A light distribution structure of a multi-color chip coplanar integrated imitation-filament lamp bead

Abstract

The utility model discloses a kind of light distribution structures of multi-color chip coplanar integrated imitating flow lamp pearl, belong to semiconductor light-emitting device packaging technical field.The structure includes bowl cup support, multiple LED chips, silicon substrate, gold wire and encapsulation colloid.The silicon substrate surface is divided into die-bonding area, soldering area and jumper isolation area, jumper isolation area is electrically isolated with other area, as the routing channel of gold wire wiring, avoid gold wire intersection span, reduce short-circuit risk.The inner side reflection wall of the bowl cup support is asymmetric structure, and the chip area of different light-emitting center height is designed with different inclination angle reflection surface, compensates optical path difference, realizes uniform light mixing.The utility model structure is simple, cost controllable, significantly improve the reliability and optical performance of LED lamp pearl, applicable to stage lamp, landscape lighting and other high requirement occasion.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor light-emitting device packaging technology, specifically to a light distribution structure for multi-color chip coplanar integrated simulated lumen lamp beads suitable for stage lights, landscape lights, imaging lights, photographic lights and other fields. Background Technology

[0002] Imitation lumen LED chips are a common type of high-power LED light source, widely used in stage lighting, landscape lighting, and photographic lighting. To meet the requirements of uniform color mixing and a high color rendering index, multiple LED chips of different colors need to be integrated into a single chip. However, existing technologies have the following problems: Complexity of gold wire layout and short circuit risk: When multi-color chips are integrated on the same plane, there are many gold wires, and the wiring path is long and complex. Gold wire crossings can easily lead to collapse and short circuits, affecting the reliability of the device.

[0003] Uneven light mixing and color spot problems: The light emission center height of different color chips is not consistent, resulting in differences in the optical path, and uneven color, color rings or color spots appear in the far field light spot.

[0004] Existing solutions are inadequate: adding diffusers or secondary optical lenses increases volume, cost, and light loss; the process of adjusting fluorescent adhesives is complex and consistency is difficult to control. Utility Model Content

[0005] The purpose of this invention is to provide a light distribution structure for a multi-color chip coplanar integrated simulated lumen lamp bead, so as to solve the problems of high risk of gold wire short circuit and uneven light mixing in the prior art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A light distribution structure for multi-color chip coplanar integrated simulated lumen lamp beads includes: A bowl-shaped support having a conductive base and a bowl-shaped cavity surrounded by an inner reflective wall; Multiple LED chips, including at least one type I chip and at least one type II chip, are coplanarly fixed to the bottom of the bowl-shaped cavity; A silicon substrate is fixed to the bottom of the bowl-cup support for mounting the first type of chip; Gold wires are used to achieve electrical connections between the electrodes of each chip and the conductive support or silicon substrate. An encapsulating colloid is filled into the cup-shaped cavity; The surface of the silicon substrate is divided into at least three functional regions: The die-bonding area is used for die bonding of the first type of chip; The bonding area has bonding pads that are connected to the internal circuitry of the silicon substrate; The jumper isolation area is electrically isolated from the die bonding area and wire bonding area, and is used as a routing channel for gold wire routing. The inner reflective wall of the bowl-shaped support has an asymmetrical structure, with reflective surfaces of different tilt angles designed for chip areas at different light-emitting center heights.

[0007] Preferably, the first type of chip is a vertical structure chip, including a red light chip, an amber light chip, or a white light chip; the second type of chip is a horizontal structure chip, including a blue light chip, a green light chip, or a violet light chip.

[0008] Preferably, the surface of the jumper isolation area is roughened or coated with an insulating coating.

[0009] Preferably, the inner reflective wall is a continuously varying curved surface or is composed of multiple planar segments at different angles.

[0010] Compared with the prior art, the beneficial effects of this utility model are as follows: Significantly reduces short-circuit risk: By setting up a dedicated jumper isolation zone, the high-risk crossing of gold wires directly over other chips or dense circuits is avoided, transforming potential wire-to-wire and wire-to-core contact risks into safe wire-to-insulating substrate contact, greatly improving product yield and reliability.

[0011] Optimized wiring for enhanced stability: Shorter gold wire lengths reduce line impedance and parasitic inductance, improving electrical performance. Shorter gold wires also offer higher mechanical strength and greater resistance to vibration and thermal shock, thus enhancing the long-term operational stability of devices, making them particularly suitable for applications requiring frequent vibration and harsh heat dissipation, such as stage lighting.

[0012] Improving light mixing from the source: The innovative asymmetrical bowl-shaped reflector design compensates for the height difference of the light-emitting center caused by physical packaging limitations, solving the fundamental problem of uneven mixing of multicolor light from an optical structure perspective and effectively eliminating the color spots of the far-field light spot.

[0013] Simple structure and controllable cost: This utility model only requires changing the design of the bracket mold, without adding extra packaging components or complex processes, making it easy to industrialize. The cost increase is minimal, but the added value and competitiveness of the product are significantly improved. Attached Figure Description

[0014] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the light distribution structure of a multi-color chip coplanar integrated simulated lumen lamp bead according to the present invention. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present utility model, and not all of them. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0018] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0019] Furthermore, the use of terms such as "first" and "second" in this utility model is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" and "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. If the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0020] Example 1 like Figure 1 As shown, this utility model provides a light distribution structure for a multi-color chip coplanar integrated simulated lumen lamp bead, comprising: The bowl-shaped support 2 has a conductive base and a bowl-shaped cavity surrounded by an inner reflective wall. The inner reflective wall is used to reflect the light emitted by the chip, serving as support and conductive path for the entire device. Multiple LED chips 4, including at least one first type chip and at least one second type chip different from the first type chip, are coplanarly fixed to the bottom of the bowl-shaped cavity; wherein, the height of the light-emitting center of the first type chip (such as a vertical chip) from the bottom of the cavity is H1, the height of the light-emitting center of the second type chip (such as a horizontal chip) from the bottom of the cavity is H2, and H1>H2.

[0021] A silicon substrate 3 is fixed to the bottom of the bowl-shaped support and is used to mount the first type of chip. The surface of the silicon substrate 3 is divided into at least three functional regions, including a die-bonding region 3.1, a wire bonding region 3.2, and a jumper isolation region 3.3.

[0022] The second type of chip is directly die-bonded to the bottom of the bowl / cup holder.

[0023] Gold wire 5 is used to realize the electrical connection between each chip electrode and the conductive support or silicon substrate bonding area; gold wire 5 is led out from the chip electrode, crosses over the jumper isolation area, and connects to the bonding area or support electrode.

[0024] An encapsulating colloid (not shown in the figure) fills the cup-shaped cavity, covering the chip and gold wires, and serves both a protective and optical function (such as mixing multicolor light).

[0025] The silicon substrate 3 has three functional regions on its surface: Die-bonding region 3.1 is used for die bonding of the first type of chip; The bonding area 3.2 is provided with bonding pads that are connected to the internal circuitry of the silicon substrate, and is used to lead out the first bonding point of the electrode of the first type of chip through the gold wire. Jumper isolation area 3.3, electrically isolated from die bond area 3.1 and wire bonding area 3.2, serves as a routing channel for gold wire routing; specifically, the jumper isolation area can serve as a routing channel for gold wire routing of other chips (especially horizontally structured chips located at a distance). Gold wires of other chips can cross this area at a low altitude and over a short distance, utilizing this area as support or isolation buffer, without directly crossing the die bond area or other sensitive areas with circuitry below.

[0026] Thanks to the addition of a jumper isolation zone, the gold wire layout is optimized and its length is significantly shortened.

[0027] As a preferred embodiment, the inner reflective wall of the bowl-shaped support 2 has an asymmetrical structure. Different tilt angles are designed for reflective surfaces above chip areas with different light-emitting center heights. Specifically, the reflective wall above chips with higher light-emitting centers is steeper, while the reflective wall above chips with lower light-emitting centers is gentler. This asymmetrical design ensures that light emitted from a higher light-emitting center (H1), although starting at a higher position, is guided outward at a greater reflection angle earlier after encountering the steeper reflective wall. Conversely, light emitted from a lower light-emitting center (H2) encounters a gentler reflective wall, resulting in a relatively higher reflection point and being reflected out later. By optimizing the angles through precise optical design, the effective light paths of all colors can be made more consistent, thereby achieving a better aerial light mixing effect.

[0028] In a preferred embodiment, the silicon substrate 3 is fixed to the conductive support by insulating adhesive.

[0029] In a preferred embodiment, the first type of chip is a vertically structured chip that needs to be mounted on a silicon substrate, including red light chips, amber light chips, or white light chips; the second type of chip is a horizontally structured chip that can be directly die-bonded, including blue light chips, green light chips, or violet light chips. In a typical six-color embodiment: the red light chip, amber light chip, and white light chip (vertically) are die-bonded on their respective silicon substrates; the blue light chip, green light chip, and violet light chip (horizontally) are directly die-bonded on a conductive support.

[0030] As a preferred embodiment, the surface of the jumper isolation area is roughened or coated with an insulating coating to further enhance the insulation effect and adhesion between the jumper and the gold wire.

[0031] As a preferred embodiment, the inner reflective wall can be a continuous curved surface with a continuously changing slope, or it can be a polygonal reflective wall composed of multiple planar segments at different angles.

[0032] The method for fabricating the light distribution structure of the above-mentioned multi-color chip coplanar integrated simulated lumen lamp bead includes the following steps: A cup holder with an asymmetric inner reflective wall is provided. The design of the reflective wall is determined by optimization through optical simulation software based on the chip type and the height of the light-emitting center in the package. One or more silicon substrates are fixed at predetermined positions on the support, and each silicon substrate surface is pre-designed with mutually isolated die-bonding areas, wire bonding areas and jumper isolation areas. The vertical structure chip is die-bonded to the die-bonding area of ​​the silicon substrate; The horizontal structure chip is directly die-bonded to the predetermined position on the conductive substrate; Perform wire bonding operation: First, the electrodes at the top of the vertical structure chip are bonded to the bonding area of ​​the silicon substrate using gold wire bonding.

[0033] Then, the wire bonding area of ​​the silicon substrate is bonded to the corresponding electrode of the conductive support using gold wire bonding.

[0034] Finally, when bonding horizontal structure chips and other long-distance gold wires, the path is planned to pass over the jumper isolation area of ​​the relevant silicon substrate before bonding.

[0035] The cavity of the bowl or cup is filled with a transparent or fluorescent encapsulating colloid, which is then baked and cured to complete the encapsulation.

[0036] Compared with the prior art, the advantages of this utility model are: Significantly reduces short-circuit risk: By setting up a dedicated jumper isolation zone, the high-risk crossing of gold wires directly over other chips or dense circuits is avoided, transforming potential wire-to-wire and wire-to-core contact risks into safe wire-to-insulating substrate contact, greatly improving product yield and reliability.

[0037] Optimized wiring for enhanced stability: Shorter gold wire lengths reduce line impedance and parasitic inductance, improving electrical performance. Shorter gold wires also offer higher mechanical strength and greater resistance to vibration and thermal shock, thus enhancing the long-term operational stability of devices, making them particularly suitable for applications requiring frequent vibration and harsh heat dissipation, such as stage lighting.

[0038] Improving light mixing from the source: The innovative asymmetrical bowl-shaped reflector design compensates for the height difference of the light-emitting center caused by physical packaging limitations, solving the fundamental problem of uneven mixing of multicolor light from an optical structure perspective and effectively eliminating the color spots of the far-field light spot.

[0039] Simple structure and controllable cost: This solution only requires changing the design of the bracket mold, without adding extra packaging components or complex processes, making it easy to industrialize with minimal cost increase, but significantly improving product added value and competitiveness.

[0040] Flexible design: This method is applicable to any combination of multi-color chips and can "tailor-make" the optimal reflector profile for a specific chip layout through optical simulation, making it highly versatile.

[0041] In the description of this specification, references to terms such as "an embodiment," "example," and "specific example" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0042] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A light distribution structure for a multi-color chip coplanar integrated simulated lumen lamp bead, comprising a cup-shaped support, multiple LED chips, a silicon substrate, gold wires, and an encapsulating colloid, characterized in that: The surface of the silicon substrate is divided into a die bonding region, a wire bonding region, and a jumper isolation region. The inner reflective wall of the bowl-shaped bracket has an asymmetrical structure, with reflective surfaces having different tilt angles for chip areas at different light-emitting center heights.

2. The structure according to claim 1, characterized in that: The jumper isolation area is electrically isolated from the die bonding area and the wire bonding area, and is used as a routing channel for gold wire wiring.

3. The structure according to claim 1, characterized in that: The surface of the jumper isolation area is roughened or coated with an insulating coating.

4. The structure according to claim 1, characterized in that: The inner reflective wall is a continuously varying curved surface or is composed of multiple planar segments at different angles.

5. The structure according to claim 1, characterized in that: The LED chip includes a vertical structure chip and a horizontal structure chip. The vertical structure chip is die-bonded to the die-bonding area of ​​the silicon substrate, and the horizontal structure chip is die-bonded directly to the bottom of the bowl-cup support.

6. The structure according to claim 5, characterized in that: The vertical structure chip is a red light chip, an amber light chip, or a white light chip; the horizontal structure chip is a blue light chip, a green light chip, or a violet light chip.

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