Heat dissipation assembly

Abstract

The utility model provides a kind of heat dissipation assembly, it is located in a data transmission equipment, it includes a frame, at least one water-cooling plate and at least one arc spring wire.The frame has an installation surface;The water-cooling plate is floatingly arranged below the installation surface, and has a heat dissipation surface in contact with a data transmission module, the water-cooling plate and the base plate in the case of the data transmission equipment jointly define a containing space to allow the data transmission module to be inserted.The arc spring wire is arranged at the side of water-cooling plate, when the data transmission module is inserted into the containing space, the water-cooling plate is pushed up, the arc spring wire is deformed to apply downward pressure to the water-cooling plate, so that the water-cooling plate and the data transmission module are tightly attached, thereby improving the heat conduction efficiency.

Description

Technical Field

[0001] This utility model relates to a heat dissipation assembly, and more particularly to a heat dissipation assembly installed in a data transmission device, which can effectively manage the heat of a pluggable data transmission module. Background Technology

[0002] With the rapid advancement of technology, high-speed data transmission modules (such as fiber optic transceiver modules) or optical communication devices integrated into switches adopt a pluggable design to facilitate rapid field replacement and upgrades. Fiber optic transceiver modules can be available in various package types, such as quad small form-factor pluggable (QSFP), octagonal small form-factor pluggable (OSFP), or multi-channel small form-factor pluggable modules, and support high-speed electrical or optical interface transmission. As computing efficiency increases, the heat generated by data transmission modules in data transmission equipment during operation also continues to grow. Therefore, to ensure the stable operation of data transmission equipment in the face of technological advancements, thermal management has become a crucial and indispensable issue in system design.

[0003] Traditional air cooling relies on airflow to remove heat. For high-power modules, this often requires increasing fan speed or airflow pressure, leading to increased system noise and energy consumption, as well as higher maintenance costs over long periods. More importantly, airflow cooling efficiency is limited by the specific heat and thermal conductivity of air. Even with optimized fin design or airflow paths, it is still difficult to meet the requirements of high-power optical modules for long-term operation at stable low temperatures.

[0004] Furthermore, in high-density layouts, the reduced spacing between modules makes airflow distribution susceptible to blockages and eddies, leading to a significant decrease in the heat dissipation performance of some modules. Uneven airflow distribution can cause some modules to remain at high temperatures for extended periods, accelerating component aging and potentially causing system instability or malfunctions.

[0005] Therefore, for the high-density and high-power applications of today's data centers, there is an urgent need to develop a heat dissipation assembly that can provide high thermal conductivity, stable contact pressure, and is suitable for pluggable high-speed data transmission modules, in order to replace the traditional air cooling method and ensure the temperature control stability and long-term reliability of the system under high load operation. Utility Model Content

[0006] In view of the above problems, this utility model provides a heat dissipation assembly for use in data transmission equipment, especially for heat dissipation applications of pluggable high-speed data transmission modules, to solve the defects of traditional air cooling methods such as insufficient heat dissipation efficiency, unstable contact and inconvenient maintenance in high power and high density environments.

[0007] This utility model provides a heat dissipation assembly for use in a chassis with a base plate in a data transmission device, characterized in that the heat dissipation assembly includes:

[0008] A frame with a mounting surface;

[0009] At least one water-cooled plate is floatingly disposed below the mounting surface and defines an accommodating space together with the internal base plate of the data transmission device to accommodate a data transmission module. The water-cooled plate has a heat dissipation surface to contact the data transmission module.

[0010] At least one arc-shaped spring wire is disposed on the side of the water-cooled plate and has at least one pin that abuts against the mounting surface of the frame;

[0011] The data transmission module can be inserted into the accommodating space, pushing the water-cooled plate vertically upward, causing the bow-shaped spring wire to elastically deform and apply downward pressure to the water-cooled plate, so that the heat dissipation surface of the water-cooled plate is in close contact with the data transmission module.

[0012] The heat dissipation assembly, wherein: the bow-shaped spring wire has a coil disposed on the side of the water-cooled plate, and the at least one pin extends from the coil to transmit elastic pressure to the water-cooled plate when the bow-shaped spring wire is displaced and deformed.

[0013] The heat dissipation assembly, wherein: the frame includes a body and at least two support portions, the at least two support portions extending downward from the body and fixed to the substrate, and the mounting surface is located on the side of the body facing the substrate.

[0014] The heat dissipation assembly further includes at least one limiting member and at least one floating fixing member. The limiting member is disposed on the mounting surface of the frame and forms at least one opening, through which the at least one floating fixing member passes and is fixed to the water-cooling plate.

[0015] The heat dissipation assembly, wherein: the water-cooled plate is provided with at least one mounting hole, the floating fixing member has a rod portion and a head portion, the rod portion being sequentially inserted through the opening of the limiting member and the mounting hole of the water-cooled plate, so that the water-cooled plate is suspended on the mounting surface of the frame.

[0016] The heat dissipation assembly, wherein: the diameter of the head of the floating fixing member is larger than the aperture of the opening, and the head is located above the limiting member and can abut against the upper surface of the limiting member; the rod of the floating fixing member passes through the opening and the mounting hole of the water-cooling plate and is combined with the water-cooling plate; a vertical gap is reserved between the head and the water-cooling plate so that the water-cooling plate can float vertically within the range of the vertical gap.

[0017] The heat dissipation assembly, wherein: one end of the water-cooled plate has a slope to guide the data transmission module into the accommodating space.

[0018] The heat dissipation assembly wherein: the side of the water-cooled plate is recessed with at least one clearance area to accommodate the at least one bow-shaped spring wire.

[0019] The heat dissipation assembly, wherein the water-cooled plate has at least one inlet pipe and one outlet pipe.

[0020] With this design, the present invention can provide a stable and efficient heat dissipation mechanism in a limited space, which not only ensures that the data transmission module maintains low temperature operation under high power and high density applications, but also supports the rapid plugging and unplugging of the module, avoiding heat dissipation failure due to poor contact, and further improving the operational reliability and maintenance convenience of the data center system. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the heat dissipation assembly of this utility model installed in a data transmission device;

[0022] Figure 2 This is an exploded view of the heat dissipation assembly of this utility model from below;

[0023] Figure 3 This is a cross-sectional schematic diagram of the heat dissipation assembly of this utility model;

[0024] Figure 4 This is a partial cross-sectional view of the heat dissipation assembly of this utility model before the data transmission module is inserted;

[0025] Figure 5 A partial cross-sectional view of the data transmission module inserted into the heat dissipation assembly of this utility model;

[0026] Figure 6 This is a three-dimensional schematic diagram of the heat dissipation assembly of this utility model, in which multiple water-cooled plates contact each data transmission module.

[0027] Explanation of reference numerals in the attached drawings: Heat dissipation assembly 1; Data transmission module 10; Data transmission device M; Base plate M1; Chassis M2; Accommodation space S; Frame 11; Limiting component 11A; Mounting surface 11M; Opening 110; Body 111; Support part 112; Reinforcing rib 113; Water cooling plate 21; Clearance area 20; Heat dissipation surface 21A; Mounting hole 211; Inflow pipe 213; Outflow pipe 214; Inclined surface 23; Bow-shaped spring wire 31; Coil 32A; Pin 32B; Floating fixing component 4; Rod part 41; Head 42; Vertical clearance G; Pressure F; Mating structure P. Detailed Implementation

[0028] The above-mentioned objectives of this utility model, as well as its structural and functional characteristics, will be explained with reference to the preferred embodiments shown in the accompanying drawings. Please refer to... Figure 1 As shown, it is a schematic diagram of the heat dissipation assembly of this utility model installed in a data transmission device; Figure 2 This is an exploded view of the heat dissipation assembly of this utility model from below; Figure 3 This is a cross-sectional schematic diagram of the heat dissipation assembly of this utility model; Figure 4 This is a partial cross-sectional view of the heat dissipation assembly of this utility model before the transceiver module is installed; and Figure 5 A partial cross-sectional view of the transceiver module inserted into the heat dissipation assembly of this utility model; and... Figure 6 This is a three-dimensional schematic diagram of the heat dissipation assembly of this utility model, in which multiple water-cooled plates respectively contact the transceiver module.

[0029] like Figures 1 to 3 As shown, this utility model provides a heat dissipation assembly 1, disposed in a data transmission device M (e.g., a switch). The data transmission device M includes a chassis M2 as a shell and a base plate M1 disposed within the chassis M2. The heat dissipation assembly 1 includes at least a frame 11, at least one water-cooled plate (cold plate) 21, and at least one bow-shaped spring wire 31. The frame 11 has a mounting surface 11M to provide the necessary mounting structure for the water-cooled plate 21. Not limited thereto, the frame 11 can also be disposed in any load-bearing position or plane, support platform, or other structural part of the chassis M2 of the data transmission device M, and is not limited to a specific mounting position. For ease of explanation and illustration, ... Figure 1 This example only illustrates one heat dissipation assembly 1 housed in chassis M2. In practical applications, multiple heat dissipation assemblies 1 can be installed in chassis M2 to suit different needs, such as chassis size or intended use. Figures 2-5 The example uses a water-cooled plate (cold plate) 21 in conjunction with a data transmission module 10.

[0030] The frame 11 includes a body 111 and at least two support portions 112. The support portions 112 extend downwards from both sides of the body 111 to support and position the frame 11, ensuring its stable placement within the chassis M2 of the data transmission equipment M. In this embodiment, one downwardly extending end of the support portion 112 is fixed to a base plate M1 inside the chassis M2. The mounting surface 11M is formed on the lower side of the body 111 for the water-cooled plate 21 to be suspended or floated. The body 111 may be further provided with reinforcing ribs 113 to improve the structural rigidity of the frame 11 and prevent deformation after long-term pressure or heat exposure.

[0031] A water-cooled plate 21 is floatingly disposed below the mounting surface 11M of the frame 11, defining an accommodating space S between it and the base plate M1 within the chassis M2 of the data transmission device M, for accommodating a data transmission module 10. The water-cooled plate 21 has a heat dissipation surface 21A for contacting the upper surface of the data transmission module 10 for heat exchange. In some embodiments, the water-cooled plate 21 may optionally be provided with at least one inlet pipe 213 and one outlet pipe 214. The inlet pipe 213 and the outlet pipe 214 are further connected to a rear-end coolant circulation system to introduce coolant flow, thereby quickly removing the heat generated by the data transmission module 10 during high-power operation.

[0032] A bow-shaped spring wire 31 is disposed on the side of the water-cooled plate 21, and has a coil 32A and at least one pin 32B extending from the coil 32A. The coil 32A is detachably sleeved or fixed on a mating structure P (such as a convex shaft, clamping ring, hook, groove, etc.) at a predetermined assembly position on the side of the water-cooled plate 21, while the pin 32B extends upward at an angle and abuts against the mounting surface 11M of the frame 11. In this embodiment, the two pins 32B extending from the coil 32A extend upward at an angle and abut against the mounting surface 11M of the frame 11. In the assembled state, the bow-shaped spring wire 31 can maintain preload. When the water-cooled plate 21 is pushed by an external force, the bow-shaped spring wire 31 will generate elastic deformation and apply downward pressure to the water-cooled plate 21 via the coil 32A to ensure a tight fit between the water-cooled plate 21 and the data transmission module 10. In this embodiment, the bow-shaped spring wire 31 is, for example, made of metal wire through bending processing.

[0033] To prevent the bow-shaped spring wire 31 from interfering with adjacent electronic components, the side of the water-cooled plate 21 can be recessed to form at least one clearance area 20 to accommodate the bow-shaped spring wire 31. This design can effectively reduce the lateral space occupied by the heat dissipation assembly 1 in the high-density layout of the switch and improve the overall integration of the installation.

[0034] Please see Figure 3 , Figure 4 and Figure 5As shown, the water-cooled plate 21 is disposed below the mounting surface 11M of the frame 11 and, together with the inner substrate M1 of the chassis M2 of the data transmission device M, defines an accommodating space S for accommodating the data transmission module 10. The water-cooled plate 21 has a heat dissipation surface 21A facing the accommodating space S, so that it can form close contact with the upper surface of the data transmission module 10 after insertion, thereby facilitating heat exchange. In addition, a slope 23 may be optionally provided on the lower surface of one end (free end) of the water-cooled plate 21. This slope 23 faces the accommodating space S and is used to guide the data transmission module 10 to gradually slide into position during insertion. By means of the guiding effect of the slope 23, the data transmission module 10 can avoid direct hard interference with the heat dissipation surface 21A in the initial stage of insertion, and the insertion force is converted into the upward displacement of the water-cooled plate 21. Accordingly, the front end of the data transmission module 10 may optionally be provided with an inclined structure (such as a guide slope) that matches the slope 23 to facilitate insertion. This two-sided bevel design further enhances the smoothness and safety of the data transmission module 10 installation, and ensures that the water-cooled plate 21 and the data transmission module 10 can establish a uniform and thermally conductive contact in the correct position.

[0035] To enable the water-cooled plate 21 to float with external force during the insertion of the data transmission module 10, the frame 11 is provided with at least one limiting member 11A on the mounting surface 11M. The limiting member 11A forms an opening 110, which serves as a through hole structure for the insertion of the floating fixing member 4.

[0036] The floating fastener 4 includes a rod portion 41 and a head portion 42. The rod portion 41 is sequentially inserted through the opening 110 of the limiting member 11A and engages with the mounting hole 211 of the water-cooling plate 21. The diameter of the head portion 42 of the floating fastener 4 is larger than the diameter of the opening 110, thus preventing the floating fastener 4 from falling off the limiting member 11A.

[0037] The head 42 is located above the limiting member 11A and abuts against the upper surface of the limiting member 11A. In the assembled state, a vertical gap G is formed between the head 42 and the water-cooling plate 21. Through this vertical gap G, the water-cooling plate 21 can float vertically within an allowable range. This floating mechanism ensures that the water-cooling plate 21 can be pushed upward when the data transmission module 10 is inserted, and forms a stable fit with the data transmission module 10 through the bow-shaped spring wire 31.

[0038] Please refer to the following: Figure 4The diagram shows a partial cross-sectional view of the heat dissipation assembly 1 before the data transmission module 10 is inserted. In this state, the data transmission module 10 is not yet placed in the receiving space S, and the water-cooled plate 21 is located at a relatively low position, supported by the floating fastener 4 and suspended below the mounting surface 11M of the frame 11. At this time, the heat dissipation surface 21A of the water-cooled plate 21 has not yet come into contact with the data transmission module 10. The pin 32B of the bow-shaped spring wire 31 naturally contacts the mounting surface 11M, and the coil 32A maintains its initial tension to facilitate displacement during subsequent module insertion.

[0039] This initial configuration design ensures that when the data transmission module 10 is inserted into the accommodating space S, it can first push the water-cooling plate 21 and move it vertically upwards. This avoids direct hard collision between the data transmission module 10 and the water-cooling plate 21, and ensures that pressure and contact can be gradually built up during the insertion process, improving overall operational smoothness and assembly safety.

[0040] Please refer to the following: Figure 5 As shown, this is a partial cross-sectional view of the heat dissipation assembly 1 with the data transmission module 10 inserted. When the data transmission module 10 is pushed into the accommodating space S, its upper surface comes into contact with the heat dissipation surface 21A of the water-cooled plate 21, and under the continuous action of the insertion force, it pushes the water-cooled plate 21, causing the water-cooled plate 21 to rise vertically. As the water-cooled plate 21 moves upward, the arc-shaped spring wire 31 provided on its side is pulled and undergoes elastic displacement deformation, thereby applying a downward pressure F to the water-cooled plate 21.

[0041] More specifically, as the water-cooled plate 21 gradually moves upward, the pin 32B of the arc-shaped spring wire 31 is squeezed by external force and expands outward. This outward expansion movement uniformly drives the coil 32A to deform synchronously, accumulating elastic energy during the deformation process. Simultaneously, the pin 32B continuously supports the mounting surface 11M of the frame 11, allowing the mutual supporting force between the frame 11 and the pin 32B to be effectively conducted through the coil 32A to the mating structure P of the water-cooled plate 21, thereby establishing a stable downward pressure F on the water-cooled plate 21. Through this downward pressure F, the heat dissipation surface 21A of the water-cooled plate 21 can form a uniform and tight contact with the upper surface of the data transmission module 10. This design effectively compensates for the assembly tolerances between the data transmission module 10 and the water-cooled plate 21, avoids reduced heat transfer efficiency due to thermal resistance caused by local gaps, and ensures that the contact pressure remains stable over a long period, thus establishing a reliable and efficient heat transfer channel.

[0042] Therefore, the water-cooled plate 21 can complete a controlled upward movement within the vertical clearance G allowed by the floating fixing member 4, and under the (elastic) pressure F applied by the bow-shaped spring wire 31, it maintains a uniform and tight fit with the upper surface of the data transmission module 10, forming a stable thermal contact. Through this structural design, not only can poor contact caused by assembly deviations or module insertion and removal processes be avoided, but also the heat dissipation performance can be ensured to remain stable during long-term operation, improving the overall system reliability.

[0043] Please see Figure 6 Please refer to the above as shown. Figures 1-5 As shown, the heat dissipation assembly 1 installed in the chassis M2 of the data transmission device M actually has multiple water-cooled plates 21 that can be configured to correspond to multiple pluggable data transmission modules 10. When each data transmission module 10 is inserted into the corresponding accommodating space S, it can form a tight thermal contact with the corresponding water-cooled plate 21.

[0044] In this multi-module configuration, the frame 11 serves as a unified support structure, providing mounting positions for multiple water-cooled plates 21 simultaneously and ensuring precise arrangement and consistent spacing between modules. Each water-cooled plate 21 is suspended below the frame 11 via a floating fastener 4, and downward pressure is provided by a corresponding bow-shaped spring cable 31 to ensure automatic adjustment and tight fit with the data transmission module 10 after insertion. This design allows each water-cooled plate 21 to float independently and automatically compensate for the insertion force and assembly tolerance of different modules, avoiding uneven contact caused by height differences in the data transmission module 10.

[0045] Furthermore, the water-cooled plate 21 can be connected to the downstream coolant circulation system via inlet pipe 213 and outlet pipe 214 to quickly remove the heat generated by the data transmission module 10 during high-power operation. Compared with traditional air-cooling methods, this invention provides more efficient and uniform thermal management in high-density environments. This structural configuration not only improves heat dissipation performance but also suppresses system noise and energy consumption, extending the service life of the data transmission module 10 and the overall equipment.

[0046] In summary, the heat dissipation assembly 1 of this utility model provides stable support through the frame 11, and combines the floating mounting structure of the water-cooled plate 21 with the elastic clamping mechanism of the bow-shaped spring wire 31, allowing the water-cooled plate 21 to automatically adjust its position as the data transmission module 10 is inserted, and maintain uniform and stable contact pressure after insertion. This design not only effectively compensates for assembly tolerances and height differences of the data transmission module 10, avoiding the decrease in heat dissipation efficiency caused by poor contact, but also ensures that the high-power module maintains a low temperature during long-term operation, improving the overall reliability and service life of the data transmission device M. Because this utility model combines simple structure, convenient assembly, and efficient heat dissipation, it is particularly suitable for high-speed data center equipment and other applications requiring high-density layout and high thermal management.

[0047] The present invention has been described in detail above. However, the above description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made based on the present invention should still fall within the patent coverage of the present invention.

Claims

1. A heat dissipation assembly for use within a chassis having a base plate in a data transmission device, characterized in that, The heat dissipation assembly includes: A frame with a mounting surface; At least one water-cooled plate is floatingly disposed below the mounting surface and defines an accommodating space together with the internal base plate of the data transmission device to accommodate a data transmission module. The water-cooled plate has a heat dissipation surface to contact the data transmission module. At least one arc-shaped spring wire is disposed on the side of the water-cooled plate and has at least one pin that abuts against the mounting surface of the frame; The data transmission module can be inserted into the accommodating space, pushing the water-cooled plate vertically upward, causing the bow-shaped spring wire to elastically deform and apply downward pressure to the water-cooled plate, so that the heat dissipation surface of the water-cooled plate is in close contact with the data transmission module.

2. The heat dissipation assembly as described in claim 1, characterized in that: The bow-shaped spring wire has a coil disposed on the side of the water-cooled plate, and at least one pin extends from the coil to transmit elastic pressure to the water-cooled plate when the bow-shaped spring wire is displaced and deformed.

3. The heat dissipation assembly as described in claim 1, characterized in that: The frame includes a body and at least two support portions, which extend downward from the body and are fixed to the substrate, and the mounting surface is located on the side of the body facing the substrate.

4. The heat dissipation assembly as described in claim 3, characterized in that: It also includes at least one limiting member and at least one floating fixing member. The limiting member is disposed on the mounting surface of the frame and forms at least one opening, through which the at least one floating fixing member passes and is fixed to the water-cooled plate.

5. The heat dissipation assembly as described in claim 4, characterized in that: The water-cooled plate is provided with at least one mounting hole, and the floating fastener has a rod and a head. The rod passes sequentially through the opening of the limiting member and the mounting hole of the water-cooled plate, so that the water-cooled plate is suspended on the mounting surface of the frame.

6. The heat dissipation assembly as described in claim 5, characterized in that: The diameter of the head of the floating fixing member is larger than the aperture of the opening, and the head is located above the limiting member and can abut against the upper surface of the limiting member. The rod of the floating fixing member passes through the opening and the mounting hole of the water-cooled plate and is combined with the water-cooled plate. A vertical gap is reserved between the head and the water-cooled plate so that the water-cooled plate can float vertically within the range of the vertical gap.

7. The heat dissipation assembly as described in claim 1, characterized in that: One end of the water-cooled plate has a bevel to guide the data transmission module into the accommodating space.

8. The heat dissipation assembly as described in claim 1, characterized in that: The side of the water-cooled plate is recessed with at least one clearance area to accommodate the at least one bow-shaped spring wire.

9. The heat dissipation assembly as described in claim 1, characterized in that: The water-cooled plate has at least one inlet pipe and one outlet pipe.

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