A semiconductor device assembly apparatus

Abstract

The utility model relates to technical field of semiconductor assembly equipment, and specifically is a kind of semiconductor device assembly equipment, including rack, and rack is equipped with first feeding area, second feeding area, material assembly area;First feeding area is equipped with frame, steering assembly for transferring frame from first feeding area to material assembly area, and steering assembly is used to frame from horizontal placement rotates to vertical placement;Second feeding area is equipped with heat dissipation piece, guiding component for the rotation of heat dissipation piece, second positioning member for positioning heat dissipation piece to material assembly area;Material assembly area is equipped with assembly area limiting cavity for the frame extension of steering, first positioning member for positioning frame to assembly area limiting cavity, second clamping assembly for transferring frame from assembly area limiting cavity to material assembly area, mounting assembly for assembling frame and heat dissipation piece.The frame and heat dissipation piece of the utility model are directly moved to material assembly area and assembled, which is conducive to improving production efficiency.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor assembly equipment technology, specifically a semiconductor device assembly equipment. Background Technology

[0002] Leadframes are one of the most critical semiconductor materials in microelectronic back-end packaging. The finished frame needs to be connected to a heat sink. For example, Chinese patent document CN111791039A discloses an automatic riveting system and method for leadframes and heat sinks. In this method, the frame or heat sink is first placed on a conveyor line. During the rotation of the turntable, the horizontally arranged leadframe and heat sink are transferred to the turntable in their respective areas step by step and stacked in the vertical direction. The turntable is then rotated to the working area for connection and assembly.

[0003] However, during the rotation of the turntable, both the lead frame and the heat sink need to wait for the turntable to rotate a certain angle before they can be placed one after the other. Due to the size of the working area and the limitations of the suction cup or the movement of the robot arm, the lead frame and the heat sink cannot be moved directly to the working area on the turntable, which increases the waiting time and reduces production efficiency.

[0004] Therefore, it is necessary to optimize and improve semiconductor assembly equipment to increase production efficiency. Utility Model Content

[0005] Regarding the aforementioned technical problem in existing turntables where the lead frame and heat sink need to wait for the turntable to rotate a certain angle before being placed sequentially, and where the lead frame and heat sink cannot be directly moved to the working area on the turntable due to limitations in the size of the working area and the travel distance of the suction cup or robot arm, thus increasing waiting time and reducing production efficiency, the technical solution adopted by this utility model to solve this problem is: A semiconductor device assembly apparatus includes a rack, the rack having a first feeding area, a second feeding area, and a material assembly area; The first feeding area is provided with a frame and a steering component that transfers the frame from the first feeding area to the material assembly area. The steering component is used to rotate the frame from a horizontal position to a vertical position. The second feeding area is equipped with a heat dissipation component, a guide assembly for rotating the heat dissipation component, and a second positioning component for positioning the heat dissipation component to the material assembly area; The material assembly area is provided with an assembly area limiting cavity into which a frame for steering extends, a first positioning member for positioning the frame to the assembly area limiting cavity, a second clamping assembly for transferring the frame from the assembly area limiting cavity to the material assembly area, and an installation assembly for assembling the frame with a heat sink.

[0006] Furthermore, the material assembly area includes a first limiting material assembly area, which is provided with a first accommodating cavity that simultaneously accommodates the frame and the heat sink, and a limiting block located outside the first accommodating cavity. The first accommodating cavity is provided with a first accommodating cavity opening that communicates with the second feeding area. The limiting block is symmetrically arranged on both sides of the first accommodating cavity opening and is perpendicular to the moving direction of the heat sink. When the limiting block extends simultaneously, it is used to press the heat sink into the first accommodating cavity.

[0007] Furthermore, the material assembly area includes a second installation material assembly area, the second installation material assembly area includes a second accommodating cavity for accommodating the frame and the heat sink, and the installation assembly includes a first pushing assembly that abuts against the heat sink and a second pushing assembly that abuts against the frame. The first pushing assembly and the second pushing assembly are disposed opposite to each other. The first pushing assembly includes a first fixed housing and a first top block disposed in the first fixed housing. The second pushing assembly includes a second top block and an eighth driving mechanism connected to the second top block.

[0008] Furthermore, the second feeding area is provided with a vibratory feeder connected to the guide assembly and a third driving device for moving the heat sink to the guide assembly. The second feeding area is provided with a second track communicating with the first accommodating cavity. The extension direction of the second track is perpendicular to the extension direction of the guide assembly. The second positioning member is provided with a second positioning push rod for pushing the heat sink entering the second track from the end of the guide assembly to the material assembly area and a fourth driving part for driving the second positioning push rod to move back and forth in a straight line. The second track is provided with a second baffle, and the second positioning push rod is provided with a second pushing end that abuts against the heat sink.

[0009] Furthermore, the steering assembly includes a rotating disk, a limiting housing connected to the frame, a limiting rotating shaft that limits the rotating disk to the limiting housing, and a third driving assembly that drives the rotating disk to rotate. The rotating disk is provided with a rotating disk limiting cavity into which the frame extends. When the rotating disk rotates, the rotating disk limiting cavity communicates with the assembly area limiting cavity.

[0010] Furthermore, the rotating disk is provided with a limiting post, and the third driving assembly is provided with a sliding part, a third driving part for driving the sliding part to move, a sliding fixing member connected to the upper side of the sliding part, and a limiting groove located on the sliding fixing member and cooperating with the limiting post. The limiting groove is arranged in a vertical direction, and the rotating disk rotates under the action of the limiting housing and the limiting groove.

[0011] Furthermore, the sliding part is provided with an abutting bracket, the frame is provided with a limiting bracket that abuts against the abutting bracket, and the rotating disk is limited between the end of the first feeding area and the limiting housing.

[0012] Furthermore, the first positioning component includes a positioning fixing part, a connecting limiting groove disposed on the positioning fixing part and communicating with the rotating disk limiting cavity, a first positioning push rod, a fourth driving part that drives the first positioning push rod to move back and forth in a straight line, and a positioning part connected to the first positioning push rod and movable along the connecting limiting groove. The positioning part is provided with a first pushing end, which is used to push the frame of the rotating disk limiting cavity to the assembly area limiting cavity. The assembly area limiting cavity is provided with an assembly area opening groove for the second clamping component to extend into.

[0013] Furthermore, the second clamping assembly includes a second clamping part, a sixth driving part for driving the second clamping part to move up and down, a seventh driving part for driving the second clamping part to move in the front-back direction, and the extension direction of the assembly area opening groove is consistent with the front-back movement direction of the second clamping part.

[0014] Furthermore, the guide assembly includes a V-shaped groove into which the heat sink extends. The V-shaped groove is spirally arranged on the outside of the guide assembly along the extension direction of the guide assembly, so that the heat sink can rotate 90 degrees relative to it. The third driving device is located at the starting end of the guide assembly.

[0015] The beneficial effects of this utility model are as follows: This invention uses a steering component to rotate a horizontally placed frame to a vertical position, allowing the frame to enter the material assembly area vertically during the loading process. The heat sink is positioned in the material assembly area and connected to the frame via an installation component. This avoids the complex operations of picking up or stacking parts during turntable conveying in traditional technologies, and also eliminates the need for a turntable, which increases loading waiting time. The frame and heat sink of this invention move directly to the material assembly area for assembly, which helps improve production efficiency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of a semiconductor device assembly equipment according to the present invention.

[0017] Figure 2 for Figure 1 Enlarged view of part A.

[0018] Figure 3 This is a schematic diagram of a semiconductor device assembly device according to the present invention from another angle.

[0019] Figure 4 for Figure 3 Enlarged view of part B.

[0020] Figure 5 This is a schematic diagram and a partial enlarged view of a semiconductor device assembly equipment according to the present invention.

[0021] Figure 6 This is a schematic diagram and a partial enlarged view of a semiconductor device assembly equipment according to the present invention.

[0022] Figure 7 This is an exploded view of the steering component, assembly area limiting cavity, and first positioning component of this utility model.

[0023] Figure 8 This is a schematic diagram of the steering component, assembly area limiting cavity, and first positioning component of this utility model.

[0024] Figure 9 This is a schematic diagram showing the coordination of the steering component, the assembly area limiting cavity, and the first positioning component of this utility model.

[0025] Figure 10 This is a schematic diagram of the second feeding area and material assembly area of ​​this utility model.

[0026] Figure 11 This is another schematic diagram of the second feeding area and material assembly area of ​​this utility model.

[0027] Figure 12 This is a schematic diagram of the second feeding area of ​​this utility model.

[0028] Figure 13 This is a schematic diagram of a semiconductor device assembly device according to the present invention, showing the pushing of a heat sink in the second feeding area.

[0029] Figure 14 for Figure 13 Enlarged view of part C.

[0030] Figure 15 This is an enlarged view of the assembly of a semiconductor device assembly equipment according to the present invention in the first limiting material assembly area.

[0031] Figure 16 This is an enlarged view of the transfer of a semiconductor device assembly device in the first limiting material assembly area according to the present invention.

[0032] Figure 17 This is a schematic diagram of the assembly components of a semiconductor device assembly equipment according to the present invention.

[0033] Figure 18 for Figure 17 Enlarged view of part D. Detailed Implementation

[0034] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0035] like Figures 1 to 18 The semiconductor device assembly equipment shown includes a frame 1, which is provided with a first feeding area 100, a second feeding area 200, and a material assembly area 300. The first feeding area 100 is provided with a frame 21, and a turning component 3 is used to transfer the frame 21 from the first feeding area 100 to the material assembly area 300. The turning component 3 is used to rotate the frame 21 from a horizontal position to a vertical position. The second feeding area 200 is provided with a heat dissipation component 71, a guide assembly 8 for rotating the heat dissipation component 71, and a second positioning component 9 for positioning the heat dissipation component 71 to the material assembly area 300; The material assembly area 300 is provided with an assembly area limiting cavity 4 into which a frame 21 for steering extends, a first positioning member 5 for positioning the frame 21 to the assembly area limiting cavity 4, a second clamping assembly 6 for transferring the frame 21 from the assembly area limiting cavity 4 to the material assembly area 300, and an installation assembly 10 for assembling the frame 21 with the heat sink 71.

[0036] This invention uses a steering component to rotate a horizontally placed frame to a vertical position, allowing the frame to enter the material assembly area vertically during the loading process. The heat sink is positioned in the material assembly area and connected to the frame via an installation component. This avoids the complex operations of picking up or stacking parts during turntable conveying in traditional technologies, and also eliminates the need for a turntable, which increases loading waiting time. The frame and heat sink of this invention move directly to the material assembly area for assembly, which helps improve production efficiency.

[0037] The first feeding area 100 is provided with a tray 2, a frame 21 located on the tray 2, a conveying component 22, and a first clamping component 23 for transferring the frame 21 from the tray 2 to the conveying component 22. This utility model uses the first clamping component to clamp the frame for feeding, the steering component to adjust the placement position of the frame, the first positioning component to position the frame entering the material assembly area, and the second clamping component to transfer the frame from the assembly area limiting cavity to the material assembly area. The process does not require the use of a turntable, which realizes efficient feeding and precise positioning of the frame, which is conducive to the rapid and accurate assembly of the frame with other components such as heat sinks from the side, and improves the overall feeding efficiency and assembly accuracy.

[0038] like Figures 1 to 3 As shown, the storage tray 2 has a receiving cavity 24, a step 25 located on the inner wall of the receiving cavity 24, and a receiving groove 26 disposed in the middle of the receiving cavity 24 for fixing the frame 21. The first clamping assembly 23 clamps multiple frames 21 simultaneously along a straight line. The first clamping assembly 23 includes multiple first clamping parts 231 that can simultaneously extend into the receiving cavity 24, a first clamping driving part 232 that drives the first clamping parts 231 to move up and down, and a second clamping driving part 233 that drives the first clamping parts 232 to move between the conveying assembly 22 and the storage tray 2.

[0039] Furthermore, by simultaneously clamping multiple frames along a straight line with the first clamping component and directionally rotating the frames with the steering component, the feeding efficiency is improved, and an efficient and continuous conveying path for the frames is realized from the storage tray to the conveying component and then to the material assembly area.

[0040] Specifically, the first clamping assembly includes multiple first clamping parts that can simultaneously extend into the receiving cavity, enabling multiple frames to be clamped at once. Through the drive of the second clamping drive part, multiple frames are synchronously transferred between the storage tray and the conveying assembly, effectively reducing the number of cycles in a single loading operation, improving the loading efficiency and capacity of the frames, and meeting the needs of high-efficiency packaging production.

[0041] Specifically, the accommodating cavity has a accommodating groove in the middle for fixing the frame, and the inner wall of the accommodating cavity has a stepped structure, which can limit and pre-fix the frame placed on the storage tray, so that the frame is in a stable and non-displaceable clamping state on the storage tray. When the first clamping part extends into the accommodating cavity to grasp, the frame is positioned in the accommodating groove, thereby improving the clamping accuracy and stability, avoiding clamping failure or damage caused by frame shaking or misalignment, and improving the safety and reliability of the loading process.

[0042] Specifically, by setting a first clamping drive unit to drive the first clamping part to move up and down, and a second clamping drive unit to drive the first clamping part to move horizontally between the conveying component and the placement tray, the first clamping component can flexibly adjust its position in three-dimensional space, adapt to placement trays and conveying components of different heights, and adjust the horizontal clamping movement path distance according to process requirements. This enhances the adaptability of the feeding mechanism to different frame specifications or different production line layouts, and improves the versatility and scalability of the overall equipment.

[0043] Specifically, the first clamping drive unit can be driven by a cylinder, and the second clamping drive unit can be driven by a gear and rack meshing mechanism, or by a track and slider structure working together to move.

[0044] like Figures 1 to 3 As shown, the conveying assembly 22 includes a first conveying area 221 for placing the first clamping part 231, a second conveying area 222 connected to the steering assembly 3, a guide ramp 223 located between the first conveying area 221 and the second conveying area 222, a conveyor belt 224 located below the first clamping part 231, a conveying drive part 225 for driving the conveyor belt 224 to move, and a first baffle located in the second conveying area 222.

[0045] Furthermore, by setting up a first conveying area and a second conveying area, and using a guide ramp to achieve a natural connection and transition between the two areas, the frame placed by the first clamping part can be smoothly introduced from the first conveying area into the second conveying area via the guide ramp, and then conveyed to the subsequent steering component. This effectively avoids the frame from shifting, getting stuck or falling during the conveying process due to height difference or sudden path change, and improves the stability and smoothness of the frame conveying process.

[0046] Specifically, a conveyor belt is provided on the lower side of the first clamping part, and the conveyor belt is driven by the conveying drive part to move, which can apply controllable conveying power to the frame placed on the first conveying area or the second conveying area, so as to realize the automatic conveying of the frame along the set direction; by adjusting the movement speed and direction of the conveyor belt, the position of the frame during the conveying process can be controlled to ensure the smooth connection of subsequent process steps.

[0047] Optionally, in some embodiments, the guide ramp gradually narrows from the first conveying area to the second conveying area, so that the narrower second conveying area can limit the frame.

[0048] Specifically, a first baffle is installed in the second conveying area. When the frame moves to the end of the second conveying area with the conveyor belt, the extended first baffle can limit and stop the frame, ensuring that the frame is in an accurate preset position before entering the steering assembly. This avoids positional deviation caused by inertia or excessive conveying speed, improving the positioning accuracy and stability of the frame before entering the next process. After the steering assembly resets, the extended first baffle can avoid the frame, allowing it to continue moving.

[0049] Optionally, in some embodiments, the second conveying area or the steering assembly is equipped with an infrared sensing device capable of sensing a frame detaching from the end of the second conveying area or entering the steering assembly, causing the first baffle to move to block the next frame. Optionally, the first baffle can be driven by a cylinder to move reciprocally in a straight line.

[0050] like Figures 13 to 18 The semiconductor device assembly equipment shown includes a material assembly area 300 comprising a first limiting material assembly area 310. The first limiting material assembly area 310 is provided with a first accommodating cavity 3101 that simultaneously accommodates the frame 21 and the heat sink 71, and a limiting block 3102 located outside the first accommodating cavity 3101. The first accommodating cavity 3101 is provided with a first accommodating cavity opening 31011 that communicates with the second feeding area 200. The limiting block 3102 is symmetrically arranged on both sides of the first accommodating cavity opening 31011 and is perpendicular to the moving direction of the heat sink 71. When the limiting block 3102 extends simultaneously, it is used to press the heat sink 71 into the first accommodating cavity 3101.

[0051] Specifically, when the limiting block moves to avoid the obstruction, the second positioning member pushes the heat sink through the opening of the first receiving cavity and into the first receiving cavity. At this time, the first receiving cavity already contains the frame and the heat sink, but the pushing of the heat sink may not be tight enough, which could cause it to loosen and fall off when the second clamping part clamps the frame and the heat sink simultaneously. When the limiting block extends towards the opening of the first receiving cavity, it can press the heat sink into the first receiving cavity, making the second clamping part further securely clamp the entire frame and heat sink structure. Specifically, the limiting block is driven by a cylinder to move linearly.

[0052] like Figures 13 to 18 The semiconductor device assembly equipment shown includes a material assembly area 300 comprising a second mounting material assembly area 320, the second mounting material assembly area 320 including a second receiving cavity 3201 accommodating the frame 21 and the heat sink 71. The mounting assembly 10 includes a first pushing assembly 3202 abutting against the heat sink 71 and a second pushing assembly 3203 abutting against the frame 21. The first pushing assembly 3202 and the second pushing assembly 3203 are disposed opposite to each other. The first pushing assembly 3202 includes a first fixing housing 32021 and a first top block 32022 disposed on the first fixing housing 32021. The second pushing assembly 3203 includes a second top block 32031 and an eighth driving mechanism 32032 connected to the second top block 32031. Specifically, in some embodiments, such as... Figure 14 As shown, the frame has protruding buckles, and the heat sink has grooves that mate with the protruding buckles, allowing for a proper connection.

[0053] Specifically, the eighth drive mechanism can be cylinder-driven. When the second clamping part clamps the entire frame and heat sink structure from the first limiting material assembly area to the second installation material assembly area, the second accommodating cavity can smoothly restrict the entire frame and heat sink to remain stable. Through the relative arrangement of the first push assembly and the second push assembly, the second push assembly pushes the frame, so that the frame and heat sink can be further connected and assembled, thereby enabling the frame and heat sink to complete the assembly, and further enabling the two components to be smoothly assembled.

[0054] like Figure 10 and Figure 11The semiconductor device assembly equipment shown includes a second feeding area 200 with a vibratory feeder 7 connected to the guide assembly 8 and a third driving device for moving a heat sink 71 to the guide assembly 8. The second feeding area 200 is provided with a second track 210 communicating with the first accommodating cavity 3101. The extension direction of the second track 210 is perpendicular to the extension direction of the guide assembly 8. The second positioning member 9 is provided with a second positioning push rod 91 for pushing the heat sink 71, which enters from the end of the guide assembly 8 into the second track 210, to the material assembly area 300, and a fourth driving part 92 for driving the second positioning push rod 91 to move back and forth in a straight line. The second track 210 is provided with a second baffle 2101, and the second positioning push rod 91 is provided with a second pushing end 911 that abuts against the heat sink 71.

[0055] Furthermore, the second track is perpendicular to the extension direction of the guide assembly, allowing the heat sink conveyed from the guide assembly to enter the second track through its end. The heat sink is then pushed along the extension direction of the second track by the second positioning push rod, and finally precisely pushed by the second pushing end to the material assembly area, achieving accurate horizontal docking with the frame. This structure eliminates the need for complex turning or multiple handling during the heat sink loading process, simplifying the heat sink's conveying path and positioning process, and improving the efficiency and consistency of heat sink loading.

[0056] Specifically, a second baffle is provided on the second track. When the heat sink is conveyed along the second track to the vicinity of the material assembly area, the second baffle can limit and stop the heat sink, keeping it in a stable ready-to-push state before being pushed, avoiding positional deviation caused by inertia or excessive conveying speed, and ensuring that the heat sink is in an accurate preset position before being pushed. When the frame enters the material assembly area, the second baffle opens, and the second pushing end can push the heat sink to move on the second track. Specifically, the second baffle is driven by a cylinder to achieve reciprocating movement on the second track.

[0057] Specifically, the second track is arranged perpendicular to the guide assembly, making the conveying path of the heat sink and the conveying path of the frame orthogonal in space. This avoids mutual interference during the conveying process and effectively utilizes the internal space layout of the equipment. The second positioning component moves reciprocally along a straight line under the drive of the fourth drive unit via the second positioning push rod, and pushes the heat sink by contacting it with the second pushing end. This allows for rapid transfer of the heat sink from the second track to the material assembly area without the need for a complex multi-axis motion mechanism. Figure 10 and Figure 11 As shown, the frame 1 is also provided with a second drive device 72 that drives the heat sink 71 to move to the guide assembly 8. The heat sink 71 is connected to the frame 21 in the horizontal direction.

[0058] This invention uses a second driving device to move the heat sink to the guide assembly. A vibratory feeder then uses vibration to move the heat sink on the guide assembly, automatically sorting and feeding it. This allows the heat sink to be transported to a predetermined position in an orderly manner, achieving fully automated and continuous supply of heat sinks from the material source to the material assembly area. This not only improves the feeding efficiency of the heat sink but also ensures the stability and consistency of the feeding. A second positioning component positions the heat sink, ensuring accurate horizontal alignment with the frame in the material assembly area. This eliminates the waiting time caused by using a turntable, thus simplifying the entire conveying and alignment process of the heat sink from feeding to assembly with the frame.

[0059] Specifically, because the heat sink is positioned horizontally with the frame in the material assembly area via the second positioning element, welding, pressing, and bonding can be performed in the correct relative positions. This effectively improves the assembly accuracy and connection reliability between the frame and the heat sink. Furthermore, since both are positioned within the material assembly area, the connection process is smoother and more efficient, contributing to improved overall packaging quality and efficiency. Optionally, in some embodiments, such as... Figure 1 and Figure 3 As shown, the second drive device can be a conveyor belt or a combination of a conveyor belt and a robot arm, so that the heat sink can be smoothly connected to the guide assembly.

[0060] like Figures 5 to 9 The semiconductor device assembly equipment shown includes a steering assembly 3 comprising a rotating disk 31, a limiting housing 32 connected to a frame 1, a limiting rotation shaft 33 that limits the rotating disk 31 to the limiting housing 32, and a third driving assembly 34 that drives the rotating disk 31 to rotate. The rotating disk 31 is provided with a rotating disk limiting cavity 311 into which a frame 21 extends. When the rotating disk 31 rotates, the rotating disk limiting cavity 311 communicates with the assembly area limiting cavity 4.

[0061] Furthermore, the steering assembly, by setting a rotatable turntable and a turntable limiting cavity on the turntable, can accommodate the frame, which was originally placed in a horizontal state, within the turntable limiting cavity. Through the rotation of the turntable, the frame can be changed from a horizontal posture to a vertical posture, thus eliminating the need for additional complex lifting or flipping mechanisms and improving the overall process continuity and ease of operation of the feeding mechanism.

[0062] Specifically, the rotating disk is limited within the limiting housing by a limiting rotating shaft and is driven to rotate by a third drive component. This effectively limits the radial and axial offset of the rotating disk during rotation, ensuring its stability and reliability. After rotating to a set angle, the rotating disk can be positioned to connect the limiting cavity of the rotating disk with the limiting cavity of the subsequent assembly area, ensuring that the frame can smoothly enter the next process area after changing its posture, thus improving the positioning accuracy and process consistency of the overall feeding and assembly process.

[0063] Specifically, the limiting housing has a limiting housing hole for the limiting rotating shaft to extend into, and the rotating disk has a rotating disk hole for the limiting rotating shaft to be inserted into. This prevents the rotating disk from detaching from the limiting housing. When the rotating disk rotates, the limiting rotating shaft and the limiting housing do not interfere with each other and rotate synchronously, allowing the rotating disk to rotate relative to the limiting housing. When the rotating disk rotates to a certain angle, the rotating disk presses down, causing the limiting rotating shaft to be pressed against the limiting housing hole for support, preventing the rotating disk from shifting. When the rotating disk rotates to a predetermined angle, the rotating disk limiting cavity connects to the assembly area limiting cavity in the material assembly area, allowing the vertically positioned frame to directly enter the assembly area limiting cavity from the rotating disk limiting cavity.

[0064] Optionally, in some embodiments, during the rotation of the rotating disk, the limiting housing can prevent the frame located in the limiting cavity of the rotating disk from dislodging from the limiting cavity of the rotating disk.

[0065] like Figures 5 to 9 The semiconductor device assembly equipment shown includes a rotating disk 31 with a limiting post 312, and a third driving component 34 with a sliding part 341, a third driving part 342 for driving the sliding part 341 to move, a sliding fixing member 343 connected to the upper side of the sliding part 341, and a limiting groove 344 located on the sliding fixing member 343 and cooperating with the limiting post 312. The limiting groove 344 is arranged in a vertical direction, and the rotating disk 31 rotates under the action of the limiting housing 32 and the limiting groove 344.

[0066] Furthermore, the sliding fixing component is provided with a limiting groove arranged in the vertical direction. The limiting post on the rotating disk can be slidably engaged in the limiting groove. When the third driving part drives the sliding part to move the sliding fixing component, the limiting groove can apply a directional guiding force to the limiting post, thereby controlling the rotation direction and rotation trajectory of the rotating disk. This ensures that the rotating disk rotates at a preset angle, effectively improving the positioning accuracy and motion reliability of the rotation action, and ensuring that the limiting cavity of the rotating disk can accurately communicate with the limiting cavity of the assembly area after rotation.

[0067] This invention transforms the linear sliding motion of the third drive component into the rotational motion of the rotating disk through the cooperation of the limiting groove and the limiting post. This eliminates the need for a complex rotary drive device, simplifies the drive structure, reduces manufacturing and assembly difficulty, and reduces the number of moving parts, thereby improving the overall reliability and ease of maintenance of the equipment.

[0068] Specifically, the rotating disk not only achieves rotational guidance through the limiting groove, but is also disposed within the limiting housing and is physically constrained by the limiting housing. This effectively prevents radial offset, swaying, or tilting during rotation, ensuring smooth and controllable rotation. Because the limiting groove is vertically oriented and tightly engages with the limiting post, under the control of the third drive assembly, the rotating disk achieves a consistent rotation angle and stop position with each rotation, thus realizing high repeatability and consistent action.

[0069] Optionally, in some embodiments, the third drive unit is driven by a cylinder or by a lead screw motor.

[0070] like Figures 5 to 9 The semiconductor device assembly equipment shown has a sliding part 341 with an abutment bracket 3411, a frame 1 with a limiting bracket 11 that abuts against the abutment bracket 3411, and a rotating disk 31 that is limited between the end of the first feeding area 100 and the limiting housing 32.

[0071] Furthermore, the abutment bracket provided on the sliding part can abut against the limiting bracket fixed on the frame when the sliding part is driven to the set position by the third drive component, thereby limiting the further movement of the sliding part and the rotating disk connected to it, ensuring that the rotating disk stops in time after rotating to the target angle, effectively preventing over-rotation or position deviation. By mechanically limiting the end position of the rotation action, the reliability and positioning accuracy of rotation control are improved.

[0072] Furthermore, the limiting bracket and the abutment bracket are equipped with buffer blocks to reduce the impact of impact on the overall structure. The sliding part is equipped with guide rails and sliders to improve the smoothness of movement.

[0073] Specifically, the rotating disk is stably positioned between the end of the second conveying area and the limiting housing, so that during rotation, the rotating disk is not only constrained by the inner side of the limiting housing but also by the space restriction at the end of the second conveying area, thus effectively fixing it in both the radial and axial directions and preventing the rotating disk from shifting, shaking, or loosening in the rotating or stationary state. Specifically, the rotation angle of the rotating disk is 90 degrees.

[0074] like Figures 1 to 7The semiconductor device assembly equipment shown includes a first positioning member 5 comprising a positioning fixing part 51, a connecting limiting groove 52 disposed on the positioning fixing part 51 and communicating with the rotating disk limiting cavity 311, a first positioning push rod 53, a fourth driving part 54 for driving the first positioning push rod 53 to move back and forth in a straight line, and a positioning part 55 connected to the first positioning push rod 54 and movable along the connecting limiting groove 52. The positioning part 55 is provided with a first pushing end 551, which is used to push the frame 21 of the rotating disk limiting cavity 311 to the assembly area limiting cavity 4. The assembly area limiting cavity 4 is provided with an assembly area opening groove 40 for the second clamping component 6 to extend into.

[0075] like Figures 7 to 9 As shown, the first positioning component, by setting a first push end, can push the positioning part along the straight direction using the first positioning push rod under the drive of the fourth drive unit. Then, the first push end will accurately and stably push the frame in the rotating disk limiting cavity into the assembly area limiting cavity, realizing the precise position transfer and docking of the frame in the horizontal direction. This ensures that the frame is in the correct preset position before entering the subsequent connection or assembly process, improving the positioning accuracy and process reliability of the overall feeding and assembly process.

[0076] Specifically, the positioning part can move linearly along the connecting limiting groove provided on the positioning fixing part, providing a guide path for the pushing action of the first pushing end, ensuring that the first pushing end moves in a predetermined linear direction when pushing the frame, avoiding frame misalignment, jamming or collision caused by deviation of the pushing direction, thereby improving the stability and controllability of the pushing action, and ensuring the smoothness and safety of the frame transfer process.

[0077] Specifically, the first positioning component adopts a linear reciprocating drive structure in conjunction with a connecting limiting groove, which can achieve precise positioning and pushing of the frame without the need for a complex multi-axis robot or rotary pushing mechanism.

[0078] Specifically, the assembly area limiting cavity 4 is provided with an assembly area opening slot 40 for the second clamping component 6 to extend into, which facilitates the extension and movement of the second clamping component 6 and improves clamping efficiency.

[0079] Specifically, the stop at the end of the assembly area limiting cavity 4 can restrict the movement or detachment of the frame.

[0080] Furthermore, such as Figure 3 and Figure 4 The semiconductor device assembly apparatus shown includes a second clamping assembly 6 comprising a second clamping part 61, a sixth driving part 62 for moving the second clamping part 61 up and down, and a seventh driving part 63 for moving the second clamping part 61 in a front-back direction. The extension direction of the assembly area opening slot 40 is consistent with the front-back movement direction of the second clamping part.

[0081] like Figures 1 to 7 The semiconductor device assembly equipment shown includes a guide component 8 with a V-groove 81 into which a heat sink 71 extends. The V-groove 81 is spirally arranged on the outside of the guide component 8 along the extension direction of the guide component 8 so that the heat sink can rotate 90 degrees relative to it. The third driving device is located at the starting end of the guide component 8.

[0082] Furthermore, the V-shaped grooves arranged on the outer side of the guide assembly are spirally distributed along their extension direction. When the heat sink is driven by the second drive device and moves along the guide assembly, it can move forward along the spiral trajectory under the guidance of the V-shaped grooves, thereby naturally achieving a directional rotation of about 90 degrees during the conveying process. This structure integrates the directional adjustment function of the heat sink into the guiding and conveying process, eliminating the need for additional rotary cylinders, rotary motors, or complex steering mechanical structures. This simplifies the directional adjustment mechanism during the heat sink loading process and reduces equipment complexity and manufacturing costs.

[0083] Specifically, the V-groove not only effectively guides and limits the heat sink, ensuring that it does not deviate or tip over during transport, but also guides the heat sink to rotate in an directional manner while moving through the spiral trajectory. As a result, when it reaches the end of the guide assembly, the heat sink is in the correct position that matches the horizontal docking with the frame. This design improves the positional accuracy and directional consistency of the heat sink during the feeding process, ensuring that the heat sink can accurately enter the subsequent second track or material assembly area, thereby improving the reliability and process stability of the overall feeding process.

[0084] This invention integrates the rotation and conveying functions of the heat sink into the same guide component. The spiral arrangement of the V-groove enables the heat sink to naturally turn on the conveying path. There is no need to set up a separate rotation device or add extra horizontal / vertical space for the rotation action. This effectively reduces the space occupied by the feeding mechanism in the horizontal or vertical direction, making the overall structure more compact. It is conducive to the miniaturization, integration and high-density layout of the equipment, and is particularly suitable for semiconductor packaging production environments with strict space configuration requirements.

[0085] Specifically, the V-groove has excellent guiding and clamping characteristics, which can limit the heat sink on both sides to prevent it from rolling, deviating or overturning during the conveying process. Combined with the spiral layout, the heat sink maintains stable guidance during the movement and simultaneously completes the direction adjustment, which improves the overall controllability and positioning accuracy of the conveying process. This ensures that the heat sink enters the subsequent process in the preset posture and avoids poor connection or equipment failure caused by incorrect direction or position deviation.

[0086] Specifically, the second drive device is located at the starting end of the guide assembly and can directly act on the initial position of the heat sink, providing a stable and reliable driving force to ensure that the heat sink smoothly enters the V-groove and moves along the guide assembly. Specifically, the heat sink 71 is arranged in a V-shape with an included angle of 90 degrees.

[0087] Example 1 like Figures 1 to 18 The semiconductor device assembly equipment shown includes a frame 1, which is provided with a first feeding area 100, a second feeding area 200, and a material assembly area 300. The first feeding area 100 is provided with a frame 21, and a turning component 3 is used to transfer the frame 21 from the first feeding area 100 to the material assembly area 300. The turning component 3 is used to rotate the frame 21 from a horizontal position to a vertical position. The second feeding area 200 is provided with a heat dissipation component 71, a guide assembly 8 for rotating the heat dissipation component 71, and a second positioning component 9 for positioning the heat dissipation component 71 to the material assembly area 300; The material assembly area 300 is provided with an assembly area limiting cavity 4 into which a frame 21 for steering extends, a first positioning member 5 for positioning the frame 21 to the assembly area limiting cavity 4, a second clamping assembly 6 for transferring the frame 21 from the assembly area limiting cavity 4 to the material assembly area 300, and an installation assembly 10 for assembling the frame 21 with the heat sink 71.

[0088] This invention uses a steering component 3 to rotate a horizontally placed frame 21 to a vertical position, allowing the frame 21 to enter the material assembly area 300 vertically during the loading process. The heat sink 71 is positioned in the material assembly area 300, and the mounting component 10 connects the heat sink 71 to the frame 1. This avoids the complex operations of picking up or stacking parts in the turntable conveying process in traditional technology, and also eliminates the need for a turntable, which would increase the loading waiting time. In this invention, the frame 21 and the heat sink 71 are directly moved to the material assembly area 300 for assembly, which helps to improve production efficiency.

[0089] Example 2 Based on Example 1, Example 2 also has the following implementation method: The material assembly area 300 includes a first limiting material assembly area 310. The first limiting material assembly area 310 is provided with a first accommodating cavity 3101 that simultaneously accommodates the frame 21 and the heat sink 71, and a limiting block 3102 located outside the first accommodating cavity 3101. The first accommodating cavity 3101 is provided with a first accommodating cavity opening 31011 that communicates with the second feeding area 200. The limiting block 3102 is symmetrically arranged on both sides of the first accommodating cavity opening 31011 and is perpendicular to the moving direction of the heat sink 71. When the limiting block 3102 extends simultaneously, it is used to press the heat sink 71 into the first accommodating cavity 3101.

[0090] Example 3 Based on Example 2, Example 3 also has the following implementation method: The material assembly area 300 includes a second installation material assembly area 320, which includes a second accommodating cavity 3201 for accommodating the frame 21 and the heat sink 71. The installation assembly 10 includes a first pushing assembly 3202 that abuts against the heat sink 71 and a second pushing assembly 3203 that abuts against the frame 21. The first pushing assembly 3202 and the second pushing assembly 3203 are disposed opposite to each other. The first pushing assembly 3202 includes a first fixed housing 32021 and a first top block 32022 disposed in the first fixed housing 32021. The second pushing assembly 3203 includes a second top block 32031 and an eighth driving mechanism 32032 connected to the second top block 32031.

[0091] Example 4 Based on Example 3, Example 4 also has the following implementation method: like Figure 11 As shown, the frame has protruding buckles, and the heat sink has grooves that mate with the protruding buckles, allowing the two to connect. The eighth drive mechanism 32032 is cylinder-driven.

[0092] Example 5 Example 5, based on Example 1, also has the following implementation method: The steering assembly 3 includes a rotating disk 31, a limiting housing 32 connected to the frame 1, a limiting rotating shaft 33 that limits the rotating disk 31 to the limiting housing 32, and a third driving assembly 34 that drives the rotating disk 31 to rotate. The rotating disk 31 is provided with a rotating disk limiting cavity 311 into which the frame 21 extends. When the rotating disk 31 rotates, the rotating disk limiting cavity 311 communicates with the assembly area limiting cavity 4.

[0093] Example 6 Example 6, based on Example 5, also has the following implementation method: The rotating disk 31 is provided with a limiting post 312. The third drive assembly 34 is provided with a sliding part 341, a third drive part 342 that drives the sliding part 341 to move, a sliding fixing member 343 connected to the upper side of the sliding part 341, and a limiting groove 344 located on the sliding fixing member 343 and cooperating with the limiting post 312. The limiting groove 344 is arranged in a vertical direction. The rotating disk 31 rotates under the action of the limiting housing 32 and the limiting groove 344. The third drive part 342 is driven by a cylinder.

[0094] Example 7 Example 7, based on Example 6, also has the following implementation method: The sliding part 341 is provided with an abutment bracket 3411, and the frame 1 is provided with a limiting bracket 11 that abuts against the abutment bracket 3411. The rotating disk 31 is limited between the end of the second conveying area 222 and the limiting housing 32. Further, the limiting bracket 3411 and the abutment bracket 11 are provided with buffer blocks. Specifically, the rotation angle of the rotating disk 31 is 90 degrees.

[0095] Example 8 Example 8, based on Example 7, further includes the following implementation method: The first positioning component 5 includes a positioning fixing part 51, a connecting limiting groove 52 disposed on the positioning fixing part 51 and communicating with the rotating disk limiting cavity 311, a first positioning push rod 53, a fourth driving part 54 that drives the first positioning push rod 53 to move back and forth in a straight line, and a positioning part 55 connected to the first positioning push rod 54 and movable along the connecting limiting groove 52. The positioning part 55 is provided with a first pushing end 551, which is used to push the frame 21 of the rotating disk limiting cavity 311 to the assembly area limiting cavity 4. The assembly area limiting cavity 4 is provided with an assembly area opening groove 40 for the second clamping component 6 to extend into.

[0096] The first positioning component 5 adopts a linear reciprocating cylinder drive structure. Specifically, the assembly area limiting cavity 4 is provided with an assembly area opening slot 40 for the second clamping component 6 to extend into, which facilitates the insertion and movement of the second clamping component 6 and improves clamping efficiency. The second clamping component 6 includes a second clamping part 61, a sixth driving part 62 that drives the second clamping part 61 to move up and down, and a seventh driving part 63 that drives the second clamping part 61 to move in the front-back direction. The extension direction of the assembly area opening slot 40 is consistent with the front-back movement direction of the second clamping part 61. The stop at the end of the assembly area limiting cavity 4 can restrict the movement or disengagement of the frame 21.

[0097] Example 9 Example 9, based on Example 8, also has the following implementation method: The second feeding area 200 is provided with a second track 210, the extension direction of which is perpendicular to the extension direction of the guide assembly 8. The second positioning member 9 is provided with a second positioning push rod 91 for pushing the heat sink 71, which enters from the end of the guide assembly 8 into the second track 210, to the material assembly area 300, and a fourth driving part 92 for driving the second positioning push rod 91 to move back and forth in a straight line. The second track 210 is provided with a second baffle 2101, and the second positioning push rod 91 is provided with a second pushing end that abuts against the heat sink 71. The second baffle 2101 is driven by a cylinder to move back and forth in the second track 210.

[0098] Example 10 Example 10, based on Example 8, also has the following implementation method: The guide assembly 8 includes a V-shaped groove 81 into which the heat sink 71 extends. The V-shaped groove 81 is spirally arranged on the outer side of the guide assembly 8 along its extension direction, so that the heat sink can rotate 90 degrees relative to it. The second drive device 72 is located at the starting end of the guide assembly 8. The heat sink 71 is V-shaped with an included angle of 90 degrees.

[0099] The above examples are merely illustrative of the technical content of this utility model to facilitate reader understanding, but do not imply that the implementation of this utility model is limited to these embodiments. Any technical extensions or re-creations made based on this utility model are protected by this utility model. The scope of protection of this utility model is defined by the claims.

Claims

1. A semiconductor device assembly apparatus, comprising a rack (1), characterized in that: The frame (1) is provided with a first feeding area (100), a second feeding area (200), and a material assembly area (300); The first loading area (100) is provided with a frame (21) and a steering component (3) for transferring the frame (21) from the first loading area (100) to the material assembly area (300). The steering component (3) is used to rotate the frame (21) from a horizontal position to a vertical position. The second feeding area (200) is provided with a heat sink (71), a guide assembly (8) for the heat sink (71) to rotate, and a second positioning component (9) for positioning the heat sink (71) to the material assembly area (300). The material assembly area (300) is provided with an assembly area limiting cavity (4) into which a frame (21) for steering extends, a first positioning member (5) for positioning the frame (21) to the assembly area limiting cavity (4), a second clamping assembly (6) for transferring the frame (21) from the assembly area limiting cavity (4) to the material assembly area (300), and an installation assembly (10) for assembling the frame (21) with the heat sink (71).

2. The semiconductor device assembly equipment according to claim 1, characterized in that: The material assembly area (300) includes a first limiting material assembly area (310), which is provided with a first accommodating cavity (3101) that simultaneously accommodates the frame (21) and the heat sink (71), and a limiting block (3102) located outside the first accommodating cavity (3101). The first accommodating cavity (3101) is provided with a first accommodating cavity opening (31011) that communicates with the second feeding area (200). The limiting block (3102) is symmetrically arranged on both sides of the first accommodating cavity opening (31011) and perpendicular to the moving direction of the heat sink (71). When the limiting block (3102) extends, it is used to press the heat sink (71) into the first accommodating cavity (3101).

3. The semiconductor device assembly equipment according to claim 2, characterized in that: The material assembly area (300) includes a second installation material assembly area (320), the second installation material assembly area (320) includes a second accommodating cavity (3201) for accommodating the frame (21) and the heat sink (71), the installation assembly (10) includes a first push assembly (3202) abutting against the heat sink (71) and a second push assembly (3203) abutting against the frame (21), the first push assembly (3202) and the second push assembly (3203) are arranged opposite to each other, the first push assembly (3202) includes a first fixed housing (32021) and a first top block (32022) disposed in the first fixed housing (32021), the second push assembly (3203) includes a second top block (32031) and an eighth drive mechanism (32032) connected to the second top block (32031).

4. The semiconductor device assembly equipment according to claim 2, characterized in that: The second feeding area (200) is provided with a vibratory plate (7) connected to the guide assembly (8) and a third driving device that drives the heat sink (71) to move to the guide assembly (8). The second feeding area (200) is provided with a second track (210) connected to the first accommodating cavity (3101). The extension direction of the second track (210) is perpendicular to the extension direction of the guide assembly (8). The second positioning member (9) is provided with a second positioning push rod (91) for pushing the heat sink (71) that enters from the end of the guide assembly (8) into the second track (210) to the material assembly area (300) and a fourth driving part (92) for driving the second positioning push rod (91) to move back and forth in a straight line. The second track (210) is provided with a second baffle (2101). The second positioning push rod (91) is provided with a second pushing end (911) that abuts against the heat sink (71).

5. The semiconductor device assembly equipment according to claim 1, characterized in that: The steering assembly (3) includes a rotating disk (31), a limiting housing (32) connected to the frame (1), a limiting rotating shaft (33) that limits the rotating disk (31) to the limiting housing (32), and a third driving assembly (34) that drives the rotating disk (31) to rotate. The rotating disk (31) is provided with a rotating disk limiting cavity (311) into which the frame (21) extends. When the rotating disk (31) rotates, the rotating disk limiting cavity (311) communicates with the assembly area limiting cavity (4).

6. The semiconductor device assembly equipment according to claim 5, characterized in that: The rotating disk (31) is provided with a limiting post (312), and the third driving assembly (34) is provided with a sliding part (341), a third driving part (342) for driving the sliding part (341) to move, a sliding fixing member (343) connected to the upper side of the sliding part (341), and a limiting groove (344) located on the sliding fixing member (343) and cooperating with the limiting post (312). The limiting groove (344) is arranged in the vertical direction, and the rotating disk (31) rotates under the action of the limiting housing (32) and the limiting groove (344).

7. A semiconductor device assembly apparatus according to claim 6, characterized in that: The sliding part (341) is provided with an abutting bracket (3411), the frame (1) is provided with a limiting bracket (11) that abuts against the abutting bracket (3411), and the rotating disk (31) is limited between the end of the first feeding area (100) and the limiting housing (32).

8. A semiconductor device assembly apparatus according to claim 5, characterized in that: The first positioning component (5) includes a positioning fixing part (51), a connecting limiting groove (52) disposed on the positioning fixing part (51) and communicating with the rotating disk limiting cavity (311), a first positioning push rod (53), a fourth driving part (54) that drives the first positioning push rod (53) to move back and forth in a straight line, and a positioning part (55) connected to the first positioning push rod (54) and movable along the connecting limiting groove (52). The positioning part (55) is provided with a first pushing end (551), which is used to push the frame (21) of the rotating disk limiting cavity (311) to the assembly area limiting cavity (4). The assembly area limiting cavity (4) is provided with an assembly area opening groove (40) into which the second clamping component (6) extends.

9. A semiconductor device assembly apparatus according to claim 8, characterized in that: The second clamping assembly (6) includes a second clamping part (61), a sixth driving part (62) that drives the second clamping part (61) to move up and down, and a seventh driving part (63) that drives the second clamping part (61) to move in the front and back direction. The extension direction of the assembly area opening groove (40) is consistent with the front and back movement direction of the second clamping part.

10. A semiconductor device assembly apparatus according to claim 4, characterized in that: The guide assembly (8) includes a V-groove (81) into which the heat sink (71) extends. The V-groove (81) is spirally arranged on the outside of the guide assembly (8) along the extension direction of the guide assembly (8) so that the heat sink can rotate 90 degrees relative to it. The third drive device is located at the starting end of the guide assembly (8).

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