting plate, with the air inlet of the guide fan facing the central through hole.

[0011] The outstanding effect of this utility model is:

[0012] It uses microchannel flat tubes as liquid-cooled heat exchange tubes, which have a large contact area. By fixing the bottom surfaces of all microchannel flat tubes on the same bottom heat exchange fixing plate, the heat exchange contact area is guaranteed. The bottom heat exchange fixing plate is in contact with the surface of the component that needs to be cooled, and its large contact area greatly improves its heat exchange effect.

[0013] Meanwhile, it fixes the top surface of all the microchannel flat tubes to the same upper fixed heat conduction plate, and improves the heat dissipation effect through the heat dissipation strips on it. At the same time, the heat dissipation effect can be further improved by the air guide fan set on it. Attached image description:

[0014] Figure 1 This is a partial structural schematic diagram of the present invention;

[0015] Figure 2 This is a partial top view of the present invention without the air guide fan;

[0016] Figure 3 This is a partial top view of the upper fixed heat-conducting plate of this utility model. Detailed implementation method:

[0017] For example, see below. Figures 1 to 3 As shown, a liquid cooling heat dissipation component includes a bottom heat exchange fixing board 10. The top surface of the bottom heat exchange fixing board 10 is welded and fixed with a plurality of microchannel flat tubes 20 arranged in a front-to-back manner and extending left and right. The adjacent side walls of each pair of adjacent microchannel flat tubes 20 are in close contact. The interior of the microchannel flat tubes 20 is formed with a plurality of through holes extending left and right, so that the liquid is evenly distributed and the contact area with the wall surface of the microchannel flat tubes 20 is increased.

[0018] The two ends of the microchannel flat tube 20 extend out to the left and right sides of the bottom heat exchange fixing main board 10 and bend upward to form a bend. All the bends on the same side are connected to the corresponding front and rear extending liquid guide tubes 30. In the two liquid guide tubes 30, one liquid guide tube 30 has an inlet connector 31 connected to one end plate, and the other liquid guide tube 30 has an outlet connector 32 connected to one end plate.

[0019] All microchannel flat tubes 20 have the same upper fixed heat-conducting plate 40 fixed on their top surfaces, and an air guide fan 50 is installed on the upper fixed heat-conducting plate 40.

[0020] Furthermore, the top surface of the upper fixed heat-conducting plate 40 is fixed with a plurality of front-to-back extending heat dissipation strips 41, and each heat dissipation strip 41 has a plurality of notches 42 formed in the middle. The notches 42 allow the airflow along two adjacent heat dissipation strips 41 to mix at the notches 42, thereby achieving turbulent airflow and improving the heat exchange effect between the airflow and the upper fixed heat-conducting plate 40 and the heat dissipation strips 41.

[0021] Furthermore, the top surfaces of the left and right sides of the upper fixed heat-conducting plate 40 are both fixed with side fixing plates 43, and the upper mounting plate 44 is fixed on the top surfaces of the two side fixing plates 43. The bottom surface of the upper mounting plate 44 is close to the top surface of the corresponding heat dissipation strip 41.

[0022] The upper mounting plate 44 has a central through hole formed in the middle, and a guide fan 50 is fixed in the middle of the top surface of the upper mounting plate 44, with the air inlet of the guide fan 50 facing the central through hole.

[0023] Multiple partition plates 33 are welded and fixed inside the liquid guiding tube body 30. The partition plates 33 divide the liquid guiding tube body 30 into multiple flow chambers. All the bends on the same side are inserted into the elongated through grooves formed on the bottom wall of the corresponding liquid guiding tube body 30. The left and right side walls of all the bends are welded and fixed to the left and right inner side walls of the elongated through grooves. The bottom surface of the corresponding partition plate 33 presses against the top surface of the two bends that are close to each other, separating the two bends and placing them in different flow chambers. This allows some of the two adjacent bends to connect to one flow chamber, and some flow chambers to connect to one bend, so that the two liquid guiding tube bodies 30 and all the microchannel flat tubes 20 form an S-shaped flow path.

[0024] Since the partition plate 23 only presses its bottom surface against the top surface of the two adjacent bends, it does not achieve overall separation. A small amount of fluid will still flow between its adjacent flow chambers, but it does not affect the overall liquid flow along the S-shaped flow path.

[0025] Of the two liquid guiding tubes 30, an inlet connector 31 is connected to the front end plate of one liquid guiding tube 30, and an outlet connector 32 is connected to the rear end plate of the other liquid guiding tube 30.

[0026] In this embodiment, the inlet connector 31 and outlet connector 32 can be connected to the outlet and inlet of the external cooling system to realize the circulation of heat exchange liquid and achieve heat exchange with good heat exchange effect.

[0027] The above embodiments are only used to illustrate the present utility model and are not intended to limit the present utility model. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present utility model. Therefore, all equivalent technical solutions also fall within the scope of the present utility model. The patent protection scope of the present utility model should be defined by the claims.

Claims

1. A liquid cooling heat dissipation assembly, comprising a bottom heat exchange fixing motherboard (10), characterized in that: The top surface of the bottom heat exchange fixing main board (10) is welded and fixed with a plurality of microchannel flat tubes (20) arranged in front and behind and extending left and right, and the adjacent side walls of each two adjacent microchannel flat tubes (20) are in close contact. The two ends of the microchannel flat tube (20) extend out of the left and right sides of the bottom heat exchange fixing main board (10) and bend upward to form a bend. All the bends on the same side are connected to the corresponding front and rear extended liquid guide tubes (30). Among the two liquid guide tubes (30), one liquid guide tube (30) has an inlet connector (31) connected to one end plate, and the other liquid guide tube (30) has an outlet connector (32) connected to one end plate.

2. The liquid cooling heat dissipation component according to claim 1, characterized in that: All microchannel flat tubes (20) have the same upper fixed heat-conducting plate (40) fixed on their top surfaces, and a fan (50) is installed on the upper fixed heat-conducting plate (40).

3. The liquid cooling heat dissipation component according to claim 2, characterized in that: The top surface of the upper fixed heat-conducting plate (40) is fixed with a plurality of front-to-back extending heat dissipation strips (41), and each heat dissipation strip (41) has a plurality of notches (42) formed in the middle.

4. The liquid cooling heat dissipation component according to claim 3, characterized in that: The top surfaces of the left and right sides of the upper fixed heat-conducting plate (40) are both fixed with side fixing plates (43), and the upper mounting plate (44) is fixed on the top surfaces of the two side fixing plates (43). The bottom surface of the upper mounting plate (44) is close to the top surface of the corresponding heat dissipation strip (41).

5. A liquid cooling heat dissipation component according to claim 4, characterized in that: The upper mounting plate (44) has a central through hole formed in the middle, and a guide fan (50) is fixed in the middle of the top surface of the upper mounting plate (44), with the air inlet of the guide fan (50) facing the central through hole.

6. A liquid cooling heat dissipation component according to claim 1, characterized in that: The liquid guide tube (30) is internally welded and fixed with multiple partition plates (33). The partition plates (33) divide the liquid guide tube (30) into multiple flow chambers. All the bends on the same side are inserted into the elongated through grooves formed on the bottom wall of the corresponding liquid guide tube (30). The left and right side walls of all the bends are welded and fixed to the left and right inner side walls of the elongated through grooves. The bottom surface of the corresponding partition plate (33) presses against the top surface of the two bends that are close to each other, separating the two bends and placing them in different flow chambers. This allows two adjacent bends to connect to one flow chamber, and some flow chambers to connect to one bend, so that the two liquid guide tubes (30) and all the microchannel flat tubes (20) form an S-shaped flow path.

7. A liquid cooling heat dissipation component according to claim 1, characterized in that: Of the two liquid guide tubes (30), one liquid guide tube (30) has an inlet connector (31) connected to the front end plate, and the other liquid guide tube (30) has an outlet connector (32) connected to the rear end plate.

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