A heat sink and heat spreader based on eddy current interference

CN224844562UActive Publication Date: 2026-10-09HUIZHOU CHUYUE THERMAL TECH CO LTD
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Patent Information

Application Number
CN202522534974.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-28
Publication Date
2026-10-09
Estimated Expiration
2035-11-28

AI Technical Summary

Technical Problem

直线型翅片气流路径相对单一,层流边界层过厚导致热阻增大

Benefits of technology

[0012]本实用新型的有益效果是:本实用新型提供的基于涡流干扰的散热片及散热器,通过在散热片上设置扰流凸起和扰流槽,气流经过扰流凸起和扰流槽形成宏观涡流,对气流路径进行重构,在散热片之间形成纵向和横向的复合涡流,通过二次流涡流增强气流混合,层流边界层在散热片表面积累,提高了散热效率;通过在扰流槽内设置螺旋结构的导流槽,多个散热片层层叠加后,上下层之间的导流槽表面的微结构,使得气流经过螺旋结构导流槽时形成微观的微观涡,导流槽的表面微结构产生高频扰动涡,从而加速气流的流动,提高散热效率。

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Abstract

The utility model discloses a kind of based on eddy current interference fin and radiator, including corresponding multiple through holes, multiple turbulence protrusions and multiple turbulence grooves, the turbulence protrusion includes first protrusion and second protrusion, the turbulence groove includes first through groove and second through groove, the first through groove is located at the outside edge of the first protrusion, the second through groove is located at the outside edge of the second protrusion, the utility model provides based on eddy current interference fin and radiator, by setting turbulence protrusion and turbulence groove on fin, airflow passes through turbulence protrusion and turbulence groove to form macroscopic eddy current, airflow path is reconstructed, longitudinal and transverse composite eddy current is formed between fin, airflow mixing is enhanced by secondary flow eddy current, laminar boundary layer is accumulated on fin surface, improve heat dissipation efficiency.
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Description

Technical Field

[0001] This utility model relates to the field of radiator technology, and in particular to a heat sink and radiator based on eddy current interference. Background Technology

[0002] The rapid development of society has placed higher demands on chip performance, which in turn means more stringent requirements on chip thermal management technology. Traditional fin designs mainly rely on straight lines or simple corrugated structures to enhance heat exchange between airflow and the fin surface. Straight fins have a relatively simple airflow path, and an excessively thick laminar boundary layer leads to increased thermal resistance. At the same time, due to the limited contact time between the airflow and the fin surface, the heat dissipation effect in high-temperature areas is not ideal, resulting in a significant heat dissipation bottleneck. Utility Model Content

[0003] To address the aforementioned problems, the purpose of this invention is to provide a heat sink based on eddy current interference. By setting turbulence protrusions and turbulence grooves on the heat sink, the airflow path is reconstructed, forming longitudinal and transverse composite eddies between the heat sinks. The secondary flow eddies enhance airflow mixing, and a laminar boundary layer accumulates on the surface of the heat sink, thereby improving heat dissipation efficiency.

[0004] To achieve the above objectives, this utility model provides a heat sink based on eddy current interference, including multiple corresponding through holes, multiple eddy current protrusions, and multiple eddy current grooves. The eddy current protrusions include a first protrusion and a second protrusion. The first protrusion and the second protrusion are located on one side of the through hole along the X-axis direction and on both sides of the through hole along the Y-axis direction. The eddy current grooves include a first through groove and a second through groove. The first through groove is located at the outer edge of the first protrusion, and the second through groove is located at the outer edge of the second protrusion.

[0005] Preferably, the first protrusion and the second protrusion are asymmetrical along the Y-axis, and the first protrusion and the second protrusion have a triangular cross-section structure or a trapezoidal cross-section structure, and the height of the turbulence protrusion is 0.5-2mm.

[0006] Preferably, the angle between the first protrusion and the second protrusion is 5-30°.

[0007] Preferably, the first and second through slots are further provided with a plurality of flow guide slots, the flow guide slots are arranged in a spiral shape, the spiral angle of the flow guide slots is 30-45°, and the depth of the flow guide slots is 20-40% of the thickness of the heat sink.

[0008] Preferably, a third protrusion is provided at the edge of the through hole, and the height of the third protrusion is greater than or equal to the height of the turbulence protrusion.

[0009] Preferably, the heat sink is further provided with a fourth protrusion at its edge, the height of the fourth protrusion being greater than or equal to the height of the turbulence protrusion, and when there are multiple fourth protrusions, they are distributed at intervals.

[0010] Preferably, the thickness of the turbulence protrusion is 0.1-0.5 mm.

[0011] This utility model also provides a radiator, including multiple heat sinks and multiple heat pipes, wherein the heat pipes are located in the through holes of the heat sinks.

[0012] The beneficial effects of this utility model are as follows: The heat sink and radiator based on eddy current interference provided by this utility model, by setting eddy current protrusions and eddy current grooves on the heat sink, the airflow passes through the eddy current protrusions and eddy current grooves to form macroscopic eddies, reconstructing the airflow path, forming longitudinal and transverse composite eddies between the heat sinks, enhancing airflow mixing through secondary flow eddies, and accumulating laminar boundary layer on the surface of the heat sink, thereby improving heat dissipation efficiency; by setting spiral structure guide grooves in the eddy current grooves, after multiple heat sinks are stacked, the microstructure on the surface of the guide grooves between the upper and lower layers causes the airflow to form microscopic eddies when passing through the spiral structure guide grooves. The surface microstructure of the guide grooves generates high-frequency eddy currents, thereby accelerating the airflow and improving heat dissipation efficiency. Attached Figure Description

[0013] The accompanying drawings illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the principles of the present invention. These drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification.

[0014] Figure 1 This is a schematic diagram of the external structure of the heat sink in Example 1; Figure 2 for Figure 1 A magnified view of a portion of point A in the middle; Figure 3 for Figure 1 Schematic diagram of the cross-sectional structure at point BB; Figure 4 for Figure 3 A magnified view of a portion of point C in the middle; Figure 5 This is a schematic diagram of the heat sink in Example 2. Detailed Implementation

[0015] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, it should be noted that, for ease of description, only the parts relevant to the present invention are shown in the accompanying drawings.

[0016] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.

[0017] Example 1: Please refer to Figures 1 to 5 This embodiment 1 includes: A heat sink based on eddy current interference includes multiple corresponding through holes 1, multiple eddy current protrusions, and multiple eddy current grooves. The eddy current protrusions include a first protrusion 21 and a second protrusion 22. The first protrusion 21 and the second protrusion 22 are located on one side of the through hole 1 along the X-axis direction and on both sides of the through hole 1 along the Y-axis direction. The eddy current grooves include a first through groove 31 and a second through groove 32. The first through groove 31 is located at the outer edge of the first protrusion 21, and the second through groove 32 is located at the outer edge of the second protrusion 22.

[0018] In this embodiment 1, the horizontal direction of the through hole 1 is the X-axis direction, and the vertical direction is the Y-axis direction. When the heat sink is in operation, airflow will blow towards the heat sink along the Y-axis direction. By setting turbulence protrusions and turbulence grooves on the heat sink, the airflow passes through the turbulence protrusions and turbulence grooves to form macroscopic vortices, which reconstructs the airflow path. The composite vortex airflow path is no longer single, and longitudinal and transverse composite vortices are formed between the heat sinks. The airflow mixing is enhanced by the secondary flow vortex, and the laminar boundary layer accumulates on the surface of the heat sink, which improves the heat dissipation efficiency.

[0019] The first protrusion 21 and the second protrusion 22 are asymmetrical along the Y-axis. Both protrusions have triangular or trapezoidal cross-sectional structures. The height of the turbulence protrusions is 0.5-2mm. For ease of processing, the turbulence grooves and protrusions can be stamped simultaneously on the heat sink. Alternatively, depending on actual needs, the turbulence grooves can be stamped first, and then the turbulence protrusions can be welded onto the heat sink. Compared to existing planar heat dissipation surfaces, the turbulence protrusions and grooves can alter the airflow path, creating vortices, extending the contact time between the airflow and the heat sink surface, and improving heat dissipation efficiency.

[0020] The angle between the first protrusion 21 and the second protrusion 22 is 5-30°. The airflow forms a macroscopic vortex by passing through the turbulence protrusions and turbulence grooves, and forms a large-scale rotating airflow through the tilt angle of the first protrusion 21 and the second protrusion 22, thereby prolonging the contact time between the airflow and the surface of the heat sink and improving the heat dissipation efficiency.

[0021] Multiple guide channels 33 are also provided in the first through slot 31 and the second through slot 32. The guide channels 33 are spirally arranged with a spiral angle of 30-45° and a depth of 20-40% of the thickness of the heat sink. Each heat sink has a guide channel 33 in the turbulence groove. During normal operation, after multiple heat sinks are stacked, the microstructure on the surface of the guide channels 33 between the upper and lower layers causes the airflow to form micro-vortices when passing through the guide channels 33. The surface microstructure of the guide channels 33 generates high-frequency turbulence vortices, thereby accelerating the airflow and improving the heat dissipation efficiency.

[0022] A third protrusion 4 is provided at the edge of the through hole 1. The height of the third protrusion 4 is greater than or equal to the height of the turbulence protrusion. In the working state, after multiple heat sinks are stacked, the heat pipe 5 is fixedly connected in the through hole 1. The heat pipe 5 conducts the heat from the heat source to the heat sink. The third protrusion 4 can increase the contact area between the heat sink and the heat pipe 5, thereby improving the heat dissipation efficiency.

[0023] A fourth protrusion 6 is also provided at the edge of the heat sink. The height of the fourth protrusion 6 is greater than or equal to the height of the turbulence protrusion. When there are multiple fourth protrusions 6, they are distributed at intervals. In this embodiment, the fourth protrusion 6 is set at the edge of the heat sink parallel to the airflow direction. Its function is twofold: First, during the process of stacking heat sinks, one side of the fourth protrusion 6 is fixedly connected to the next layer of heat sink, and the other side is used to fixally connect to the previous layer of heat sink, so that there is a gap between the upper and lower layers of heat sink, providing space for the first protrusion 21, the second protrusion 22 and the third protrusion 4. Second, when the airflow passes through the heat sink, the interval is also the space through which the airflow passes. At the same time, the edge blocking allows the airflow to flow in the space for a longer time, improving the concentrated heat dissipation of the heat sink, thereby improving the heat dissipation efficiency of the heat sink.

[0024] The thickness of the turbulence protrusions is 0.1-0.5mm. By setting multiple turbulence protrusions in combination, they form staggered micro-guide vanes, which turbulent the airflow, thereby changing the airflow trajectory, increasing the heat dissipation density, and thus improving the heat dissipation efficiency.

[0025] Example 2, Reference Figure 5 A heat sink includes multiple heat sinks and multiple heat pipes 5 as in Embodiment 1. The heat pipes 5 are located inside the through holes 1 of the heat sinks, and their heat dissipation principle is the same as that in Embodiment 1, and will not be repeated here.

[0026] The heat sink based on eddy current interference provided by this utility model sets eddy current protrusions and eddy current grooves on the heat sink. The airflow passes through the eddy current protrusions and eddy current grooves to form macroscopic eddies, which reconstruct the airflow path and form longitudinal and transverse composite eddies between the heat sinks. The airflow path of the composite eddy current is no longer single. The airflow mixing is enhanced by secondary flow eddies, and the laminar boundary layer accumulates on the surface of the heat sink, which improves the heat dissipation efficiency. By setting spiral structure guide grooves in the eddy current grooves, after multiple heat sinks are stacked, the microstructure on the surface of the guide grooves between the upper and lower layers causes the airflow to form microscopic eddies when passing through the spiral structure guide grooves. The surface microstructure of the guide grooves generates high-frequency disturbance eddies, thereby accelerating the airflow and improving the heat dissipation efficiency.

[0027] In this description, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "X-axis," and "Y-axis," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the utility model.

[0028] Those skilled in the art should understand that the above embodiments are merely for clearly illustrating the present invention and are not intended to limit the scope of the present invention. For those skilled in the art, other changes or modifications can be made based on the above-described invention, and these changes or modifications still fall within the scope of the present invention.

Claims

1. A heat sink based on eddy current interference, characterized in that: It includes multiple corresponding through holes, multiple turbulence protrusions, and multiple turbulence grooves. The turbulence protrusions include a first protrusion and a second protrusion. The first protrusion and the second protrusion are located on one side of the through hole along the X-axis direction and on both sides of the through hole along the Y-axis direction. The turbulence grooves include a first through groove and a second through groove. The first through groove is located at the outer edge of the first protrusion, and the second through groove is located at the outer edge of the second protrusion.

2. The heat sink based on eddy current interference according to claim 1, characterized in that: The first and second protrusions are asymmetrical along the Y-axis. The first and second protrusions have a triangular or trapezoidal cross-section structure. The height of the turbulence protrusion is 0.5-2mm.

3. The heat sink based on eddy current interference according to claim 1, characterized in that: The angle between the first protrusion and the second protrusion is 5-30°.

4. The heat sink based on eddy current interference according to claim 1, characterized in that: The first and second through slots are further provided with multiple flow guide slots, which are spiral in shape, with a spiral angle of 30-45° and a depth of 20-40% of the thickness of the heat sink.

5. The heat sink based on eddy current interference according to claim 1, characterized in that: A third protrusion is provided at the edge of the through hole, and the height of the third protrusion is greater than or equal to the height of the turbulence protrusion.

6. The heat sink based on eddy current interference according to claim 1, characterized in that: The heat sink is also provided with a fourth protrusion at its edge. The height of the fourth protrusion is greater than or equal to the height of the turbulence protrusion. When there are multiple fourth protrusions, they are distributed at intervals.

7. The heat sink based on eddy current interference according to claim 1, characterized in that: The thickness of the turbulence protrusion is 0.1-0.5 mm.

8. A radiator, characterized in that: It includes multiple heat sinks and multiple heat pipes, wherein the heat sinks are the eddy current interference-based heat sinks according to any one of claims 1-7, and the heat pipes are located in the through holes of the heat sinks.