LED backlight source die bonding equipment with electromagnetic adsorption

Abstract

The utility model relates to a fixed crystal equipment technical field especially relates to a LED backlight source fixed crystal equipment with electromagnetic adsorption, its technical scheme includes base, support base, motor no.

Description

Technical Field

[0001] This utility model relates to the field of die bonding equipment technology, and in particular to an LED backlight die bonding device with electromagnetic adsorption. Background Technology

[0002] LED backlights are components that provide uniform light sources for LED display modules. They consist of LED chips, light guide plates, diffusion films, etc. Die bonding is one of the core processes in LED packaging, which involves precisely attaching tiny LED chips onto a designated substrate.

[0003] Traditional die bonding processes use vacuum adsorption or manual transfer. However, vacuum adsorption is prone to chip falling due to insufficient negative pressure or chip crushing due to excessive negative pressure, while manual transfer is inefficient. To address these issues, we propose an LED backlight die bonding device with electromagnetic adsorption. Utility Model Content

[0004] The purpose of this invention is to address the problems existing in the background technology by proposing an LED backlight die bonding device with electromagnetic adsorption.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an LED backlight die bonding device with electromagnetic adsorption, comprising a base, a support base, a first motor, and a second motor. A turntable is provided at the upper end of the base, and a conveyor belt is provided on one side of the turntable. A mounting frame is provided above the turntable. A first motor is provided at one end of the mounting frame. A screw is rotatably mounted inside the mounting frame at the output end of the first motor. A nut is threaded onto the outer wall of the screw. A first guide rail is provided on the upper inner wall of the mounting frame. A first slider is slidably mounted on the upper end of the nut and attached to the first guide rail. A second hydraulic rod is provided at the lower end of the nut. An electromagnetic transmitter is provided on the outer wall of the second hydraulic rod. An electromagnetic chuck electrically connected to the electromagnetic generator is provided at the telescopic end of the second hydraulic rod.

[0006] Preferably, a second frame is provided at the upper end of the base, and equidistantly distributed conveyor rollers are rotatably installed inside the second frame, and the conveyor belt is rotatably sleeved on the outer wall of the conveyor belt.

[0007] Preferably, the outer wall of the conveyor belt has equally spaced slots for storing backlight LED chips, and the front end of the second frame is equipped with a second motor whose output end is connected to the conveyor roller. The second motor drives the conveyor pipe to rotate, thereby causing the conveyor belt to move intermittently.

[0008] Preferably, the rear end of the mounting frame is provided with a frame connected to the base, and the turntable is provided with assembly slots arranged in a circular array for placing the backlight substrate. The frame supports a pair of mounting frames, and the assembly slots position and place the backlight substrate.

[0009] Preferably, the upper end of the turntable is provided with equidistant guide rails, the lower end of the assembly slot is provided with a slider that is slidably mounted to the guide rails, and a side block is provided on one side of the lower end of the assembly slot. The lower end of the assembly slot slides on the outer wall of the guide rails via the slider, thus providing sliding support for the assembly slot.

[0010] Preferably, an adjustment frame is sleeved on the outer side of the side block, and a hydraulic rod is provided at the front end of the frame, with the telescopic end of the hydraulic rod connected to the adjustment frame. The two side walls of the adjustment frame act as a push-pull mechanism for the internal side block, facilitating the removal of the placement slot from the outside, increasing the operating space, and facilitating the storage and retrieval of workpieces.

[0011] Preferably, the upper end of the base is provided with a support seat, the upper end of the support seat has a rolling groove, and the lower end of the turntable is provided with pulleys arranged in a circular array and rolled inside the rolling groove. The upper end of the support seat is provided with a motor three, the output end of which is connected to the lower end of the turntable. The turntable is driven to rotate by the motor three, and the pulleys roll inside the rolling groove, providing rolling support to the bottom of the turntable.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] 1. In this utility model, the LED chip of the backlight is placed inside the placement groove of the conveyor belt. The conveyor belt drives the LED chip of the backlight to move intermittently. The electromagnetic chuck moves to the top of the LED chip of the backlight at the end of the conveyor belt. The electromagnetic chuck is driven by the hydraulic rod to adhere to the LED chip of the backlight and perform electromagnetic adsorption on the LED chip. After adsorption, it is transported and pressed on the upper end of the backlight substrate coated with glue inside the assembly groove for LED chip die bonding. The assembly groove is distributed in a ring array on the turntable. After the turntable rotates, the side block is pushed and pulled by the adjustment frame, which increases the operating space and helps the workpiece unloading. Attached Figure Description

[0014] Figure 1 This is a front-view three-dimensional structural diagram of the present invention;

[0015] Figure 2 This is a top-view three-dimensional structural diagram of the conveyor belt of this utility model;

[0016] Figure 3 This is a three-dimensional sectional view of the mounting frame of this utility model.

[0017] Figure 4 This is a top-view three-dimensional structural diagram of the turntable of this utility model;

[0018] Figure 5 This is a front-view three-dimensional structural diagram of the assembly groove of this utility model.

[0019] Reference numerals in the attached drawings: 1. Base; 2. Support base; 3. Turntable; 4. Frame 1; 5. Frame 2; 6. Conveyor belt; 7. Motor 1; 8. Motor 2; 9. Mounting frame; 10. Hydraulic rod 1; 11. Conveyor roller; 12. Placement groove; 13. Screw; 14. Guide rail 1; 15. Slider 1; 16. Nut; 17. Hydraulic rod 2; 18. Electromagnetic chuck; 19. Electromagnetic transmitter; 20. Motor 3; 21. Groove; 22. Pulley; 23. Side block; 24. Assembly groove; 25. Slider 2; 26. Guide rail 2; 27. Adjustment frame. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] like Figures 1-5 As shown, the present invention proposes an LED backlight die bonding device with electromagnetic adsorption, including a base 1, a support base 2, a motor 7 and a motor 8. A turntable 3 is provided on the upper end of the base 1, a conveyor belt 6 is provided on one side of the turntable 3, and a mounting frame 9 is provided above the turntable 3. A motor 7 is provided at one end of the mounting frame 9. A screw 13 is rotatably installed inside the mounting frame 9 at the output end of the motor 7. A nut 16 is threadedly installed on the outer wall of the screw 13. A guide rail 14 is provided on the upper inner wall of the mounting frame 9. A slider 15 is slidably installed on the upper end of the nut 16 and slides with the guide rail 14. A hydraulic rod 17 is provided at the lower end of the nut 16. An electromagnetic transmitter 19 is provided on the outer wall of the hydraulic rod 17. An electromagnetic chuck 18 electrically connected to the electromagnetic generator is provided at the telescopic end of the hydraulic rod 17.

[0022] A frame 2 5 is provided on the upper end of the base 1. Equally spaced conveyor rollers 11 are rotatably installed inside the frame 2 5. The conveyor belt 6 is rotatably sleeved on the outer wall of the conveyor belt 6.

[0023] The outer wall of the conveyor belt 6 is provided with equally spaced placement slots 12 for storing backlight LED chips, and the front end of the frame 2 5 is provided with a motor 2 8 whose output end is connected to the conveyor roller 11.

[0024] The rear end of the mounting frame 9 is provided with a frame 4 connected to the base 1, and the top of the turntable 3 is provided with assembly slots 24 arranged in a ring array for placing the backlight substrate.

[0025] The upper end of the turntable 3 is provided with equidistant guide rails 26, the lower end of the assembly groove 24 is provided with sliders 25 that are slidably installed with the guide rails 26, and a side block 23 is provided on one side of the lower end of the assembly groove 24.

[0026] An adjustment frame 27 is sleeved on the outer side of the side block 23, and a hydraulic rod 10 is provided at the front end of the frame 4. The telescopic end of the hydraulic rod 10 is connected to the adjustment frame 27.

[0027] The base 1 has a support seat 2 at its upper end. The support seat 2 has a roller groove 21 inside its upper end. The turntable 3 has pulleys 22 arranged in a circular array and rolled inside the roller groove 21 at its lower end. The support seat 2 has a motor 20 whose output end is connected to the lower end of the turntable 3.

[0028] Based on the implementation steps of Example 1: The flexible FPC backlight substrate is placed into the assembly slot 24 of the turntable 3. The pads of the flexible FPC backlight substrate are coated with conductive die bond adhesive. The assembly slot 24 is positioned along the guide rail 26 by the second slider 25 to ensure that the substrate pads are coaxial with the center of the turntable 3. The second slider 25 is a damping slider. After sliding, it is positioned by the internal damping component. The LED chips with nickel magnetic plating at the bottom are placed one by one into the placement slot 12 of the conveyor belt 6. The size of the placement slot 12 is adapted to the chip to avoid the chip shifting during transportation.

[0029] Motor 28 is started, which drives the conveyor roller 11 inside the frame 25 to rotate, thereby causing the conveyor belt 6 to move intermittently. It pauses for a few seconds after moving to each slot, gradually conveying the placement slot 12 containing LED chips to the electromagnetic adsorption pickup station. At the corresponding position between the end of the conveyor belt 6 and the turntable 3, motor 17 is started, which drives the screw 13 inside the mounting frame 9 to rotate. The nut 16 slides along the guide rail 14 through the slider 15, moving the electromagnetic chuck 18 to directly above the placement slot 12 of the pickup station. The hydraulic rod 2 17 is controlled to extend, so that the electromagnetic chuck 18 adheres to the surface of the LED chip. At the same time, the electromagnetic transmitter 19 is energized, and the electromagnetic chuck 18 generates magnetism, firmly adsorbing the chip to prevent the chip from falling off or being damaged. The telescopic end of the hydraulic rod 2 17 is shortened, causing the electromagnetic chuck 18 adsorbing the chip to leave the conveyor belt 6, completing the chip pickup.

[0030] Motor 7 drives screw 13 again, moving electromagnetic chuck 18 along guide rail 14 to the die bonding station of turntable 3. At this time, turntable 3 has been rotated by motor 20, so that an assembly slot 24 is aligned directly below electromagnetic chuck 18. The hydraulic rod extends again, transporting the chip to the FPC substrate pad in the assembly slot 24. The power of electromagnetic transmitter 19 is cut off, the magnetism of electromagnetic chuck 18 disappears, and the chip falls smoothly onto the die bonding adhesive layer of the substrate. The die bonding adhesive initially fixes the chip instantly, completing the die bonding. Motor 20 drives turntable 3 to rotate, moving the assembly slot 24 with one chip die bonded to the unloading preparation station. At the same time, the next empty assembly slot 24 is moved to the die bonding station, realizing continuous production.

[0031] Hydraulic rod 10 on frame 4 is activated, which pushes adjustment frame 27 to move. The center of the socket frame is located outside side block 23, ensuring effective rotation of turntable 3 and side block 23. This drives assembly slot 24 to slide along guide rail 26 via slider 25, allowing assembly slot 24 to extend beyond the edge of turntable 3, expanding the operating space and facilitating the removal of die-bonded substrates by operators or robotic arms. The adsorption force of electromagnetic chuck 18 can be precisely adjusted by current. Compared with traditional vacuum adsorption, it completely avoids the problem of chip falling due to insufficient negative pressure or chip crushing due to excessive negative pressure. In this embodiment, the LED chip damage rate is reduced. Continuous die bonding is achieved through automatic feeding by conveyor belt 6, automatic switching of workstations by turntable 3, and automatic handling by electromagnetic chuck 18, which improves efficiency compared to manual transfer.

[0032] Traditional vacuum adsorption relies on negative pressure, which can easily damage chips due to fluctuations in negative pressure. This equipment features controllable electromagnetic adsorption force, preventing chips from falling or being crushed at the source. Traditional manual transfer requires repeated picking and placing of chips and substrates, and is prone to fatigue and errors. This equipment features a fully automated process, achieving mass production-level efficiency. Traditional equipment relies on manual visual positioning, which can lead to deviations and subsequent soldering failures. This equipment improves positioning accuracy through mechanical transmission. The assembly slot 24 of traditional rotary die bonders is fixed, limiting the operating space. This equipment allows for sliding adjustment of the assembly slot 24, improving the convenience of loading and unloading.

[0033] The above specific embodiments are merely several preferred embodiments of this utility model. Based on the technical solution of this utility model and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

[0034] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A die bonding device for an LED backlight with electromagnetic adsorption, comprising a base (1), a support (2), a first motor (7), and a second motor (8), characterized in that: The base (1) is provided with a turntable (3) at the upper end and a conveyor belt (6) on one side of the turntable (3). A mounting frame (9) is provided above the turntable (3). A motor (7) is provided at one end of the mounting frame (9). A screw (13) is rotatably installed inside the mounting frame (9) at the output end of the motor (7). A nut (16) is threadedly installed on the outer wall of the screw (13). A guide rail (14) is provided on the inner wall of the upper end of the mounting frame (9). A slider (15) is slidably installed on the upper end of the nut (16) and slides on the guide rail (14). A hydraulic rod (17) is provided at the lower end of the nut (16). An electromagnetic transmitter (19) is provided on the outer wall of the hydraulic rod (17). An electromagnetic chuck (18) electrically connected to the electromagnetic generator is provided at the telescopic end of the hydraulic rod (17).

2. The LED backlight die bonding device with electromagnetic adsorption according to claim 1, characterized in that: The base (1) is provided with a frame two (5) at the upper end. Equally spaced conveyor rollers (11) are rotatably installed inside the frame two (5). The conveyor belt (6) is rotatably sleeved on the outer wall of the conveyor belt (6).

3. The LED backlight die bonding device with electromagnetic adsorption according to claim 2, characterized in that: The outer wall of the conveyor belt (6) is provided with equidistant placement slots (12) for storing backlight LED chips, and the front end of the frame (5) is provided with a motor (8) whose output end is connected to the conveyor roller (11).

4. The LED backlight die bonding device with electromagnetic adsorption according to claim 1, characterized in that: The mounting frame (9) is provided with a frame (4) connected to the base (1) at the rear end, and an assembly slot (24) arranged in a ring array above the turntable (3) for placing the backlight substrate.

5. The LED backlight die bonding device with electromagnetic adsorption according to claim 4, characterized in that: The turntable (3) is provided with two guide rails (26) that are evenly distributed at the upper end, and the assembly groove (24) is provided with a slider (25) that is slidably installed with the guide rails (26) at the lower end. A side block (23) is provided on one side of the lower end of the assembly groove (24).

6. The LED backlight die bonding device with electromagnetic adsorption according to claim 5, characterized in that: An adjustment frame (27) is sleeved on the outside of the side block (23), and a hydraulic rod (10) is provided at the front end of the frame (4). The telescopic end of the hydraulic rod (10) is connected to the adjustment frame (27).

7. The LED backlight die bonding device with electromagnetic adsorption according to claim 1, characterized in that: The base (1) is provided with a support seat (2) at the upper end. The support seat (2) has a roller groove (21) inside the upper end. The turntable (3) is provided with pulleys (22) arranged in a ring array and rolled inside the roller groove (21) at the lower end. The support seat (2) is provided with a motor (20) whose output end is connected to the lower end of the turntable (3).

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