Chip wafer underframe separation device

Abstract

The utility model belongs to chip wafer production equipment technical field, concretely relates to a chip wafer lower frame separation device. It includes: annular compression joint part, annular compression joint part bottom end is used to contact blue film upper surface, to cover the wafer on blue film in it, the inner diameter of annular compression joint part is greater than the outer diameter of wafer, the outer diameter of annular compression joint part is less than the inner diameter of metal frame on blue film, press part is located above wafer, is connected with annular compression joint part. The utility model is used to solve the problem that blue film is difficult to separate with metal frame in the lower frame process after wafer cutting. By contacting the bottom end of annular compression joint part with the surface of blue film, the annular structure can press the blue film as a whole, the press part above the wafer does not contact the wafer, and the whole separation device can be easily pressed and fixed by hand, at this time, the blue film on the metal frame can be directly separated, even if there is strong adhesion between the metal frame and the blue film, the metal frame and the blue film can also be safely and efficiently separated.

Description

Technical Field

[0001] This utility model belongs to the technical field of chip wafer manufacturing equipment, specifically relating to a chip wafer lower frame separation device. Background Technology

[0002] In the wafer manufacturing process, the dicing process involves cutting the produced chip wafers according to the dimensions of each chip. During dicing, the wafer is attached to the underlying blue film and secured with a metal frame before entering the dicing machine for cutting. After dicing, before shipping, the wafer, along with the blue film, needs to be separated from the metal frame.

[0003] However, in the existing separation process, when removing the wafer and blue film directly from the metal frame, the blue film is usually peeled off by hand along the edge of the metal frame. The wafer and blue film are prone to deformation due to the loss of support from the metal frame. This deformation may cause the chip position on the wafer to shift, leading to a series of unknown quality problems, such as chip damage and blue film adhesion, thus affecting product quality. Sometimes, if the blue film is not peeled properly, it may stick together. When it reaches the downstream factory and is placed on the screening machine, it will cause the blue film to be uneven and deformed, resulting in a series of problems such as the machine not being able to hold the blue film. Utility Model Content

[0004] To address the shortcomings of existing technologies, a chip wafer lower frame separation device is provided to solve the problem of the blue film being difficult to separate from the metal frame during the lower frame process after wafer dicing.

[0005] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A chip wafer lower frame separation device, comprising: An annular pressing part, the bottom end of which is used to contact the upper surface of the blue film to cover the wafer located on the blue film. The inner diameter of the annular pressing part is larger than the outer diameter of the wafer, and the outer diameter of the annular pressing part is smaller than the inner diameter of the metal frame located on the blue film. The pressing part is located above the wafer and is connected to the annular pressing part.

[0006] Compared with existing technologies, the above technical solutions have the following beneficial effects: By contacting the bottom end of the annular pressing part with the surface of the blue film, the annular structure can press the blue film in one circle. The pressing part located above the wafer does not contact the wafer, and the entire separation device can be easily pressed and fixed by hand. At this time, the blue film on the metal frame can be directly separated. Even if there is a strong adhesion between the metal frame and the blue film, the metal frame and the blue film can be separated safely and efficiently.

[0007] Based on the above technical solution, the embodiments of this application can be further improved as follows: In one embodiment, the device further includes an extension ring, the inner ring of which is provided with a first connecting ring, the first connecting ring being provided with a first external thread, and the inner side of the annular pressing portion being provided with a first internal thread that matches the first external thread.

[0008] By setting an extension ring, more blue film can be pressed down, increasing the contact area with the blue film. This makes it less likely for the blue film to deform when the metal frame is pulled. Furthermore, the extension ring is connected to the annular pressing part by a thread through the first connecting ring, making it detachable and allowing for the replacement of extension rings of different sizes and specifications.

[0009] In one embodiment, the outer diameter of the extension ring is smaller than the inner diameter of the metal frame, and the inner diameter of the extension ring is larger than the outer diameter of the wafer.

[0010] By controlling the inner and outer rings of the extension ring within a suitable range, the extension ring can fully contact the blue film without interfering with the wafer and the outer metal frame, thus maximizing the ease of separating the blue film and the metal frame.

[0011] In one embodiment, the device further includes a pressure ring for pressing against the surface of the extension ring. The inner ring of the pressure ring is provided with a second connecting ring, and the second connecting ring is provided with a second internal thread. The outer side of the annular pressing portion is provided with a second external thread that matches the second internal thread.

[0012] By using a pressure ring to connect and press the outer ring of the annular crimping part onto the extension ring, the outwardly extending extension ring can receive more support from above, preventing deformation of the outer ring extension ring when the entire extension ring is pressed down to close the annular crimping part.

[0013] In one embodiment, the outer diameter of the pressure ring is smaller than the outer diameter of the extension ring.

[0014] In one embodiment, the outer wall of the second connecting ring is provided with a plurality of reinforcing ribs spaced apart circumferentially, and the bottom end of the reinforcing ribs is connected and fixed to the surface of the pressure ring.

[0015] The addition of multiple reinforcing ribs enhances the supporting function.

[0016] In one embodiment, the outer side of the bottom end of the reinforcing rib extends to be pressed against the surface of the extension ring.

[0017] In one embodiment, the annular pressing portion and / or the pressing portion are made of a transparent or translucent material.

[0018] The wafer is made transparent or semi-transparent, allowing the internal wafer to be seen through the pressing or pressing part, thus preventing damage to the wafer when the annular pressing part covers the blue film on the outer periphery of the wafer.

[0019] In one embodiment, the pressing part is provided with a handle.

[0020] The handle on the pressing part makes it easy for operators to pick up the entire separation device. Attached Figure Description

[0021] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of this utility model.

[0023] Figure 2 This is a schematic diagram of the usage state in Embodiment 1 of this utility model.

[0024] Figure 3 This is a schematic diagram of the overall structure of Embodiment 2 of this utility model.

[0025] Figure 4 for Figure 3 A schematic diagram of the longitudinal cross-section structure.

[0026] Figure 5 for Figure 4 A schematic diagram of the explosion structure.

[0027] Figure 6 This is a schematic diagram of the usage state in Embodiment 2 of this utility model.

[0028] Figure label: 1. Annular crimping part; 2. Pressing part; 3. Extension ring; 4. First connecting ring; 5. First external thread; 6. First internal thread; 7. Pressure ring; 8. Second connecting ring; 9. Second internal thread; 10. Second external thread; 11. Reinforcing rib; 12. Handle; 13. Wafer; 14. Blue film; 15. Metal frame. Detailed Implementation

[0029] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the present invention and should not be construed as limiting the scope of protection of the present invention. It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this utility model pertains.

[0030] In the description of this application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0031] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly defined.

[0032] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0033] Example 1 like Figure 1 As shown, the wafer 13 lower frame separation device provided by this utility model is used in the lower frame process after wafer 13 is cut. At this time, the wafer 13 is attached to the center surface of the blue film 14, and the metal frame 15 is attached to the outer ring surface of the blue film 14. The metal frame 15 is an annular metal frame 15. It is necessary to remove the metal frame 15 from the blue film 14. This is specifically achieved by using the separation device in this example. The separation device includes: an annular pressing part 1 and a pressing part 2.

[0034] like Figure 2 As shown, the bottom end of the annular pressing part 1 is used to contact the upper surface of the blue film 14 to cover the wafer 13 located on the blue film 14. The inner diameter of the annular pressing part 1 is larger than the outer diameter of the wafer 13, and the outer diameter of the annular pressing part 1 is smaller than the inner diameter of the metal frame 15 located on the blue film 14. Specifically, the bottom end of the annular pressing part 1 is placed on the blue film 14 between the wafer 13 and the metal frame 15 to perform a pressing function. When the annular pressing part 1 and the pressing part 2 are used alone, the first internal thread 6 and the second external thread 10 do not need to be provided on the annular pressing part 1.

[0035] The pressing part 2 is located above the wafer 13 to ensure that it does not come into contact with the wafer 13. At the same time, the pressing part 2 is connected to the annular pressing part 1. When the pressing part 2 is pressed, it can be pressed together with the annular pressing part 1 onto the blue film 14. The pressing part 2 can be integrally formed with the annular pressing part 1.

[0036] By contacting the bottom end of the annular pressing part 1 with the surface of the blue film 14, the annular structure can press the blue film 14 in one circle. The pressing part 2 located above the wafer 13 does not contact the wafer 13, and can be easily pressed and fixed by hand. At this time, the metal frame 15 can be pulled upwards directly to separate the blue film on the metal frame. Even if there is a strong adhesion between the metal frame and the blue film, the metal frame and the blue film can be separated safely and efficiently.

[0037] Example 2 like Figures 3-6 As shown, based on Embodiment 1, in order to increase the contact area with the blue film 14 and prevent the blue film 14 from deforming, an extension ring 3 is also included. The inner ring of the extension ring 3 is provided with a first connecting ring 4, and the first connecting ring 4 is provided with a first external thread 5. The inner side of the annular pressing part 1 is provided with a first internal thread 6 that matches the first external thread 5. After the annular pressing part 1 is connected to the threaded part of the first connecting ring 4 through the internal thread, when the annular pressing part 1 is pressed down, it can press on the extension ring 3. The bottom surface of the extension ring 3 increases the contact area with the blue film 14. By setting the extension ring 3, more of the blue film 14 can be pressed down, increasing the contact area with the blue film 14. When the metal frame 15 is pulled, the blue film 14 is less likely to deform. In addition, the extension ring 3 is connected to the threaded part of the annular pressing part 1 through the first connecting ring 4, forming a detachable extension ring 3, so that extension rings of different sizes and specifications can be replaced.

[0038] Specifically, in order not to affect the removal of the metal frame 15, the outer diameter of the extension ring 3 is smaller than the inner diameter of the metal frame 15, and the inner diameter of the extension ring 3 is larger than the outer diameter of the wafer 13. By controlling the inner and outer diameters of the extension ring 3 within a suitable range, the extension ring 3 can fully contact the blue film 14 without interfering with the wafer 13 and the outer metal frame 15, thus maximizing the convenience of separating the blue film 14 and the metal frame 15.

[0039] To improve the support effect on the extension ring 3, a pressure ring 7 is also included for pressing against the surface of the extension ring 3. The inner ring of the pressure ring 7 is provided with a second connecting ring 8, and the second connecting ring 8 is provided with a second internal thread 9. The outer side of the annular pressing part 1 is provided with a second external thread 10 that matches the second internal thread 9. Similarly, the second internal and external threads can be used to detachably connect the pressure ring 7 and the annular pressing part 1.

[0040] Furthermore, by using the pressure ring 7 to connect and press the outer ring of the annular pressing part 1 onto the extension ring 3, the outwardly extending extension ring 3 can receive more support from above, thus preventing the outer ring extension ring 3 from deforming when the entire extension ring 3 is pressed down to close the annular pressing part 1.

[0041] Similarly, in order not to affect the removal of the metal frame 15, the outer diameter of the pressure ring 7 is smaller than the outer diameter of the extension ring 3.

[0042] To improve the stability of the second connecting ring 8 and the pressure ring 7, and to increase the pressure of the pressure ring 7 on the surface of the extension ring 3, a number of reinforcing ribs 11 are provided circumferentially on the outer wall of the second connecting ring 8. The bottom end of the reinforcing ribs 11 is connected and fixed to the surface of the pressure ring 7. The multiple reinforcing ribs 11 can better provide support.

[0043] The outer side of the bottom end of the reinforcing rib 11 extends to press against the surface of the extension ring 3. By extending the reinforcing rib 11 outward and pressing it against the surface of the extension ring 3, the downward support effect of the reinforcing rib 11 on the extension ring 3 can be directly improved, while ensuring that the outer side of the reinforcing rib 11 does not extend beyond the outer ring of the extension ring 3.

[0044] To facilitate observation of the internal wafer 13, the annular pressing part 1 and / or the pressing part 2 are made of transparent or semi-transparent material. Alternatively, the pressing part 2 can be made of transparent or semi-transparent material to observe the wafer 13 from the pressing part 2, or the annular pressing part 1 can be made of transparent or semi-transparent material to observe the wafer 13 from the annular pressing part 1, or both the annular pressing part 1 and the pressing part 2 can be made transparent or semi-transparent. The design allows the wafer 13 to be seen through the pressing or pressing part 2, preventing damage to the wafer 13 when the annular pressing part 1 covers the blue film 14 on the outer periphery of the wafer 13. Specifically, the material can be made of materials such as PP, PE, or PTFE, which are durable, stable, and do not easily adhere to the blue film 14.

[0045] In this embodiment, a handle 12 is provided on the pressing part 2. In this example, the handle 12 on the pressing part 2 is implemented by connecting with screws and nuts, or a fixed handle can be installed, which can make it convenient for the operator to pick up the entire separation device.

[0046] In specific operation, the blue film 14, wafer 13 and metal frame 15 are placed as a whole on the table. Then, a separation device of appropriate size is selected, and the bottom end of the annular pressing part 1 is brought into contact with the blue film 14. One hand presses down the pressing part 2, and the other hand pulls the metal frame 15 upward to separate the metal frame 15 from the blue film 14. Then, the subsequent process is carried out. If the blue film 14 is large, an extension ring 3 can be connected to the annular pressing part 1. Furthermore, a pressure ring 7 can be connected to press the upper surface of the extension ring 3. In use, the lower surface of the extension ring 3 is brought into contact with the blue film 14. Compared with the annular pressing part 1, the extension ring 3 has a larger contact area and is less likely to deform the blue film 14.

[0047] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A chip wafer lower frame separation device, characterized in that, include: An annular pressing part, the bottom end of which is used to contact the upper surface of the blue film to cover the wafer located on the blue film. The inner diameter of the annular pressing part is larger than the outer diameter of the wafer, and the outer diameter of the annular pressing part is smaller than the inner diameter of the metal frame located on the blue film. The pressing part is located above the wafer and is connected to the annular pressing part; It also includes an extension ring, the inner ring of which is provided with a first connecting ring, the first connecting ring being provided with a first external thread, and the inner side of the annular pressing part being provided with a first internal thread that matches the first external thread; The outer diameter of the extension ring is smaller than the inner diameter of the metal frame, and the inner diameter of the extension ring is larger than the outer diameter of the wafer. It also includes a pressure ring for pressing against the surface of the extension ring, wherein the inner ring of the pressure ring is provided with a second connecting ring, the second connecting ring is provided with a second internal thread, and the outer side of the annular pressing part is provided with a second external thread that matches the second internal thread; The outer diameter of the pressure ring is smaller than the outer diameter of the extension ring; The outer wall of the second connecting ring is provided with a plurality of reinforcing ribs spaced apart in the circumferential direction, and the bottom end of the reinforcing ribs is connected and fixed to the surface of the pressure ring; The outer side of the bottom end of the reinforcing rib extends to be pressed against the surface of the extension ring.

2. The chip wafer lower frame separation device according to claim 1, characterized in that, The annular pressing part and / or the pressing part are made of transparent or semi-transparent material.

3. The chip wafer lower frame separation device according to claim 1, characterized in that, The pressing part is provided with a handle.

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