An image sensor package structure

Abstract

The utility model provides a kind of image sensor packaging structure, it is related to the field of semiconductor packaging, including image sensor, substrate, side wall, transparent cover plate and transparent grid;Image sensor is located the upper plate surface of substrate;Image sensor is electrically connected by lead with substrate;Side wall is arranged around the rim of substrate;Transparent cover plate is sealed and fixed with the top of side wall;Transparent grid is located between substrate and transparent cover plate;Transparent grid includes a plurality of first baffle being arranged along front and back direction and a plurality of second baffle being arranged along left and right direction;First baffle and second baffle are vertically arranged;The board face of first baffle and the board face of second baffle are perpendicular intersection;First baffle and second baffle are fixed with the inner wall of side wall;The board face of first baffle and the board face of second baffle are roughened treatment.The utility model can solve the problem that in prior art, oblique light is easy to be reflected to photosensitive area of image sensor by side wall mirror surface, and form stray light interference, affect normal work of image sensor.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging, and in particular to an image sensor packaging structure. Background Technology

[0002] An image sensor is a core component of an image device that converts optical sensing signals into electronic signals. When packaging an image sensor, it is usually electrically connected to the substrate, typically by wire bonding. Pads or other electrical connection points are provided on the substrate to connect the image sensor to external electronic circuits, enabling signal sensing, processing, and interaction. The specific structure is shown in Chinese patent application number 202320409187.5, which discloses a low-noise image sensor packaging structure.

[0003] When using the image sensor packaging structure provided by the above patent, if oblique light rays above the transparent cover, such as ambient light that is not incident perpendicularly, illuminate the straight inner wall of the side wall, they are easily reflected by the side wall. If the reflected light rays are concentrated towards the photosensitive area of ​​the image sensor, stray light interference will be formed. This stray light will cause the signal-to-noise ratio of the optical signal received by the photosensitive area of ​​the image sensor to decrease, specifically manifested as glare, ghosting, or reduced contrast in the image, affecting the normal operation of the image sensor. Utility Model Content

[0004] To address the aforementioned problems, this utility model provides an image sensor packaging structure that can solve the problem in the prior art where obliquely incident light rays are easily reflected through the side wall mirrors to the photosensitive area of ​​the image sensor, forming stray light interference and affecting the normal operation of the image sensor; thereby reducing stray light received by the image sensor.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: This utility model provides an image sensor packaging structure, including an image sensor, a substrate, a sidewall, a transparent cover plate, and a transparent grid; If the substrate is horizontally arranged, the image sensor is located on the upper surface of the substrate; the image sensor is electrically connected to the substrate via leads; the sidewall is arranged around the edge of the substrate; the transparent cover is sealed and fixed to the top of the sidewall; The transparent grid is located between the substrate and the transparent cover plate; the transparent grid includes a plurality of first partitions arranged in the front-to-back direction and a plurality of second partitions arranged in the left-to-right direction; both the first and second partitions are vertically arranged; the surface of the first partition intersects the surface of the second partition perpendicularly; all the first partitions are equidistant; all the second partitions are equidistant; the distance between two adjacent first partitions is equal to the distance between two adjacent second partitions; both the first and second partitions are fixed to the inner wall of the side wall; The surfaces of the first partition and the second partition are roughened.

[0006] The image sensor packaging structure provided by this utility model preferably has rounded edges on the first and second partitions.

[0007] The image sensor packaging structure provided by this utility model preferably has a light-shielding groove formed on the upper surface of the substrate; the image sensor is located in the light-shielding groove; and the top surface of the image sensor is higher than the upper surface of the substrate.

[0008] The above technical solution has the following advantages or beneficial effects: The image sensor packaging structure provided by this utility model includes a transparent grille for filtering ambient light that can be reflected by the mirror surface of the inner wall of the sidewall and reach the photosensitive area of ​​the image sensor. Specifically, the transparent grille is placed between a substrate and a transparent cover plate to process ambient light entering the sidewall. The transparent grille includes several first partitions arranged in the front-back direction and several second partitions arranged in the left-right direction. The first and second partitions are both vertically arranged, and the surfaces of the first and second partitions intersect perpendicularly, forming grille gaps between the two first and two second partitions. It should be noted that all the first and second partitions are equidistant, and the distance between two adjacent first partitions is equal to the distance between two adjacent second partitions. This ensures that each grille gap of the transparent grille is of equal size, allowing ambient light to pass through the transparent grille uniformly, thereby enabling the photosensitive area of ​​the image sensor to receive uniform ambient light and generate a clear image. In order to encapsulate the transparent grille into the image sensor... Within the sensor packaging structure, both the first and second partitions are fixed to the inner wall of the sidewall. To filter ambient light that can be reflected by the mirror of the inner wall of the sidewall to the photosensitive area of ​​the image sensor, the surfaces of the first and second partitions are roughened. The roughened surfaces can cause diffuse reflection of large-angle incident light (where large-angle incident light refers to incident light with a large angle to the vertical), causing the large-angle incident light to reflect irregularly in different directions, thus preventing it from reaching the inner wall of the sidewall for mirror reflection. It should also be noted that if incident light perpendicular to the surface of the transparent cover passes through the transparent grille, since the grille is transparent and its top is not roughened, the incident light can pass directly through the first and second partitions. And if small-angle incident light passes through the gap of the grille adjacent to the inner wall of the sidewall, it can still produce mirror reflection with the inner wall of the sidewall, but because the incident light angle is small, the resulting mirror reflection light still cannot reach the photosensitive area of ​​the image sensor. In existing technologies, obliquely incident light is easily reflected by the side wall mirrors to the photosensitive area of ​​the image sensor, creating stray light interference and affecting the normal operation of the image sensor. The image sensor packaging structure provided by this utility model, by setting a transparent grid and roughening the surfaces of the first and second partitions in the transparent grid, causes diffuse reflection when large-angle incident light comes into contact with the partition surfaces, thus preventing large-angle incident light from reaching the inner wall of the side wall for specular reflection and reducing stray light interference caused by obliquely incident light. Attached Figure Description

[0009] The present invention, its features, shape, and advantages will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings. Like reference numerals denote like parts throughout the drawings. The drawings are not intentionally drawn to scale; the focus is on illustrating the gist of the invention.

[0010] Figure 1 This is a cross-sectional schematic diagram of the image sensor packaging structure provided in Embodiment 1 of this utility model.

[0011] Figure 2 This is a three-dimensional structural diagram of the transparent grille in Embodiment 1 of this utility model. Detailed Implementation

[0012] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.

[0013] Example 1: like Figures 1-2 As shown, the image sensor packaging structure provided in Embodiment 1 of this utility model includes an image sensor 1, a substrate 2, a sidewall 3, a transparent cover plate 4, and a transparent grid 5; If the substrate 2 is set horizontally, the image sensor 1 is located on the upper surface of the substrate 2; the image sensor 1 and the substrate 2 are electrically connected through lead wire 0; the side wall 3 is set around the edge of the substrate 2; the transparent cover plate 4 is sealed and fixed to the top of the side wall 3. A transparent grille 5 is located between the substrate 2 and the transparent cover plate 4; the transparent grille 5 includes several first partitions 51 arranged in the front-to-back direction and several second partitions 52 arranged in the left-to-right direction; both the first partitions 51 and the second partitions 52 are vertically arranged; the surface of the first partition 51 intersects the surface of the second partition 52 perpendicularly; all the first partitions 51 are equidistant; all the second partitions 52 are equidistant; the distance between two adjacent first partitions 51 is equal to the distance between two adjacent second partitions 52; both the first partitions 51 and the second partitions 52 are fixed to the inner wall of the side wall 3; The surfaces of the first partition 51 and the second partition 52 are roughened.

[0014] When using the image sensor packaging structure provided in Embodiment 1 of this utility model, ambient light enters the inner side of the side wall 3 from the transparent cover plate 4. After being filtered by the transparent grid 5, the ambient light illuminates the photosensitive area on the upper surface of the image sensor 1, enabling the image sensor 1 to receive the light signal. Specifically, when the ambient light passes through the transparent grid 5, vertically incident ambient light can directly pass through the first partition 51 or the second partition 52, while a portion of the obliquely incident ambient light (with a small angle to the vertical, such as 30 degrees) can directly pass through the grid gap formed by the first partition 51 and the second partition 52, and the remainder (with a larger angle to the vertical) can pass through the grid gap. (e.g., greater than 30 degrees) When the ambient light shines on the surface of the first partition 51 or the second partition 52, the rough sidewall causes diffuse reflection of the incident ambient light, reducing stray light generated by the specular reflection of the sidewall 3. It should be noted that the intensity of the ambient light incident at an angle passing through the grid gap formed by the first partition 51 and the second partition 52 can be controlled by adjusting the distance between the first partition 51 and the second partition 52. For example, increasing the distance between the first partition 51 and the second partition 52 can allow ambient light with an angle of 40 degrees to the vertical to pass through the grid gap formed by the first partition 51 and the second partition 52.

[0015] The image sensor packaging structure provided in Embodiment 1 of this utility model includes a transparent grille 5 for filtering ambient light that can be reflected by the mirror surface of the inner wall of the side wall 3 to the photosensitive area of ​​the image sensor 1. Specifically, the transparent grille 5 is placed between the substrate 2 and the transparent cover plate 4 to process the ambient light entering the side wall 3. The transparent grille 5 includes several first partitions 51 arranged in the front-back direction and several second partitions 52 arranged in the left-right direction. The first partitions 51 and the second partitions 52 are both vertically arranged, and the surface of the first partition 51 intersects the surface of the second partition 52 perpendicularly, so that the two first partitions 51 and the two second partitions 52 form a grille gap. It should be noted that all the first partitions 51 are equidistant, all the second partitions 52 are equidistant, and the distance between two adjacent first partitions 51 is equal to the distance between two adjacent second partitions 52, so that the size of each grille gap of the transparent grille 5 is equal, thereby allowing ambient light to pass through the transparent grille 5 evenly, so that the photosensitive area of ​​the image sensor 1 receives uniform ambient light and generates a clear image. In order to enable the transparent grille 5 to filter ambient light, the transparent grille 5 is designed to filter ambient light that can be reflected by the mirror surface of the inner wall of the side wall 3 to the photosensitive area of ​​the image sensor 1. The grille 5 is encapsulated within the image sensor packaging structure, with both the first partition 51 and the second partition 52 fixed to the inner wall of the side wall 3. To filter ambient light that can be reflected by the mirror surface of the inner wall of the side wall 3 to the photosensitive area of ​​the image sensor 1, the surfaces of the first partition 51 and the second partition 52 are roughened. This roughening process allows for diffuse reflection of large-angle incident light (where large-angle incident light refers to light with a large angle to the vertical), causing it to reflect irregularly in different directions, thus reducing the intensity of light reflection. The incident light cannot reach the inner wall of the side wall 3 and undergo specular reflection. It should also be noted that if the incident light perpendicular to the surface of the transparent cover plate 4 passes through the transparent grille 5, since the transparent grille 5 is transparent and the top is not roughened, the incident light can directly pass through the first partition 51 and the second partition 52. And if the incident light at a small angle passes through the grille gap of the inner wall of the adjacent side wall 3, it can still produce specular reflection with the inner wall of the side wall 3. However, since the incident light angle is small, the specular reflected light produced still cannot reach the photosensitive area of ​​the image sensor 1. In existing technologies, obliquely incident light is easily reflected by the side wall mirrors to the photosensitive area of ​​the image sensor, forming stray light interference and affecting the normal operation of the image sensor. By adopting the image sensor packaging structure provided in Embodiment 1 of this utility model, a transparent grille 5 is set, and the surfaces of the first partition 51 and the second partition 52 in the transparent grille 5 are roughened, so that when large-angle incident light comes into contact with the surface of the partition, it is diffusely reflected, thereby preventing large-angle incident light from reaching the inner wall of the side wall 3 and undergoing specular reflection, thus reducing stray light interference formed by obliquely incident light.

[0016] like Figure 2As shown, in the image sensor packaging structure provided in Embodiment 1 of this utility model, preferably, since some large-angle oblique light may irradiate the edges of the first partition 51 and the second partition 52, forming refracted light, the refracted light may pass through the first partition 51 and the second partition 52 and irradiate the photosensitive area of ​​the image sensor 1, thereby forming stray light; in order to solve this problem, specifically, the edges of the first partition 51 and the second partition 52 are rounded, so that the angle of the refracted light is shifted, avoiding the refracted light from irradiating the photosensitive area of ​​the image sensor 1, and further reducing the impact of stray light on the operation of the image sensor 1.

[0017] like Figure 1 As shown in Embodiment 1 of this utility model, the image sensor packaging structure preferably includes a light-shielding groove 21 on the upper surface of the substrate 2 to further reduce the influence of stray light on the operation of the image sensor 1. The image sensor 1 is located in the light-shielding groove 21, and the top surface of the image sensor 1 is higher than the upper surface of the substrate 2. If ambient light still passes through the inner wall of the side wall 3 and generates specular reflection, part of the reflected light can be blocked by the upper surface of the substrate 2 protruding from the image sensor 1, thereby reducing the influence of reflected light on the image sensor 1.

[0018] like Figure 1 As shown, in the image sensor packaging structure provided in Embodiment 1 of this utility model, preferably, a plurality of solder balls 6 are also provided on the bottom of the substrate for electrical connection with electronic circuits to realize circuit interconnection.

[0019] In summary, the image sensor packaging structure provided by this utility model can solve the problem in the prior art where oblique light rays are easily reflected through the side wall mirrors to the photosensitive area of ​​the image sensor, forming stray light interference and affecting the normal operation of the image sensor; thus reducing the stray light received by the image sensor.

[0020] Those skilled in the art should understand that variations can be implemented by combining existing technology and the above embodiments, and will not be elaborated here. Such variations do not affect the substantive content of this utility model, and will not be elaborated here.

[0021] The preferred embodiments of this utility model have been described above. It should be understood that this utility model is not limited to the specific embodiments described above, and the devices and structures not described in detail should be understood as being implemented in a conventional manner in the art; any possible variations and modifications made by those skilled in the art without departing from the technical solution of this utility model, or equivalent embodiments with equivalent changes, do not affect the essential content of this utility model. Therefore, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from the content of the technical solution of this utility model, shall still fall within the protection scope of the technical solution of this utility model.

Claims

1. An image sensor packaging structure, characterized in that, Includes image sensor, substrate, sidewalls, transparent cover plate and transparent grid; If the substrate is horizontally arranged, the image sensor is located on the upper surface of the substrate; the image sensor is electrically connected to the substrate via leads; the sidewall is arranged around the edge of the substrate; the transparent cover is sealed and fixed to the top of the sidewall; The transparent grid is located between the substrate and the transparent cover plate; the transparent grid includes a plurality of first partitions arranged in the front-to-back direction and a plurality of second partitions arranged in the left-to-right direction; both the first and second partitions are vertically arranged; the surface of the first partition intersects the surface of the second partition perpendicularly; all the first partitions are equidistant; all the second partitions are equidistant; the distance between two adjacent first partitions is equal to the distance between two adjacent second partitions; both the first and second partitions are fixed to the inner wall of the side wall; The surfaces of the first partition and the second partition are roughened.

2. The image sensor packaging structure as described in claim 1, characterized in that, The edges of the first partition and the second partition are rounded.

3. The image sensor packaging structure as described in claim 1, characterized in that, A light-shielding groove is formed on the upper surface of the substrate; the image sensor is located in the light-shielding groove; the top surface of the image sensor is higher than the upper surface of the substrate.

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