Modular assembly structure for IGBTs

Abstract

The utility model relates to the field of power electronics technology especially, it relates to a kind of IGBT modular assembly structure, it includes fin and at least one IGBT device, IGBT device includes main body and soldering pin, main body is connected with soldering pin, further include rear cover and connecting component, at least one pin via is provided in rear cover, rear cover is connected with fin by connecting component, and main body is fixedly arranged between rear cover and fin, soldering pin matches and passes through pin via to the outside of rear cover.The installation space is formed between rear cover and fin, IGBT device is arranged in installation space, then fixed by connecting component, form modular assembly, in the case where the heat dissipation performance of IGBT device is guaranteed, assembly efficiency is significantly improved;And, the connecting component made of metal does not contact with IGBT device, reduces the risk of poor insulation withstand voltage, beneficial to modular use.

Description

Technical Field

[0001] This utility model relates to the field of power electronics technology, and in particular to an IGBT modular assembly structure. Background Technology

[0002] IGBT devices are also called insulated gate bipolar transistors. To ensure heat dissipation, during assembly, IGBT devices are fixed to a heat sink by screws passing through mounting holes on the IGBT device. When assembling multiple IGBT devices, each IGBT device is fixed with one screw. This assembly method is inefficient and not conducive to modular applications. Utility Model Content

[0003] The technical problem solved by this utility model is to provide a modular assembly structure for IGBTs with high assembly efficiency.

[0004] The technical solution adopted by this utility model to solve its technical problem is: IGBT modular assembly structure, including heat sink and at least one IGBT device. The IGBT device includes a body and solder pins. The body is connected to the solder pins. It also includes a back cover and a connecting assembly. The back cover is provided with at least one pin through hole. The back cover and the heat sink are connected by the connecting assembly. The body is fixedly disposed between the back cover and the heat sink. The solder pins are matched and pass through the pin through hole to the outside of the back cover.

[0005] Furthermore, the heat sink has a mounting slot, the main body is fixedly installed in the mounting slot, and the heat sink is fitted to the back cover around its perimeter.

[0006] Furthermore, the back cover is provided with at least one elastic pressure plate, which fixes the main body on the heat sink, and the elastic pressure plate corresponds one-to-one with the main body.

[0007] Furthermore, an insulating and thermally conductive adhesive tape is installed between the main body and the heat sink.

[0008] Furthermore, the connecting assembly includes a screw connection structure, which includes a connecting screw, a connecting through hole provided on the heat sink, and a connecting threaded groove provided on the back cover. The connecting screw passes through the connecting through hole and matches the connecting threaded groove, and the connecting screw, the connecting through hole, and the connecting threaded groove correspond one-to-one.

[0009] Furthermore, the back cover is provided with at least one height-limiting support post, the direction of which is the same as the direction of the welding pin.

[0010] Furthermore, the rear cover is equipped with four height-limiting support columns, which are respectively located at the four corners of the rear cover, and the connecting threaded groove is located at one end of the height-limiting support column.

[0011] Furthermore, at least one height-limiting support column has a PCB connection positioning column at its other end.

[0012] Furthermore, the connecting components also include a snap-fit ​​structure.

[0013] Furthermore, it also includes a heat dissipation enhancer, with heat sinks fixedly mounted on the heat dissipation enhancer.

[0014] The beneficial effects of this utility model are as follows: By providing a back cover and a connecting assembly, the back cover has at least one pin through-hole. The back cover and the heat sink are connected by the connecting assembly, and the main body is fixedly disposed between the back cover and the heat sink. The soldered pins pass through the pin through-hole to the outside of the back cover. By forming an installation space between the back cover and the heat sink, the IGBT device is placed in the installation space and then fixed by the connecting assembly, forming a modular assembly. This significantly improves assembly efficiency while ensuring the heat dissipation performance of the IGBT device. Furthermore, the metal connecting assembly does not come into contact with the IGBT device, reducing the risk of poor insulation withstand voltage and facilitating modular application. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the present invention; Figure 2 This is an exploded view of the present invention; Figure 3 This is a schematic diagram of the present invention assembled on a PCB board; Figure 4 yes Figure 3 A sectional view; Components, parts and numbers in the figure: Heat sink 1, mounting slot 11, connection via 12, IGBT device 2, main body 21, solder pin 22, back cover 3, pin via 31, elastic pressure plate 32, connecting screw 41, snap-fit ​​structure 42, height limiting support column 5, PCB connection positioning column 6, heat dissipation enhancer 7, insulating thermal conductive tape 8, PCB board 9. Detailed Implementation

[0016] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0017] like Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, the modular assembly structure of this utility model for IGBTs includes a heat sink 1 and at least one IGBT device 2. The IGBT device 2 includes a body 21 and solder leads 22, with the body 21 connected to the solder leads 22. It also includes a back cover 3 and a connecting assembly. The back cover 3 has at least one pin via 31. The back cover 3 is connected to the heat sink 1 via the connecting assembly, and the body 21 is fixedly disposed between the back cover 3 and the heat sink 1. The solder leads 22 pass through the pin via 31 to the outside of the back cover 3. When the pin via 31 is a small hole, each solder lead 22 corresponds to a pin via 31. When the pin via 31 is a large strip-shaped hole, multiple solder leads 22 correspond to one pin via 31.

[0018] Heat sink 1 serves to dissipate heat. Heat sink 1 and back cover 3 are arranged side by side, forming an installation space between the back cover 3 and heat sink 1. IGBT device 2 is placed in the installation space and then fixed by connecting components to form a modular assembly. While ensuring the heat dissipation performance of IGBT device 2, the assembly efficiency is significantly improved. Furthermore, the metal connecting components will not come into contact with IGBT device 2, reducing the risk of poor insulation withstand voltage and facilitating modular application.

[0019] Specifically, in order to improve the fixing effect of IGBT device 2, for example... Figure 2 As shown, the heat sink 1 has a mounting groove 11, and the main body 21 is fixedly installed in the mounting groove 11. The heat sink 1 is fitted with the back cover 3 around its perimeter. The mounting groove 11 has a groove-shaped structure. This design not only improves the fixing effect of the IGBT device 2, but also places the main body 21 of the IGBT device 2 inside the mounting space formed between the back cover 3 and the heat sink 1, protecting the main body 21 and improving its service life.

[0020] Based on the number of main bodies 21, the main bodies 21 are evenly arranged in the mounting groove 11, and the back cover 3 is made of plastic with a certain strength. To further improve the fixing effect of the IGBT device 2, for example... Figure 2 As shown, an elastic pressure plate 32 is provided in the back cover 3. The elastic pressure plate 32 fixes the main body 21 onto the heat sink 1, and the elastic pressure plate 32 corresponds one-to-one with the main body 21. The elastic pressure plate 32 applies pressure to the main body 21 installed in the mounting groove 11, so that the main body 21 is tightly pressed against the bottom of the mounting groove 11. To ensure good insulation and withstand voltage of the IGBT device 2, an insulating and thermally conductive adhesive tape 8 is provided between the main body 21 and the heat sink 1. The insulating and thermally conductive adhesive tape 8 not only has good insulation and withstand voltage function, but also has a certain thermal conductivity requirement to ensure that the heat generated by the IGBT device 2 is quickly conducted away.

[0021] The connecting component serves to connect the back cover 3 to the heat sink 1. For ease of maintenance, the connecting component preferably allows for a detachable connection between the back cover 3 and the heat sink 1. For quick assembly, for example... Figure 1 Figure 2 As shown, the connecting component is preferably a snap-fit ​​structure 42, which includes a snap-fit ​​on the side of the rear cover 3 and a hook on the side of the heat sink 1. The snap-fit ​​and hook are detachably connected. To improve the connection strength, the connecting component includes a screw connection structure, which includes a connecting screw 41, a connecting through hole 12 on the heat sink 1, and a connecting threaded groove on the rear cover 3. The connecting screw 41 passes through the connecting through hole 12 and matches the connecting threaded groove. The connecting screw 41, the connecting through hole 12, and the connecting threaded groove correspond one-to-one. Of course, the screw connection structure and the snap-fit ​​structure 42 can also be used together, which provides a better connection effect, but the cost is relatively higher.

[0022] To further improve the heat dissipation performance of the entire IGBT modular assembly structure, for example... Figure 3 As shown, this utility model also includes a heat dissipation enhancer 7, and the heat sink 1 is fixedly mounted on the heat dissipation enhancer 7.

[0023] This utility model's IGBT modular assembly structure is soldered to the PCB board 9 via pin vias 31. To ensure consistency in the mounting height of the IGBT module and the PCB, and to prevent the heat generated by the IGBT from affecting other components on the PCB, a certain gap is required between the main body 21 and the PCB board 9. At least one height-limiting support post 5 is provided on the back cover 3, with the direction of the height-limiting support post 5 being the same as the direction of the soldered pins 22. The height-limiting support post 5 is attached to the PCB board 9, allowing the main body 21 and the PCB board 9 to be spaced apart. To ensure the effectiveness of the height-limiting support post 5, further... Figure 3 As shown, the rear cover 3 is provided with four height-limiting support columns 5, which are respectively located at the four corners of the rear cover 3. The connecting threaded groove is located at one end of the height-limiting support column 5. Setting the connecting threaded groove on the height-limiting support column 5 will not affect the main body of the rear cover 3, thus ensuring the overall strength of the rear cover 3.

[0024] To facilitate the assembly and positioning of the IGBT modular assembly structure with the PCB board, for example... Figure 1 , Figure 2 , Figure 4 As shown, at least one height-limiting support column 5 has a PCB connection positioning column 6 at its other end. Of course, the positioning column 6 can also be set independently on the height-limiting support column 5. The PCB connection positioning column 6 is inserted into the positioning hole of the PCB board 9 to form a positioning structure.

Claims

1. An IGBT modular assembly structure, comprising a heat sink (1) and at least one IGBT device (2), wherein the IGBT device (2) comprises a body (21) and solder pins (22), the body (21) being connected to the solder pins (22), characterized in that: It also includes a back cover (3) and a connecting assembly. The back cover (3) has at least one pin via (31). The back cover (3) is connected to the heat sink (1) through the connecting assembly. The main body (21) is fixedly disposed between the back cover (3) and the heat sink (1). The soldered pins (22) are matched and pass through the pin via (31) to the outside of the back cover (3).

2. The IGBT modular assembly structure as described in claim 1, characterized in that: The heat sink (1) has a mounting groove (11), and the main body (21) is fixedly installed in the mounting groove (11). The heat sink (1) is attached to the back cover (3) around its perimeter.

3. The IGBT modular assembly structure as described in claim 1, characterized in that: At least one elastic pressure plate (32) is provided in the back cover (3). The elastic pressure plate (32) fixes the main body (21) on the heat sink (1), and the elastic pressure plate (32) corresponds to the main body (21) one by one.

4. The IGBT modular assembly structure as described in claim 1, characterized in that: An insulating thermally conductive tape (8) is provided between the main body (21) and the heat sink (1).

5. The IGBT modular assembly structure as described in claim 1, characterized in that: The connecting assembly includes a screw connection structure, which includes a connecting screw (41), a connecting through hole (12) provided on the heat sink (1), and a connecting thread groove provided on the back cover (3). The connecting screw (41) passes through the connecting through hole (12) and matches the connecting thread groove. The connecting screw (41), the connecting through hole (12), and the connecting thread groove correspond one-to-one.

6. The IGBT modular assembly structure as described in claim 5, characterized in that: At least one height-limiting support post (5) is provided on the back cover (3), and the direction of the height-limiting support post (5) is the same as the direction of the welding pin (22).

7. The IGBT modular assembly structure as described in claim 5, characterized in that: The rear cover (3) is provided with four height-limiting support columns (5). The four height-limiting support columns (5) are respectively located at the four corners of the rear cover (3), and the connecting thread groove is located at one end of the height-limiting support column (5).

8. The IGBT modular assembly structure as described in claim 7, characterized in that: At least one height-limiting support column (5) has a PCB connection positioning column (6) at the other end.

9. The IGBT modular assembly structure as described in claim 1, characterized in that: The connecting components include a snap-fit ​​structure (42).

10. The IGBT modular assembly structure as described in any one of claims 1 to 9, characterized in that: It also includes a heat dissipation enhancer (7), with the heat sink (1) fixedly mounted on the heat dissipation enhancer (7).

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