Quick die changeable optical chip integration packaging apparatus

Abstract

The utility model relates to the light chip integrated packaging equipment of quick die change belongs to integrated packaging equipment technical field, including operation platform, be equipped with mounting bracket on operation platform, be equipped with integrated packaging body on mounting bracket, the die is clamped on operation platform, be equipped with the clamping assembly for clamping die on operation platform, the removal assembly for removing die is equipped with on operation platform lower surface, be equipped with the clamping hole on operation platform, the side wall of clamping hole is equipped with the mounting slot, the die is clamped with operation platform through clamping hole, the die both sides are equipped with the clamping slot, the utility model discloses through removal assembly, connecting rod, the cooperation of removal board and second spring, when needing to remove the die, second spring drives removal board to push the die and separates from clamping hole, has improved the disassembly efficiency of die obviously, thereby the die is convenient for quick dismounting replacement, through clamping assembly, the cooperation of wedge block and die clamping slot and the reset action of first spring, can complete the clamping fixation of die quickly, simple operation and reliable fixation.

Description

Technical Field

[0001] This utility model relates to the field of integrated packaging equipment technology, and in particular to an optical chip integrated packaging equipment with rapid mold changing capability. Background Technology

[0002] In the practical application of optical chip integrated packaging equipment, the rapid mold replacement process is particularly critical, directly affecting the efficiency of the entire production process. In traditional packaging equipment, the connection between the mold and the operating table mainly relies on bolt fastening or manual snap-fit ​​structures. Specifically, when installing the mold, the operator needs to tighten each bolt one by one or make meticulous adjustments to the snap-fit ​​components. This series of operations is not only cumbersome but also time-consuming. The situation is equally unfavorable when disassembling the mold. Special tools are usually needed to loosen the bolts, or the mold is removed by forcibly prying it. This disassembly method can easily damage the mold itself or the surface of the operating table. More seriously, it may cause the mold to be not securely fixed, thus affecting the accuracy of the packaging process and ultimately having an adverse impact on product quality. Summary of the Invention

[0003] To overcome the technical defects of the existing technology, this utility model provides an optical chip integrated packaging device with quick mold change capability, which has the effect of quick disassembly and mold replacement.

[0004] The technical solution adopted by this utility model is as follows: it includes an operating table, a mounting frame is provided on the operating table, an integrated packaging body is provided on the mounting frame, a mold is snapped onto the operating table, a snapping component for snapping onto the mold is provided on the operating table, and a removal component for removing the mold is provided on the lower surface of the operating table.

[0005] Preferably, in order to install the snap-fit ​​assembly, the operating table is provided with snap-fit ​​holes, the sidewalls of the snap-fit ​​holes are provided with mounting grooves, the mold is snapped into the operating table through the snap-fit ​​holes, and the mold is provided with snap-fit ​​grooves on both sides.

[0006] Preferably, in order to adjust the position of the wedge block, the snap-fit ​​assembly includes a wedge block, the wedge block is slidably snapped into the mounting groove, and the wedge block is snapped into the snap-fit ​​groove, and a moving rod is connected to the wedge block, the moving rod being inserted into the operating table.

[0007] Preferably, in order to reset the wedge block, a first spring is sleeved on the moving rod, the two ends of the first spring are fixedly connected to the wedge block and the mounting groove respectively, and a limit plate is installed on the other end of the moving rod.

[0008] Preferably, in order to adjust the position of the removal plate, the removal assembly includes a mounting cover, which is installed on the lower surface of the operating table and located below the snap-fit ​​hole. A connecting rod is inserted into the mounting cover, and the other end of the connecting rod is equipped with a removal plate. The removal plate is slidably snapped into the snap-fit ​​hole.

[0009] Preferably, in order for the connecting rod to be removed from the mounting cover, the mounting cover is provided with an insertion hole, and the connecting rod is inserted into the mounting cover through the insertion hole.

[0010] Preferably, in order to reset the removal plate, a second spring is sleeved on the connecting rod. The second spring is located inside the mounting cover, and both ends of the second spring are fixedly connected to the mounting cover and the removal plate, respectively.

[0011] Preferably, in order to limit the position of the connecting rod, a circular plate is installed at the other end of the connecting rod, and the circular plate is located below the mounting cover.

[0012] The beneficial effects of this utility model are as follows: By using the snap-fit ​​assembly, the wedge block and the mold snap-fit ​​groove cooperate with each other and the reset action of the first spring, the mold snap-fit ​​and fixation can be completed quickly. The operation is simple and the fixation is reliable. By using the removal assembly, the connecting rod, the removal plate and the second spring cooperate with each other. When it is necessary to remove the mold, the second spring drives the removal plate to push the mold out of the snap-fit ​​hole, which significantly improves the mold disassembly efficiency and facilitates quick disassembly and replacement of the mold. Attached Figure Description

[0013] Figure 1 This is a structural schematic diagram of the present invention from a side view.

[0014] Figure 2 This is a structural schematic diagram of the present invention from a downward viewing angle.

[0015] Figure 3 This is a schematic diagram of the operating table of this utility model.

[0016] Figure 4 This is a schematic diagram of the snap-fit ​​assembly of this utility model.

[0017] Figure 5 This is a schematic diagram of the structure of the removal component of this utility model.

[0018] Explanation of reference numerals in the attached figures: 1. Operating table; 2. Mounting bracket; 3. Integrated encapsulation body; 4. Mold; 5. Snap-fit ​​assembly; 501. Wedge block; 502. Moving rod; 503. First spring; 504. Limiting plate; 6. Removal assembly; 601. Mounting cover; 602. Connecting rod; 603. Removal plate; 604. Insertion hole; 605. Second spring; 606. Circular plate; 7. Snap-fit ​​hole; 8. Mounting groove; 9. Snap-fit ​​groove. Detailed Implementation

[0019] The present invention will be further described below with reference to the accompanying drawings:

[0020] like Figures 1-5 As shown, this embodiment provides a fast-changing optical chip integrated packaging device, including an operating table 1, a mounting frame 2 on the operating table 1, an integrated packaging body 3 on the mounting frame 2, a mold 4 snapped onto the operating table 1, and a snapping component 5 on the operating table 1 for snapping onto the mold 4, which can quickly complete the snapping and fixing of the mold 4. The operation is simple and the fixing is reliable. The lower surface of the operating table 1 is provided with a removal component 6 for removing the mold 4, which significantly improves the disassembly efficiency of the mold 4, thereby facilitating the quick disassembly and replacement of the mold 4.

[0021] As a technical optimization solution of this utility model, specifically as follows: Figure 4 As shown, the operating table 1 is provided with a snap-fit ​​hole 7, and the side wall of the snap-fit ​​hole 7 is provided with an installation groove 8. The mold 4 is snapped into the operating table 1 through the snap-fit ​​hole 7. The mold 4 is provided with snap-fit ​​grooves 9 on both sides. The snap-fit ​​assembly 5 includes a wedge block 501, which is slidably snapped into the installation groove 8 and snapped into the snap-fit ​​groove 9. A moving rod 502 is connected to the wedge block 501 and is inserted into the operating table 1. A first spring 503 is sleeved on the moving rod 502. The two ends of the first spring 503 are fixedly connected to the wedge block 501 and the installation groove 8, respectively. A limit plate 504 is installed on the other end of the moving rod 502. The mold 4 is moved horizontally along the surface of the operating table 1 onto the snap-fit ​​hole 7. The operator aligns the snap-fit ​​grooves 9 on both sides of the mold 4 with the mounting groove 8, and then presses the mold 4 down. During the pressing process, the edge of the snap-fit ​​groove 9 of the mold 4 will squeeze the wedge block 501. The wedge block 501 slides into the mounting groove 8 and compresses the first spring 503. When the mold 4 falls completely onto the surface of the operating table 1, the wedge block 501 loses its squeezing force and slides outward under the elastic reset of the first spring 503, and tightly snaps into the snap-fit ​​groove 9 of the mold 4, thus completing the quick fixation of the mold 4 and the operating table 1. When it is necessary to replace the mold 4, the operator holds the circular plate 606 and moves it, which causes the connecting rod 602 to drive the removal plate 603 to move downward and compress the second spring 605.

[0022] As a technical optimization solution of this utility model, specifically as follows: Figure 5As shown, the removal assembly 6 includes a mounting cover 601, which is mounted on the lower surface of the operating table 1 and located below the snap-fit ​​hole 7. A connecting rod 602 is inserted into the mounting cover 601, and a removal plate 603 is mounted on the other end of the connecting rod 602. The removal plate 603 is slidably snapped into the snap-fit ​​hole 7. The mounting cover 601 is provided with an insertion hole 604, through which the connecting rod 602 is inserted into the mounting cover 601. A second spring 605 is sleeved on the connecting rod 602. The second spring 605 is located below the mounting cover 601. Inside the cover 601, the two ends of the second spring 605 are fixedly connected to the mounting cover 601 and the removal plate 603 respectively. The other end of the connecting rod 602 is equipped with a circular plate 606, which is located below the mounting cover 601. The connecting rod 602 drives the removal plate 603 to move downward and compress the second spring 605. At this time, the upper surface of the removal plate 603 contacts the lower surface of the mold 4 and pushes the mold 4 upward. As the removal plate 603 continues to push upward, the mold 4 is smoothly moved out of the snap-fit ​​hole 7 to the edge of the operating table 1.

[0023] In use, when installing the mold 4, the mold 4 is moved horizontally along the surface of the operating table 1 above the snap-fit ​​hole 7, aligning the snap-fit ​​grooves 9 on both sides of the mold 4 with the mounting groove 8. Then, the mold 4 is pressed down. During the pressing process, the edge of the snap-fit ​​groove 9 of the mold 4 will squeeze the wedge block 501. The wedge block 501 slides inward into the mounting groove 8 and compresses the first spring 503. When the mold 4 falls completely onto the surface of the operating table 1, the wedge block 501 loses its squeezing force and slides outward under the elastic reset of the first spring 503, tightly snapping into the snap-fit ​​groove 9 of the mold 4, thus completing the quick fixation of the mold 4 to the operating table 1. When it is necessary to replace the mold 4, the operator holds the circular plate 606 and moves it, thereby causing the connecting rod 602 to... The removal plate 603 moves downward and compresses the second spring 605. At this time, the upper surface of the removal plate 603 contacts the lower surface of the mold 4 and pushes the mold 4 upward. As the removal plate 603 continues to push upward, the mold 4 is smoothly moved out of the snap-fit ​​hole 7 to the edge of the operating table 1, completing the quick disassembly of the mold 4. After disassembly, the circular plate 606 and the limiting plate 504 are released. The removal plate 603 falls back to the initial position under the elastic reset of the second spring 605. The wedge block 501 extends out of the mounting slot 8 again under the reset action of the first spring 503, ready for the next installation of the mold 4. The whole process does not require additional tools, is simple and efficient to operate, and significantly improves the mold changing efficiency of the optical chip integrated packaging equipment.

[0024] The foregoing has shown and described the basic principles, main features, and advantages of this invention. Those skilled in the art should understand that this invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this invention. Various changes and modifications may be made to this invention without departing from its spirit and scope. All such changes and modifications fall within the scope of this invention as defined by the appended claims and their equivalents.

Claims

1. A fast-changing optical chip integrated packaging device, comprising an operating table (1), wherein a mounting frame (2) is provided on the operating table (1), and an integrated packaging body (3) is provided on the mounting frame (2), characterized in that: The operating table (1) is fitted with a mold (4), and the operating table (1) is provided with a clamping component (5) for clamping the mold (4). The lower surface of the operating table (1) is provided with a removal component (6) for removing the mold (4).

2. The optical chip integrated packaging equipment with rapid mold changing capability according to claim 1, characterized in that: The operating table (1) is provided with a snap-fit ​​hole (7), and the side wall of the snap-fit ​​hole (7) is provided with an installation groove (8). The mold (4) is snapped into the operating table (1) through the snap-fit ​​hole (7), and the mold (4) is provided with snap-fit ​​grooves (9) on both sides.

3. The optical chip integrated packaging equipment with rapid mold changing capability according to claim 2, characterized in that: The snap-fit ​​assembly (5) includes a wedge block (501), which is slidably snapped into the mounting groove (8) and snapped into the snap-fit ​​groove (9). A moving rod (502) is connected to the wedge block (501) and is inserted into the operating table (1).

4. The optical chip integrated packaging equipment with rapid mold changing capability according to claim 3, characterized in that: A first spring (503) is sleeved on the moving rod (502). The two ends of the first spring (503) are fixedly connected to the wedge block (501) and the mounting groove (8) respectively, and a limit plate (504) is installed on the other end of the moving rod (502).

5. The optical chip integrated packaging equipment with rapid mold changing capability according to claim 2, characterized in that: The removal assembly (6) includes a mounting cover (601), which is mounted on the lower surface of the operating table (1) and located below the snap-fit ​​hole (7). A connecting rod (602) is inserted into the mounting cover (601), and a removal plate (603) is mounted on the other end of the connecting rod (602). The removal plate (603) is slidably snapped into the snap-fit ​​hole (7).

6. The optical chip integrated packaging equipment with rapid mold changing capability according to claim 5, characterized in that: The mounting cover (601) is provided with a socket (604), and the connecting rod (602) is inserted into the mounting cover (601) through the socket (604).

7. The optical chip integrated packaging equipment with rapid mold changing capability according to claim 6, characterized in that: A second spring (605) is sleeved on the connecting rod (602). The second spring (605) is located inside the mounting cover (601), and both ends of the second spring (605) are fixedly connected to the mounting cover (601) and the removal plate (603), respectively.

8. The optical chip integrated packaging equipment with rapid mold changing capability according to claim 7, characterized in that: A circular plate (606) is installed at the other end of the connecting rod (602), and the circular plate (606) is located below the mounting cover (601).

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