A power module

Abstract

The utility model provides a kind of power module, including main part and at least one power output terminal.The power output terminal includes the first part and the second part of being connected, first part is located in module, second part extends to module outside.Main part includes heat dissipation shell, it is spaced apart along vertical direction with power output terminal.The module further includes the heat dissipation block and insulating part corresponding being arranged between the second part of terminal and heat dissipation shell.The insulating part is fixed to heat dissipation block and is placed between the two, so that the heat of terminal can be sequentially passed through insulating part and heat dissipation block and be transferred to heat dissipation shell.The structure establishes insulation and efficient heat conduction path for exposed terminal, effectively improves its heat dissipation condition, improves the power output capacity and operating reliability of module.

Description

Technical Field

[0001] This utility model relates to the field of motor controllers, and more particularly to a power module. Background Technology

[0002] Power modules are core components of power electronic systems. They integrate power semiconductor chips and output high-current signals through power output terminals to drive loads such as motors. Typically, one part of the power output terminals is located inside the module package and connected to the chip electrodes; the other part extends to the outside of the module for connecting to busbars or cables. To control the chip's operating temperature, power modules are generally equipped with metal heat sinks, but their primary heat dissipation target is the heat source inside the module.

[0003] As power ratings and current densities continue to increase, the large currents flowing through the power output terminals generate significant Joule heat. This is especially true for terminals extending to the outside of the module, which traditionally lack effective heat dissipation paths, often remaining "suspended" or relying solely on natural air convection, making it difficult for heat to dissipate quickly. This leads to the formation of hot spots in these areas, potentially causing softening of the terminal materials and decreased connection reliability. Furthermore, heat conduction exacerbates the temperature rise at internal connection points, making it a critical bottleneck restricting the overall module's current output capability, power density, and long-term reliability.

[0004] In conclusion, there is currently no good solution to this problem. Utility Model Content

[0005] In order to overcome the above-mentioned technical defects, the purpose of this utility model is to provide a power module.

[0006] This utility model discloses a power module, characterized in that the power module includes a main body and at least one power output terminal; the power output terminal includes a first part and a second part; the first part and the second part are fixedly connected along a first direction; the first part is disposed inside the power module, and the second part extends outside the power module along the first direction. The main body includes a heat dissipation housing, which is spaced apart from the power output terminals in a second direction and extends along a first direction; the second direction is perpendicular to the first direction. The power module also includes a heat sink and an insulating element that are disposed in a one-to-one correspondence with the second part of at least one power output terminal; the heat sink is disposed on the side of the heat sink housing facing the second part in a first direction and extends along the second direction; the insulating element is fixedly connected to the heat sink and disposed between the heat sink and the second part, so that the heat of the second part is transferred to the heat sink housing in sequence through the insulating element and the heat sink.

[0007] Preferably, the power module further includes a heat sink and an insulating component that are respectively disposed in correspondence with the first part; the heat sink is disposed on the side of the heat sink housing facing the first part in the second direction and extends along the second direction; the insulating component is fixedly connected to the heat sink and disposed between the heat sink and the first part, so that the heat of the first part is transferred to the heat sink housing in sequence through the insulating component and the heat sink.

[0008] Preferably, the insulating element is at least one of an insulating film, an insulating pad, or an insulating coating.

[0009] Preferably, the heat sink and the heat sink housing are integrally formed into a single structure.

[0010] Preferably, the heat sink and the heat sink housing are separate structures that are fixed to each other, and the heat sink is made of copper or copper alloy.

[0011] Preferably, the thickness of the insulating component is 0.1mm to 2mm.

[0012] Preferably, the thermal conductivity of the insulating component is greater than or equal to 0.5 W / (m·K).

[0013] Preferably, the heat dissipation housing has water channels inside for coolant to pass through and exchange heat with the heat dissipation housing.

[0014] Preferably, the sidewalls of the heat dissipation housing have a smooth structure without heat dissipation ribs.

[0015] Compared with existing technologies, the above technical solution has the following advantages: 1. The power module provided in this application solves the problem of overheating of power output terminals and limitation of power output in the prior art by setting a dedicated heat conduction path composed of insulating components and heat sinks for the exposed power output terminals. It efficiently guides the heat on the terminals to the main heat dissipation housing. By combining the insulating components, it significantly improves the heat dissipation capacity and temperature uniformity of the terminals while ensuring absolute electrical safety and reliability, thereby enhancing the long-term operational reliability and service life of the power module under high current conditions. 2. Furthermore, by extending the heat dissipation structure to the internal terminals of the module and providing various implementation methods such as insulating films, gaskets, or coatings, efficient thermal management of the entire current path is achieved in an integrated manner. Diverse insulation solutions adapt to different processes, balancing insulation safety and production flexibility. Through the coordinated design of insulation thickness and thermal conductivity, sufficient insulation strength is ensured while minimizing thermal resistance, making the insulation layer itself an effective heat conduction channel and optimizing overall heat dissipation efficiency. 3. This application also provides two optimized solutions for the heat dissipation structure: a one-piece molding and a split design, each with its own advantages in reducing thermal resistance and facilitating manufacturing. Furthermore, by setting the heat dissipation housing as a smooth liquid cooling system, a leap from conductive heat dissipation to efficient convective heat transfer is achieved. This active liquid cooling design significantly improves the module's heat dissipation limit and thermal stability, enabling it to withstand extreme high thermal loads and providing a reliable foundation for achieving higher power density and more compact designs in power modules. Attached Figure Description

[0016] Figure 1 A schematic diagram of the power module provided in this application; Figure 2 A schematic diagram of the heat dissipation structure of the second part of the power module provided in this application; Figure 3 A partial structural schematic diagram of the power module provided in this application; Figure 4 A schematic diagram of the heat dissipation structure of the first part of the power module provided in this application.

[0017] Attached reference numerals: 100, power module; 1. Main body; 2. Heat dissipation housing; 3. Power output terminal; 31. First part; 32. Second part; 4. Heat sink; 5. Insulating components; x, the first direction; z, the second direction. Detailed Implementation

[0018] The advantages of this utility model are further illustrated below with reference to the accompanying drawings and specific embodiments.

[0019] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0020] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The singular forms “a,” “the,” and “the” as used in this disclosure and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0021] It should be understood that although the terms first, second, third, etc., may be used in this disclosure to describe various information, such information should not be limited to these terms. These terms are used only to distinguish information of the same type from one another. For example, without departing from the scope of this disclosure, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if," as used herein, can be interpreted as "when," "in response to determination," or "when," or "in the event of a determination." In the description of this utility model, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0022] In the description of this utility model, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "linking" should be interpreted broadly. For example, they can refer to mechanical or electrical connections, or internal connections between two components. They can be direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0023] In the following description, the use of suffixes such as "module," "part," or "unit" to denote elements is solely for the purpose of illustrating this invention and has no specific meaning in itself. Therefore, "module" and "part" can be used interchangeably.

[0024] Please see Figures 1-2 , Figure 1 A schematic diagram of the power module provided in this application; Figure 2 A schematic diagram of the heat dissipation structure of the second part of the power module provided in this application.

[0025] like Figures 1-2 As shown, this utility model discloses a power module 100, characterized in that the power module 100 includes a main body 1 and at least one power output terminal 3; the power output terminal 3 includes a first part 31 and a second part 32; the first part 31 and the second part 32 are fixedly connected along a first direction; the first part 31 is disposed inside the power module 100, and the second part 32 extends outside the power module 100 along the first direction; The main body 1 includes a heat dissipation housing 2, which is spaced apart from the power output terminal 3 in a second direction and extends along a first direction; the second direction is perpendicular to the first direction. The power module 100 also includes a heat sink 4 and an insulating member 5, which are disposed in a one-to-one correspondence with the second part 32 of at least one power output terminal 3. The heat sink 4 is disposed on the side of the heat sink housing 2 facing the second part 32 in a first direction and extends along the second direction. The insulating member 5 is fixedly connected to the heat sink 4 and is disposed between the heat sink 4 and the second part 32, so that the heat of the second part 32 is transferred to the heat sink housing 2 in sequence through the insulating member 5 and the heat sink 4.

[0026] The power module 100 provided in this application solves the problem of overheating and power output limitation of the power output terminal 3 in the prior art by setting a dedicated heat conduction path composed of an insulating component 5 and a heat sink 4 for the exposed power output terminal 3. It efficiently guides the heat on the terminal to the main heat dissipation housing 2. By combining the insulating component 5, it significantly improves the heat dissipation capacity and temperature uniformity of the terminal while ensuring absolute electrical safety and reliability, thereby enhancing the long-term operational reliability and service life of the power module 100 under high current conditions.

[0027] The above is an explanation of the basic concept of the power module 100 provided in this application. The following will describe the possible specific implementation methods of each component.

[0028] Similarly, heat dissipation treatment can also be applied to the first part 31.

[0029] Please see Figures 3-4 , Figure 3 A partial structural schematic diagram of the power module provided in this application; Figure 4 A schematic diagram of the heat dissipation structure of the first part of the power module provided in this application.

[0030] like Figures 3-4 As shown, by way of example, in one possible implementation, the power module 100 further includes a heat sink 4 and an insulating member 5 that are disposed one-to-one with the first part 31; the heat sink 4 is disposed on the side of the heat sink housing 2 facing the first part 31 in the second direction and extends along the second direction; the insulating member 5 is fixedly connected to the heat sink 4 and is disposed between the heat sink 4 and the first part 31, so that the heat of the first part 31 is transferred to the heat sink housing 2 in sequence through the insulating member 5 and the heat sink 4.

[0031] This solution extends the heat dissipation structure further to the first terminal section 31 inside the module, achieving integrated thermal management of the power terminals from the inside out. By actively conducting heat to the heat source within the module package, the junction temperature at the connection point between the terminal and the internal chip is effectively reduced, minimizing heat accumulation at the source. The combined internal and external heat dissipation design results in a more balanced temperature distribution throughout the current path, preventing localized overheating and significantly benefiting the reduction of thermal stress on interconnect materials and the maintenance of long-term connection stability.

[0032] The above describes the heat dissipation path of the first part 31 and the second part 32 of the power output terminal 3 of this application. The specific implementation of each component will be described below.

[0033] First, the specific implementation method of the insulating component 5 is not limited.

[0034] In one possible implementation, the insulating element 5 is at least one of an insulating film, an insulating pad, or an insulating coating.

[0035] This solution offers various insulation implementation methods, including insulating films, insulating pads, and insulating coatings, providing high flexibility and process adaptability in heat dissipation design. Different insulation forms can be matched with various manufacturing processes, from simple surface mounting to precision coating, meeting different cost control and automated production needs. The diverse options allow this heat dissipation solution to be easily integrated into various existing power module 100 package processes, providing a practical and diversified technical path for achieving efficient heat dissipation while ensuring reliable electrical isolation.

[0036] Furthermore, the thickness of the insulating component 5 is 0.1mm to 2mm.

[0037] The thickness of the insulating element 5 is limited to achieve an optimal synergy between electrical insulation performance and heat dissipation efficiency. This thickness range minimizes the thermal resistance of the insulation layer itself while providing sufficient insulation safety margin and preventing electric field breakdown. This allows the insulating element 5 to function as both a reliable electrical barrier and a link in an efficient heat conduction path, thereby optimizing the heat conduction capability of the entire heat dissipation path without sacrificing safety.

[0038] Furthermore, in one possible implementation, the thermal conductivity of the insulating component 5 is greater than or equal to 0.5 W / (m·K). This ensures that the insulating component 5 is not only an insulator but also an effective thermal conductor. The insulating component 5, possessing a certain thermal conductivity, can actively participate in the longitudinal transfer of heat, rather than merely existing as a heat insulation layer. This characteristic directly reduces the thermal resistance from the high-temperature terminal to the heat sink 4, thereby further improving heat dissipation efficiency.

[0039] Secondly, the specific implementation method of heat sink 4 is also not limited.

[0040] In one possible implementation, the heat sink 4 and the heat sink housing 2 are integrally formed as a single structure.

[0041] By integrating the heat sink 4 with the heat sink housing 2 into a single unit, the physical continuity and thermal integrity of the heat dissipation path are achieved. This integrated design completely eliminates contact thermal resistance between separate components, maximizing the theoretically optimal heat conduction efficiency from the insulating component 5 to the heat sink housing 2. Simultaneously, this structure reduces the number of assembly parts, simplifies the module assembly process, enhances overall mechanical strength and reliability, and avoids the risk of performance degradation of the heat dissipation interface due to tightening or vibration. It is highly suitable for applications with extremely high reliability and power density requirements.

[0042] In another possible implementation, the heat sink 4 can also be a separate structure that is fixed to the heat sink housing 2, and the heat sink 4 is made of copper or copper alloy.

[0043] This split structure optimizes both design and material selection. The split structure reduces the processing difficulty and complexity of the heat sink housing 2, improving production flexibility. Furthermore, the use of copper heat sink 4, with its excellent thermal conductivity, rapidly diffuses heat laterally, compensating for any increase in thermal resistance that might result from the split structure and ensuring efficient heat dissipation. This combination achieves a good balance between manufacturing convenience and heat dissipation performance.

[0044] Finally, the specific structure of the heat sink 2 is also not limited.

[0045] In one possible implementation, the interior of the heat dissipation housing 2 is provided with water channels for coolant to pass through and exchange heat with the heat dissipation housing 2.

[0046] By integrating liquid cooling channels within the heat sink housing 2, the heat dissipation method is upgraded from passive air cooling to active liquid cooling, significantly improving the module's heat dissipation capacity and heat sink stability. The coolant directly exchanges heat with the heat sink housing 2 efficiently, quickly removing heat introduced from the terminals and diffused through the housing. This design enables the power module 100 to withstand extremely harsh and continuous high thermal load conditions, providing a solid thermal management foundation for improving the module's current output capability.

[0047] Furthermore, the sidewall of the heat dissipation housing 2 is a smooth structure without heat dissipation ribs.

[0048] Finally, by designing the liquid-cooled sidewall of the heat sink housing 2 as a smooth structure without ribs, the flow resistance and heat transfer characteristics between it and the coolant are significantly optimized. The smooth inner wall reduces flow resistance, which helps to reduce water pump power consumption and promotes the smooth and uniform flow of coolant throughout the water channel, avoiding uneven heat transfer caused by local stagnation.

[0049] It should be noted that the embodiments of this utility model have better implementability and are not intended to limit this utility model in any way. Any person skilled in the art may use the above-disclosed technical content to change or modify it into equivalent effective embodiments. However, any modifications or equivalent changes and modifications made to the above embodiments based on the technical essence of this utility model without departing from the content of the technical solution of this utility model shall still fall within the scope of the technical solution of this utility model.

Claims

1. A power module, characterized in that, The power module includes a main body and at least one power output terminal; the power output terminal includes a first part and a second part; the first part and the second part are fixedly connected along a first direction; the first part is disposed inside the power module, and the second part extends outside the power module along the first direction. The main body includes a heat dissipation housing, which is spaced apart from the power output terminal in a second direction and extends along the first direction; the second direction is perpendicular to the first direction. The power module further includes a heat sink and an insulating element that correspond one-to-one with the second portion of the at least one power output terminal; the heat sink is disposed on the side of the heat sink housing facing the second portion in the first direction and extends along the second direction; the insulating element is fixedly connected to the heat sink and disposed between the heat sink and the second portion, so that the heat of the second portion is transferred to the heat sink housing in sequence through the insulating element and the heat sink.

2. The power module as described in claim 1, characterized in that, The power module further includes a heat sink and an insulating component that are arranged one-to-one with the first part; the heat sink is disposed on the side of the heat sink housing facing the first part in the second direction and extends along the second direction; the insulating component is fixedly connected to the heat sink and is disposed between the heat sink and the first part, so that the heat of the first part is transferred to the heat sink housing in sequence through the insulating component and the heat sink.

3. The power module as described in claim 1, characterized in that, The insulating element is at least one of an insulating film, an insulating pad, or an insulating coating.

4. The power module as described in claim 1, characterized in that, The heat sink and the heat sink housing are integrally formed as a single unit.

5. The power module as described in claim 1, characterized in that, The heat sink and the heat sink housing are separate structures that are fixed to each other, and the heat sink is made of copper or copper alloy.

6. The power module as described in claim 3, characterized in that, The thickness of the insulating component is 0.1mm to 2mm.

7. The power module as described in claim 6, characterized in that, The thermal conductivity of the insulating component is greater than or equal to 0.5 W / (m·K).

8. The power module as described in claim 1, characterized in that, The heat dissipation housing has water channels inside for coolant to pass through and exchange heat with the heat dissipation housing.

9. The power module as described in claim 8, characterized in that, The sidewalls of the heat dissipation housing have a smooth structure without heat dissipation ribs.

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