Vehicle-mounted power amplifier with heat dissipation structure

Abstract

The utility model discloses a vehicle-mounted power amplifier with heat dissipation structure, including the front of heat dissipation casing is equipped with a plurality of heat dissipation fins, and the bottom of heat dissipation casing is equipped with an opening, and the side of heat dissipation casing is equipped with a plurality of fixed legs, and the fixed leg extends to the bottom of heat dissipation casing and makes the bottom of heat dissipation casing form heat dissipation gap by lifting, the metal bottom plate can be detachably connected at the opening, and the accommodation cavity is formed between the metal bottom plate and heat dissipation casing, the power amplifier mainboard is fixedly installed on the metal bottom plate, and the power amplifier mainboard is located in the accommodation cavity, the utility model discloses a vehicle-mounted power amplifier with heat dissipation structure, and the heat dissipation is carried out through heat dissipation fin and heat dissipation gap, and the contact area with air is further increased, the heat dissipation efficiency is improved, and the heat accumulation in the heat dissipation casing can be dissipated.

Description

Technical Field

[0001] This utility model relates to a vehicle power amplifier with a heat dissipation structure. Background Technology

[0002] The main function of a car amplifier is to amplify the audio signals of the car entertainment system to meet the entertainment and audio-visual needs of passengers.

[0003] Car amplifiers typically generate a lot of heat, making heat dissipation a crucial issue. Most existing heat dissipation methods involve direct contact between the radiator and the amplifier components. However, this type of radiator has low heat dissipation efficiency, and the car amplifier has to withstand high temperatures for extended periods. Summary of the Invention

[0004] The purpose of this utility model is to provide a vehicle-mounted power amplifier with a heat dissipation structure, comprising: a heat dissipation housing, wherein the front of the heat dissipation housing is provided with a plurality of heat dissipation fins, the bottom surface of the heat dissipation housing is provided with an opening, and the side of the heat dissipation housing is provided with a plurality of fixed feet, the fixed feet extending downward beyond the bottom surface of the heat dissipation housing, thereby raising the bottom surface of the heat dissipation housing to form a heat dissipation gap; a metal base plate, wherein the metal base plate is detachably connected to the opening, and a receiving cavity is formed between the metal base plate and the heat dissipation housing; and a power amplifier main board, wherein the power amplifier main board is fixedly mounted on the metal base plate, and the power amplifier main board is located within the receiving cavity.

[0005] Preferably, the fixed support leg is L-shaped and includes a vertical support plate, a horizontal mounting plate, and a triangular reinforcing plate. The upper end of the vertical support plate is fixedly connected to the heat dissipation shell, and the lower end of the vertical support plate is provided with the horizontal mounting plate. The horizontal mounting plate has a fixing hole, and the triangular reinforcing plate connects the vertical support plate and the horizontal mounting plate.

[0006] Preferably, the number of fixed feet is four, and the four fixed feet are arranged in pairs on both sides of the heat dissipation housing.

[0007] Preferably, the heat dissipation housing and the four fixed feet are integrally cast from metal.

[0008] Preferably, the heat sink housing has several interfaces on its side, and the interfaces correspond to the circuit connectors of the power amplifier motherboard.

[0009] Preferably, the heat dissipation housing is fixed to the metal base plate by screws.

[0010] The advantages and beneficial effects of this utility model are as follows: It provides a vehicle power amplifier with a heat dissipation structure, which dissipates heat by utilizing the heat dissipation fins on the heat dissipation housing and the heat dissipation gaps under the heat dissipation housing, further increasing its contact area with the air, improving heat dissipation efficiency, and helping the heat accumulated inside the heat dissipation housing to dissipate. Attached Figure Description

[0011] Figure 1 This is a front view of the present invention.

[0012] Figure 2 This is a side view of the present invention.

[0013] Figure 3 This is a schematic diagram of the heat dissipation shell in this utility model.

[0014] Figure 4 This is a schematic diagram of the metal base plate in this utility model.

[0015] Figure 5 This is a schematic diagram of the power amplifier motherboard in this utility model. Detailed Implementation

[0016] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings and examples. The following examples are only used to more clearly illustrate the technical solution of this utility model and should not be construed as limiting the scope of protection of this utility model.

[0017] The specific technical solution of this utility model is as follows: like Figures 1 to 5 As shown, a vehicle-mounted power amplifier with a heat dissipation structure includes: a heat dissipation housing 1, the front of which is provided with a plurality of heat dissipation fins 2, the bottom surface of which is provided with an opening 3, and the side of which is provided with a plurality of fixed legs 4, the fixed legs 4 extending downward beyond the bottom surface of the heat dissipation housing 1, thereby raising the bottom surface of the heat dissipation housing 1 to form a heat dissipation gap 5; a metal base plate 6, which is detachably connected to the opening 3, and a cavity is formed between the metal base plate 6 and the heat dissipation housing 1; and a power amplifier main board 7, which is fixedly mounted on the metal base plate 6 and located within the cavity.

[0018] The aforementioned fixed support 4 is L-shaped in overall shape. The fixed support 4 includes a vertical support plate 41, a horizontal mounting plate 42, and a triangular reinforcing plate 43. The upper end of the vertical support plate 41 is fixedly connected to the heat dissipation housing 1, and the lower end of the vertical support plate 41 is provided with the horizontal mounting plate 42. The horizontal mounting plate 42 has a fixing hole 44. The triangular reinforcing plate 43 connects the vertical support plate 41 and the horizontal mounting plate 42. Specifically, the vehicle amplifier is installed in the vehicle through the fixed support 4, so that there is a heat dissipation gap 5 between the bottom of the vehicle amplifier and the vehicle body, which is conducive to heat dissipation.

[0019] The number of the aforementioned fixed support legs 4 is four, and the four fixed support legs 4 are arranged in pairs on both sides of the heat dissipation housing 1.

[0020] The aforementioned heat dissipation housing 1 and the four fixed support legs 4 are integrally cast from metal.

[0021] The heat sink 1 has several interfaces 11 on its side, and the interfaces 11 correspond to the circuit connectors 71 of the power amplifier motherboard 7.

[0022] The aforementioned heat sink 1 is fixed to the metal base plate 6 by screws 61; specifically, this facilitates disassembly and allows for easy repair by personnel should an internal fault occur. During use, the heat generated in the power amplifier motherboard 7 is dissipated outward through the heat sink fins 2 and the metal base plate 6, thereby achieving the technical effect of heat dissipation. The fixed support 4 raises the bottom surface of the heat sink housing 1 to form a heat dissipation gap 5, which further increases the contact area with the air and improves the heat dissipation efficiency, thereby better reducing the heat accumulation inside the heat sink housing 1.

[0023] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A vehicle-mounted power amplifier with a heat dissipation structure, characterized in that, include: The heat dissipation housing has several heat dissipation fins on its front side, an opening on its bottom surface, and multiple fixed feet on its side. The fixed feet extend downward beyond the bottom surface of the heat dissipation housing, raising the bottom surface of the heat dissipation housing to form a heat dissipation gap. A metal base plate, which is detachably connected to the opening, and an accommodating cavity is formed between the metal base plate and the heat dissipation housing; A power amplifier motherboard is fixedly mounted on a metal base plate and is located within the accommodating cavity.

2. The vehicle-mounted power amplifier with a heat dissipation structure according to claim 1, characterized in that, The fixed support leg is L-shaped in general. The fixed support leg includes a vertical support plate, a horizontal mounting plate and a triangular reinforcing plate. The upper end of the vertical support plate is fixedly connected to the heat dissipation shell. The lower end of the vertical support plate is provided with the horizontal mounting plate. The horizontal mounting plate has a fixing hole. The triangular reinforcing plate connects the vertical support plate and the horizontal mounting plate.

3. The vehicle-mounted power amplifier with a heat dissipation structure according to claim 2, characterized in that, The number of fixed feet is four, and the four fixed feet are arranged in pairs on both sides of the heat dissipation housing.

4. The vehicle-mounted power amplifier with a heat dissipation structure according to claim 3, characterized in that, The heat dissipation housing and the four fixed legs are integrally cast from metal.

5. A vehicle-mounted power amplifier with a heat dissipation structure according to claim 4, characterized in that, The heat sink housing has several interfaces on its side, which correspond to the circuit connectors of the power amplifier motherboard.

6. The vehicle-mounted power amplifier with a heat dissipation structure according to claim 5, characterized in that, The heat dissipation housing is fixed to the metal base plate by screws.

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