A photosensitive chip packaging structure, an optical sensor and an electronic device

Abstract

The utility model relates to sensor technical field especially is related to a kind of photosensitive chip packaging structure, light sensor and electronic equipment, photosensitive chip packaging structure includes substrate, photosensitive chip, wire, light transmission plate, enclosure structure and glue seal structure;Photosensitive chip is connected to substrate at one end, the side of photosensitive chip away from substrate has sequentially arranged photosensitive region, isolation region and wiring area from center to outside, and isolation region is arranged around photosensitive region;Enclosure structure is connected to isolation region and is arranged around photosensitive region;Light transmission plate is connected to the side of enclosure structure away from isolation region, and light transmission plate, enclosure structure and photosensitive region enclose sealed cavity;Compared with the scheme that the light transmission glue is integrally covered on photosensitive chip in prior art, the photosensitive chip packaging structure of the present application, guarantee the light transmission of light transmission plate, so that external light beam can smoothly enter photosensitive region, light transmission plate is finished product, and light transmission glue is not needed, reduce the requirement to packaging production line.

Description

Technical Field

[0001] This utility model relates to the field of optical sensor technology, and in particular to a photosensitive chip packaging structure, an optical sensor, and an electronic device. Background Technology

[0002] Photosensitive chips are devices that can sensitively sense light energy from ultraviolet to infrared light and convert it into electrical signals. Photosensitive sensor chips such as ambient light sensors (ALS), proximity sensors (PS), and lidar (LIDAR) are widely used in consumer electronics, industrial automation, and automotive fields.

[0003] A photosensitive sensor comprises a substrate, a photosensitive chip, and wiring. The photosensitive chip is mounted on the substrate, with a photosensitive area and a wiring area at the end of the chip facing away from the substrate. The photosensitive area is located in the middle of this end, while the wiring areas are located on either side. Existing photosensitive chip packaging structures involve applying a light-transmitting adhesive to the photosensitive sensor and substrate. This adhesive encapsulates the photosensitive area, wiring areas, and wiring. The adhesive must not only secure the wiring to prevent loosening or detachment but also provide isolation and protection for the photosensitive area, while maintaining good light transmittance to minimize light signal attenuation. This places specific requirements on the optical and mechanical properties of the adhesive. Furthermore, the coating process and curing conditions are stringent when using light-transmitting adhesive to encapsulate the photosensitive chip. Insufficiently dense application of the adhesive or an inappropriate curing temperature can lead to the formation of tiny air bubbles within the adhesive, increasing refraction and scattering of light during transmission and reducing transmittance. Therefore, existing photosensitive sensor packaging structures place high demands on the packaging lines. Utility Model Content

[0004] The technical problem to be solved by this utility model is that the existing optical sensor packaging structure has high requirements for the coating process and curing conditions of the light-transmitting adhesive, and also has high requirements for the packaging production line.

[0005] In order to solve the above-mentioned technical problems, the purpose of this utility model is to provide a photosensitive chip packaging structure, including a substrate, a photosensitive chip, wires, a light-transmitting plate, an enclosure structure and an encapsulation structure;

[0006] One end of the photosensitive chip is connected to the substrate. The side of the photosensitive chip facing away from the substrate has a photosensitive area, an isolation area and a wiring area arranged sequentially from the center to the outside. The isolation area is arranged around the photosensitive area.

[0007] The enclosure structure is connected to the isolation area and arranged around the photosensitive area;

[0008] The light-transmitting plate is connected to the side of the enclosure structure away from the isolation area, and the light-transmitting plate, the enclosure structure, and the photosensitive area form a sealed cavity;

[0009] The wire connects the substrate and the wiring area;

[0010] The encapsulation structure covers the conductor, the enclosure structure, and the wiring area.

[0011] In some embodiments, the enclosure structure is a cylindrical body, one end of which is connected to the isolation area, and the other end of which is connected to the light-transmitting plate, and the cavity of the cylindrical body forms the sealed cavity.

[0012] In some embodiments, the cylinder is a light-shielding cylinder.

[0013] In some embodiments, the sealing structure is a light-shielding adhesive.

[0014] In some embodiments, the light-transmitting plate is a glass plate.

[0015] In some embodiments, the side of the encapsulation structure opposite to the substrate is connected to the light-transmitting plate.

[0016] In some embodiments, the encapsulation structure is cylindrical, and the light-transmitting plate and the photosensitive chip are located in the cylindrical cavity of the encapsulation structure.

[0017] A light sensor, characterized in that it includes the above-described photosensitive chip packaging structure.

[0018] An electronic device comprising the aforementioned optical sensor.

[0019] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0020] This utility model discloses a photosensitive chip packaging structure, comprising a substrate, a photosensitive chip, wires, a light-transmitting plate, a protective structure, and an encapsulation structure. One end of the photosensitive chip is connected to the substrate. On the side of the photosensitive chip facing away from the substrate, a photosensitive area, an isolation area, and a wiring area are arranged sequentially from the center to the outside, with the isolation area surrounding the photosensitive area. The protective structure is connected to the isolation area and surrounds the photosensitive area. The light-transmitting plate is connected to the side of the protective structure facing away from the isolation area. The light-transmitting plate, the protective structure, and the photosensitive area form a sealed cavity. The protective structure forms a physical barrier to prevent the encapsulation material from seeping into and contaminating the photosensitive area, thus achieving sealed protection for the photosensitive area. The wiring area and wires are covered by the encapsulation structure, providing reinforced protection for the wires. Compared to the prior art where the entire photosensitive chip is covered with light-transmitting adhesive, the photosensitive chip packaging structure of this application allows external light beams to smoothly enter the photosensitive area simply by ensuring the light transmittance of the light-transmitting plate. The light-transmitting plate is a finished product and does not require the use of light-transmitting adhesive, reducing the requirements for the packaging production line. Attached Figure Description

[0021] Figure 1This is an isometric view of the photosensitive chip packaging structure of this utility model;

[0022] Figure 2 This is a schematic diagram of the internal structure of the photosensitive chip packaging structure of this utility model;

[0023] Figure 3 This is a schematic diagram of the structure for applying adhesive to the isolation area;

[0024] Figure 4 A schematic diagram showing the structure for bonding the enclosure to the isolation zone;

[0025] Figure 5 A schematic diagram of a structure for bonding a light-transmitting panel to the building envelope.

[0026] Figure 6 This is a schematic diagram of the integral molding and sealing structure;

[0027] Figure 7 This is a schematic diagram of a structure that separates multiple packages;

[0028] In the diagram, 1 is the substrate, 2 is the photosensitive chip, 21 is the photosensitive area, 22 is the isolation area, 23 is the wiring area, 3 is the wire, 4 is the light-transmitting plate, 5 is the enclosure structure, 6 is the encapsulation structure, and 7 is the sealing cavity. Detailed Implementation

[0029] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0030] In the description of this utility model, it should be understood that the terms "upper," "lower," "left," "right," "top," and "bottom," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. It should be understood that the terms "first," "second," etc., are used in this utility model to describe various information, but this information should not be limited to these terms; these terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this utility model, "first" information can also be called "second" information, and similarly, "second" information can also be called "first" information.

[0031] like Figure 1 , Figure 2As shown, a preferred embodiment of the photosensitive chip packaging structure of this utility model includes a substrate 1, a photosensitive chip 2, a wire 3, a light-transmitting plate 4, a protective structure 5, and an encapsulation structure 6. One end of the photosensitive chip 2 is connected to the substrate 1. The side of the photosensitive chip 2 facing away from the substrate 1 has a photosensitive area 21, an isolation area 22, and a wiring area 23 arranged sequentially from the center to the outside. The isolation area 22 surrounds the photosensitive area 21. The protective structure 5 is connected to the isolation area 22 and surrounds the photosensitive area 21. The light-transmitting plate 4 is connected to the side of the protective structure 5 facing away from the isolation area 22. The light-transmitting plate 4 and the protective structure 6 are... The photosensitive area 21 and the enclosure 5 form a sealed cavity 7. The enclosure structure 5 can form a physical barrier to prevent the encapsulating material from seeping into and contaminating the photosensitive area 21, thus achieving sealed protection for the photosensitive area. The wiring area 23, the enclosure structure 5, and the wire 3 are covered by the encapsulating structure 6, which reinforces and protects the wire 3. Compared with the existing technology of covering the photosensitive chip 2 entirely with light-transmitting adhesive, the photosensitive chip packaging structure of this application ensures the light transmittance of the light-transmitting plate 4 so that external light beams can smoothly enter the photosensitive area. The light-transmitting plate 4 is a finished product, and its light transmittance is easier to control precisely than that of the light-transmitting adhesive. This is because the material composition, processing technology, and detection methods of the light-transmitting plate 4 are easier to control than those of the light-transmitting adhesive. Specifically, in terms of raw material composition, the raw material composition of the light-transmitting plate 4 is relatively simple during the production process, and its absorption and scattering of light are relatively stable and regular. Therefore, the light transmittance is easy to maintain at a relatively stable and predictable level. Translucent adhesives are often systems composed of multiple components. Besides the main polymer, various additives and fillers may be added. This complexity increases the number of factors affecting light propagation, making it more difficult to precisely control light transmittance. In terms of manufacturing processes, the production of translucent panels 4, such as optical glass, utilizes mature and standardized processes, like float glass production. This allows for precise control of parameters such as glass thickness and flatness, ensuring a relatively fixed and designed optical path for light transmission, thus guaranteeing stable light transmittance. Translucent adhesives, on the other hand, are typically applied through coating and potting processes. In these processes, the thickness and uniformity of the adhesive layer are difficult to control as precisely as in translucent panels 4, easily leading to fluctuations in light transmittance due to uneven thickness and localized defects. Regarding testing methods, translucent panels 4 have a comprehensive optical testing process during production. High-precision optical testing equipment allows for easy and accurate measurement of the light transmittance of each finished product, enabling the selection of compliant products and the rejection of substandard ones. However, after encapsulation, it is often difficult to directly and non-destructively test the light transmittance of the light-transmitting adhesive. Only random sampling can provide a rough assessment, making it difficult to comprehensively control the light transmittance as with light-transmitting plate 4. In this embodiment, the use of light-transmitting adhesive is eliminated, significantly reducing the requirements for the encapsulation production line.

[0032] In some embodiments of this utility model, the enclosure structure 5 is a cylindrical body, with one end connected to the isolation area 22 and the other end connected to the light-transmitting plate 4. The cavity of the cylindrical body forms a sealed cavity 7. The cylindrical structure provides reliable support for the light-transmitting plate 4, ensuring a stable relative position between the light-transmitting plate 4 and the photosensitive chip 2. The sealed cavity 7 isolates the photosensitive area 21 from the external environment. The cylindrical body can block non-perpendicularly incident light, reducing stray light entering the photosensitive area 21, thereby improving the sensitivity and accuracy of the photosensitive sensor.

[0033] In some embodiments of this invention, the cylinder is a light-shielding cylinder. The light-shielding cylinder can more effectively block stray light from entering the sealed cavity 7 and interfering with the photosensitive area 21. It can reduce the amount of non-target light from the ambient light entering the photosensitive area; only light along the axial direction of the light-shielding cylinder has a chance to enter the photosensitive area 21, making the light signal received by the photosensitive area 21 more accurate. This improves the accuracy and sensitivity of the photosensitive sensor in detecting target light signals, which is crucial for applications with stringent requirements for light signal accuracy, such as high-precision ambient light sensors and lidar. Because the light-shielding cylinder has light-shielding capabilities, there is no need to set a light-shielding structure on the outside of the light-shielding cylinder to block stray light, simplifying the photosensitive chip packaging structure.

[0034] In some embodiments of this invention, the sealing structure 6 is a light-shielding adhesive. The sealing structure 6 is used to prevent stray light from entering the photosensitive area, and in this case, the light transmittance of the enclosure structure 5 is not required. Achieving light shading is less difficult than achieving light transmittance, and the coating and curing processes of the light-shielding adhesive do not need to consider optical consistency, making it easier to achieve large-scale mass production and reduce production control costs.

[0035] In some embodiments of this invention, the light-transmitting plate 4 is a glass plate. Glass plates typically have high light transmittance, allowing a large amount of light to pass through smoothly, enabling the photosensitive area 21 to fully receive external light and maximizing the light sensor's ability to capture light signals. Furthermore, the glass plate has a uniform internal material distribution and a relatively stable refractive index. When light passes through the glass plate, it does not experience significant refraction or scattering due to uneven refractive index, thus ensuring the predictability and stability of the light propagation path and improving the accuracy and precision of the light sensor in detecting light signals.

[0036] In some embodiments of this invention, the encapsulation structure 6 is connected to the light-transmitting plate 4 on the side opposite to the substrate 1. The encapsulation structure 6 is connected to the light-transmitting plate 4, providing additional support and fixation for the light-transmitting plate 4, making it more stable. This prevents the light-transmitting plate 4 from loosening or shifting due to external vibrations, collisions, or slight displacement during long-term use, thus maintaining the stable optical performance of the light sensor. Furthermore, the encapsulation structure 6 connected to the light-transmitting plate 4 helps to improve the sealing around the sealing cavity 7. The side of the substrate 1 connected to the photosensitive chip 2 has a chip mounting area and an encapsulation area. The photosensitive chip 2 is connected to the chip mounting area, one end of the wire 3 is connected to the wiring area 23, and the other end is connected to the encapsulation area. The encapsulation structure 6 covers the encapsulation area.

[0037] In some embodiments of this invention, the encapsulation structure 6 is cylindrical, with the light-transmitting plate 4 and the photosensitive chip 2 located within the cylindrical cavity of the encapsulation structure 6. The cylindrical encapsulation structure 6 provides surrounding protection for the internal light-transmitting plate 4, photosensitive chip 2, and related components.

[0038] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0039] The packaging method of the photosensitive chip packaging structure in this embodiment is as follows: First, multiple photosensitive chips 2 are mounted on a substrate 1, such that the photosensitive chips 2 are arranged sequentially at intervals; then wiring is performed; then wires 3 are connected to the wiring area 23 of each photosensitive chip 2 and the substrate 1; next, as... Figure 3 As shown, apply adhesive to area 22; after application, as... Figure 4 As shown, the lower end of the enclosure structure 5 is pressed onto the isolation area 22 containing adhesive droplets; then, as... Figure 5 As shown, apply adhesive to the upper end of the enclosure structure 5 and bond the light-transmitting panel 4 to the enclosure structure 5; after the adhesive has cured, as shown... Figure 6 As shown, multiple integrally connected encapsulation structures 6 are formed by applying adhesive to the substrate 1; finally, as... Figure 7 As shown, substrate 1 is cut to separate multiple packages.

[0040] An embodiment of an optical sensor includes the photosensitive chip packaging structure described above. The optical sensor of this embodiment includes, but is not limited to, ambient light sensors, proximity sensors, and lidar.

[0041] An embodiment of an electronic device includes the aforementioned optical sensor. This electronic device includes, but is not limited to, mobile phones, motor vehicles, and drones.

[0042] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present utility model, and these improvements and substitutions should also be considered within the protection scope of the present utility model.

Claims

1. A photosensitive chip packaging structure, characterized in that, It includes a substrate (1), a photosensitive chip (2), a wire (3), a light-transmitting plate (4), an enclosure structure (5), and an encapsulation structure (6); One end of the photosensitive chip (2) is connected to the substrate (1). The photosensitive chip (2) has a photosensitive area (21), an isolation area (22) and a wiring area (23) arranged sequentially from the center to the outside on the side away from the substrate (1). The isolation area (22) is arranged around the photosensitive area (21). The enclosure structure (5) is connected to the isolation area (22) and arranged around the photosensitive area (21); The light-transmitting plate (4) is connected to the side of the enclosure structure (5) away from the isolation area (22), and the light-transmitting plate (4), the enclosure structure (5) and the photosensitive area (21) form a sealed cavity (7); The wire (3) connects the substrate (1) and the wiring area (23); The encapsulation structure (6) covers the conductor (3), the enclosure structure (5), and the wiring area (23).

2. The photosensitive chip packaging structure according to claim 1, characterized in that, The enclosure structure (5) is a cylindrical body, one end of which is connected to the isolation area (22), and the other end of which is connected to the light-transmitting plate (4). The cavity of the cylindrical body forms the sealed cavity (7).

3. The photosensitive chip packaging structure according to claim 2, characterized in that, The cylinder is a light-shielding cylinder.

4. The photosensitive chip packaging structure according to claim 1, characterized in that, The sealing structure (6) is a light-shielding adhesive.

5. The photosensitive chip packaging structure according to claim 1, characterized in that, The light-transmitting plate (4) is a glass plate.

6. The photosensitive chip packaging structure according to claim 1, characterized in that, The encapsulation structure (6) is connected to the light-transmitting plate (4) on the side opposite to the substrate (1).

7. The photosensitive chip packaging structure according to claim 1, characterized in that, The encapsulation structure (6) is cylindrical, and the light-transmitting plate (4) and the photosensitive chip (2) are located in the cylindrical cavity of the encapsulation structure (6).

8. An optical sensor, characterized in that, Includes the photosensitive chip packaging structure as described in any one of claims 1 to 7.

9. An electronic device, characterized in that, Including the optical sensor as described in claim 8.

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