Double-ball patch infrared receiving head

Abstract

The utility model discloses a kind of double-ball patch infrared receiving head, comprising: a double-sided wiring PCB board, its lower surface is equipped with 4 PIN feet for SMT patch;An infrared receiving processing chip and two photosensitive chips are fixed on the upper surface of the PCB board, and are connected with PCB board wiring by welding wire;An anti-interference shield cover is covered on the upper surface of the PCB board, and the infrared receiving processing chip and two photosensitive chips are wrapped.The utility model provides a kind of double-ball patch infrared receiving head with structural innovation, efficient production and superior performance.

Description

Technical Field

[0001] This utility model relates to the field of infrared receiving device technology, specifically to a dual-sphere patch infrared receiving head. Background Technology

[0002] Traditional patch infrared receivers typically employ a pre-injection molding and subsequent lead-cutting encapsulation process. This process relies on specialized lead-cutting molds and molding equipment, resulting in a cumbersome production workflow that not only increases equipment and mold costs but also limits further improvements in production efficiency. Furthermore, these receivers offer limited shielding against electromagnetic interference (EMI) and generally suffer from insufficient light-gathering capabilities, making it difficult to meet the increasingly demanding application requirements in terms of receiving sensitivity and effective range. Therefore, the industry urgently needs a novel patch infrared receiver structure that combines high production efficiency, strong anti-interference capabilities, and high receiving sensitivity. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a dual-sphere patch infrared receiver head with innovative structure, high production efficiency, and superior performance.

[0004] To achieve the above objectives, the present invention adopts the following specific technical solution: A dual-sphere surface-mount infrared receiver head, the core of which lies in using a PCB board as the main body for carrying and electrical connection. The PCB board is a double-sided board, with four symmetrically distributed pins on its lower surface, forming a standard SMT surface-mount interface; its upper surface is fixed with an infrared receiving processing chip and two photosensitive chips through die bonding. These chips are electrically interconnected with the wiring on the upper surface of the PCB board through precise wire bonding technology.

[0005] One of the key improvements is the inclusion of an anti-interference shielding cover on top of the PCB board. This shielding cover is made of thin iron material that has undergone electroplating. Its shape matches the upper surface of the PCB board, and it is firmly soldered to the PCB board using an SMT mounting process (applying solder paste followed by reflow soldering) to form a sealed metal cavity that completely encloses the infrared receiving and processing chip and the photosensitive chip, thus constituting an effective electromagnetic shielding barrier.

[0006] Furthermore, a light-filtering molding compound is positioned directly above each of the two photosensitive chips. This molding compound is securely fastened to the corresponding window on the anti-interference shield using a snap-fit ​​method. Its material filters out most visible light interference while ensuring effective infrared transmission. Notably, the top of each light-filtering molding compound is molded into a spherical structure; this double-spherical design acts as a focusing lens, converging a wider range of infrared signals onto the photosensitive chip, significantly improving receiving sensitivity.

[0007] As a preferred embodiment, a large-area grounding (GND) wiring layer is laid on the upper surface of the PCB board, particularly below the chip and bonding wire areas. This GND layer, together with the iron shield above, forms a dual anti-interference system that can effectively isolate external electromagnetic noise and ensure the purity of signal transmission between chips.

[0008] Compared with the prior art, the present invention has the following significant advantages: 1. PCB board packaging eliminates the need for component brackets, reducing material costs; 2. Small size and high assembly density make it suitable for automated SMT production, improving production efficiency; 3. The combination of anti-interference shielding cover and GND wiring effectively improves the ability to resist electromagnetic interference; 4. Spherical light-filtering molding compound can focus light and filter out visible light, improving receiving sensitivity and distance. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of the internal structure of the present invention; Figure 2 Wiring diagram on PCB board; Figure 3 This is the wiring diagram under the PCB board; Figure 4 This is a schematic diagram of the internal solder wire connections.

[0010] In the diagram: 1- PCB board, 2- PIN pin, 3- Infrared receiver processing chip, 4- Photosensitive chip, 5- Bonding wire, 6- Anti-interference shielding cover, 7- Light filter molding compound. Detailed Implementation

[0011] The present invention will be further described below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and should not be used to limit the scope of protection of the present invention.

[0012] See Figures 1-4 This utility model provides a dual-ball patch infrared receiver head, the main body of which is a double-sided PCB board 1. The lower surface of the PCB board 1 is provided with four pins 2 for surface mounting, and its layout conforms to the standard SMT packaging specification.

[0013] On the upper surface of PCB board 1, an infrared receiving and processing chip 3 and two discrete photosensitive chips 4 are fixed with insulating adhesive. The infrared receiving and processing chip 3 is responsible for signal amplification, filtering, and demodulation, while the two photosensitive chips 4 are used to receive infrared light signals. They are electrically connected to the pre-designed circuit wiring on the upper surface of PCB board 1 by fine solder wires 5.

[0014] A stamped thin iron shield 6 serves as the core anti-interference component. Its edges are soldered to the pads on the upper surface of the PCB board 1 using SMT technology, sealing all the aforementioned chips within its internal cavity. At the top of the shield 6, corresponding to the positions of the two photosensitive chips 4, two windows are opened. Two light-filtering plastic sealants 7 with spherical tops are pressed into and fixed within these windows using a snap-fit ​​structure.

[0015] In the production process, the die bonding and wire bonding of the chips on PCB board 1 are completed first. Then, the shielding cover 6 and the light filter molding compound 7 are pre-assembled. Next, the entire assembly is positioned by its pins 2 using a pick-and-place machine and mounted onto the product motherboard along with other components. Finally, it is soldered into shape in a reflow oven. This process is efficient and simple, and is extremely suitable for modern large-scale automated production.

[0016] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A dual-sphere patch infrared receiver head, characterized in that, include: A double-sided PCB board with four pins on its lower surface for SMT assembly; An infrared receiving and processing chip and two photosensitive chips are fixed on the upper surface of the PCB board and connected to the PCB board wiring via solder wires. An anti-interference shielding cover is placed on the upper surface of the PCB board, enclosing the infrared receiving and processing chip and two photosensitive chips.

2. The dual-sphere patch infrared receiver head according to claim 1, characterized in that, The anti-interference shield is made of thin iron and is electroplated.

3. A dual-sphere patch infrared receiver head according to claim 1 or 2, characterized in that, A light-filtering molding compound is provided above the photosensitive chip, and the light-filtering molding compound is fixed to the anti-interference shielding cover by a snap fastener.

4. The dual-sphere patch infrared receiver head according to claim 3, characterized in that, The top of the light-filtering molding compound is molded into a spherical structure.

5. A dual-sphere patch infrared receiver head according to claim 1, characterized in that, The upper surface of the PCB board is covered with a large area of ​​GND wiring.

6. A dual-sphere patch infrared receiver head according to claim 1, characterized in that, The anti-interference shielding cover is mounted on the upper surface of the PCB board by SMT solder paste application and then fixed by reflow soldering.

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