A double-layered heat sink

Abstract

The utility model discloses a double -deck fin, include: with the chip's heat dissipation aluminum plate I still include: heat dissipation aluminum plate II, and it is with heat dissipation aluminum plate I size is compatible, and heat dissipation aluminum plate I and heat dissipation aluminum plate II inner surface opposite formed area is heat dissipation cavity, bridge, it is provided with n groups, and transversely irregular distribution is in heat dissipation cavity, and n group bridge will heat dissipation cavity isolate and divide into vertical distribution n-1 group heat dissipation channel. The utility model discloses a double -deck fin, solved the problem of the poor heat dissipation effect of existing fin.

Description

Technical Field

[0001] This utility model relates to the field of heat sink technology, specifically a double-layer heat sink for use in thin televisions. Background Technology

[0002] With the development of television technology, the integration of electronic components on the motherboard is becoming increasingly higher, their performance is constantly improving, and their power density is continuously increasing, generating a large amount of heat during operation. If this heat cannot be dissipated in time, it will cause the temperature of the electronic components to rise, affecting their performance and lifespan, and may even lead to television malfunctions. Therefore, effective heat dissipation measures are needed to ensure the normal operating temperature of the motherboard.

[0003] Existing motherboard heatsinks are primarily single-piece structures with smooth surfaces on both sides, such as... Figure 4 As shown, although such a structure increases the heat dissipation area, the dispersed direction of hot air dissipation prevents the formation of an effective heat dissipation channel, resulting in poor heat dissipation performance of the heat sink and hindering rapid and effective heat dissipation. Utility Model Content

[0004] One object of this invention is to solve at least the aforementioned problems and / or defects, and to provide at least the advantages described below.

[0005] To achieve these objectives and other advantages according to the present invention, a double-layer heat sink is provided, comprising: a heat dissipation aluminum plate I bonded to the chip, and further comprising: Heat dissipation aluminum plate II is adapted to the size of heat dissipation aluminum plate I. The area formed by the inner surfaces of heat dissipation aluminum plate I and heat dissipation aluminum plate II is a heat dissipation cavity. The cable trays are provided in n sets, which are irregularly distributed laterally in the heat dissipation cavity. The n sets of cable trays isolate the heat dissipation cavity into n-1 sets of vertically distributed heat dissipation channels.

[0006] Preferably, the surface of the heat dissipation aluminum plate I that is attached to the chip is smooth, and the other side is wavy. Both sides of the heat dissipation aluminum plate II are wavy.

[0007] Preferably, the vertical distance between the crests and troughs of the wave is 0.05 to 0.7 mm.

[0008] Preferably, both heat dissipation aluminum plate I and heat dissipation aluminum plate II are provided with several clearance grooves or clearance holes.

[0009] Preferably, the thickness of heat dissipation aluminum plate I is 0.6-2mm; the thickness of heat dissipation aluminum plate II is 0.6-2mm; and the overall thickness of heat dissipation aluminum plate I and heat dissipation aluminum plate II is 4mm-13mm.

[0010] Preferably, the surfaces of the heat dissipation aluminum plate I and the heat dissipation aluminum plate II are provided with a number of mounting holes for easy insertion of the limiting component. The mounting holes on the heat dissipation aluminum plate I are small holes, and the mounting holes on the heat dissipation aluminum plate II are large holes, with the small holes and large holes being concentric.

[0011] This utility model has at least the following beneficial effects: This device consists of a double-layer heat sink structure composed of heat sink I and heat sink II. By utilizing the heat dissipation channels divided by the bridge frame to form a chimney effect, it accelerates the exchange of hot and cold gases in the heat dissipation cavity, enabling the heat sink to continuously remove heat and improve heat dissipation efficiency.

[0012] Other advantages, objectives and features of this invention will be partly apparent from the following description, and partly understood by those skilled in the art through study and practice of this invention. Attached Figure Description

[0013] Figure 1 This is a front structural diagram of the present invention; Figure 2 This is a schematic diagram of the rear structure of the present invention; Figure 3 This is a side view of the present invention. Figure 4 The existing heat sink overall structure; The markings in the diagram are: 1. Heat dissipation aluminum plate I, 2. Heat dissipation aluminum plate II, 4. Heat dissipation cavity, 5. Cable tray, 6. Heat dissipation channel, 7. Mounting hole, 8. Clearance hole; Detailed Implementation

[0014] The present invention will now be described in further detail with reference to the accompanying drawings, so that those skilled in the art can implement it based on the description.

[0015] It should be understood that terms such as “having,” “comprising,” and “including” as used herein do not exclude the presence or addition of one or more other elements or combinations thereof.

[0016] It should be noted that in the description of this utility model, the terms indicating orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0017] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "installed", "equipped with", "sleeved / connected", "connected", etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0018] Furthermore, in this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Moreover, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0019] The present invention will now be described in detail with reference to the accompanying drawings: Figure 1-3 This invention discloses a double-layer heat sink, comprising: a heat dissipation aluminum plate I1 bonded to the chip, and further comprising: Heat dissipation aluminum plate II2 is adapted to the size of heat dissipation aluminum plate I1, and the area formed by the inner surfaces of heat dissipation aluminum plate I1 and heat dissipation aluminum plate II2 is heat dissipation cavity 4. The cable tray 5 is provided in n groups and is irregularly distributed laterally in the heat dissipation cavity 4. The n groups of cable trays 5 isolate the heat dissipation cavity 4 into n-1 groups of vertically distributed heat dissipation channels 6.

[0020] Working principle: During installation, first attach one side of the heat dissipation aluminum plate I1 of this heat sink to the chip, and ensure that this heat sink is installed vertically on the TV motherboard so that the heat dissipation channel 6 of the heat sink faces upward to form a chimney-like channel; When in use, the chip generates a lot of heat. This heat first accumulates on the surface of the chip. The heat dissipation aluminum plate I1 is in close contact with the chip surface to absorb the heat from the chip surface and transfers it to the heat dissipation aluminum plate II2 through the bridge 5. At this time, the heat from heat dissipation aluminum plate II2 and heat dissipation aluminum plate I1 will heat the surrounding air. The hot air rises along the four sets of heat dissipation channels 6 in the heat dissipation cavity 4 because the density is smaller. At the same time, because the heat dissipation fins are installed vertically, the heat dissipation channels 6 form a chimney-like structure. The hot air rises and goes out from the upper port, while the cold air enters from the lower port, forming natural convection in the heat dissipation cavity 4 and continuously carrying away the heat.

[0021] In actual production, ① heat dissipation aluminum plate Ⅰ1 and heat dissipation aluminum plate Ⅱ2 form an integral structure through the bridge 5 on both sides, and the bridge 5 on both sides can be installed close to the edge or recessed inward by a few mm. Meanwhile, in actual use, n of the n groups of cable trays 5 can be selected as 3-10 groups, and the optimal number of groups for this heat sink is 5 groups, forming four heat dissipation channels 6; this allows the heat sink to form a chimney effect through four independent heat dissipation channels 6 at the same time, avoiding heat accumulation in a single heat dissipation channel 6 and slow heat dissipation efficiency. In addition, the function of the cable tray 5 also includes: transferring the heat of the heat dissipation aluminum plate I1 to the heat dissipation aluminum plate II2; ②The double-layer heat dissipation aluminum plate I1 and heat dissipation aluminum plate II2 structure allows hot air to rise and leave through the four sets of internal heat dissipation channels 6, instead of the hot air spreading out in all directions due to a single layer, resulting in poor heat dissipation; ③ In actual production, the preferred structure of the heat dissipation aluminum plate I1 and heat dissipation aluminum plate II2 in this device is a notched rectangular shape, which can be referred to in detail. Figure 1 ; ④ This device is suitable for the motherboard of a thin-film television.

[0022] In summary, this device consists of a double-layer heat sink structure composed of heat sink aluminum plate I1 and heat sink aluminum plate II2. By utilizing the heat dissipation channels 6 divided by the bridge frame 5 to form a chimney effect, it accelerates the exchange of hot and cold gases in the heat dissipation cavity 4, enabling the heat sink to continuously remove heat and increase the heat dissipation efficiency.

[0023] In the above scheme, the surface of the heat dissipation aluminum plate I1 that is attached to the chip is smooth, and the other side is wavy. Both sides of the heat dissipation aluminum plate II2 are wavy.

[0024] Working principle: The smooth surface of the heat sink aluminum plate I1 that is in contact with the chip ensures a tighter contact between the chip and the heat sink aluminum plate I1, eliminating tiny gaps between them and reducing the obstruction of heat transfer caused by gaps (air in the gaps has poor thermal conductivity) due to poor contact. The other side of heat dissipation aluminum plate I1 is wavy, and both sides of heat dissipation aluminum plate II2 are wavy. The wavy, extendable structure increases the heat dissipation area of ​​heat dissipation aluminum plate I1 and heat dissipation aluminum plate II2, which is beneficial to the contact between heat dissipation aluminum plate I1 and heat dissipation aluminum plate II2 and air, thereby improving heat dissipation efficiency.

[0025] The vertical distance between the crests and troughs of the wave is 0.05–0.7 mm.

[0026] In actual use, the vertical distance between the crest and trough of the wave in this device is 0.05 to 0.7 mm, and 0.3 ± 0.2 mm is preferred.

[0027] As described above, both the heat dissipation aluminum plate I1 and the heat dissipation aluminum plate II2 are provided with several clearance grooves or clearance holes 8.

[0028] Working principle: In actual processing, multiple through-holes or clearance holes 8 are made on the surfaces of heat dissipation aluminum plate I1 and heat dissipation aluminum plate II2 to provide mounting positions for other hardware on the main board and ensure that heat dissipation aluminum plate I1 fits tightly with the chip side; at the same time, clearance holes 8 are preferred in actual production to reduce processing difficulty and production costs.

[0029] In the above scheme, the thickness of the heat dissipation aluminum plate I1 is 0.6–2 mm; the thickness of the heat dissipation aluminum plate II2 is 0.6–2 mm; and the overall thickness of the heat dissipation aluminum plate I1 and heat dissipation aluminum plate II2 is 4 mm–13 mm. In actual use, the preferred thickness of the heat dissipation aluminum plate I1 is 1.4 ± 0.2 mm; the preferred thickness of the heat dissipation aluminum plate II2 is 1.27 ± 0.2 mm; and the preferred overall thickness is 7.4 ± 0.2 mm.

[0030] As described above, the surfaces of the heat dissipation aluminum plate I1 and the heat dissipation aluminum plate II2 are provided with a number of mounting holes 7 for easy insertion of the limiting component. The mounting holes 7 on the heat dissipation aluminum plate I1 are small holes, and the mounting holes 7 on the heat dissipation aluminum plate II2 are large holes. The small holes and the large holes are concentric.

[0031] Working principle: During installation, the heat dissipation aluminum plates I1 and II2 of this heat sink are fixed to the motherboard by inserting them through the mounting hole 7 using limiting components (such as screws with springs, with large holes for easy placement of the screw tail and small holes for easy passage of the screw front to connect with the motherboard). Finally, the heat sink and motherboard are vertically installed inside the TV. Vertical installation ensures the formation of a chimney effect that facilitates accelerated heat dissipation.

[0032] Although the embodiments of this utility model have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for this utility model. For those skilled in the art, other modifications can be easily made. Therefore, without departing from the general concept defined by the claims and their equivalents, this utility model is not limited to the specific details and the illustrations shown and described herein.

Claims

1. A double-layer heat sink, comprising: The heat dissipation aluminum plate I, which is attached to the chip, is characterized in that it further includes: Heat dissipation aluminum plate II is adapted to the size of heat dissipation aluminum plate I. The area formed by the inner surfaces of heat dissipation aluminum plate I and heat dissipation aluminum plate II is a heat dissipation cavity. The cable trays are provided in n sets, which are irregularly distributed laterally in the heat dissipation cavity. The n sets of cable trays isolate the heat dissipation cavity into n-1 sets of vertically distributed heat dissipation channels.

2. The double-layer heat sink according to claim 1, characterized in that, The surface of the heat dissipation aluminum plate I that is attached to the chip is smooth, while the other side is wavy. Both sides of the heat dissipation aluminum plate II are wavy.

3. The double-layer heat sink according to claim 2, characterized in that, The vertical distance between the crests and troughs of the wave is 0.05–0.7 mm.

4. The double-layer heat sink according to claim 1, characterized in that, Both the heat dissipation aluminum plate I and the heat dissipation aluminum plate II are provided with several clearance grooves or clearance holes.

5. The double-layer heat sink according to claim 1, characterized in that, The thickness of the heat dissipation aluminum plate I is 0.6-2mm; the thickness of the heat dissipation aluminum plate II is 0.6-2mm; and the overall thickness of the heat dissipation aluminum plate I and heat dissipation aluminum plate II is 4mm-13mm.

6. The double-layer heat sink according to claim 1, characterized in that, The surfaces of the heat dissipation aluminum plate I and the heat dissipation aluminum plate II are provided with several mounting holes for easy insertion of the limiting component. The mounting holes on the heat dissipation aluminum plate I are small holes, and the mounting holes on the heat dissipation aluminum plate II are large holes. The small holes and the large holes are concentric.

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