A DCDC power module integrated with a heat dissipation substrate

Abstract

The utility model provides a DCDC power module of integrated radiating substrate relates to power module technical field. The DCDC power module of integrated radiating substrate, including lower shell and upper shell, lower shell and upper shell are connected through screw, and the bottom four corners of lower shell inner wall all are installed with mounting post, and the top between four mounting posts is installed with PCB board through screw. The DCDC power module of integrated radiating substrate, through setting up the fin at the bottom of PCB board, and extending to the outside of lower shell, so that the equipment can directly utilize the fin to the bottom of PCB board and carry out heat dissipation treatment when working, can further increase the heat dissipation effect through setting up the blowing assembly and using with the fin, and using blowing assembly can not only blow the fin, but also can directly blow the top of PCB board, so that the filter capacitor and other elements installed on the PCB board can be quickly heat dissipation treatment, and then realize double -sided heat dissipation, be favorable to practical application.

Description

Technical Field

[0001] This utility model relates to the field of power module technology, specifically to a DC-DC power module with an integrated heat dissipation substrate. Background Technology

[0002] A DC-DC power module is a power management device that achieves DC-DC voltage conversion through semiconductor switching technology. Its core functions include boost, buck, polarity conversion, and voltage stabilization, and it is compatible with various power supply systems such as batteries and AC mains power. Its working principle is based on switching power supply technology, regulating the output voltage through pulse width modulation or pulse frequency modulation. It consists of a control chip, switching elements, energy storage inductors, and filter capacitors.

[0003] Current DC-DC power modules generally do not have a heat dissipation substrate. Instead, they rely on heat sinks on the casing of the DC-DC power module for heat dissipation. However, this heat dissipation effect is poor and cannot directly cool down the PCB board of the DC-DC power module. Furthermore, it cannot quickly dissipate heat from components such as filter capacitors mounted on the PCB board, resulting in poor heat dissipation performance and hindering practical applications.

[0004] Therefore, those skilled in the art provide a DC-DC power module with an integrated heat dissipation substrate to solve the problems mentioned in the background art. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides a DC-DC power module with an integrated heat dissipation substrate, which solves the problem of poor heat dissipation performance of existing DC-DC power modules mentioned in the background art.

[0006] To achieve the above objectives, this utility model is implemented through the following technical solution: a DC-DC power module with an integrated heat dissipation substrate, comprising a lower shell and an upper shell, wherein the lower shell and the upper shell are connected by screws, mounting posts are installed at the four corners of the bottom of the inner wall of the lower shell, a PCB board is installed between the tops of the four mounting posts by screws, heat sinks are fixedly connected at equal intervals to the bottom of the PCB board, and strip grooves are opened at equal intervals on the bottom of the lower shell, wherein the bottoms of the heat sinks all penetrate the strip grooves and extend to the bottom of the lower shell; A blower assembly is provided on one side of the lower shell. The blower assembly is used to blow air to the heat sink and to blow air to the top of the PCB board through the upper shell.

[0007] The above technical solution involves installing a heat sink at the bottom of the PCB board and extending it to the outer side of the lower shell. This allows the device to directly dissipate heat from the bottom of the PCB board during operation. Furthermore, by using a blower assembly in conjunction with the heat sink, the heat dissipation effect is further enhanced. The blower assembly can not only blow air onto the heat sink but also directly onto the top of the PCB board, enabling rapid heat dissipation of components such as filter capacitors mounted on the PCB board. This achieves double-sided heat dissipation, which is beneficial for practical applications.

[0008] Preferably, the blower assembly includes a mounting slot, a blower fan, a guide channel, an L-shaped channel, ventilation holes, and heat dissipation holes. The mounting slot is located on one side of the lower housing, the blower fan is installed inside the mounting slot, the guide channel is located inside the lower housing and below the mounting slot, the L-shaped channel is located inside the upper housing and above the mounting slot, the ventilation holes are equidistantly located at the bottom of the upper housing and communicate with the interior of the L-shaped channel, and the heat dissipation holes are equidistantly located on the side of the lower housing away from the mounting slot.

[0009] The above technical solution utilizes a blower to direct airflow, and the airflow channel can better guide the airflow from the blower to the heat sink. At the same time, the L-shaped groove and ventilation holes can better guide the airflow from the blower to the top of the PCB board, thereby quickly dissipating heat from components such as filter capacitors mounted on the top of the PCB board. This achieves double-sided heat dissipation, which is beneficial for practical applications.

[0010] Preferably, mounting plates are fixedly installed on both sides of the bottom of the lower shell, and mounting holes are provided at both ends of the mounting plates.

[0011] The above technical solution allows for better installation and use of the lower shell by utilizing the mounting plate and mounting holes. At the same time, the mounting plate ensures that the bottom of the lower shell is hollowed out during installation, further ensuring heat dissipation.

[0012] Preferably, a filter screen is fixedly installed inside the mounting slot and on the side of the blower.

[0013] The above technical solution uses a filter screen to prevent dust from entering the interior of the mounting slot.

[0014] Preferably, the blower fan is electrically connected to the PCB board.

[0015] The above technical solution enables the fan to be powered on and operate simultaneously when the PCB board is in operation.

[0016] Preferably, the heat sink is made of copper-aluminum alloy.

[0017] The above technical solution utilizes a heat sink made of copper-aluminum alloy to increase heat conduction.

[0018] This utility model provides a DC-DC power module with an integrated heat dissipation substrate, which has the following beneficial effects: This DC-DC power module with an integrated heat dissipation substrate features a heat sink at the bottom of the PCB board, extending to the outer side of the lower casing. This allows the device to directly dissipate heat from the bottom of the PCB board during operation. Furthermore, a blower assembly works in conjunction with the heat sink to further enhance the heat dissipation effect. The blower assembly can not only blow air onto the heat sink but also directly onto the top of the PCB board, enabling rapid heat dissipation of components such as filter capacitors mounted on the PCB board. This achieves double-sided heat dissipation, which is beneficial for practical applications. Attached Figure Description

[0019] Figure 1 This is a first-view three-dimensional structural diagram of the present invention.

[0020] Figure 2 This is a second-view three-dimensional structural diagram of the present invention.

[0021] Figure 3 This is a schematic diagram of the third-view three-dimensional structure of this utility model.

[0022] Figure 4 This is a schematic diagram showing the internal structure of this utility model.

[0023] In the diagram: 1. Lower shell; 2. Upper shell; 3. Mounting post; 4. PCB board; 5. Heat sink; 6. Strip groove; 7. Mounting groove; 8. Fan; 9. Airflow guide groove; 10. L-shaped groove; 11. Ventilation hole; 12. Heat dissipation hole; 13. Mounting support plate; 14. Mounting hole; 15. Filter screen. Detailed Implementation

[0024] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0025] Reference Figure 1 , Figure 2 and Figure 4This utility model provides a DC-DC power module with an integrated heat dissipation substrate, including a lower shell 1 and an upper shell 2, which are connected by screws. Mounting plates 13 are fixedly installed on both sides of the bottom of the lower shell 1. Mounting holes 14 are provided at both ends of the mounting plates 13. The mounting plates 13 and mounting holes 14 allow for better installation of the lower shell 1, and also ensure that the bottom of the lower shell 1 is open during installation, further ensuring heat dissipation. Mounting posts 3 are installed at the four corners of the bottom of the inner wall of the lower shell 1. A PCB board 4 is installed between the tops of the four mounting posts 3 using screws. The mounting posts 3 allow for better installation of the PCB board 4, and also allow for open bottoms of the PCB board 4 for easy heat dissipation. Heat sinks 5 are fixedly connected at equal intervals to the bottom of the PCB board 4. The heat sinks 5 are made of copper-aluminum alloy, which increases thermal conductivity. The bottom of the lower shell 1 has equally spaced strip grooves 6, and the bottom of the heat sink 5 extends through the strip grooves 6 to the bottom of the lower shell 1. Extending the bottom of the heat sink 5 to the bottom of the lower shell 1 allows the bottom of the heat sink 5 to come into contact with the outside air, further increasing the heat dissipation effect.

[0026] Reference Figure 1 , Figure 3 and Figure 4 In one aspect of this embodiment, a blower assembly is provided on one side of the lower shell 1. The blower assembly is used to blow air towards the heat sink 5 and also to blow air through the upper shell 2 towards the top of the PCB board 4. The blower assembly includes a mounting slot 7, a blower fan 8, a guide channel 9, an L-shaped slot 10, ventilation holes 11, and heat dissipation holes 12. The mounting slot 7 is located on one side of the lower shell 1, and the blower fan 8 is installed inside the mounting slot 7, allowing for better installation of the blower fan 8. A filter screen 15 is fixedly installed inside the mounting slot 7 and on one side of the blower fan 8, preventing dust from entering the mounting slot 7. The blower fan 8 is electrically connected to the PCB board 4, and when the PCB board 4 is working, the blower fan 8 is also simultaneously powered on and operates. The guide channel 9 is located inside the lower shell 1 and below the mounting slot 7, allowing for better guidance of the air blown by the blower fan 8 towards the heat sink 5. L-shaped slots 10 are formed inside the upper shell 2 and above the mounting slot 7. Ventilation holes 11 are equidistantly formed at the bottom of the upper shell 2 and communicate with the interior of the L-shaped slots 10. Using the L-shaped slots 10 and ventilation holes 11, the air blown by the fan 8 can be better directed to the top of the PCB board 4, thereby quickly dissipating heat from components such as filter capacitors mounted on the top of the PCB board 4, achieving double-sided heat dissipation, which is beneficial for practical applications. Heat dissipation holes 12 are equidistantly formed on the side of the lower shell 1 away from the mounting slot 7. These holes allow heat to be exhausted from inside the equipment to the outside, thus forming a better heat dissipation airflow.

[0027] Working principle: When in use, first power on the device to power on the PCB board 4, so that the fan 8 can also be powered on and start working simultaneously.

[0028] The heat generated by the PCB board 4 during operation is transferred through the heat sink 5. On one hand, since the bottom of the heat sink 5 extends to the bottom of the lower shell 1, the flow of outside air allows the heat sink 5 to better perform its heat transfer function. On the other hand, the operation of the fan 8, and the use of the air guide groove 9, directs the air blown by the fan 8 to the position of the heat sink 5, thereby further increasing the heat dissipation effect of the heat sink 5. Furthermore, the air blown by the fan 8 can be led to the outside of the device through the heat dissipation holes 12.

[0029] Furthermore, the L-shaped groove 10 and ventilation holes 11 allow the air blown by the fan 8 to be directed to the top of the PCB board 4, thereby quickly dissipating heat from components such as filter capacitors mounted on the top of the PCB board 4, achieving double-sided heat dissipation, which is beneficial for practical applications. The ventilation holes 12 also allow the air blown by the fan 8 to be directed to the outside of the device.

[0030] It should be noted that since air is blown out from the inside of the ventilation hole 11 and the guide groove 9, but no air is blown into the inside of the heat dissipation hole 12, the air blown out from the ventilation hole 11 and the guide groove 9 will not crossflow. Instead, it will be discharged to the outside of the equipment through the heat dissipation hole 12, thus forming a better heat dissipation air duct.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A DC-DC power module with an integrated heat dissipation substrate, comprising a lower shell (1) and an upper shell (2), wherein the lower shell (1) and the upper shell (2) are connected by screws, characterized in that, Mounting posts (3) are installed at the four corners of the bottom of the inner wall of the lower shell (1). A PCB board (4) is installed between the tops of the four mounting posts (3) by screws. Heat sinks (5) are fixedly connected at equal intervals at the bottom of the PCB board (4). Strip grooves (6) are opened at equal intervals at the bottom of the lower shell (1). The bottom of the heat sinks (5) all pass through the strip grooves (6) and extend to the bottom of the lower shell (1). A blower assembly is provided on one side of the lower shell (1). The blower assembly is used to blow air to the position of the heat sink (5) on one hand, and to blow air to the top of the PCB board (4) through the upper shell (2) on the other hand.

2. The DC-DC power module with an integrated heat dissipation substrate according to claim 1, characterized in that: The blower assembly includes a mounting slot (7), a blower fan (8), a guide channel (9), an L-shaped slot (10), a ventilation hole (11), and a heat dissipation hole (12). The mounting slot (7) is located on one side of the lower shell (1). The blower fan (8) is installed inside the mounting slot (7). The guide channel (9) is located inside the lower shell (1) and below the mounting slot (7). The L-shaped slot (10) is located inside the upper shell (2) and above the mounting slot (7). The ventilation hole (11) is equidistantly located at the bottom of the upper shell (2) and communicates with the interior of the L-shaped slot (10). The heat dissipation hole (12) is equidistantly located on the side of the lower shell (1) away from the mounting slot (7).

3. The DC-DC power module with an integrated heat dissipation substrate according to claim 1, characterized in that: Mounting plates (13) are fixedly installed on both sides of the bottom of the lower shell (1), and mounting holes (14) are opened at both ends of the mounting plates (13).

4. The DC-DC power module with an integrated heat dissipation substrate according to claim 2, characterized in that: A filter screen (15) is fixedly installed inside the mounting slot (7) and on one side of the blower (8).

5. The DC-DC power module with an integrated heat dissipation substrate according to claim 2, characterized in that: The blower (8) is electrically connected to the PCB board (4).

6. The DC-DC power module with an integrated heat dissipation substrate according to claim 1, characterized in that: The heat sink (5) is made of copper-aluminum alloy.

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