Heat dissipation assembly

Abstract

The utility model provides a kind of heat dissipation assembly, it is located in a data transmission equipment, it includes a frame, at least one water cooling plate and at least one elastic piece.The frame has a mechanism mounting surface;Water cooling plate is suspended in the mechanism mounting surface, has a heat dissipation surface with data transmission module contact to carry out heat dissipation;The water cooling plate and the chassis substrate in the data transmission equipment jointly define a containing space, to accommodate data transmission module;Elastic piece is arranged between mechanism mounting surface and water cooling plate, and its two ends are respectively abutted on mechanism mounting surface and water cooling plate, and at least one end is fixed.When data transmission module is inserted into containing space, it will push the water cooling plate and move along vertical, and compress the elastic piece, so that it generates restoring force and presses on the water cooling plate, so that water cooling plate and data transmission module can be closely attached, form stable heat dissipation contact interface, to improve heat conduction efficiency.

Description

Technical Field

[0001] This utility model relates to a heat dissipation component, and more particularly to a heat dissipation component for data transmission equipment, which can effectively manage the thermal performance of pluggable data transmission modules. Background Technology

[0002] With the rapid advancement of technology, high-speed data transmission modules (such as fiber optic transceiver modules) or optical communication devices integrated into switches adopt a pluggable design to facilitate rapid field replacement and upgrades. Fiber optic transceiver modules can be available in various package types, such as quad small form-factor pluggable (QSFP), octagonal small form-factor pluggable (OSFP), or multi-channel small form-factor pluggable modules, and support high-speed electrical or optical interface transmission. As computing efficiency increases, the heat generated by data transmission modules in data transmission equipment during operation also continues to grow. Therefore, to ensure the stable operation of data transmission equipment in the face of technological advancements, thermal management has become a crucial and indispensable issue in system design.

[0003] Traditional air cooling relies on airflow to remove heat. For high-power modules, this often requires increasing fan speed or airflow pressure, leading to increased system noise and energy consumption, as well as higher maintenance costs over long periods. More importantly, airflow cooling efficiency is limited by the specific heat and thermal conductivity of air. Even with optimized fin design or airflow paths, it is still difficult to meet the requirements of high-power optical modules for long-term operation at stable low temperatures.

[0004] Furthermore, in high-density layouts, the reduced spacing between modules makes airflow distribution susceptible to blockages and eddies, leading to a significant decrease in the heat dissipation performance of some modules. Uneven airflow distribution can cause some modules to remain at high temperatures for extended periods, accelerating component aging and potentially causing system instability or malfunctions.

[0005] Therefore, for the high-density and high-power applications of today's data centers, there is an urgent need to develop a heat dissipation component that can provide high thermal conductivity, stable contact pressure, and is suitable for pluggable high-speed data transmission modules, in order to replace the traditional air cooling method and ensure the temperature control stability and long-term reliability of the system under high load operation. Utility Model Content

[0006] The purpose of this invention is to provide a heat dissipation component to solve the problems of insufficient heat dissipation efficiency, poor temperature control stability and inconvenient maintenance of traditional air-cooled heat dissipation in high-power pluggable data transmission module applications.

[0007] This utility model provides a heat dissipation component for use inside a chassis with a base plate in a data transmission device, characterized in that the heat dissipation component comprises:

[0008] A frame with a mechanism mounting surface;

[0009] At least one water-cooled plate is suspended below the mounting surface of the mechanism and has a heat dissipation surface that can contact a data transmission module for heat dissipation. The water-cooled plate and the substrate together define an accommodating space for the data transmission module to be inserted.

[0010] At least one elastic member is disposed between the mounting surface of the mechanism and the water-cooled plate, and the two ends of the elastic member abut against the mounting surface of the mechanism and the water-cooled plate respectively;

[0011] When the data transmission module is inserted into the accommodating space, it can push the water-cooled plate vertically upward, causing the elastic element to be compressed and generate a restoring force, applying downward pressure to the water-cooled plate, so that the heat dissipation surface is in close contact with the data transmission module.

[0012] The heat dissipation assembly, wherein the elastic element is a spring.

[0013] The heat dissipation assembly, wherein the elastic element is a compression spring.

[0014] The heat dissipation assembly includes a frame comprising a body and two support portions extending downward from both sides of the body and fixed to the substrate, wherein the mounting surface of the mechanism is located on the side of the body facing the substrate.

[0015] The heat dissipation assembly further includes at least one limiting member disposed on the mechanism mounting surface of the frame and forming at least one limiting hole for at least one fixing member to pass through and engage.

[0016] The heat dissipation assembly includes a water-cooled plate with at least one mounting hole, and a fixing member with a rod and a head. The rod passes sequentially through the limiting hole of the limiting member and the mounting hole of the water-cooled plate, thereby suspending and positioning the water-cooled plate below the mechanism mounting surface of the frame.

[0017] In the heat dissipation assembly, the diameter of the head of the fixing member is larger than the inner diameter of the limiting hole, and the head is located above the limiting member and can abut against the upper surface of the limiting member. When the rod of the fixing member passes through the limiting hole and the mounting hole of the water-cooling plate and is combined with the water-cooling plate, a vertical gap is reserved between the head and the water-cooling plate to allow the water-cooling plate to float and move vertically.

[0018] The heat dissipation assembly, wherein one end of the water-cooled plate has a guide slope for guiding the data transmission module smoothly into the accommodating space.

[0019] When the data transmission module is inserted into the accommodating space, its upper surface pushes the water-cooled plate vertically upwards, compressing the elastic element located between the frame mounting surface and the water-cooled plate and generating a restoring force. This restoring force allows the water-cooled plate to apply stable downward pressure, ensuring a tight fit between its heat dissipation surface and the upper surface of the data transmission module. This forms a reliable thermal contact interface, ensuring that heat can be efficiently conducted to the water-cooled plate and quickly carried away by its internal cooling fluid, thereby improving overall heat dissipation performance.

[0020] Through the coordinated design of the frame, water-cooled plate, and elastic components, the water-cooled plate can be vertically floated relative to the frame and automatically corrected its position and maintained a stable fit during the insertion of the data transmission module. This structure not only ensures high-quality thermal contact and heat dissipation performance, but also simplifies the insertion and removal of the data transmission module and improves the convenience of system assembly and maintenance as well as space utilization efficiency. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the heat dissipation component of this utility model installed in a data transmission device;

[0022] Figure 2 This is an exploded view of the heat dissipation component of this utility model from below;

[0023] Figure 3 This is a cross-sectional schematic diagram of the heat dissipation component of this utility model;

[0024] Figure 4 This is a partial cross-sectional view of the heat dissipation component of this utility model before the data transmission module is inserted;

[0025] Figure 5 A partial cross-sectional view of the data transmission module inserted into the heat dissipation component of this utility model;

[0026] Figure 6 This is a three-dimensional schematic diagram of the heat dissipation component of this utility model used in a data transmission module.

[0027] Explanation of reference numerals in the attached drawings: Data transmission device M; base plate M1; chassis M2; heat dissipation assembly 1; data transmission module 10; accommodating space S; frame 11; opening 110h; limiting member 11A; mechanism mounting surface 11M; limiting hole 110; body 111; support part 112; reinforcing rib 113; water cooling plate 21; inflow pipe 213; outflow pipe 214; heat dissipation surface 21A; flow channel 21c; mounting hole 21h; guide slope 22; elastic element 31; fixing part 4; rod part 41; head 42; vertical clearance G; pressure F. Detailed Implementation

[0028] The structural and functional characteristics of the heat dissipation component proposed in this utility model will be described with reference to the preferred embodiment shown in the accompanying drawings.

[0029] Please see Figures 1 to 6 As shown. Figure 1 This is a schematic diagram of the heat dissipation component of this utility model installed in a data transmission device; Figure 2 This is an exploded view of the heat dissipation component of this utility model from below; Figure 3 This is a cross-sectional schematic diagram of the heat dissipation component of this utility model; Figure 4 This is a partial cross-sectional view of the heat dissipation component of this utility model before the data transmission module is inserted; Figure 5 This is a partial cross-sectional schematic diagram of the heat dissipation component and data transmission module of this utility model; Figure 6 This is a three-dimensional schematic diagram of the heat dissipation component of this utility model used in a data transmission module.

[0030] like Figure 1 As shown, the present invention provides a heat dissipation component 1, which is disposed in a data transmission device M, such as a switch (not fully shown in the figure), which includes a chassis M2 and a base plate M1 disposed in the chassis M2.

[0031] like Figure 2 As shown, the heat dissipation assembly 1 includes a frame 11, at least one water-cooling plate 21, and at least one elastic member 31. Figure 2 , Figure 6 As shown, in a preferred embodiment of the present invention, the heat dissipation assembly 1 includes a plurality of water-cooled plates 21 and a plurality of elastic members 31 corresponding to each water-cooled plate 21. The frame 11 has a mechanism mounting surface 11M.

[0032] In this embodiment of the invention, the frame 11 is disposed on the base plate M1 within the chassis M2 of the data transmission device M. However, the invention is not limited thereto; the frame 11 may also be disposed at any load-bearing position, support platform, or other structural part of the chassis M2 of the data transmission device M, and is not limited to a specific installation position.

[0033] In this embodiment of the utility model, the substrate M1 is, for example, the main board of the data transmission device M. In addition to supporting the frame 11, the substrate M1 can also support other electronic components or circuit modules, such as processors, power modules, etc. (not shown), to realize data transmission and system control functions.

[0034] Please see Figures 1 to 3 As shown, in this embodiment of the present invention, the frame 11 may include a body 111 and at least two support portions 112 extending downward from both sides of the body 111. The mounting surface 11M of the mechanism is formed on the lower side of the body 111 for the water-cooled plate 21 to be suspended or floated.

[0035] Furthermore, to enhance the overall structural rigidity and installation stability of the frame 11, at least one reinforcing rib 113 may be provided on the body 111 of the frame 11. The reinforcing rib 113 may be embedded in the groove formed by the body 111, thereby providing additional support and positioning. Through the configuration of the reinforcing rib 113, the frame 11 can be effectively prevented from deforming or bending under long-term operation or external force.

[0036] In this embodiment of the invention, the frame 11 can be fixed to the base plate M1 of the data transmission device M by screwing, snapping, welding or other suitable means to provide a stable support foundation for the water-cooled plate 21. Its material can be selected from metals (aluminum alloys, stainless steel, etc.) or high-strength plastics, depending on actual heat transfer requirements, structural strength, and weight limitations.

[0037] The water-cooled plate 21 is suspended below the mounting surface 11M of the mechanism and together with the substrate M1, defines an accommodating space S for the data transmission module 10 to be inserted.

[0038] Please see Figure 4 and Figure 5 As shown, the water-cooled plate 21 is suspended below the mechanism mounting surface 11M of the frame 11 and has a heat dissipation surface 21A facing the accommodating space S. The heat dissipation surface 21A can be in close contact with the upper surface of the data transmission module 10, which can effectively introduce the heat generated by the data transmission module 10 during operation into the interior of the water-cooled plate 21, and quickly remove the heat through the circulating cooling fluid in its flow channel to achieve a high-efficiency heat dissipation effect.

[0039] Please see Figures 3 to 5 As shown. Figure 3 As shown in the embodiment of this utility model, the water-cooled plate 21 is composed of an upper plate and a lower plate (not shown in the figure), and at least one flow channel 21c is formed inside it. The flow channel 21c is connected to the water inlet and the water outlet (not shown in the figure) of the water-cooled plate 21, respectively, so that the cooling fluid can be introduced from the water inlet, circulates inside the water-cooled plate 21 along the flow channel 21c, and then discharged through the water outlet to complete the heat exchange cycle. The upper plate and the lower plate can be sealed together by welding, bonding or other fixing methods to prevent the cooling fluid from leaking and maintain a stable heat transfer efficiency; in other embodiments, the water-cooled plate 21 can also adopt an integral molding structure to further reduce the risk of leakage, and this utility model is not limited thereto.

[0040] In some embodiments, the water-cooled plate 21 may optionally be provided with at least one inlet pipe 213 and one outlet pipe 214. The inlet pipe 213 and outlet pipe 214 can be further connected to a downstream coolant circulation system (not shown) to introduce cooling fluid, thereby quickly removing the heat generated by the data transmission module 10 during high-power operation. In this way, the heat generated by the data transmission module 10 during operation can be conducted through its upper surface to the heat dissipation surface 21A of the water-cooled plate 21, which is in close contact with it, and further introduced into the flow channel 21c inside the water-cooled plate 21, where it is quickly removed by the flowing cooling fluid, achieving a highly efficient and stable heat dissipation effect.

[0041] The elastic element 31 is disposed between the mechanism mounting surface 11M of the frame 11 and the corresponding water-cooled plate 21, with each end abutting against the mechanism mounting surface 11M and the water-cooled plate 21 respectively to provide downward elastic pressure. The elastic element 31 can be fixed to at least one side of the frame 11 or the water-cooled plate 21 by welding, gluing, snap-fitting, or screwing to ensure assembly stability and positioning accuracy. In one embodiment, the elastic element 31 is a spring (or compression spring), one end of which is welded to the mechanism mounting surface 11M and corresponds to the placement position of the water-cooled plate 21. The geometric parameters of the spring (such as wire diameter, number of turns, or pitch) can be designed according to actual needs to adjust its elastic coefficient and preload magnitude, ensuring that the water-cooled plate 21 maintains a stable floating and fitting effect during operation.

[0042] like Figure 5 As shown, when the data transmission module 10 is inserted into the accommodating space S, its upper surface pushes the water-cooled plate 21 vertically upward, compressing the elastic member 31 located between the water-cooled plate 21 and the mounting surface 11M, and generating a restoring force. Through this restoring force, the heat dissipation surface 21A of the water-cooled plate 21 continuously applies downward pressure to the data transmission module 10, forming a tight and stable thermal contact. This ensures that heat can be efficiently conducted to the water-cooled plate 21 and carried away by its internal fluid, improving overall heat dissipation performance and contact stability.

[0043] In a preferred embodiment of this utility model, the heat dissipation assembly 1 further includes at least one fixing member 4, and at least one limiting member 11A is provided on the side of the body 111 of the frame 11 facing the substrate M1, i.e., on the mechanism mounting surface 11M. The limiting member 11A is an elongated member, and its shape can be a continuous structure with multiple undulating segments, forming recesses between each undulating segment to accommodate the corresponding fixing member 4, and forming at least one limiting hole 110 at each corresponding position. The limiting member 11A can be formed on the mechanism mounting surface 11M of the frame 11 by means of welding, overlapping, or stamping, for example.

[0044] The water-cooled plate 21 has corresponding mounting holes 21h, and the fixing member 4 has a rod portion 41 and a head portion 42. The rod portion 41 is sequentially inserted into the limiting hole 110 of the limiting member 11A and the mounting hole 21h of the water-cooled plate 21, thereby suspending and positioning the water-cooled plate 21 below the mechanism mounting surface 11M. The diameter of the head portion 42 of the fixing member 4 is larger than the inner diameter of the limiting hole 110, and it is located above the limiting member 11A, abutting against its upper surface. After the fixing member 4 is inserted and combined with the water-cooled plate 21, a vertical gap G is reserved between the head portion 42 of the fixing member 4 and the water-cooled plate 21, so that the water-cooled plate 21 can be adjusted vertically within the range of the vertical gap G, ensuring stable contact and good thermal contact with the data transmission module 10.

[0045] In this embodiment of the present invention, in order to facilitate the installation of the fastener 4, the body 111 of the frame 11 can form at least one opening 110h at the position of the limiting hole 110 of the corresponding limiting member 11A. Through this opening 110h, the fastener 4 can be sequentially inserted into the limiting hole 110 of the limiting member 11A from above the body 111, and further inserted into the mounting hole 21h at the corresponding position of the water-cooled plate 21, thereby completing the assembly of the fastener 4 and the suspension and positioning of the water-cooled plate 21.

[0046] Furthermore, in order to keep the water-cooled plate 21 in balance when subjected to force, multiple fasteners 4 and elastic elements 31 can be configured on a single water-cooled plate 21 according to actual needs, and distributed at appropriate positions in an intermittent manner to form a uniform and stable support structure.

[0047] With the combined action of the fixing member 4 and the limiting member 11A, the movement of the water-cooled plate 21 is restricted to the vertical direction and can only float and adjust within a preset range, thereby effectively avoiding horizontal displacement and ensuring the structural stability and fitting accuracy of the heat dissipation component 1 during operation.

[0048] Please refer to Figure 3 and Figure 4 As shown, the floating range of the water-cooled plate 21 is mainly defined by the vertical gap G reserved between the head 42 of the fixing member 4 and the water-cooled plate 21, and is further limited by the structural cooperation of the limiting member 11A and the elastic member 31. The vertical gap G can be designed to be between approximately 0.5 and 3 millimeters (mm). With this gap design, when the data transmission module 10 is inserted into the accommodating space S, it can push the water-cooled plate 21 slightly upward in the vertical direction, so that the water-cooled plate 21 can automatically adjust to the appropriate position, and under the restoring force of the elastic member 31, it will generate downward pressure, thereby keeping the heat dissipation surface 21A and the upper surface of the data transmission module 10 stable and tightly attached, so as to improve the heat conduction efficiency and stability.

[0049] In a preferred embodiment of this utility model, the natural length of the elastic member 31 under no external force is greater than the distance between the water-cooled plate 21 and the frame 11 body 111. Therefore, it can continuously apply downward pressure F in the initial state to form pre-pressure, thereby ensuring the bonding stability between the water-cooled plate 21 and the data transmission module. In another embodiment, the natural length of the elastic member 31 can be designed to be slightly shorter than the distance between the water-cooled plate 21 and the frame 11 body 111, so that it is not compressed in the initial state, and only begins to compress and generate restoring force when the water-cooled plate 21 is pushed up. This provides downward pressure after the data transmission module 10 is inserted, achieving a stable and tight bonding effect.

[0050] With the above structural configuration, the water-cooled plate 21, suspended and supported by the fixing member 4, has the ability to float and adjust vertically. When the data transmission module 10 is inserted into the accommodating space S and pushes the water-cooled plate 21 upward, the elastic member 31 will be compressed and generate a restoring force. Finally, under the combined action of the pushing force of the data transmission module 10 and the restoring pressure of the elastic member 31, the water-cooled plate 21 achieves automatic height adjustment and stable holding, so that the heat dissipation surface 21A and the upper surface of the data transmission module 10 form a tight and uniform thermal contact interface, ensuring good heat conduction efficiency and bonding stability.

[0051] Please refer to the following: Figure 3 and Figure 4 As shown in this embodiment of the invention, a guide slope 22 is formed on the lower front side of the water-cooling plate 21. When the data transmission module 10 is inserted into the accommodating space S, the guide slope 22 can guide part of the module's pushing force upward, assisting the water-cooling plate 21 to rise smoothly and adjust to the appropriate position, while guiding the data transmission module 10 to smoothly enter the accommodating space S. Correspondingly, the upper front surface of the data transmission module 10 can also be provided with a matching guide slope structure. During the contact process, the two can automatically correct the insertion posture of the module, avoid deviation and jamming, and improve the smoothness of insertion and alignment accuracy. This invention is not limited to the data transmission module 10 having a guide slope 22; as long as the guiding effect can be achieved, it is within the scope of this invention.

[0052] like Figure 3 As shown, when no external force is applied, the water-cooled plate 21 can maintain its natural downward state under the restoring force of the elastic member 31 or natural gravity. At this time, the head 42 of the fixing member 4 abuts against the upper side of the limiting member 11A, restricting the water-cooled plate 21 from continuing to move downward and keeping it at the preset lowest position. In this embodiment of the present invention, the elastic member 31 can continuously apply downward pre-pressure to ensure that the water-cooled plate 21 is stably positioned at the lowest position, providing a ready state for subsequent insertion operations.

[0053] like Figure 5As shown, when the data transmission module 10 is inserted into the accommodating space S, its upper surface pushes the water-cooled plate 21 vertically upward and compresses the elastic member 31 disposed between the water-cooled plate 21 and the mechanism mounting surface 11M. As the elastic member 31 is compressed and generates a restoring force, this restoring force is applied downward to the water-cooled plate 21, so that its heat dissipation surface 21A remains in close contact with the upper surface of the data transmission module 10, ensuring stable contact pressure F and good heat conduction effect.

[0054] Please refer to the following: Figure 3 As shown, when the data transmission module 10 is removed from the self-accommodating space S, its upward pushing force on the water-cooled plate 21 is immediately released. At this time, under the action of the restoring force, or in conjunction with the gravity of the water-cooled plate 21 itself, the elastic element 31 pushes the water-cooled plate 21 back to its original position vertically, restoring it to its initial natural falling state, thus preparing for the next insertion operation.

[0055] Please cooperate. Figure 4 and Figure 5 As shown, in order to clearly present the operation process and effect of the heat dissipation component 1 of this utility model, the operation process is divided into three stages, which correspond to the structural changes and functional reactions of the water cooling plate 21 and the elastic member 31 when the data transmission module 10 is not inserted, inserted, and pulled out, respectively.

[0056] like Figure 4 As shown, in the initial stage: when the data transmission module 10 has not yet been inserted into the accommodating space S, the water-cooled plate 21 is not pushed by external force and is in a natural falling state. At this time, under the action of gravity or the downward pressure provided by the elastic member 31, the water-cooled plate 21 is located at the preset lowest position and is suspended below the mechanism mounting surface 11M of the frame 11 by the fixing member 4. In this state, an accommodating space S is formed between the water-cooled plate 21 and the substrate M1, providing sufficient height for the data transmission module 10 to be inserted. When the data transmission module 10 is inserted, its upper surface will push the water-cooled plate 21 to move vertically upward, causing the elastic member 31 to be compressed and generate a downward restoring force, thereby causing the heat dissipation surface 21A of the water-cooled plate 21 to form a stable and tight fit with the upper surface of the data transmission module 10 to ensure good heat conduction.

[0057] like Figure 5 As shown, during the insertion stage: when the data transmission module 10 is inserted into the accommodating space S, its front end will first contact and push the water-cooling plate 21, causing the water-cooling plate 21 to move vertically upward (lift), reserving the necessary space for the insertion of the data transmission module 10. As the insertion force continues to act, the elastic element 31 is gradually compressed and generates a restoring force. This restoring force continues to exert downward force on the water-cooling plate 21 and is transmitted through the water-cooling plate 21 to the upper surface of the data transmission module 10, causing the heat dissipation surface 21A to maintain a stable and uniform fit with the upper surface of the data transmission module 10, forming a reliable and stable thermal contact state, thereby greatly improving the heat dissipation efficiency.

[0058] like Figure 4 As shown, during the reset phase: after the data transmission module 10 is pulled out of the accommodating space S, its pushing force on the water-cooled plate 21 is immediately released. At this time, under the restoring force of the elastic member 31 or its own gravity, the water-cooled plate 21 returns to the preset position vertically, restoring its initial falling state, ready for the next insertion operation.

[0059] With the above structural design, the water-cooled plate 21 can automatically adjust its position and generate stable pressure during the insertion of the data transmission module 10 under the action of the elastic member 31, so that its heat dissipation surface 21A is in close contact with the upper surface of the data transmission module 10, ensuring good thermal contact quality, thereby improving heat dissipation efficiency and system operation reliability.

[0060] In summary, this invention, through the use of an elastic element positioned between the mounting surface of the frame mechanism and the water-cooled plate, combined with the suspension and limiting configuration of the fixing and limiting components, enables the water-cooled plate to have vertical floating adjustment capability. When the data transmission module is inserted into the receiving space, the water-cooled plate can move vertically upward under the suspension limitation of the fixing element, and the elastic element generates a stable downward restoring pressure, ensuring that its heat dissipation surface and the upper surface of the data transmission module remain uniform and tightly fitted, forming a stable thermal contact interface. This ensures that heat is effectively conducted to the water-cooled plate and quickly dissipated, thereby improving the overall heat dissipation efficiency and system operational reliability.

[0061] The present invention has been described in detail above. However, the above description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of implementation of the present invention. That is, all equivalent changes and modifications made based on the present invention should still fall within the patent coverage of the present invention.

Claims

1. A heat dissipation assembly for use within a chassis having a substrate in a data transmission device, characterized in that, The heat dissipation component includes: A frame with a mechanism mounting surface; At least one water-cooled plate is suspended below the mounting surface of the mechanism and has a heat dissipation surface that can contact a data transmission module for heat dissipation. The water-cooled plate and the substrate together define an accommodating space for the data transmission module to be inserted. At least one elastic member is disposed between the mounting surface of the mechanism and the water-cooled plate, and the two ends of the elastic member abut against the mounting surface of the mechanism and the water-cooled plate respectively; When the data transmission module is inserted into the accommodating space, it can push the water-cooled plate vertically upward, causing the elastic element to be compressed and generate a restoring force, applying downward pressure to the water-cooled plate, so that the heat dissipation surface is in close contact with the data transmission module.

2. The heat dissipation assembly as described in claim 1, characterized in that, The elastic element is a spring.

3. The heat dissipation assembly as described in claim 1, characterized in that, The elastic element is a compression spring.

4. The heat dissipation assembly as described in claim 1, characterized in that, The frame includes a main body and two support portions extending downward from both sides of the main body and fixed to the substrate. The mounting surface of the mechanism is located on the side of the main body facing the substrate.

5. The heat dissipation assembly as described in claim 1, characterized in that: It also includes at least one limiting member disposed on the mechanism mounting surface of the frame and forming at least one limiting hole for at least one fastener to pass through and engage.

6. The heat dissipation assembly as described in claim 5, characterized in that, The water-cooled plate is provided with at least one mounting hole. The fixing member has a rod and a head. The rod passes through the limiting hole of the limiting member and the mounting hole of the water-cooled plate in sequence, thereby suspending and positioning the water-cooled plate below the mechanism mounting surface of the frame.

7. The heat dissipation assembly as described in claim 6, characterized in that, The diameter of the head of the fastener is larger than the inner diameter of the limiting hole, and the head is located above the limiting member and can abut against the upper surface of the limiting member. When the rod of the fastener passes through the limiting hole and the mounting hole of the water-cooled plate and is combined with the water-cooled plate, a vertical gap is reserved between the head and the water-cooled plate to allow the water-cooled plate to float and move vertically.

8. The heat dissipation assembly as described in claim 1, characterized in that, One end of the water-cooled plate has a guide ramp to guide the data transmission module smoothly into the accommodating space.

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