Liquid cooling heat dissipation device

Abstract

The utility model provides a kind of liquid cooling heat sink, including shell assembly, liquid cooling plate and heat conduction component;Water inlet and water outlet are arranged on liquid cooling plate, shell assembly includes side plate, panel assembly and cover plate, side plate has fixed structure, heat conduction component includes insulating component and heat conduction component, liquid cooling plate also has support structure.The utility model provides liquid cooling heat sink due to the section of side plate keeps consistent in length direction, can be truncated side plate, and the length of cover plate two sides bending edge is changed, satisfy the product processing demand of different depth size, improve production efficiency, save production, manufacturing cost;At the same time, by using heat conduction component can effectively improve the heat dissipation efficiency of first heating element with higher heat dissipation through liquid cooling plate;In addition, it can meet the heat dissipation requirement of different heating devices, improve the heat dissipation effect and applicability of the liquid cooling heat sink.

Description

Technical Field

[0001] This utility model relates to the field of power supply heat dissipation technology, and in particular to a liquid cooling heat dissipation device. Background Technology

[0002] With increasingly higher power density requirements for UPS products, liquid cooling has become the preferred alternative to traditional air cooling. However, the heat loss and dimensions of various components on the circuit board differ, making it difficult to meet the heat dissipation needs of different components. At the same time, the components of liquid cooling devices have low versatility for products with different power ranges, resulting in higher production costs and lower production efficiency. Utility Model Content

[0003] The purpose of this utility model is to solve the problems of existing liquid cooling heat dissipation devices, which have different heat loss and external dimensions of various components on the circuit board, making it difficult to meet the heat dissipation requirements of different components. At the same time, the components of liquid cooling heat dissipation devices have low versatility for products of different power ranges, resulting in high production costs and low production efficiency. This utility model provides a liquid cooling heat dissipation device.

[0004] The technical solution adopted by this utility model to solve its technical problem is: a liquid cooling heat dissipation device, characterized in that it includes a housing assembly, a liquid cooling plate disposed in the housing assembly, and a heat-conducting component disposed on the liquid cooling plate; the liquid cooling plate is provided with an inlet and an outlet; the housing assembly includes a side plate, a panel assembly, and a cover plate; the side plate has a fixing structure for fixedly connecting with the panel assembly and the cover plate; the heat-conducting component includes an insulating component disposed on the liquid cooling plate and a heat-conducting component abutting against a first heating element; the liquid cooling plate also has a support structure for supporting a second heating element.

[0005] Furthermore, the panel assembly includes a front panel and a rear panel, and the fixing structure includes a plurality of liquid cooling holes disposed in the middle of the side panel for fixed connection with the liquid cooling plate, first panel holes disposed at both ends of the side panel for fixed connection with the front panel and the rear panel, and a plurality of first cover plate holes disposed at the top and bottom of the side panel for fixed connection with the cover plate.

[0006] Furthermore, a plurality of liquid cooling holes are evenly distributed on the side plate, the first panel holes are symmetrically distributed at both ends of the side plate, and a plurality of first cover plate holes are symmetrically distributed at the top and bottom of the side plate relative to the liquid cooling holes.

[0007] Furthermore, the front panel has a first side plate hole for fixed connection with the first panel hole, a frame hole for fixing the housing assembly in the frame, a light guide hole for installing a light guide element, and a handle.

[0008] Furthermore, the rear panel has a second side plate hole for fixed connection with the first panel hole, a second cover plate hole for fixed connection with the cover plate, and a clearance hole for avoiding the inlet and outlet.

[0009] Furthermore, the cover plate has a first bent edge and a second bent edge, the first bent edge has a third side plate hole for fixed connection with the cover plate hole, and the second bent edge has a second panel hole for fixed connection with the rear panel.

[0010] Furthermore, the first heating element is a power tube with a copper sheet on it, and the heat-conducting component is a ceramic substrate that is bonded to the copper sheet of the power tube.

[0011] Furthermore, the insulating component includes a first insulating element and a second insulating element that are bonded to the liquid cooling plate, and the ceramic substrate is disposed between the first insulating element and the second insulating element.

[0012] Furthermore, the second heating element is a plurality of circuit boards, and the support structure is a plurality of support columns for supporting the circuit boards.

[0013] Furthermore, a thermally conductive pad is provided between the circuit board and the support column.

[0014] The beneficial effects of the liquid cooling heat dissipation device provided by this utility model are as follows: By using a fixed structure to install the liquid cooling plate on the side plate and fixing the side plate to the panel assembly and the cover plate, the overall stability of the housing assembly can be effectively guaranteed; furthermore, since the cross-section of the side plate is consistent in the length direction, the processing requirements of products with different depth dimensions can be met by cutting the side plate and changing the length of the bent edges on both sides of the cover plate, thereby meeting the part dimensions required for products with different power ranges, improving the versatility of various parts in the housing assembly, increasing production efficiency, and saving production and manufacturing costs; at the same time, by using heat-conducting components, the heat dissipation efficiency of the first heating element with higher heat generation through the liquid cooling plate can be effectively improved, and the safety of the first heating element installed on the liquid cooling plate is ensured by insulating components; in addition, by using a support structure to install the second heating element with lower heat generation on the liquid cooling plate, the heat dissipation requirements of different heat-generating devices can be met, improving the heat dissipation effect and applicability of the liquid cooling heat dissipation device. Attached Figure Description

[0015] Figure 1 This is an assembly diagram of the liquid cooling heat dissipation device provided by this utility model. Figure 2 This is a schematic diagram of the internal structure of the liquid cooling heat dissipation device provided by this utility model. Figure 1 ; Figure 3This is a schematic diagram of the internal structure of the liquid cooling heat dissipation device provided by this utility model. Figure 2 ; Figure 4 Schematic diagram of the heat conduction component in the liquid cooling heat dissipation device provided by this utility model Figure 1 ; Figure 5 Schematic diagram of the heat conduction component in the liquid cooling heat dissipation device provided by this utility model Figure 2 ; Figure 6 This is a schematic diagram of the first heating element and the second heating element in the liquid cooling heat dissipation device provided by this utility model. In the picture: 100-Liquid cooling heat dissipation device 10-Side panel, 101-Liquid cooling hole, 102-First panel hole, 103-First cover plate hole, 11-Front panel 111-First side panel hole, 112-Rack hole, 113-Light guide hole, 114-Handle, 12-Rear panel 121-Second side plate hole, 122-Second cover plate hole, 123-Allowing hole, 13-Cover plate, 131-First bend edge, 1311-Third side panel hole, 132-Second bend edge, 1321-Second panel hole 20-Liquid cooling plate, 21-Water inlet, 22-Water outlet, 30-First heating element, 31-Second heating element 41-First insulating component, 42-Ceramic substrate, 43-Second insulating component, 50-Support column. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0017] See Figure 1-5The present invention provides a liquid cooling heat dissipation device 100, which includes a housing assembly, a liquid cooling plate 20 disposed within the housing assembly, and a heat-conducting component disposed on the liquid cooling plate 20. The liquid cooling plate 20 is provided with an inlet 21 and an outlet 22. The housing assembly includes a side plate 10, a panel assembly, and a cover plate 13. The side plate 10 has a fixing structure for fixedly connecting with the panel assembly and the cover plate 13. The heat-conducting component includes an insulating component disposed on the liquid cooling plate 20 and a heat-conducting component that abuts against a first heating element 30. The liquid cooling plate 20 also has a support structure for supporting a second heating element 31. By using a fixed structure to install the liquid cooling plate 20 onto the side plate 10 and fixing the side plate 10 to the panel assembly and the cover plate 13, the overall stability of the housing assembly can be effectively ensured. Furthermore, since the cross-section of the side plate 10 remains consistent along its length, the processing requirements of products with different depths can be met by cutting the side plate 10 and changing the length of the bent edges on both sides of the cover plate 13. This allows for the sizing of parts required for products with different power ratings, improving the versatility of parts within the housing assembly, increasing production efficiency, and saving production and manufacturing costs. Simultaneously, the use of heat-conducting components effectively improves the heat dissipation efficiency of the first heating element 30, which generates higher heat, through the liquid cooling plate 20, and insulating components ensure the safety of the first heating element 30 mounted on the liquid cooling plate 20. In addition, by using a support structure to mount the second heating element 31, which generates lower heat, onto the liquid cooling plate 20, the heat dissipation requirements of different heat-generating devices can be met, improving the heat dissipation effect and applicability of the liquid cooling device 100.

[0018] like Figure 2 As shown, the panel assembly includes a front panel 11 and a rear panel 12. The fixing structure includes several liquid cooling holes 101 located in the middle of the side panel 10 for fixed connection with the liquid cooling plate 20, first panel holes 102 located at both ends of the side panel 10 for fixed connection with the front panel 11 and the rear panel 12, and several first cover plate holes 103 located at the top and bottom of the side panel 10 for fixed connection with the cover plate 13. The liquid cooling plate 20 is fixedly connected to the side panel 10 by using bolts, studs and pins and other locking elements passing through the liquid cooling holes 101 on the side panel 10 and locking them in the liquid cooling plate 20. Furthermore, since the liquid cooling hole 101, the first panel hole 102, and the first cover plate hole 103 are all processed in subsequent processes, for UPS (uninterruptible power supply) products of different depths and sizes, the side plate 10 can be generated first using a mold, then the side plate 10 can be cut according to different product requirements, and finally the hole positions of the liquid cooling hole 101, the first panel hole 102, and the first cover plate hole 103 can be processed, thereby greatly improving production efficiency and saving production and manufacturing costs.

[0019] like Figure 2As shown, a plurality of liquid cooling holes 101 are evenly distributed on the side plate 10, first panel holes 102 are symmetrically distributed at both ends of the side plate 10, and a plurality of first cover plate holes 103 are symmetrically distributed at the top and bottom of the side plate 10 relative to the liquid cooling holes 101. By evenly distributing the plurality of liquid cooling holes 101 on the side plate 10, symmetrically distributing the first panel holes 102 at both ends of the side plate 10, and symmetrically distributing the plurality of first cover plate holes 103 at the top and bottom of the side plate 10 relative to the liquid cooling holes 101, the positioning accuracy and uniformity of the liquid cooling holes 101, the first panel holes 102 and the first cover plate holes 103 on the side plate 10 can be effectively improved, thereby ensuring the stability of the fixed connection between the side plate 10 and the front and rear panels 12, the cover plate 13 and the liquid cooling plate 20 through the liquid cooling holes 101, the first panel holes 102 and the first cover plate holes 103.

[0020] like Figure 2 As shown, the front panel 11 has a first side plate hole 111 for fixed connection with the first panel hole 102, a frame hole 112 for fixing the housing assembly into the frame, a light guide hole 113 for mounting light guide elements, and a handle 114. By using bolts, studs, and pins to pass through the first side plate hole 111 of the front panel 11 and lock them into the first panel hole 102 of the side plate 10, the side plate 10 can be fixedly connected to the front panel 11. By using locking members to pass through the frame hole 112 and lock them into the frame, the liquid cooling heat dissipation device 100 can be fixed into the frame using the front panel 11. Light guide elements such as light guide pillars can be mounted on the front panel 11 using the light guide hole 113 to indicate the operating status of the liquid cooling heat dissipation device 100. Furthermore, the handle 114 on the front panel 11 effectively improves the ease of installing and removing the liquid cooling heat dissipation device 100 from the frame.

[0021] like Figure 2 As shown, the rear panel 12 has a second side plate hole 121 for fixed connection with the first panel hole 102, a second cover plate hole 122 for fixed connection with the cover plate 13, and a clearance hole 123 for avoiding the inlet 21 and outlet 22. The rear panel 12 can be mounted on the side plate 10 by using a locking member that passes through the second side plate hole 121 and locks it into the first panel hole 102. The clearance hole 123 on the rear panel 12 allows the inlet 21 and outlet 22 of the liquid cooling plate 20 to protrude from the rear panel 12, effectively improving the convenience for operators to connect the inlet 21 and outlet 22 to external equipment.

[0022] like Figure 2 and Figure 3As shown, the cover plate 13 has a first bent edge 131 and a second bent edge 132. The first bent edge 131 has a third side plate hole 1311 for fixed connection with the hole of the cover plate 13, and the second bent edge 132 has a second panel hole 1321 for fixed connection with the rear panel 12. The installation steps of the assembly are as follows: First, the first heating element 30 is installed on the liquid cooling plate 20 using a heat-conducting component, and the second heating element 31 is installed on the liquid cooling plate 20 using a support structure. Then, bolts, studs, and pins are used as locking components to pass through the liquid cooling hole 101 on the side plate 10 and lock into the liquid cooling plate 20, thus fixing the liquid cooling plate 20 to the side plate 10. Next, locking components are used to pass through the third side plate hole 1311 on the cover plate 13 and lock into the cover plate hole 13 of the side plate 10, thus fixing the top of the cover plate 13 to the side plate 10. The front panel 10 is fixedly connected to the bottom. Then, bolts, studs, and pins are used as locking devices to pass through the first side plate hole 111 of the front panel 11 and lock into the first panel hole 102 of the side panel 10, thus fixing the side panel 10 to the front panel 11. Finally, locking devices are used to pass through the second side plate hole 121 of the rear panel 12 and lock into the first panel hole 102 of the side panel 10, and locking devices are used to pass through the second cover plate hole 122 of the rear panel 12 and lock into the second panel hole 1321 of the cover plate 13, thereby completing the assembly operation of the component. Since the cross-section of the side panel 10 is consistent in the length direction, the processing requirements of products with different depth dimensions can be met by cutting the side panel 10 and changing the length of the first bending edge 131 and the second bending edge 132 of the cover plate 13. This allows for the satisfaction of the part dimensions required for products with different power ranges, improving the versatility of the parts in the housing assembly, increasing production efficiency, and saving production and manufacturing costs.

[0023] like Figure 4 As shown, the first heating element 30 is a power transistor with copper sheets on it. The heat-conducting component is a ceramic substrate 42 that is bonded to the copper sheets of the power transistor. Since the power transistor has the highest power consumption and generates the most heat, it is directly bonded to the liquid cooling plate 20 to shorten the heat transfer path and improve heat dissipation efficiency. Furthermore, by placing the power transistor on a circuit board and using surface mount packaging to bond it to the liquid cooling plate 20, the copper sheets of the power transistor are positioned on top of the package, thereby effectively reducing the heat transfer path and thermal resistance of the internal heat source. Moreover, by placing the ceramic substrate 42 on the liquid cooling plate 20, the copper sheets can be directly bonded to the ceramic substrate 42, shortening the heat transfer path from the copper sheets to the liquid cooling plate 20 and improving heat dissipation efficiency.

[0024] like Figure 4 and Figure 5As shown, the insulating components include a first insulating element 41 and a second insulating element 43 that are attached to the liquid cooling plate 20, with a ceramic substrate 42 disposed between the first insulating element 41 and the second insulating element 43. The installation steps of the heat-conducting assembly are as follows: First, place the liquid cooling plate 20 on the worktable, then fix the first insulating element 41 in the desired position, and then place the ceramic substrate 42; next, due to limitations in the assembly process, there is a slight gap between the ceramic substrate 42 and the first set of insulating elements, resulting in 100% electrical insulation between the circuit board and the liquid cooling plate 20. Subsequently, the second set of insulating elements is installed to cover the gap between the ceramic substrate 42 and the first insulating element 41. Finally, the power transistor is fixedly connected to the liquid cooling plate 20, and the copper strip of the power transistor is attached to the ceramic substrate 42.

[0025] like Figure 5 and Figure 6 As shown, the second heating element 31 comprises several circuit boards, and the supporting structure consists of several support columns 50 for supporting the circuit boards. The heat generated by the second heating element 31 is lower than that of the first heating element 30. Therefore, by using the support columns 50 to mount the second heating element 31 onto the liquid cooling plate 20, heating elements with different power consumptions can be separated, thereby further improving the heat dissipation effect of the liquid cooling heat dissipation device 100. Furthermore, in the embodiment provided by this utility model, a thermally conductive pad is also provided between the circuit board and the support column 50, thereby effectively improving the thermal conductivity effect of transferring heat from the circuit board to the liquid cooling plate 20 for heat dissipation.

[0026] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A liquid cooling heat dissipation device, characterized in that, It includes a housing assembly, a liquid cooling plate (20) disposed within the housing assembly, and a heat-conducting component disposed on the liquid cooling plate (20); The liquid cooling plate (20) is provided with an inlet (21) and an outlet (22). The housing assembly includes a side plate (10), a panel assembly, and a cover plate (13). The side plate (10) has a fixing structure for fixed connection with the panel assembly and the cover plate (13). The heat conduction assembly includes an insulating component disposed on the liquid cooling plate (20) and a heat conduction component that abuts against the first heating element (30). The liquid cooling plate (20) also has a support structure for supporting the second heating element (31).

2. The liquid cooling heat dissipation device as described in claim 1, characterized in that, The panel assembly includes a front panel (11) and a rear panel (12). The fixing structure includes a plurality of liquid cooling holes (101) disposed in the middle of the side panel (10) and used for fixed connection with the liquid cooling plate (20), first panel holes (102) disposed at both ends of the side panel (10) and used for fixed connection with the front panel (11) and the rear panel (12), and a plurality of first cover plate holes (103) disposed at the top and bottom of the side panel (10) and used for fixed connection with the cover plate (13).

3. The liquid cooling heat dissipation device as described in claim 2, characterized in that, A plurality of liquid cooling holes (101) are evenly distributed on the side plate (10), the first panel holes (102) are symmetrically distributed at both ends of the side plate (10), and a plurality of first cover plate holes (103) are symmetrically distributed at the top and bottom of the side plate (10) relative to the liquid cooling holes (101).

4. The liquid cooling heat dissipation device as described in claim 2, characterized in that, The front panel (11) has a first side panel hole (111) for fixed connection with the first panel hole (102), a frame hole (112) for fixing the housing assembly in the frame, a light guide hole (113) for installing a light guide element, and a handle (114).

5. The liquid cooling heat dissipation device as described in claim 2, characterized in that, The rear panel (12) has a second side plate hole (121) for fixed connection with the first panel hole (102), a second cover plate hole (122) for fixed connection with the cover plate (13), and a clearance hole (123) for avoiding the inlet (21) and outlet (22).

6. The liquid cooling heat dissipation device as described in claim 2, characterized in that, The cover plate (13) has a first bent edge (131) and a second bent edge (132). The first bent edge (131) has a third side plate hole (1311) for fixed connection with the first cover plate hole (103), and the second bent edge (132) has a second panel hole (1321) for fixed connection with the rear panel (12).

7. The liquid cooling heat dissipation device as described in claim 1, characterized in that, The first heating element (30) is a power tube with a copper sheet on it, and the heat-conducting component is a ceramic substrate (42) that is attached to the copper sheet of the power tube.

8. The liquid cooling heat dissipation device as described in claim 7, characterized in that, The insulating components include a first insulating element (41) and a second insulating element (43) that are attached to the liquid cooling plate (20), and the ceramic substrate (42) is disposed between the first insulating element (41) and the second insulating element (43).

9. A liquid cooling heat dissipation device as described in claim 1, characterized in that, The second heating element (31) is a plurality of circuit boards, and the support structure is a plurality of support columns (50) for supporting the circuit boards.

10. A liquid cooling heat dissipation device as described in claim 9, characterized in that, A thermally conductive pad is also provided between the circuit board and the support column (50).

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