Pressure adjustable radiator

Abstract

The utility model discloses a pressure adjustable radiator, aims at providing a simple structure, can change radiator to circuit board chip's pressure, has realized the pressure adjustment and visual pressure adjustable radiator of radiator. The utility model discloses a support plate, adjusting assembly and radiator assembly, adjusting assembly includes adjusting hand wheel and lift module, adjusting hand wheel with lift module lower end respectively sets up support plate upper and lower two ends, radiator assembly with lift module lower end is connected, adjusting hand wheel with lift module movable end cooperation and drive radiator assembly with the chip product on the external machine table jacking end cooperation. The utility model discloses applied to the technical field of radiator.

Description

Technical Field

[0001] This invention relates to the technical field of radiators, and in particular to a pressure-adjustable radiator. Background Technology

[0002] During the use of various electromechanical or electronic equipment, components generate heat. For example, the CPU module's core temperature can reach over 90 degrees Celsius during operation. High temperatures can lead to throttling, stuttering, or even system crashes. Therefore, a heatsink is needed to continuously dissipate heat from the CPU module. Currently, heatsinks on the market are mainly divided into air-cooled and water-cooled types, using fans to remove heat from copper busbars or water flow to achieve a cooling effect. For certain server products or specific equipment, larger heatsinks are required for cooling. Currently, most heatsinks on the market are fixed installations, secured to the motherboard by screws on a bracket. Due to manufacturing tolerances, the screws vary in length, resulting in uneven pressure when pressing on the CPU module. This makes pressure adjustment impossible, leading to overpressure or poor contact. Furthermore, long-term use can cause the screws to loosen, causing the heatsink to shift. If a simple, adjustable heatsink that can change the pressure exerted by the heatsink on the circuit board chips could be designed, providing adjustable and visual pressure control, these problems could be solved. Utility Model Content

[0003] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a pressure-adjustable heat sink with a simple structure that can change the pressure of the heat sink on the circuit board chip, and realize the pressure adjustment and visualization of the heat sink.

[0004] The technical solution adopted by this utility model is as follows: This utility model includes a support plate, an adjustment component, and a heat sink component. The adjustment component includes an adjustment handwheel and a lifting module. The adjustment handwheel and the lifting module are respectively disposed at the upper and lower ends of the support plate. The heat sink component is connected to the lower end of the lifting module. The adjustment handwheel cooperates with the movable end of the lifting module and drives the heat sink component to cooperate with the chip product on the lifting end of the external machine.

[0005] Furthermore, the lifting module includes a lifting plate, a measuring plate, and a base plate. The lifting plate is movably connected to the lower end face of the support plate via several linear bearings. The adjusting handwheel passes through the support plate and engages with the upper end face of the lifting plate. The measuring plate is connected to the lower end face of the lifting plate via several first equal-height screws. The lifting plate is connected to the base plate via several second equal-height screws. The adjusting handwheel drives the measuring plate to engage with the base plate.

[0006] Furthermore, a pressure sensor is provided at the lower end of the measuring plate, and the pressure sensor cooperates with the upper surface of the base plate.

[0007] Furthermore, a plurality of floating springs are provided between the lifting plate and the measuring plate, and the lifting plate floats in coordination with the measuring plate through a plurality of linear bearings and a plurality of floating springs.

[0008] Furthermore, the heat sink assembly includes a heat sink, an inlet, and an outlet. The heat sink is connected to an external circulation mechanism through the inlet and the outlet, respectively. The upper surface of the heat sink is connected to the lower surface of the base plate through several support rods, and the lower heat dissipation surface of the heat sink is compatible with the chip product.

[0009] Furthermore, the support plate is connected to the external machine support surface via several lifting rods.

[0010] Furthermore, a limiting component is provided on the upper surface of the support plate. The limiting component includes a limiting plate and a slide rail cylinder. Several sets of slide rail cylinders are provided on the upper surface of the support plate. The limiting plate is connected to the movable end of several sets of slide rail cylinders. The limiting plate is provided with several limiting grooves. Several slide rail cylinders drive several limiting grooves to cooperate with the upper limit block at the upper end of the lifting rod.

[0011] Furthermore, a lower limit block is provided in the middle of the lifting rod, and the lower limit block cooperates with the lower end face of the support plate.

[0012] Furthermore, the adjusting handwheel is provided with a locking pin, which is locked in place with the adjusting handwheel.

[0013] The beneficial effects of this utility model are: by adjusting the handwheel to change the compression stroke of the spring, the pressure of the heat sink on the circuit board chip can be changed; by locking the handwheel with a locking pin, the output pressure is kept stable; and the pressure sensor can collect and transmit the pressure to realize the function of pressure visualization. Attached Figure Description

[0014] Figure 1 This is a perspective view of the present invention; Figure 2 This is a perspective view of another aspect of this utility model; Figure 3 This is an exploded view of the present invention; Figure 4 This is an exploded view of the adjustment component; Figure 5 This is a perspective view of the heat sink assembly. Detailed Implementation

[0015] like Figures 1 to 5As shown, in this embodiment, the present invention includes a support plate 1, an adjustment component 2, and a heat sink assembly 3. The adjustment component 2 includes an adjustment handwheel 4 and a lifting module 5. The adjustment handwheel 4 and the lifting module 5 are respectively disposed at the upper and lower ends of the support plate 1. The heat sink assembly 3 is connected to the lower end of the lifting module 5. The adjustment handwheel 4 cooperates with the movable end of the lifting module 5 and drives the heat sink assembly 3 to cooperate with the chip product 6 on the lifting end of the external machine. Therefore, in this application, during the process of pressing the heat sink assembly 3 against the chip product 6, the pressing force can be finely adjusted through the adjustment component 2, making the pressure between the heat sink assembly 3 and the chip product 6 more stable.

[0016] like Figures 1 to 4 As shown, in this embodiment, the lifting module 5 includes a lifting plate 51, a measuring plate 52, and a base plate 53. The lifting plate 51 is movably connected to the lower end face of the support plate 1 via several linear bearings 54. The adjusting handwheel 4 passes through the support plate 1 and engages with the upper end face of the lifting plate 51. The measuring plate 52 is connected to the lower end face of the lifting plate 51 via several first equal-height screws 7. The lifting plate 51 is connected to the base plate 53 via several second equal-height screws 8. The adjusting handwheel 4 drives the measuring plate 52 to engage with the base plate 53. Therefore, the lifting module 5 employs a multi-stage linkage lifting method, which can effectively avoid product damage caused by uneven force or rigid contact.

[0017] like Figure 4 As shown, in this embodiment, a pressure sensor 9 is provided at the lower end of the measuring plate 52, and the pressure sensor 9 cooperates with the upper surface of the base plate 53. Therefore, the pressure sensor 9 synchronizes the pressure value during the fine-tuning process of the adjusting handwheel 4, enabling precise adjustment in conjunction with the adjusting handwheel 4.

[0018] like Figure 4 As shown, in this embodiment, a plurality of floating springs 10 are provided between the lifting plate 51 and the measuring plate 52. The lifting plate 51 floats in conjunction with the measuring plate 52 through a plurality of linear bearings 54 and a plurality of floating springs 10. Therefore, the compression stroke of the springs can be changed by adjusting the extension of the movable end of the adjusting handwheel 4, thereby changing the pressure of the heat sink assembly 3 on the chip product 6 and providing a reset function.

[0019] like Figure 2 and Figure 5As shown, in this embodiment, the heat sink assembly 3 includes a heat sink 31, a water inlet 32, and a water outlet 33. The heat sink 31 is connected to an external circulation mechanism via the water inlet 32 ​​and the water outlet 33. The upper surface of the heat sink 31 is connected to the lower surface of the base plate 53 via several support rods 34. The lower heat dissipation surface of the heat sink 31 mates with the chip product 6. Therefore, the water inlet 32 ​​and the water outlet 33 form a passage, carrying away the heat conducted from the bottom of the heat sink 31 to the interior, and working with the external circulation mechanism to achieve heat dissipation circulation.

[0020] like Figure 1 and Figure 2 As shown, in this embodiment, the support plate 1 is connected to the external machine support surface via several lifting rods 11. Therefore, the lifting rods 11 achieve both overall support and the lifting effect of the device.

[0021] like Figure 1 and Figure 2 As shown, in this embodiment, a limiting component 12 is provided on the upper surface of the support plate 1. The limiting component 12 includes a limiting plate 121 and a slide rail cylinder 122. Several sets of slide rail cylinders 122 are disposed on the upper surface of the support plate 1. The limiting plate 121 is connected to the movable ends of the several sets of slide rail cylinders 122. The limiting plate 121 is provided with several limiting grooves 123. The several slide rail cylinders 122 drive the several limiting grooves 123 to cooperate with the upper limit block 13 at the upper end of the lifting rod 11. Thus, when the chip product 6 is lifted and aligned with the heat sink assembly 3, the upper end of the lifting rod 11 passes through the wide end of the limiting groove 123. The slide rail cylinder 122 drives the limiting plate 121 to move laterally, and the narrow end of the limiting groove 123 cooperates with the lifting rod 11. The upper limit block 13 can prevent the adjusting handwheel 4 from adjusting too much and causing overpressure on the chip product 6. like Figure 1 and Figure 2 As shown, in this embodiment, a lower limit block 14 is provided in the middle of the lifting rod 11, and the lower limit block 14 cooperates with the lower end face of the support plate 1. Therefore, the lower limit block 14 can prevent the top of the device from rising too high and affecting other external equipment.

[0022] like Figure 1 and Figure 2 As shown, in this embodiment, the adjusting handwheel 4 is provided with a locking pin 15, which is locked to the adjusting handwheel 4. Therefore, the locking pin 15 can lock the adjusting handwheel 4, preventing it from loosening during use and causing a decrease in the clamping force.

[0023] The working principle of this utility model is as follows: Before the equipment is started, several lifting rods 11 are connected to the external machine support surface. The chip product 6 is placed in the chip slot on the external machine lifting mechanism. The limiting component 12 is in the unlocked state. The external machine lifting mechanism drives the chip product 6 to contact the heat sink 31 and continuously lift it. When it is lifted to the working position, the limiting component 12 is pushed and locked. By rotating the adjusting handwheel 4, the adjusting component 2 is driven and the heat sink 31 is pressed against the chip product 6. The upper limit block 13 is limited and cooperates with the narrow end of the limiting groove 123. The adjusting handwheel 4 is continuously rotated to make the heat sink 31 press down. The pressure sensor 9 synchronizes the pressure value. After rotating to the standard pressure, the locking pin 15 is locked, so that the heat sink can be visually adjusted and pressed.

[0024] Although the embodiments of this utility model are described with reference to actual solutions, they do not constitute a limitation on the meaning of this utility model. For those skilled in the art, modifications to the implementation schemes and combinations with other schemes based on this specification are obvious.

Claims

1. A pressure-adjustable radiator, comprising a support plate (1), an adjustment assembly (2), and a radiator assembly (3), characterized in that: The adjustment component (2) includes an adjustment handwheel (4) and a lifting module (5). The adjustment handwheel (4) and the lifting module (5) are respectively disposed at the upper and lower ends of the support plate (1). The heat sink component (3) is connected to the lower end of the lifting module (5). The adjustment handwheel (4) cooperates with the movable end of the lifting module (5) and drives the heat sink component (3) to cooperate with the chip product (6) on the lifting end of the external machine.

2. The pressure-adjustable radiator according to claim 1, characterized in that: The lifting module (5) includes a lifting plate (51), a measuring plate (52), and a base plate (53). The lifting plate (51) is movably connected to the lower end face of the support plate (1) through several linear bearings (54). The adjusting handwheel (4) passes through the support plate (1) and cooperates with the upper end face of the lifting plate (51). The measuring plate (52) is connected to the lower end face of the lifting plate (51) through several first equal-height screws (7). The lifting plate (51) is connected to the base plate (53) through several second equal-height screws (8). The adjusting handwheel (4) drives the measuring plate (52) to cooperate with the base plate (53).

3. The pressure-adjustable radiator according to claim 2, characterized in that: A pressure sensor (9) is provided at the lower end of the measuring plate (52), and the pressure sensor (9) is in contact with the upper surface of the base plate (53).

4. The pressure-adjustable radiator according to claim 2, characterized in that: A plurality of floating springs (10) are provided between the lifting plate (51) and the measuring plate (52). The lifting plate (51) floats in cooperation with the measuring plate (52) through a plurality of linear bearings (54) and a plurality of floating springs (10).

5. The pressure-adjustable radiator according to claim 2, characterized in that: The heat sink assembly (3) includes a heat sink (31), a water inlet (32) and a water outlet (33). The heat sink (31) is connected to an external circulation mechanism through the water inlet (32) and the water outlet (33). The upper surface of the heat sink (31) is connected to the lower surface of the base plate (53) through several support rods (34). The lower heat dissipation surface of the heat sink (31) is matched with the chip product (6).

6. The pressure-adjustable radiator according to claim 1, characterized in that: The support plate (1) is connected to the external machine support surface through several lifting rods (11).

7. A pressure-adjustable radiator according to claim 6, characterized in that: The upper surface of the support plate (1) is provided with a limiting component (12). The limiting component (12) includes a limiting plate (121) and a slide rail cylinder (122). Several sets of slide rail cylinders (122) are provided on the upper surface of the support plate (1). The limiting plate (121) is connected to the movable end of several sets of slide rail cylinders (122). The limiting plate (121) is provided with several limiting grooves (123). Several slide rail cylinders (122) drive several limiting grooves (123) to cooperate with the upper limit block (13) at the upper end of the lifting rod (11).

8. A pressure-adjustable radiator according to claim 6, characterized in that: The lifting rod (11) is provided with a lower limit block (14) in the middle, and the lower limit block (14) cooperates with the lower end face of the support plate (1).

9. A pressure-adjustable radiator according to claim 1, characterized in that: The adjusting handwheel (4) is provided with a locking pin (15), which is locked to the adjusting handwheel (4).

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