Display device, electronic device

Abstract

The application discloses a display device and an electronic device. A plurality of isolation layers are arranged to correspond to a plurality of light-emitting units, the light-emitting units are wrapped by the isolation layers, BM glue is arranged between adjacent isolation layers, and the thickness of the isolation layer is greater than the thickness of the BM glue, so that the separation of the ink color area packaging area is realized. The refractive index of the packaging layer is less than the refractive index of the isolation layer, the shielding and influence of the BM glue on the light-emitting unit are avoided, the light coupling-out efficiency of the light-emitting unit is improved, the light loss of the light-emitting unit is reduced, the ink consistency and high light efficiency are ensured, and the power consumption of the whole machine is reduced.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display device and electronic device. Background Technology

[0002] Among related technologies, micro-LEDs are considered the ultimate display technology due to their self-emissive properties and longer lifespan than organic light-emitting diodes (OLEDs). Compared to miniLEDs, micro-LEDs have several advantages: firstly, they are smaller in size, resulting in a smaller pixel ratio and higher contrast for the same pixel pitch; secondly, they lack a substrate, are thinner, and cannot withstand significant pressure; and thirdly, they cannot have too thick a black film layer, as this would affect transmittance.

[0003] In current solutions, inkjet printing of BM (black photoresist) is typically used to achieve ink color consistency on Micro LED substrates. This solution requires precise adjustment of the BM adhesive's viscosity, flowability, and thickness to ensure that the BM adhesive does not cover the Micro LED. In addition, due to capillary action, the BM adhesive may wrap around the sides of the Micro LED and partially climb onto the front of the Micro LED, resulting in light loss from the Micro LED. Utility Model Content

[0004] This application aims to at least solve one of the technical problems existing in the prior art. To this end, one objective of this application is to provide a display device or electronic device that reduces the shading and impact of BM adhesive on the light-emitting unit and improves the light coupling efficiency of the light-emitting unit.

[0005] To address the aforementioned technical problems, embodiments of this application provide a display device, including:

[0006] Multiple light-emitting units;

[0007] Multiple isolation layers corresponding to multiple light-emitting units, the isolation layers being used to enclose the light-emitting units;

[0008] Additionally, a BM adhesive is disposed between adjacent isolation layers, wherein the thickness of the BM adhesive is less than the thickness of the isolation layer;

[0009] And an encapsulation layer for covering the BM adhesive and the isolation layer, wherein the refractive index of the encapsulation layer is less than the refractive index of the isolation layer.

[0010] In some embodiments, the refractive index of the isolation layer is less than that of gallium nitride; and / or,

[0011] The refractive index of the isolation layer is between 1.3 and 2.3.

[0012] In some embodiments, the encapsulation layer contains scattering particles; and / or,

[0013] The refractive index of the encapsulation layer is between 1 and 2.

[0014] In some embodiments, the light-emitting unit includes a plurality of light-emitting chips, and the isolation layer includes a plurality of convex isolation structures, each of the convex isolation structures enclosing one of the light-emitting chips, with adjacent convex isolation structures in contact with each other.

[0015] In some embodiments, the surface of the isolation layer is provided with a plurality of protrusions.

[0016] In some embodiments, the protrusions on the surface of the isolation layer are arc-shaped or serrated.

[0017] In some embodiments, the raised structures on the surface of the isolation layer are uniformly arranged, or,

[0018] The density of the protrusions on the surface of the isolation layer gradually decreases from the center toward the edge of the isolation layer.

[0019] In some embodiments, the isolation layer and the encapsulation layer have the same transparent substrate, and the density of scattering particles disposed in the isolation layer and the encapsulation layer is different, so that the refractive index of the encapsulation layer is less than that of the isolation layer.

[0020] In some embodiments, the encapsulation layer includes a multilayer transparent structure, and the refractive index of the transparent structure gradually decreases from the light-emitting unit toward the light-emitting side.

[0021] A second aspect of this application provides an electronic device including the display device described in any of the preceding claims.

[0022] The beneficial effects of this application embodiment are as follows: By setting multiple isolation layers corresponding to multiple light-emitting units, the light-emitting units are wrapped by the isolation layers, and BM glue is set between adjacent isolation layers, with the thickness of the isolation layer being greater than the thickness of the BM glue, thereby achieving separation of the ink color area encapsulation area. Furthermore, the BM glue and isolation layers are covered by an encapsulation layer, and the functional layer is covered on the encapsulation layer. The refractive index of the encapsulation layer is set to be less than the refractive index of the isolation layer to avoid the BM glue from shielding and affecting the light-emitting units, thereby improving the light coupling efficiency of the light-emitting units, reducing the light loss of the light-emitting units, and ensuring ink color consistency and high light efficiency, thereby reducing the overall power consumption of the device.

[0023] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0024] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0025] Figure 1 This is a first schematic diagram of the display device provided in an embodiment of this application;

[0026] Figure 2 This is a second schematic diagram of the display device provided in the embodiments of this application;

[0027] Figure 3 This is a third schematic diagram of the display device provided in the embodiments of this application;

[0028] Figure 4 This is a fourth schematic diagram of the display device provided in the embodiments of this application;

[0029] Figure 5 This is a fifth schematic diagram of the display device provided in the embodiments of this application;

[0030] Figure 6 This is the sixth schematic diagram of the display device provided in the embodiments of this application.

[0031] Figure label:

[0032] 100: Substrate, 200: BM adhesive, 300: Encapsulation layer, 400: Functional layer, 500: Isolation layer, 600: Light-emitting unit. Detailed Implementation

[0033] The embodiments of this application are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. The embodiments of this application are described in detail below.

[0034] Micro LEDs, due to their self-emissive nature and longer lifespan than OLEDs, are hailed by the industry as the ultimate display technology. Compared to Mini LEDs, Micro LEDs are smaller in size, resulting in a smaller pixel ratio and higher contrast for the same pixel pitch. However, they lack a substrate, are thinner, and cannot withstand significant pressure; they also cannot have too thick a black film layer, as this would affect transmittance.

[0035] In current solutions, Micro LED substrates typically use inkjet printing of BM adhesive to achieve ink color consistency. This solution requires precise adjustment of the BM adhesive's viscosity, flowability, and thickness to ensure that the BM adhesive does not cover the Micro LED. In addition, due to capillary action, the BM adhesive may wrap around the sides of the Micro LED and partially climb onto the front of the Micro LED, resulting in light loss from the Micro LED.

[0036] To address the aforementioned technical problems, this application provides a display device, see [link to relevant documentation]. Figure 1As shown, the display device in this embodiment includes: multiple light-emitting units 600, multiple isolation layers 500, an encapsulation layer 300, and BM adhesive 200; wherein, the multiple isolation layers 500 correspond to the multiple light-emitting units 600, and the isolation layers 500 are used to wrap the light-emitting units 600; the BM adhesive 200 is disposed between adjacent isolation layers 500, and the thickness of the isolation layer 500 is greater than the thickness of the BM adhesive 200; the encapsulation layer 300 covers the BM adhesive 200 and the isolation layers 500, and the refractive index of the encapsulation layer 300 is less than the refractive index of the isolation layer 500.

[0037] In this embodiment, based on the characteristics of Micro LED—small pixel size, large pixel pitch, and thin thickness—an isolation layer 500 is set on its light-emitting unit 600. Multiple light-emitting units 600 are formed on the substrate 100. By setting multiple isolation layers 500 corresponding to multiple light-emitting units 600, the light-emitting units 600 are wrapped by the isolation layers 500. BM glue 200 is set between adjacent isolation layers 500, and the thickness of the isolation layer 500 is greater than the thickness of the BM glue 200, thereby achieving separation of the black color area encapsulation area. The BM glue 200 and the isolation layer 500 are covered by the encapsulation layer 300. The functional layer 400 is covered on the encapsulation layer 300 to avoid the BM glue 200 from blocking and affecting the light-emitting unit 600. The refractive index of the encapsulation layer 300 is set to be less than the refractive index of the isolation layer 500 to improve the light coupling efficiency of the light-emitting unit 600, reduce the light loss of the light-emitting unit 600, and at the same time ensure the uniformity of the black color and high luminous efficiency, thereby reducing the power consumption of the whole machine.

[0038] In some embodiments, the display device further includes a functional layer 400, which covers the encapsulation layer 300. The functional layer 400 can achieve functions such as anti-glare, anti-reflection, anti-fingerprint, haze, gloss, hardness, and wear resistance.

[0039] In some embodiments, the isolation layer 500 is a convex isolation structure. The convex isolation structure can be made of a transparent encapsulation material with a high refractive index to improve light extraction efficiency. The convex isolation structure can be made into different shapes according to the process to improve light extraction efficiency.

[0040] In some embodiments, the distance between the edge of one side of the isolation layer 500 and the edge of the light-emitting unit 600 in the same direction is 1 μm to 50 μm.

[0041] In some embodiments, the isolation layer 500 can be fabricated by inkjet printing, photolithography, dispensing, printing or molding.

[0042] In some embodiments, the light-emitting unit 600 may include one or more micro light-emitting diodes, the micro light-emitting diodes being made of gallium nitride material.

[0043] In some embodiments, the light-emitting unit 600 includes a red light-emitting chip, a green light-emitting chip, and a blue light-emitting chip, all of which are micro light-emitting diodes.

[0044] In some embodiments, the refractive index of the isolation layer 500 is less than that of gallium nitride.

[0045] In this embodiment, by setting the refractive index of the encapsulation layer 300 to be less than the refractive index of the isolation layer 500, and the refractive index of the isolation layer 500 to be less than the refractive index of gallium nitride, the light emission efficiency of the display device can be enhanced.

[0046] In some embodiments, the refractive index of the isolation layer 500 is related to the thickness of the light-emitting unit 600. The thickness of the isolation layer 500 is greater than the thickness of the light-emitting unit, which can reduce the shielding and influence of the BM adhesive 200 adjacent to the light-emitting unit 600 on the emitted light of the light-emitting unit 600.

[0047] In some embodiments, the refractive index of the isolation layer 500 is between 1.3 and 2.3.

[0048] In some embodiments, scattering particles are disposed within the encapsulation layer 300.

[0049] In some embodiments, the refractive index of the encapsulation layer 300 is between 1 and 2.

[0050] In some embodiments, see Figure 2 As shown, the light-emitting unit 600 includes a plurality of light-emitting chips 610, and the isolation layer 500 includes a plurality of convex isolation structures 510, each convex isolation structure 510 enclosing a light-emitting chip 610, with adjacent convex isolation structures 510 in contact with each other.

[0051] In some embodiments, adjacent convex isolation structures 510 are connected.

[0052] In some embodiments, the light-emitting unit 600 includes a red light-emitting chip, a green light-emitting chip, and a blue light-emitting chip. The red light-emitting chip, the green light-emitting chip, and the blue light-emitting chip are arranged side by side. The red light-emitting chip, the green light-emitting chip, and the blue light-emitting chip can share the same convex isolation structure, or each light-emitting chip can be provided with an independent convex isolation structure to wrap it, so as to isolate it from the encapsulation layer 300.

[0053] In some embodiments, the convex isolation structure 510 can be a microlens structure, with the encapsulated microlens covering the sidewall of the light-emitting chip 610 to guide the laterally scattered light to the light-emitting surface, significantly increasing the effective light output.

[0054] In some embodiments, the convex isolation structure 510 can be in the form of a single lens, multiple lenses, square, or microstructure.

[0055] In some embodiments, the isolation layer 500 can be in the form of a single lens, multiple lenses, a square shape, or a microstructure.

[0056] In some embodiments, see Figure 3 As shown, the isolation layer 500 is a square microstructure. The upper surface of the square microstructure extends beyond the upper surface of the BM adhesive 200. The square microstructure can cover the entire light-emitting unit 600. The light-emitting unit 600 includes a red light-emitting chip, a green light-emitting chip, and a blue light-emitting chip. In this way, the distance between the red light-emitting chip, the green light-emitting chip, and the blue light-emitting chip and the upper surface of the square microstructure is similar, which can ensure that the light emission efficiency of the red light-emitting chip, the green light-emitting chip, and the blue light-emitting chip is similar.

[0057] In some embodiments, the length or width of the red, green, and blue light-emitting chips ranges from 1 to 10 μm.

[0058] In some embodiments, see Figure 4 As shown, the surface of the isolation layer 500 is provided with multiple protrusion structures.

[0059] In this embodiment, by setting a protruding structure on the surface of the isolation layer 500, the emission efficiency or emission intensity of the red, green and blue light-emitting chips can be finely adjusted according to their emission requirements to adapt to different application scenarios.

[0060] In some embodiments, combined with Figure 4 As shown, the raised structure on the surface of the isolation layer 500 is arc-shaped.

[0061] In this embodiment, by setting an arc-shaped protrusion structure on the surface of the isolation layer 500, multiple microlens structures are formed on the light-emitting unit 600. Ordinary LEDs are prone to color deviation from the viewpoint due to uneven distribution of red, green and blue light. The microlenses fuse the three colors of light to achieve color consistency across the entire viewing angle. Furthermore, the emission efficiency or emission intensity of the red, green and blue light-emitting chips can be finely adjusted according to their emission requirements to adapt to different application scenarios.

[0062] In some embodiments, combined with Figure 4 As shown, the protruding structure on the surface of the isolation layer 500 can be a microlens array. The microlens array can adjust the optical path and extend the narrow emission angle (usually <120°) of the red, green and blue light-emitting chips to a wider range, which is suitable for large-scale lighting scenarios.

[0063] In some embodiments, combined with Figure 5 As shown, the protrusions on the surface of the isolation layer 500 are serrated.

[0064] In this embodiment, by providing a serrated protrusion structure on the surface of the isolation layer 500, the serrated structure can reduce total internal reflection loss by changing the incident angle of light inside the lens. Furthermore, the serrated structure integrates red, green, and blue light, avoiding viewing angle deviation caused by uneven LED distribution.

[0065] In some embodiments, the raised structures on the surface of the isolation layer 500 are uniformly arranged.

[0066] In this embodiment, the arrangement of the protrusions on the surface of the isolation layer 500 is related to the shape of the isolation layer 500. The isolation layer 500 is a square microstructure with uniformly arranged protrusions on its surface. The upper surface of the square microstructure extends beyond the upper surface of the BM adhesive 200. The square microstructure can cover the entire light-emitting unit 600. The light-emitting unit 600 includes a red light-emitting chip, a green light-emitting chip, and a blue light-emitting chip. Thus, the distances between the red light-emitting chip, the green light-emitting chip, and the blue light-emitting chip and the upper surface of the square microstructure are similar, and the number of protrusions allocated to the red light-emitting chip, the green light-emitting chip, and the blue light-emitting chip is similar, which can ensure that the light emission efficiency of the red light-emitting chip, the green light-emitting chip, and the blue light-emitting chip is similar.

[0067] In some embodiments, the density of the protrusions on the surface of the isolation layer 500 gradually decreases from the center toward the edge of the isolation layer 500.

[0068] In this embodiment, the arrangement of the protrusions on the surface of the isolation layer 500 is related to the shape of the isolation layer 500. The isolation layer 500 has an arc-shaped structure, and the density of the protrusions on its surface gradually decreases from the center to the edge of the isolation layer 500. The protrusions on the surface of the isolation layer 500 all extend beyond the upper surface of the BM adhesive 200. The protrusions on the surface of the isolation layer 500 can cover the entire light-emitting unit 600. The light-emitting unit 600 includes a red light-emitting chip, a green light-emitting chip, and a blue light-emitting chip. The number of protrusions on the upper surface of the arc-shaped isolation layer 500 allocated to the red light-emitting chip, the green light-emitting chip, and the blue light-emitting chip is similar, which can ensure that the light emission efficiency of the red light-emitting chip, the green light-emitting chip, and the blue light-emitting chip is similar.

[0069] In some embodiments, the isolation layer 500 is a transparent material. The isolation layer 500 mainly serves to mechanically protect the light-emitting unit 600 and improve reliability. It also enhances heat dissipation, reduces chip junction temperature, and improves light extraction efficiency.

[0070] In some embodiments, the isolation layer 500 can be made of transparent silicone, epoxy resin, polyimide, photoresist, or other materials.

[0071] In some embodiments, the refractive index of the isolation layer 500 is less than that of gallium nitride (GaN), and its refractive index can be between 1.3 and 2.3. Specifically, scattering particles can be dispersed in the isolation layer 500 to enhance the light emission efficiency.

[0072] In some embodiments, the thickness of the encapsulation layer 300 is between 5 and 300 μm. The encapsulation layer 300 can be manufactured by inkjet printing, spin coating, molding, film application, etc. The encapsulation layer 300 mainly functions to seal, waterproof, dustproof, and corrosion-proof, thereby improving reliability.

[0073] In some embodiments, the encapsulation layer 300 can be made of transparent silicone, epoxy resin, polyimide, photoresist, or other materials.

[0074] In some embodiments, the refractive index of the encapsulation layer 300 is between 1 and 2, which is less than the refractive index of the isolation layer 500, thereby improving the light coupling efficiency of the light-emitting unit 600 through its combination with the isolation layer 500.

[0075] In some embodiments, the encapsulation layer 300 may be dispersed with scattering particles to enhance the light emission effect.

[0076] In some embodiments, the encapsulation layer 300 may be a multilayer transparent structure, and the refractive index of the film layer away from the light-emitting unit 600 is lower than the refractive index of the film layer near the light-emitting unit 600.

[0077] In some embodiments, the encapsulation layer 300 includes a multilayer transparent structure, in which scattering particles are dispersed. By setting the density of the scattering particles in each transparent structure, the refractive index of each transparent structure can be adjusted.

[0078] In some embodiments, combined with Figure 6 As shown, the transparent substrate of the isolation layer 500 and the encapsulation layer 300 are the same. The density of scattering particles in the isolation layer 500 and the encapsulation layer 300 is different, so that the refractive index of the encapsulation layer 300 is less than that of the isolation layer 500.

[0079] In some embodiments, the encapsulation layer 300 includes a multilayer transparent structure, and the refractive index of the transparent structure gradually decreases from the light-emitting unit 600 toward the light-emitting side, and the direction of the light-emitting unit 600 toward the light-emitting side is consistent with the direction of the light-emitting unit 600 toward the functional layer 400.

[0080] In some embodiments, BM adhesive 200 is at least one of black fluoride, epoxy adhesive, epoxy resin, silicone, silicone resin and polyurethane material.

[0081] In some embodiments, the BM adhesive 200 contains at least one of melanin, black powder, toner, carbon paste, or scattering powder.

[0082] In some embodiments, the thickness of BM adhesive 200 is less than or equal to the height of the convex isolation structure. It can be lower than or higher than the height of the isolation layer 500, provided that the side of the isolation layer 500 is not obstructed.

[0083] In some embodiments, due to the presence of the convex isolation structure, the space outside the isolation structure is large and interconnected, so there is no need to worry about the problem of climbing. The manufacturing process of BM adhesive 200 can be simplified, and methods such as inkjet or spraying can be used. The range of choices for the material's viscosity and flowability is greatly increased, and more economical and faster methods can be selected.

[0084] In some embodiments, BM adhesive 200 is mainly used to achieve ink color consistency. The main material of BM adhesive 200 can be one or more mixtures of materials such as black fluoride, epoxy adhesive, epoxy resin, silicone, silicone resin and polyurethane, which may include one or more of melanin, black powder, such as black pigment, toner, carbon paste or scattering powder.

[0085] In some embodiments, BM adhesive 200 can also be made of black film material. Due to the presence of the convex isolation structure, black film material can be laminated. Since the light-emitting unit 600 is relatively high, the film material will be punctured, thereby ensuring the light emission of the light-emitting unit 600.

[0086] In some embodiments, the blackness of the isolation layer 500 is less than that of the BM adhesive 200.

[0087] In some applications, black material can be added to the 500 layer of the release liner, but the blackness should be less than that of the 200 layer of BM adhesive.

[0088] In some embodiments, the encapsulation layer 300 can be integrated with the substrate of the light-emitting unit 600 as part of the functional layer 400, such as the OCA film layer of the functional layer 400. The OCA film layer is a substrate-free, high-transparency double-sided adhesive tape, mainly used for bonding optical components such as touch screens and display screens, and has the characteristics of high light transmittance, high temperature resistance, and UV resistance.

[0089] In some embodiments, the encapsulation layer 300 is integrated with the functional layer 400, and the encapsulation layer 300 is the OCA film layer of the functional layer 400.

[0090] In some embodiments, the functional layer 400 can be a multilayer film structure, which can be used to achieve one or more functions such as anti-glare, anti-reflection, anti-fingerprint, haze, gloss, hardness, and wear resistance.

[0091] This application also provides an electronic device, including the display device described above.

[0092] The beneficial effects of this application embodiment are as follows: By setting multiple isolation layers 500 corresponding to multiple light-emitting units 600, the light-emitting units 600 are wrapped by the isolation layers 500, and the BM adhesive 200 is set between adjacent isolation layers 500, and the thickness of the isolation layer 500 is greater than the thickness of the BM adhesive 200, thereby realizing the separation of the ink color area encapsulation area. The BM adhesive 200 and the isolation layers 500 are covered by the encapsulation layer 300, and the functional layer 400 is covered on the encapsulation layer 300. The refractive index of the encapsulation layer 300 is set to be less than the refractive index of the isolation layer 500 to avoid the BM adhesive 200 from blocking and affecting the light-emitting units 600, thereby improving the light coupling efficiency of the light-emitting units 600, reducing the light loss of the light-emitting units 600, and ensuring ink color consistency and high light efficiency, thereby reducing the power consumption of the whole machine.

[0093] Other configurations and operations of the electronic devices according to embodiments of this application are known to those skilled in the art and will not be described in detail here.

[0094] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0095] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A display device, characterized in that, include: substrate; Multiple light-emitting units disposed on a substrate, wherein each light-emitting unit includes multiple light-emitting chips; Multiple isolation layers corresponding to multiple light-emitting units, the isolation layers being used to enclose the light-emitting units; Additionally, a BM adhesive is disposed between adjacent isolation layers, wherein the thickness of the BM adhesive is less than the thickness of the isolation layer; And an encapsulation layer for covering the BM adhesive and the isolation layer, wherein the refractive index of the encapsulation layer is less than the refractive index of the isolation layer.

2. The display device according to claim 1, characterized in that, The refractive index of the isolation layer is less than that of gallium nitride; and / or, The refractive index of the isolation layer is between 1.3 and 2.

3.

3. The display device according to claim 1, characterized in that, The encapsulation layer contains scattering particles; and / or, The refractive index of the encapsulation layer is between 1 and 2.

4. The display device according to claim 1, characterized in that, The light-emitting unit includes multiple light-emitting chips, and the isolation layer includes multiple convex isolation structures, each of which encloses one light-emitting chip, with adjacent convex isolation structures in contact.

5. The display device according to any one of claims 1-4, characterized in that, The surface of the isolation layer is provided with multiple protrusions.

6. The display device according to claim 5, characterized in that, The raised structure on the surface of the isolation layer is arc-shaped or serrated.

7. The display device according to claim 5, characterized in that, The raised structures on the surface of the isolation layer are uniformly arranged, or, The density of the protrusions on the surface of the isolation layer gradually decreases from the center toward the edge of the isolation layer.

8. The display device according to any one of claims 1-4, characterized in that, The isolation layer and the encapsulation layer have the same transparent substrate, and the density of scattering particles disposed in the isolation layer and the encapsulation layer is different, so that the refractive index of the encapsulation layer is less than that of the isolation layer.

9. The display device according to any one of claims 1-4, characterized in that, The encapsulation layer comprises a multi-layer transparent structure, and the refractive index of the transparent structure gradually decreases from the light-emitting unit towards the light-emitting side.

10. An electronic device, characterized in that, include: The display device as described in any one of claims 1-9.

Images