Thermal management control assembly and vehicle

Abstract

The embodiment of the application provides a kind of thermal management control component and vehicle, it is related to the field of vehicle thermal management technology.The thermal management control component provided by the application includes controller;Controller is provided with the first circuit area and the second circuit area arranged along the first direction;First circuit area is used to be electrically connected with high-voltage load, and the second circuit area is used to be electrically connected with low-voltage load;First circuit area and the second circuit area are provided with the isolation area extending along the second direction between them;The first direction is perpendicular to the second direction.By dividing controller into the first circuit area and the second circuit area arranged along the first direction, and setting the isolation area perpendicular to the first direction between them, the direct coupling path between high-voltage and low-voltage circuit is cut off in spatial dimension, can be targeted to block the electric field or magnetic field overlapping phenomenon generated by line layout, component distribution, avoid low-voltage control signal being contaminated by high-voltage switch action.Improve work stability.

Description

Technical Field

[0001] This application relates to vehicle thermal management technology, and more particularly to a thermal management control component and a vehicle. Background Technology

[0002] With rapid economic development and increasing environmental awareness, new energy electric vehicles are rapidly developing and becoming more widespread. Currently, thermal management control components are crucial for ensuring the performance of the three core electrical systems (battery, motor, and electronic control) in new energy electric vehicles and improving overall vehicle energy efficiency; therefore, the quality and performance of thermal management control components are of paramount importance.

[0003] In related technologies, thermal management control components include key components such as housing, controller, compressor, water pump and heater. The controller is located inside the housing and is equipped with not only high-pressure circuits for controlling the compressor and heater, but also low-pressure circuits for controlling the multi-way valve and water pump.

[0004] However, the above setup can easily cause mutual interference between the low-voltage and high-voltage circuits, affecting normal operation. Utility Model Content

[0005] In view of this, this application provides a thermal management control component and vehicle that can avoid interference between low-voltage and high-voltage circuits on the controller and improve operational stability.

[0006] To achieve the above objectives, this application provides a thermal management control component and vehicle, which adopts the following technical solution:

[0007] In a first aspect, this application provides a thermal management control component, including a controller;

[0008] The controller is provided with a first circuit area and a second circuit area arranged along a first direction.

[0009] The first circuit region is used for electrical connection to a high-voltage load, and the second circuit region is used for electrical connection to a low-voltage load.

[0010] An isolation region is provided between the first circuit region and the second circuit region;

[0011] The isolation area extends along a second direction, and the first direction is perpendicular to the second direction.

[0012] In one possible implementation, the thermal management control component provided in this application includes at least one digital isolator within the isolation area. The digital isolator connects the first circuit area and the second circuit area and is used for signal isolation between the first circuit area and the second circuit area.

[0013] In one possible implementation, the thermal management control component provided in this application further includes a transformer within the isolation area. The transformer connects the first circuit area and the second circuit area and is used for power isolation between the first circuit area and the second circuit area.

[0014] In one possible implementation, the thermal management control component provided in this application has an isolation zone, the width of which is greater than or equal to 5 mm.

[0015] In one possible implementation, the thermal management control component provided in this application includes a high-voltage input module, a high-voltage output module, a compressor control module, and a heater control module within the first circuit area.

[0016] The compressor control module and the heater control module are disposed on the first surface of the controller, and the compressor control module and the heater control module are spaced apart along the second direction;

[0017] The high-voltage input module and the high-voltage output module are disposed on the second surface of the controller, with the first surface and the second surface facing each other.

[0018] In one possible implementation, the thermal management control component provided in this application further includes a filter module within the first circuit region. The filter module is disposed on the second surface of the controller and between the high-voltage input module and the high-voltage output module.

[0019] In one possible implementation, the thermal management control component provided in this application includes a low-pressure input module, a low-pressure output module, a water pump control module, a multi-way valve control module, and an electronic expansion valve control module within the second circuit area.

[0020] The low-pressure input module, the low-pressure output module, the water pump control module, the multi-way valve control module, and the electronic expansion valve control module are all disposed on the second surface of the controller;

[0021] The electronic expansion valve control module and the water pump control module are arranged at intervals along a first direction, and the multi-way valve control module and the electronic expansion valve control module are arranged at intervals along a second direction.

[0022] In one possible implementation, the thermal management control component provided in this application includes multiple low-pressure output modules, each of which includes a water pump connector and a multi-way valve connector.

[0023] The water pump connector is electrically connected to the water pump control module, and the water pump connector is located on one side of the water pump control module along the second direction;

[0024] The multi-way valve connector is electrically connected to the multi-way valve control module, and the multi-way valve connector is disposed on one side of the multi-way valve control module along the first direction.

[0025] In one possible implementation, the thermal management control component provided in this application further includes a housing, and the controller is disposed within the housing;

[0026] The controller has multiple heat dissipation areas, and multiple heat-conducting components are disposed between the housing and the controller, with the heat-conducting components corresponding to the heat dissipation areas;

[0027] The controller is connected to the housing via the heat-conducting component.

[0028] Secondly, this application provides a vehicle, including a vehicle body and a thermal management control component as described above; the thermal management control component is disposed on the vehicle body.

[0029] The thermal management control component and vehicle provided in this application include a controller. The controller has a first circuit region and a second circuit region arranged along a first direction. The first circuit region is electrically connected to a high-voltage load, and the second circuit region is electrically connected to a low-voltage load. An isolation region is provided between the first circuit region and the second circuit region. The isolation region extends along a second direction, and the first direction is perpendicular to the second direction. By dividing the controller into two independent first and second circuit regions arranged along the first direction, and providing an isolation region perpendicular to the first direction between them, the direct coupling path between the high-voltage and low-voltage circuits is spatially severed, especially suppressing interference caused by high-frequency signals through spatial radiation or conduction. It can specifically block the overlap of electric or magnetic fields caused by wiring and component distribution, preventing the low-voltage control signal from being contaminated by high-voltage switch operation. For example, transient current fluctuations of the high-voltage load will not be coupled to the low-voltage control loop through a common impedance, preventing false triggering or logic disorder and improving operational stability.

[0030] In addition to the technical problems solved by the embodiments of this application, the technical features constituting the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that can be solved by the technical solutions provided by this application, other technical features contained in the technical solutions, and the beneficial effects brought about by these technical features will be further explained in detail in the specific embodiments. Attached Figure Description

[0031] The specific embodiments of this application are described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only for illustration and explanation of this application, and this application is not limited to the specific embodiments described below.

[0032] Figure 1 This is a schematic diagram of the structure of the thermal management control component provided in the embodiments of this application;

[0033] Figure 2 Exploded view of the thermal management control component provided in the embodiments of this application Figure 1 ;

[0034] Figure 3 Exploded view of the thermal management control component provided in the embodiments of this application Figure 2 ;

[0035] Figure 4 This is a schematic diagram of the controller provided in an embodiment of this application;

[0036] Figure 5 for Figure 4 A schematic diagram of the structure of the first surface of the controller;

[0037] Figure 6 for Figure 4 A schematic diagram of the structure of the second surface of the controller;

[0038] Explanation of reference numerals in the attached figures:

[0039] 10. Compressor; 20. Central processing module; 100. Housing; 110. First housing; 120. Second housing; 200. Controller; 201. First surface; 202. Second surface; 203. Heat dissipation area; 300. First circuit area; 301. High-pressure input module; 302. High-pressure output module; 303. Compressor control module; 304. Heater control module; 305. Filter module; 400. Second circuit area; 401. Low-pressure input module; 402. Water pump control module; 403. Multi-port valve control module; 404. Electronic expansion valve control module; 405. Communication module; 406. Water pump connector; 407. Multi-port valve connector; 500. Isolation area; 600. Digital isolator; 700. Transformer; 800. Heat-conducting component.

[0040] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be described in more detail below with reference to the accompanying drawings. In the drawings, the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The described embodiments are some, but not all, embodiments of this application. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application. The embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0042] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0043] In the description of the embodiments of this application, it should be understood that the terms "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0044] In the description of the embodiments of this application, "a plurality of" means two or more, unless otherwise specified precisely.

[0045] The terms "first," "second," "third," "fourth," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0046] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or apparatus.

[0047] As mentioned in the background section, with rapid economic development and increasing environmental awareness, new energy electric vehicles are rapidly developing and becoming more widespread. Currently, thermal management control components are crucial for ensuring the performance of the three core electrical systems (battery, motor, and electronic control system) in new energy electric vehicles and improving overall vehicle energy efficiency. This places higher demands on the quality and functionality of thermal management control components.

[0048] In related technologies, the thermal management control system, composed of thermal management control components, is an essential system among many vehicle systems. The thermal management control components include key components such as a housing, controller, compressor, water pump, and heater. The controller is housed within the housing, which has a connection port. An external connector needs to pass through this port and plug into the connector body on the controller to achieve an electrical connection between the external connector and the connector body. For example, the controller has pin headers, and the external connector is a female connector. The female connector needs to plug into the pin headers to achieve an electrical connection between the controller and the external connector, ensuring the normal connection of the power supply line or control logic line.

[0049] The controller not only includes high-voltage circuits for controlling the compressor and heater, but also low-voltage circuits for controlling the multi-way valve and water pump. However, in traditional configurations, the high-voltage and low-voltage circuits are in a disordered state, which can easily cause mutual interference between them, affecting normal operation. For example, the signal transmission quality of the low-voltage circuit may suffer from decreased control accuracy or communication interruption due to high-voltage noise. Alternatively, transient current fluctuations in the high-voltage load (such as start-stop surges) can couple to the low-voltage circuit through a common impedance, leading to false triggering or logic disorder.

[0050] Based on the aforementioned technical problems, this application provides a thermal management control component and a vehicle. In this technical solution, the thermal management control component includes a controller; the controller has a first circuit region and a second circuit region arranged along a first direction; the first circuit region is electrically connected to a high-voltage load, and the second circuit region is electrically connected to a low-voltage load; an isolation region is provided between the first circuit region and the second circuit region; the isolation region extends along a second direction, and the first direction is perpendicular to the second direction. By dividing the controller into two independent first and second circuit regions arranged along the first direction, and providing an isolation region perpendicular to the first direction between them, the direct coupling path between the high-voltage and low-voltage circuits is spatially severed, especially suppressing interference caused by high-frequency signals through spatial radiation or conduction. It can specifically block the overlap of electric or magnetic fields caused by wiring and component distribution, preventing low-voltage control signals from being contaminated by high-voltage switch actions. For example, transient current fluctuations of the high-voltage load will not be coupled to the low-voltage control loop through a common impedance, preventing false triggering or logic disorder and improving operational stability.

[0051] It should be noted that, Figures 1 to 6This diagram illustrates a simplified schematic of the thermal management control assembly and various components within the vehicle. The specific structures of the thermal management control assembly and other components within the vehicle are not limited to these examples. Figures 1 to 6 of examples.

[0052] The present application will now be described in detail with reference to the accompanying drawings and specific embodiments:

[0053] Reference Figure 1 , Figure 2 and Figure 3 As shown in the figure, a thermal management control component provided in this application embodiment includes a compressor 10, a housing 100, and a controller 200. The compressor 10 is prior art in this technical field, and this application embodiment does not limit the specific structure of the compressor 10.

[0054] The housing 100 includes a first housing 110 and a second housing 120 connected to each other. A receiving cavity is formed between the first housing 110 and the second housing 120. The compressor 10 is integrally formed with the first housing 110. In conventional methods, the compressor 10 and the housing 100 need to be connected by bolts and a sealing ring is required. However, in this solution, the first housing 110 is integrally formed with the compressor 10. This eliminates redundant bolts and sealing rings, reducing assembly complexity.

[0055] The first housing 110 and the second housing 120 are made of metal. Traditional split-type structures suffer from contact thermal resistance and potential gap thermal resistance due to bolted connections and sealing rings. This is because, in a split-type structure, thermally conductive adhesive needs to be filled between the compressor 10 and the controller 200. However, the thermal conductivity of this adhesive is lower than that of metal. Furthermore, split assembly can lead to assembly gaps due to tolerances in the components, further contributing to low thermal conductivity. The aforementioned method, through integral molding, eliminates this thermal resistance and significantly improves thermal conductivity.

[0056] Reference Figure 4 , Figure 5 and Figure 6 As shown, the controller 200 has a first circuit region 300 and a second circuit region 400 arranged along a first direction; the first circuit region 300 is used for electrical connection with a high-voltage load, and the second circuit region 400 is used for electrical connection with a low-voltage load. Figure 4 , Figure 5 and Figure 6 Unless otherwise specified, the X, Y, and Z arrows shown are mutually perpendicular in three-dimensional space. The first direction is defined as the direction of the Y arrow, and the second direction is defined as the direction of the X arrow.

[0057] An isolation region 500 is provided between the first circuit region 300 and the second circuit region 400.

[0058] The isolation zone 500 extends along the second direction, and the first direction is perpendicular to the second direction.

[0059] In the above configuration, in related technologies, the controller 200 can be a circuit board, divided into two independent circuit regions arranged along a first direction: a first circuit region 300 and a second circuit region 400. An isolation region 500 perpendicular to the first direction is provided between the two, forming a cross-shaped orthogonal isolation design. This spatially severs the direct coupling path between the high-voltage and low-voltage circuits, especially suppressing interference caused by high-frequency noise through spatial radiation or conduction.

[0060] The isolation area 500 extends along the second direction, precisely covering the potential interference path between the first circuit area 300 and the second circuit area 400. It can specifically block the overlapping of electric or magnetic fields caused by the wiring and component distribution, and prevent the low-voltage control signal from being contaminated by the operation of the high-voltage switch.

[0061] The high-voltage circuit in the first circuit area 300 is completely separated from the low-voltage circuit in the second circuit area 400, ensuring that transient current fluctuations of the high-voltage load (such as start-stop impacts) will not be coupled to the low-voltage control circuit through the common impedance, thus preventing false triggering or logic disorder.

[0062] Furthermore, by setting up the isolation region 500, a clear physical boundary can be formed on the circuit board of the controller 200, making the wiring and component layout of the high-voltage circuit in the first circuit region 300 and the low-voltage circuit in the second circuit region 400 more organized and reducing the risk of human error during assembly. In one possible implementation, at least one digital isolator 600 is provided in the isolation region 500. The digital isolator 600 connects the first circuit region 300 and the second circuit region 400 and is used for signal isolation between the first circuit region 300 and the second circuit region 400.

[0063] In specific implementation, refer to Figure 5 and Figure 6 As shown, a digital isolator 600 is disposed on the first surface 201 of the controller 200, and three digital isolators 600 are disposed on the second surface 202 of the controller 200. Of course, the number of digital isolators 600 can be flexibly adjusted according to the design.

[0064] Here, the first circuit region 300 and the second circuit region 400 of the controller 200 can be understood as regions of the controller 200 in three-dimensional space. Both the first circuit region 300 and the second circuit region 400 have a first surface 201 and a second surface 202.

[0065] The digital isolator 600 achieves electrical isolation during signal transmission using optocouplers, capacitors, or magnetic isolation technology, allowing only valid signals to pass through while blocking common-mode interference voltage and high-frequency noise. Transient voltage spikes generated by load switching in the high-voltage circuit within the first circuit region 300 cannot be conducted through the digital isolator 600 to the low-voltage control loop in the second circuit region 400, preventing malfunctions in the low-voltage control logic. Furthermore, it can suppress crosstalk paths, meeting automotive-grade EMC standards.

[0066] Reference Figure 5 As shown, the controller 200 is equipped with a central processing module 20 (Microcontroller Unit, MCU), and the central processing module 20 is located in the second circuit area 400. The MCU on the low-voltage side is susceptible to surge impacts on the high-voltage side. By setting up a digital isolator 600, the lifespan of the central processing module 20 can be extended, ensuring the stable operation of the central processing module 20.

[0067] In one possible implementation, a transformer 700 is further provided within the isolation region 500. The transformer 700 connects the first circuit region 300 and the second circuit region 400, and serves for power isolation between the two circuit regions. The transformer 700 utilizes the principle of electromagnetic induction to achieve contactless energy transfer between the high-voltage and low-voltage sides, cutting off the DC path between the high-voltage circuit in the first circuit region 300 and the low-voltage circuit in the second circuit region 400.

[0068] Transformer 700 can perform impedance matching and voltage conversion for different load characteristics, ensuring efficient power transmission and consistent dynamic response on both high and low voltage sides. For example, the high-voltage load in the first circuit area 300 also requires low-voltage control logic signals for control. By setting up transformer 700, the stable transmission of low-voltage control logic signals from the second circuit area 400 can be ensured. Transformer 700 can be an automotive-grade planar transformer (Planar Magnetically Resonant Transformer), using low-temperature solder paste (SnAgCu) and high-temperature magnetic materials (such as amorphous alloys) to ensure that the inductance fluctuation is less than 5% within the range of -40℃ to 150℃. Transformer 700 can also be potted with silicone and equipped with a shock-absorbing bracket to withstand random vibration and prevent insulation damage caused by inter-turn friction of the coil.

[0069] The isolation area 500 is set as an isolation zone, and the width of the isolation zone is greater than or equal to 5 mm.

[0070] By implementing the above settings, the spatial distance between the first circuit region 300 and the second circuit region 400 can be physically increased. This reduces the coupling capacitance value to a negligible level and significantly weakens the transmission of high-frequency noise.

[0071] The high-voltage system of new energy vehicles is susceptible to transient high voltage risks. A 5mm insulating strip meets basic insulation requirements and eliminates the risk of arcing and breakdown.

[0072] In one possible implementation, a high-voltage input module 301, a high-voltage output module 302, a compressor 10 control module, and a heater control module 304 are provided in the first circuit region 300.

[0073] The compressor 10 control module and the heater control module 304 are disposed on the first surface 201 of the controller 200, and the compressor 10 control module and the heater control module 304 are spaced apart along the second direction.

[0074] The high-voltage input module 301 and the high-voltage output module 302 are disposed on the second surface 202 of the controller 200, with the first surface 201 and the second surface 202 facing each other.

[0075] It should be noted here that you should continue to refer to... Figure 5 and Figure 6 As shown, the controller 200 is connected to an external high-voltage power supply via a high-voltage input module 301 to control the on / off state of the external high-voltage power supply. The high-voltage input module 301 can be a copper lug mounted on the controller 200, and the high-voltage output module 302 can also be a copper lug mounted on the controller 200. The controller 200 is electrically connected to the compressor 10 and the heater via the high-voltage output module 302, and controls the opening and closing of high-voltage loads such as the compressor 10 and the heater via the compressor 10 control module and the heater control module 304.

[0076] The compressor 10 control module and the heater control module 304 are arranged at intervals along the second direction to avoid the superposition of transient currents during high-power load switching and to prevent ground bounce noise coupling caused by sharing a grounding circuit. At the same time, the separate arrangement of the compressor 10 control module and the heater control module 304 avoids the accumulation of local hot spots, which is conducive to reasonable heat dissipation and extends the life of components.

[0077] In addition, the compressor 10 control module and the heater control module 304 are set on the first surface 201 of the controller 200, and the high-pressure input module 301 and the high-pressure output module 302 are set on the second surface 202 of the controller 200. This makes reasonable use of the space on the controller 200, realizes the rational layout of components, improves space utilization, and facilitates the integration of more components into the controller 200 to realize more control functions.

[0078] In one possible implementation, a filter module 305 is also provided within the first circuit region 300. The filter module 305 is disposed on the second surface 202 of the controller 200, between the high-voltage input module 301 and the high-voltage output module 302. Here, the filter module 305 is a filter that integrates passive components such as capacitors and inductors to form a low-pass / band-pass filter, which targets and weakens high-frequency switching noise in the high-voltage circuit (such as harmonics generated by the IGBT inverter of the compressor 10). After the high-voltage input module 301 receives the high-voltage DC power supply, the filter module 305 can filter out the high-frequency ripple caused by the battery internal resistance or the parasitic inductance of the cable, thus preventing voltage fluctuations from affecting the speed stability of the compressor 10.

[0079] By setting up the filter module 305, the radiation intensity of the high-voltage circuit can be reduced to meet automotive-grade limit requirements.

[0080] The second circuit area 400 is equipped with a low-voltage input module 401, a low-voltage output module, a water pump control module 402, a multi-way valve control module 403, and an electronic expansion valve control module 404.

[0081] The low-pressure input module 401, the low-pressure output module, the water pump control module 402, the multi-way valve control module 403, and the electronic expansion valve control module 404 are all located on the second surface 202 of the controller 200.

[0082] By setting a water pump control module 402, a multi-way valve control module 403, and an electronic expansion valve control module 404 on the controller 200, the controller 200 can integrate more components and achieve multi-functional integration.

[0083] The electronic expansion valve control module 404 and the water pump control module 402 are arranged at intervals along the first direction, and the multi-way valve control module 403 and the electronic expansion valve control module 404 are arranged at intervals along the second direction.

[0084] By arranging the electronic expansion valve control module 404 and the water pump control module 402 at intervals along the first direction, coupling interference between high-frequency switching signals and analog signals is avoided. Simultaneously, the space of the controller 200 is utilized efficiently to achieve high-density integration of multiple modules within a single surface. The multi-way valve control module 403 and the electronic expansion valve control module 404 are arranged at intervals along the second direction to avoid arcing interference during relay switching, thus improving the operational stability of the components.

[0085] In addition, the water pump control module 402, the multi-way valve control module 403, and the electronic expansion valve control module 404, these low-pressure modules are all centrally located on the second surface 202 of the controller 200, which facilitates quick docking with the vehicle's OBD interface or CAN bus connector and improves the clarity of the vehicle's network topology.

[0086] By using the above settings, multiple security barriers can be built through physical partitioning and directional arrangement, and the overlap of local hotspots can also be avoided.

[0087] In one specific implementation, multiple low-pressure output modules are configured, including a water pump connector 406 and a multi-way valve connector 407; the water pump connector 406 is electrically connected to the water pump control module 402, and the water pump connector 406 is located on one side of the water pump control module 402 along the second direction.

[0088] Both the water pump connector 406 and the multi-way valve connector 407 can be configured as pin headers. The water pump connector 406 can be plugged into the busbar of the water pump, and the multi-way valve connector 407 can be plugged into the busbar of the multi-way valve.

[0089] The multi-way valve connector 407 is electrically connected to the multi-way valve control module 403, and the multi-way valve connector 407 is disposed on one side of the multi-way valve control module 403 along the first direction.

[0090] Reference Figure 6 As shown, it also includes a communication module 405. The controller 200 is connected to an external low-voltage power supply through a low-voltage input module 401 to enable the controller 200 to be powered. The controller 200 is connected to the vehicle through the communication module 405 to facilitate the user to receive various parameters of the controller 200 or input control commands to the controller 200.

[0091] The water pump connector 406 and the multi-way valve connector 407 are deployed along different directions on the sides of their respective control modules, forming the shortest "control-execution" path. The water pump control module 402 is directly connected to the water pump connector 406, shortening the PWM control signal transmission path, avoiding signal reflection and attenuation caused by long traces, and shortening the water pump speed response time. The multi-way valve control module 403 is directly connected to the multi-way valve connector 407, shortening the transmission path of the multi-way valve control signal. The multi-way valve connector 407 is independent of the water pump connector 406, avoiding capacitive coupling caused by parallel routing of their signal lines.

[0092] The low-pressure input module 401 and the multi-way valve control module 403 are arranged at a distance along a first direction. The low-pressure input module 401 and the water pump connector 406 are arranged at a distance along a second direction. The communication module 405 and the low-pressure input module 401 are arranged at a distance along the first direction. Alternatively, the low-pressure input module 401 can be understood as being located between the communication module 405 and the water pump connector 406. The communication module 405 and the multi-way valve connector 407 are arranged at a distance along the first direction.

[0093] The above-described configuration allows for the construction of multiple safety barriers through physical separation and independent circuit design. Simultaneously, the optimized spatial layout of the controller 200 improves the space utilization of its second surface 202. High-density integration of multiple modules is achieved using the single-sided space of the controller 200.

[0094] In one possible implementation, refer to Figure 5 As shown, and in combination Figure 2 and Figure 3 The controller 200 has multiple heat dissipation areas 203, and multiple heat-conducting components 800 are provided between the housing 100 and the controller 200, with the heat-conducting components 800 corresponding to the heat dissipation areas 203.

[0095] The controller 200 is connected to the housing 100 via a thermally conductive component 800. The thermally conductive component 800 can be thermally conductive adhesive, a copper-based thermally conductive sheet, a graphene coating, etc.

[0096] The controller 200 has multiple heat dissipation areas 203 on its first surface 201. The first surface 201 of the controller 200 faces the first housing 110. The heat-conducting component 800 is directly attached to the heat dissipation area 203 of the controller 200 to form a low thermal resistance conduction path and quickly transfer heat to the first housing 110, thereby improving heat dissipation efficiency. In order to further improve heat dissipation efficiency, multiple fins are provided on the outer side wall of the first housing 110 to improve the convective heat transfer efficiency between the first housing 110 and the air, thereby improving the heat dissipation effect.

[0097] In practice, the compressor 10 control module, heater control module 304, and central processing module 20 are all equipped with heat dissipation areas 203. Furthermore, the area on the second surface 202 of the controller 200 opposite to the water pump control module 402 can also be set as a heat dissipation area 203. By setting multiple heat dissipation areas 203, the heat dissipation effect of the controller 200 is improved.

[0098] In one possible implementation, this application provides a vehicle including a vehicle body and the aforementioned thermal management control component, the thermal management control component being disposed on the vehicle body. The thermal management control component has been described in detail above and will not be repeated here. This vehicle possesses the technical advantages of the aforementioned thermal management control component, enabling it to avoid interference between the low-voltage and high-voltage circuits on the controller 200, thereby improving operational stability. In this application embodiment, the vehicle can be a pure electric vehicle, a hybrid electric vehicle, or a range-extended electric vehicle, etc. This application embodiment does not limit the specific structure of the vehicle.

[0099] The vehicles mentioned in this application embodiment can also refer to large cars, small cars, special-purpose vehicles, etc. For example, according to vehicle type, the vehicles in this application embodiment can be sedans, off-road vehicles, multi-purpose vehicles (MPVs), or other types of vehicles. Of course, they can also be other types of vehicles, and this application embodiment does not limit them.

[0100] The implementation principle of a thermal management control component and vehicle according to an embodiment of this application is as follows: The thermal management control component includes a controller 200; the controller 200 is provided with a first circuit region 300 and a second circuit region 400 arranged along a first direction; the first circuit region 300 is used for electrical connection with a high-voltage load, and the second circuit region 400 is used for electrical connection with a low-voltage load; an isolation region 500 is provided between the first circuit region 300 and the second circuit region 400; the isolation region 500 extends along a second direction, and the first direction is perpendicular to the second direction. By dividing the controller 200 into two independent first circuit regions 300 and second circuit regions 400 arranged along the first direction, and providing an isolation region 500 perpendicular to the first direction between them, the direct coupling path between the high-voltage and low-voltage circuits is cut off in a spatial dimension, especially suppressing interference caused by high-frequency signals through spatial radiation or conduction. It can specifically block the overlap of electric or magnetic fields caused by wiring and component distribution, and prevent the low-voltage control signal from being contaminated by the operation of the high-voltage switch. For example, transient current fluctuations in high-voltage loads will not be coupled to low-voltage control circuits through common impedance, preventing false triggering or logic disorder and improving operational stability.

[0101] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the application disclosed herein.

[0102] The embodiments in this application are intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed in this application. The specification and embodiments are to be considered exemplary only, and the true scope and spirit of this application are indicated by the claims.

[0103] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A thermal management control component, characterized in that, Including the controller; The controller is provided with a first circuit area and a second circuit area arranged along a first direction. The first circuit region is used for electrical connection to a high-voltage load, and the second circuit region is used for electrical connection to a low-voltage load. An isolation region is provided between the first circuit region and the second circuit region; The isolation area extends along a second direction, and the first direction is perpendicular to the second direction.

2. The thermal management control component according to claim 1, characterized in that, At least one digital isolator is provided within the isolation area. The digital isolator connects the first circuit area and the second circuit area and is used for signal isolation between the first circuit area and the second circuit area.

3. The thermal management control component according to claim 2, characterized in that, A transformer is also provided within the isolation area. The transformer connects the first circuit area and the second circuit area and is used for power isolation between the first circuit area and the second circuit area.

4. The thermal management control component according to claim 1, characterized in that, The isolation area is an isolation strip, and the width of the isolation strip is greater than or equal to 5 millimeters.

5. The thermal management control component according to any one of claims 1 to 4, characterized in that, The first circuit area is equipped with a high-voltage input module, a high-voltage output module, a compressor control module, and a heater control module; The compressor control module and the heater control module are disposed on the first surface of the controller, and the compressor control module and the heater control module are spaced apart along the second direction; The high-voltage input module and the high-voltage output module are disposed on the second surface of the controller, with the first surface and the second surface facing each other.

6. The thermal management control component according to claim 5, characterized in that, A filter module is also provided in the first circuit area. The filter module is disposed on the second surface of the controller and is located between the high voltage input module and the high voltage output module.

7. The thermal management control component according to claim 5, characterized in that, The second circuit area is equipped with a low-voltage input module, a low-voltage output module, a water pump control module, a multi-way valve control module, and an electronic expansion valve control module; The low-pressure input module, the low-pressure output module, the water pump control module, the multi-way valve control module, and the electronic expansion valve control module are all disposed on the second surface of the controller; The electronic expansion valve control module and the water pump control module are arranged at intervals along a first direction, and the multi-way valve control module and the electronic expansion valve control module are arranged at intervals along a second direction.

8. The thermal management control component according to claim 7, characterized in that, The low-pressure output module is configured as multiple, and the multiple low-pressure output modules include a water pump connector and a multi-way valve connector; The water pump connector is electrically connected to the water pump control module, and the water pump connector is located on one side of the water pump control module along the second direction; The multi-way valve connector is electrically connected to the multi-way valve control module, and the multi-way valve connector is disposed on one side of the multi-way valve control module along the first direction.

9. The thermal management control component according to any one of claims 1 to 4, characterized in that, It also includes a housing, within which the controller is disposed; The controller has multiple heat dissipation areas, and multiple heat-conducting components are disposed between the housing and the controller, with the heat-conducting components corresponding to the heat dissipation areas; The controller is connected to the housing via the heat-conducting component.

10. A vehicle, characterized in that, It includes a vehicle body and a thermal management control component as described in any one of claims 1 to 9; the thermal management control component is disposed on the vehicle body.

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