Diode lead encapsulant material mold

Abstract

The utility model discloses a diode lead encapsulation material mold relates to encapsulation mold technical field, including plastic -encapsulated rack, cage and plug, the inside of plastic -encapsulated rack is provided with a plurality of cages, and the outer wall of cage is installed with the plug, the middle position of cage is installed with the wedge -shaped block, the inside insertion of cage has material positioning disc, and material positioning disc top end is equipped with a plurality of for positioning runner, the diode chip of rectifier is positioned and placed with through runner top of material positioning disc, this device has in material positioning disc with epoxy glass steel composite material, has the advantage that bears big, compression -resistant, anticorrosive performance is good, and can be under the condition of instantaneous high temperature, achieve the effect of heat protection and corrosion -resistant, improve the service life, and light in weight.

Description

Technical Field

[0001] This utility model relates to the field of packaging mold technology, specifically a diode lead packaging material mold. Background Technology

[0002] The diode is made by fabricating electrode plates from metal materials to connect the diode leads. The main methods used are evaporation, electroplating, and soldering. The fabricated diode chip is then placed into a packaging tool, which is then sealed with plastic. Common sealing materials include silicone, epoxy, and polyamide.

[0003] However, existing diode lead-package material molds have the following problems during use: traditional packaging mold holders are of a single size, and when placing materials of different shapes, they are usually integrated and cannot be disassembled, resulting in poor flexibility. In addition, the material trays need to withstand high temperature, high pressure and chemical corrosion, which makes them easy to be damaged. If the entire packaging mold is damaged, it needs to be replaced, which is costly. Summary of the Invention

[0004] The purpose of this invention is to provide a diode lead-in packaging material mold to solve the related problems mentioned in the background art.

[0005] To solve the above technical problems, this utility model provides the following technical solution: a diode lead-encapsulation material mold, including a plastic encapsulation placement frame, a retainer, and an insert block. The inner side of the plastic encapsulation placement frame is provided with multiple retainers, and the outer wall of the retainer is equipped with an insert block. A wedge block is installed at the middle position of the retainer. A material positioning disk is inserted inside the retainer, and the top of the material positioning disk is provided with multiple flow channels for positioning. A rectifier diode chip is positioned above the material positioning disk through the flow channels.

[0006] As a preferred embodiment of the diode lead packaging material mold of this utility model, a handle is installed on the bottom side wall of the plastic encapsulation placement frame, and a rubber block is provided on the outer wall of the handle.

[0007] As a preferred embodiment of the diode lead packaging material mold of this utility model, the outer wall of the plastic encapsulation placement frame is coated with a high-temperature resistant inorganic coating.

[0008] As a preferred embodiment of the diode lead encapsulation material mold of this utility model, the inner wall of the flow channel is provided with a reinforcing layer, and the interior of the reinforcing layer is provided with epoxy fiberglass.

[0009] As a preferred embodiment of the diode lead packaging material mold of this utility model, the bottom end of the material positioning disk is provided with a wedge-shaped groove, and the wedge-shaped groove and the side wall of the material positioning disk are provided with a high-temperature resistant and wear-resistant rubber block that is compatible with the high-temperature resistant pad.

[0010] The advantages of the diode lead-encapsulation material mold of this utility model are as follows: 1. This utility model uses epoxy fiberglass composite material in the flow channel, which has high load-bearing capacity, compressive strength, good corrosion resistance, good thermal performance, and is a high-quality thermal insulation material. It can achieve thermal protection and corrosion resistance under instantaneous high temperature conditions, improve service life, and is lightweight.

[0011] 2. After the rectifier diode chip is placed at the material positioning plate, the material positioning plate can be inserted into the wedge block and the insert block through the wedge groove. The high temperature resistant pad and the high temperature resistant and wear-resistant rubber block are closely attached to the position to complete the positioning. The wedge groove and the wedge block are fitted together to further improve the fixing effect. It is convenient to replace the material positioning plate with different shaped flow channels and meet the needs of quick replacement of the material positioning plate. Attached Figure Description

[0012] Figure 1 This is a top view of the structure of this utility model; Figure 2 This is a schematic diagram of the main structure of this utility model; Figure 3 This is a schematic diagram of the main sectional view of the material positioning disk and reinforcing layer of this utility model; Figure 4 This is a top view schematic diagram of the material positioning plate and flow channel of this utility model; Figure 5 This is a schematic diagram of the material positioning disk and the structural rectifier diode chip of this utility model; Figure 6 This is a schematic diagram of the three-dimensional structure of the cage of this utility model.

[0013] In the diagram: 1. Plastic-sealed placement rack; 2. Retainer; 3. Insert block; 4. Wedge block; 5. High-temperature resistant pad; 6. Hand handle; 7. Material positioning plate; 8. Flow channel; 9. Rectifier diode chip; 10. Reinforcing layer; 11. Epoxy fiberglass; 12. High-temperature resistant and wear-resistant rubber block; 13. Wedge groove. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] Example 1, such as Figure 1-4As shown, this utility model provides a technical solution: a diode lead wire packaging material mold, including a plastic encapsulation placement frame 1, a retainer 2, and an insert block 3. Multiple retainers 2 are arranged inside the plastic encapsulation placement frame 1, and insert blocks 3 are installed on the outer walls of the retainers 2. A wedge block 4 is installed at the middle position of the retainer 2. A material positioning disk 7 is inserted inside the retainer 2, and multiple flow channels 8 for positioning are opened at the top of the material positioning disk 7. A wedge groove 13 is opened at the bottom of the material positioning disk 7, and high-temperature resistant pads 5 are provided on the wedge groove 13 and the side wall of the material positioning disk 7. A matching high-temperature and wear-resistant rubber block 12 is used. A rectifier diode chip 9 is positioned above the material positioning disk 7 through the flow channel 8. After the rectifier diode chip 9 is placed at the position of the material positioning disk 7, the material positioning disk 7 can be inserted into the wedge block 4 and the insert block 3 through the wedge groove 13. The high-temperature resistant pad 5 is tightly attached to the position of the high-temperature and wear-resistant rubber block 12 to complete the positioning. The wedge groove 13 is fitted with the wedge block 4 to further improve the fixing effect and facilitate the replacement of material positioning disks 7 with different shapes of flow channels 8, so as to meet the needs of quick replacement of material positioning disks 7.

[0016] Example 2, as Figure 1-4 As shown, this utility model provides a technical solution: a diode lead encapsulation material mold, including a reinforcing layer 10 disposed on the inner wall of the flow channel 8, and an epoxy fiberglass 11 disposed inside the reinforcing layer 10. The epoxy fiberglass 11 is disposed through the flow channel 8. Since the epoxy fiberglass 11 composite material has high load-bearing capacity, good corrosion resistance, good thermal performance, and is a high-quality heat insulation material, it can achieve the effects of heat protection and corrosion resistance under instantaneous high temperature conditions.

[0017] Example 3, as Figure 1-6 As shown, this utility model provides a technical solution: a diode lead packaging material mold, including a handle 6 mounted on the bottom side wall of the plastic encapsulation placement frame 1, and a rubber block provided on the outer wall of the handle 6. The outer wall of the plastic encapsulation placement frame 1 is sprayed with a high-temperature resistant inorganic coating. By providing an inorganic high-temperature resistant coating at the plastic encapsulation placement frame 1, using inorganic high-temperature resistant coating XZ-T001, it can be oil-resistant, acid and alkali-resistant, can be used at high temperatures, and can improve the antioxidant protection effect.

[0018] Working principle: First, the operator can place the rectifier diode chip 9 at the material positioning plate 7. Then, the material positioning plate 7 can be inserted into the wedge block 4 and the insert block 3 through the wedge groove 13. The high-temperature resistant pad 5 is tightly fitted with the high-temperature resistant and wear-resistant rubber block 12 to complete the positioning. The wedge groove 13 fits the wedge block 4 in shape, further improving the fixing effect and facilitating the replacement of material positioning plates 7 with different shaped flow channels 8. This allows for quick replacement of the material positioning plate 7. Finally, the operator can pick up the plastic-sealed placement rack 1 with the handle 6 and place it under pressure. Inside the molding machine, the molding compound is transformed into a liquid state under high pressure and temperature in the film pressing machine. It is then pushed forward along flow channel 8. Epoxy fiberglass 11 is installed at flow channel 8. Epoxy fiberglass 11 composite material has high load-bearing capacity, pressure resistance, good corrosion resistance, good thermal performance, and is a high-quality heat insulation material. It can provide thermal protection and corrosion resistance under instantaneous high temperatures, improving service life, and is lightweight. An inorganic high-temperature resistant coating, XZ-T001, is applied to the molding placement rack 1. This coating is oil-resistant, acid- and alkali-resistant, and can be used at high temperatures, improving antioxidant protection.

[0019] Finally, it should be noted that the above content is only used to illustrate the technical solution of this utility model, and is not intended to limit the scope of protection of this utility model. Simple modifications or equivalent substitutions made by those skilled in the art to the technical solution of this utility model do not depart from the essence and scope of the technical solution of this utility model.

Claims

1. A diode lead-in packaging material mold, comprising a plastic encapsulation holder (1), a retainer (2), and an insert block (3), characterized in that: The inner side of the plastic-encapsulated placement rack (1) is provided with multiple retainers (2), and the outer wall of the retainer (2) is provided with inserts (3). A wedge block (4) is provided at the middle position of the retainer (2). A material positioning disk (7) is inserted inside the retainer (2), and multiple flow channels (8) for positioning are opened at the top of the material positioning disk (7). A rectifier diode chip (9) is positioned above the material positioning disk (7) through the flow channels (8).

2. The diode lead-encapsulation material mold according to claim 1, characterized in that: The bottom side wall of the plastic-sealed placement rack (1) is equipped with a handle (6), and the outer wall of the handle (6) is provided with a rubber block.

3. The diode lead-encapsulation material mold according to claim 1, characterized in that: The outer wall of the plastic-sealed rack (1) is coated with a high-temperature resistant inorganic coating.

4. The diode lead-encapsulation material mold according to claim 1, characterized in that: The inner wall of the flow channel (8) is provided with a reinforcing layer (10), and the interior of the reinforcing layer (10) is provided with epoxy fiberglass (11).

5. A diode lead-encapsulation material mold according to claim 1, characterized in that: The bottom end of the material positioning plate (7) is provided with a wedge groove (13), and the wedge groove (13) and the side wall of the material positioning plate (7) are provided with a high temperature resistant and wear-resistant rubber block (12) that is compatible with the high temperature resistant pad (5).

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