Exhaust structure and wafer processing apparatus

Abstract

The application relates to an exhaust structure and a wafer processing device. The exhaust structure comprises a pipeline internally provided with an exhaust passage, a pair or multiple pairs of air vents symmetrically arranged on the two sides of the pipeline and communicated with the exhaust passage, the air vents being communicated with the processing tank, a door stop assembly rotatably connected to the air vents of the pipeline, and a first driving assembly connected to the pipeline and drivingly connected with the door stop assemblies, the door stop assemblies being synchronously rotated by the same angle under the action of the first driving assembly. The exhaust structure can ensure the consistency of the opening and closing angles of the multiple exhaust ports, greatly reduce the air pressure difference between the exhaust passage and the processing tank, greatly reduce the over-high pressure in the processing tank and the gas leakage caused by the high pressure in the processing tank, further greatly reduce the corrosion of metal components and the aging of electrical elements caused by the leaked gas, and prolong the service life of the device.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to an exhaust structure and wafer processing equipment. Background Technology

[0002] During wafer processing, various volatile gases are generated during the operation of the processing tanks. To prevent these gases from stagnating within the tanks, exhaust structures are installed between adjacent tanks, directing the gases through vents into the main pipeline for discharge. Simultaneously, a continuous supply of clean compressed air (CDA) is typically provided above the processing tanks. Its core function is to create a stable positive pressure barrier within the tanks, preventing contaminants such as particles and moisture from entering and guiding the volatile gases towards the exhaust vents, ensuring orderly gas discharge.

[0003] Currently, multiple treatment tanks correspond to the same exhaust pipe. The vents connecting the exhaust pipe and the treatment tanks are typically opened and closed using individual motors. This makes it impossible to guarantee that all vents open and close at the same angle simultaneously, resulting in a pressure difference between the delayed-opening treatment tanks and the exhaust pipe. This pressure difference not only affects the timely discharge of gas from the treatment tanks but can also create excessively high positive pressure within the tanks due to delayed gas discharge. This can cause gas to leak from the sealing gaps, resulting in serious consequences. Utility Model Content

[0004] In view of this, the present application provides an exhaust structure and a wafer processing apparatus to solve at least one problem existing in the prior art.

[0005] In a first aspect, embodiments of this application provide an exhaust structure for a wafer processing apparatus, the wafer processing apparatus including at least two processing tanks for processing wafers; the exhaust structure includes: The main pipe has an exhaust channel inside, and one or more pairs of vents connected to the exhaust channel are symmetrically arranged on both sides of the main pipe. The vents can be connected to the treatment tank. A door stop assembly is rotatably connected to the vent of the main pipeline; A first drive assembly is connected to the main pipe and is drive-connected to multiple door stop assemblies. The multiple door stop assemblies rotate synchronously at the same angle under the action of the first drive assembly.

[0006] In conjunction with the first aspect of this application, in an optional embodiment, the door stop assembly includes: The rotating shaft is connected to the first drive assembly for transmission. A door baffle is adapted to the vent, and the rotating shaft is connected to the door baffle. The door baffle rotates with the rotating shaft under the driving action of the first driving component.

[0007] In conjunction with the first aspect of this application, in an optional embodiment, the first driving component includes: First driving component; A transmission belt is connected to the first driving component for transmission. A drive wheel is connected to the rotating shaft, and a drive belt is wound around a plurality of drive wheels. The plurality of drive wheels rotate synchronously with the drive belt under the driving action of the first drive member.

[0008] In conjunction with the first aspect of this application, in an alternative embodiment, the first drive assembly further includes a plurality of tensioning shafts rotatably connected to the main pipe and configured to tension the drive belt.

[0009] In conjunction with the first aspect of this application, in an optional embodiment, the exhaust structure further includes: An angle sensor, connected to the drive wheel, is configured to detect the rotation angle of the drive wheel.

[0010] In conjunction with the first aspect of this application, in an optional embodiment, the exhaust structure further includes: A first pressure sensor, connected to the main pipe and located within the exhaust passage, is configured to detect the gas pressure within the exhaust passage.

[0011] In conjunction with the first aspect of this application, in an optional embodiment, the exhaust structure further includes: A separator is connected to the main pipe near the exhaust port, the separator dividing the exhaust port into a first exhaust port and a second exhaust port, the first exhaust port and the second exhaust port being configured to connect to different types of gas collection devices.

[0012] In conjunction with the first aspect of this application, in an optional embodiment, the exhaust structure further includes; The second driving component is connected to the outlet of the main pipe near the exhaust channel; A baffle plate is movably connected to the air outlet of the main pipe. The baffle plate can close or open the air outlet under the driving action of the second driving member.

[0013] In a second aspect, embodiments of this application provide a wafer processing apparatus, including an exhaust structure according to any one of the claims in the first aspect; the wafer processing apparatus further includes: A negative pressure device is connected to the outlet of the exhaust channel; Treatment tanks, one or more pairs of treatment tanks are symmetrically arranged on both sides of the main pipe and connected to the vent. A fan filter unit, located above the treatment tank, is configured to input clean, dry air into the treatment tank.

[0014] In conjunction with a second aspect of this application, in an optional embodiment, the wafer processing apparatus further includes: A second pressure sensor, located inside the processing tank, is configured to detect the gas pressure inside the processing tank.

[0015] The exhaust structure provided in this application embodiment ensures the consistency of the operation of multiple door stop components by connecting multiple door stop components to the same drive source. This ensures the consistency of the opening and closing angles of multiple exhaust ports, greatly reducing the phenomenon of pressure difference between the exhaust channel and the treatment tank. Consequently, it greatly reduces the occurrence of excessive pressure in the treatment tank and the occurrence of gas leakage due to high pressure in the treatment tank. Furthermore, it greatly reduces the corrosion of metal parts and aging of electrical components by leaked gas, shortens the service life of equipment, and reduces the mixing of gas with adjacent treatment tanks.

[0016] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0017] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a three-dimensional schematic diagram of the exhaust structure provided in the embodiments of this application; Figure 2 for Figure 1 A cross-sectional view of the central exhaust structure; Figure 3 This is a partial structural schematic diagram of the wafer processing equipment provided in an embodiment of this application.

[0018] Figure label: 100. Wafer processing equipment; 10. Exhaust structure; 11. Main pipe; 111. Exhaust passage; 112. Vent; 113. Outlet; 1131. First outlet; 1132. Second outlet; 12. Door stop assembly; 121. Rotating shaft; 122. Door stop panel; 13. First drive assembly; 131. First drive component; 132. Transmission belt; 133. Transmission pulley; 134. Tensioning shaft; 14. Separator; 15. Second drive unit; 20. Treatment tank; 30. Fan and filter unit; 40. Flange. Detailed Implementation

[0019] To make the technical solution and beneficial effects of this utility model more apparent and understandable, a detailed description is provided below by listing specific embodiments. The accompanying drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show the details of the local features; unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which this application pertains.

[0020] In the description of this utility model, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "height", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the purpose of simplifying the description of this utility model and do not indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. In other words, they should not be construed as limitations on this utility model.

[0021] In this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating the relative importance of the indicated features or the number of indicated technical features. Therefore, a feature specified as "first" or "second" can explicitly indicate that at least one of those features is included. In the description of this utility model, "multiple" means at least two, such as two, three, etc.; "several" means at least one, such as one, two, three, etc., unless otherwise explicitly specified.

[0022] In this utility model, unless otherwise explicitly defined, the terms "installation," "connection," "linking," "fixing," and "setting," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can also refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0023] In this utility model, unless otherwise explicitly defined, the terms "above," "on top of," "above," "over," "below," "below," "below," or "below" for "first feature above second feature" can refer to direct contact between the first and second features, or indirect contact between the first and second features through an intermediate medium. Furthermore, "above," "above," and "over" for "first feature above second feature" can mean the first feature is directly above or diagonally above the second feature, or simply indicates that the horizontal height of the first feature is higher than the horizontal height of the second feature. Similarly, "below," "below," and "below" for "first feature below second feature" can mean the first feature is directly below or diagonally below the second feature, or simply indicates that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0024] In related technologies, when the vent 112 of the treatment tank 20 is not opened simultaneously, the treatment tank 20 that opens first forms a conductive path with the exhaust channel 111, causing the gas in the treatment tank 20 to be rapidly extracted, resulting in a sharp drop in pressure and the formation of a local negative pressure. Meanwhile, the gas in the other treatment tank 20 cannot be discharged in time and will accumulate there. Furthermore, the CDA supply above that treatment tank 20 continues to be input, causing the pressure in that treatment tank 20 to continuously rise. Excessive pressure causes gas in the treatment tank 20 to leak from its sealing gaps. Examples of such sealing gaps include the connection between the tank cover and the tank body, and the seals at the liquid addition port. The leaked gas not only diffuses into the surrounding area of ​​the equipment but also corrodes metal parts, ages electrical components, shortens the equipment's lifespan, and may even mix with the gas from adjacent treatment tanks 20.

[0025] Furthermore, the pressure difference can cause airflow turbulence within the exhaust channel 111, reducing exhaust efficiency. When the high-speed airflow from the vent 112 side enters the main pipe 11, it creates a localized high-pressure area within the pipe. When the vent 112 on the other side opens with a delay, the path of the gas entering the main pipe 11 from that side is blocked by the high-pressure airflow, forcing some gas to swirl within the main pipe 11, creating an airflow dead zone. This stagnant gas not only increases the overall pressure within the main pipe 11, further exacerbating the pressure imbalance in the processing tanks 20 on both sides, but also causes unstable airflow, forming particle clusters within the processing tanks 20. Excessive particle accumulation on the wafer surface directly leads to defective wafers.

[0026] Based on this, this application provides an exhaust structure 10, which connects multiple door stop assemblies 12 to the same drive source to ensure the consistency of the operation of multiple door stop assemblies 12, thereby ensuring the consistency of the opening and closing angles of multiple vents 112. This can greatly reduce the phenomenon of pressure difference between the exhaust channel 111 and the treatment tank 20, thereby greatly reducing the situation of excessive pressure in the treatment tank 20, greatly reducing the situation of gas leakage due to high pressure in the treatment tank 20, and further greatly reducing the corrosion of metal parts and aging of electrical components by leaked gas, shortening the service life of equipment, and mixing with the gas of adjacent treatment tanks 20.

[0027] For details, please refer to Figures 1 to 3 This application provides an exhaust structure 10, which includes a main pipe 11, door stop assemblies 12, and a first drive assembly 13. The main pipe 11 has an exhaust channel 111 inside, with vents 112 symmetrically arranged on both sides communicating with the exhaust channel 111. The door stop assemblies 12 are rotatably connected to the vents 112, and the first drive assembly 13 is drively connected to all door stop assemblies 12, driving them to rotate synchronously by the same angle.

[0028] In this embodiment, gas is generated when the processing tank 20 processes the wafer. This gas needs to be discharged through the exhaust channel 111. Multiple gate components 12 are simultaneously and synchronously rotated by the first drive component 13, allowing the gas in the processing tank 20 to enter the exhaust channel 111 through symmetrically distributed vents 112. Due to the balanced resistance of various airflow paths, the pressure in the processing tank 20 and the exhaust channel 111 remains dynamically balanced, preventing the formation of high-pressure zones in the gas flow channels and effectively preventing gas leakage caused by inter-tank pressure imbalance. The airflow stability in the main pipe 11 is enhanced, avoiding particle deposition problems caused by airflow turbulence. The symmetrical exhaust path design ensures consistent exhaust efficiency in each processing tank 20, improving the uniformity of the wafer processing process.

[0029] In an optional embodiment, the door stop assembly 12 includes a rotating shaft 121 and a door stop plate 122. The rotating shaft 121 is connected to the first drive assembly 13. The door stop plate 122 is adapted to the vent 112. The rotating shaft 121 is connected to the door stop plate 122. The door stop plate 122 rotates with the rotating shaft 121 under the drive of the first drive assembly 13.

[0030] The door baffle 122 is a planar structural component that is adapted to the size of the vent 112. The rotating shaft 121 is connected to the middle position of the door baffle 122. When the rotating shaft 121 rotates, it drives the door baffle 122 to rotate together.

[0031] In an optional embodiment, the first drive assembly 13 includes a first drive member 131, a drive belt 132, and drive pulleys 133. The drive belt 132 is drively connected to the first drive member 131, the drive pulleys 133 are connected to the rotating shaft 121, and the drive belt 132 is wound around a plurality of drive pulleys 133. The plurality of drive pulleys 133 rotate synchronously with the drive belt 132 under the driving action of the first drive member 131.

[0032] The first driving component 131 serves as a power device and can be a rotary motor, but is not limited to this. The transmission belt 132 is a ring-shaped flexible component used to transmit power. The transmission wheel 133 refers to a pulley structure that cooperates with the transmission belt 132. The transmission wheel 133 and the transmission belt 132 can achieve transmission through meshing. For example, the transmission wheel 133 has a toothed structure, and the inner surface of the transmission belt 132 has toothed grooves adapted to the toothed structure, but is not limited to this.

[0033] In this embodiment, the first driving component 131 starts and drives the transmission belt 132 to rotate. The transmission belt 132 drives multiple transmission wheels 133 to rotate synchronously through toothed meshing. Since all transmission wheels 133 mesh with the same transmission belt 132, the angular velocities of each transmission wheel 133 remain absolutely consistent. When the transmission wheels 133 rotate, they drive the corresponding rotating shaft 121 to rotate, thereby driving the door baffles 122 to open or close at the same angle. The rigid meshing transmission method of the transmission belt 132 eliminates the backlash error in gear transmission, ensuring that the multiple door baffles 122 maintain positional synchronization at any opening angle. When the processing tank 20 needs to exhaust air, all door baffles 122 open simultaneously to the same degree under the drive of the transmission belt 132, and the vent 112 on both sides of the processing tank 20 has equal conduction area, so that the exhaust flow remains balanced.

[0034] This embodiment achieves absolutely synchronized operation of multiple door baffles 122, ensuring that the vents 112 of both sides of the treatment tank 20 open at the same angle simultaneously. The internal pressure of the treatment tank 20 remains dynamically balanced during exhaust, preventing sudden pressure drops or rises due to premature opening on one side. Airflow from both sides of the main pipe 11 enters the exhaust channel 111 at the same flow rate, preventing the formation of localized high-pressure zones and airflow swirling, thus maintaining stable exhaust efficiency.

[0035] In an optional embodiment, the first drive assembly 13 further includes a plurality of tensioning shafts 134, which are rotatably connected to the main pipe 11 and configured to tension the drive belt 132. The tensioning shaft 134 refers to a shaft structure that adjusts the tension of the drive belt 132 through rotational movement. Specifically, it can be implemented as a metal shaft with bearings, its axis parallel to the drive wheel 133, and its surface provided with anti-slip texture to increase friction with the drive belt 132. This feature compensates for deformation of the drive belt 132 due to temperature changes or long-term use by applying controllable radial pressure.

[0036] In this embodiment, the multiple tensioning shafts 134 can automatically compensate for length changes in the transmission belt 132 caused by temperature fluctuations or material creep, eliminate the gap between the transmission wheel 133 and the transmission belt 132, ensure the consistency of the rotation angle of the multiple door baffles 122, and prevent air pressure imbalance in the processing tank 20 due to asynchronous transmission. The rotatable design of the tensioning shafts 134 avoids hard compression on the surface of the transmission belt 132, reduces abnormal wear of the transmission belt 132, and extends the service life of the transmission system.

[0037] In an optional embodiment, the exhaust structure 10 further includes an angle sensor (not shown in the figure), which is connected to the drive wheel 133 and configured to detect the rotation angle of the drive wheel 133. The angle sensor is a device for detecting the angular displacement of a rotating component, and can be implemented using a rotary encoder or a potentiometer. By measuring the change in the rotation angle of the drive wheel 133, the opening and closing state of the door stop assembly 12 is fed back in real time.

[0038] In this embodiment, the angle sensor is directly mounted on the rotating shaft of the transmission wheel 133. When the first drive member 131 drives multiple transmission wheels 133 to rotate synchronously via the transmission belt 132, the angle sensor collects the angular displacement data of the transmission wheels 133 in real time. Since the transmission wheel 133 is fixedly connected to the rotating shaft 121 of the door stop assembly 12, the rotation angle of the transmission wheel 133 directly corresponds to the opening and closing angle of the door stop 122. When the rotation angle of a certain transmission wheel 133 deviates from the preset value, it indicates that the door stop assembly 12 corresponding to that transmission wheel 133 is lagging or leading. At this time, the output power of the first drive member 131 or the tension of the transmission belt 132 can be adjusted to restore the synchronous rotation of all transmission wheels 133. This process forms a closed-loop control, ensuring that the opening angle of the vents 112 of multiple processing tanks 20 is consistent, eliminating the pressure difference and airflow turbulence caused by the rotation angle deviation.

[0039] In an optional embodiment, the exhaust structure 10 further includes a first pressure sensor (not shown in the figure), which is connected to the main pipe 11 and located within the exhaust channel 111, and is configured to detect the gas pressure within the exhaust channel 111. The first pressure sensor is a detection device capable of measuring gas pressure in real time; specifically, it can be implemented using a piezoresistive sensor or a capacitive sensor, with its measuring end directly exposed to the airflow environment of the exhaust channel 111. This sensor provides real-time data input to the control system by detecting dynamic pressure changes within the pipe.

[0040] In this embodiment, when the vents 112 of the processing tanks 20 are not opened synchronously, local high-pressure or low-pressure areas will form in the exhaust channel 111. The first pressure sensor detects the absolute pressure value or pressure difference change in the channel and converts the pressure signal into an electrical signal, which is then transmitted to the control unit. The control unit determines whether to trigger the angle adjustment command of the gate assembly 12 based on a preset pressure threshold. This closed-loop control mechanism can dynamically balance the pressure relationship between each processing tank 20 and the main pipe 11, eliminating pressure imbalance caused by airflow turbulence.

[0041] In an optional embodiment, the exhaust structure 10 further includes a separator 14 connected to the outlet 113 of the main pipe 11 near the exhaust channel 111. The separator 14 divides the outlet 113 into a first outlet 1131 and a second outlet 1132, which are configured to connect to different types of gas collection devices. The separator 14 refers to a physical isolation structure located at the outlet 113 of the main pipe 11, which can be implemented using a partition or partition wall made of corrosion-resistant material. This structure, by dividing a single outlet 113 into two independent channels, prevents the mixing of different types of gases at the end of the exhaust path.

[0042] For example, the first gas outlet 1131 is connected to an acidic gas collection device, and the second gas outlet 1132 is connected to an alkaline gas collection device.

[0043] It should be noted that multiple processing tanks 20 contain the same processing solution, and the processing tanks 20 generate alkaline or acidic gases during the wafer processing. When the processing solution used to process the wafer generates acidic gas, the acidic gas exhaust from the processing tank 20 is discharged into an acidic gas collection device through the first outlet 1131. When the processing solution used to process the wafer generates alkaline gas, the alkaline gas exhaust from the processing tank 20 is discharged into an alkaline gas collection device through the second outlet 1132, so that different types of gases can be collected separately using different types of gas collection devices.

[0044] In an optional embodiment, the exhaust structure 10 further includes a second drive member 15 and a baffle plate (not shown in the figure). The second drive member 15 is connected to the main pipe 11 near the exhaust port 113 of the exhaust channel 111. The baffle plate is movably connected to the exhaust port 113 of the main pipe 11, and the baffle plate can close or open the exhaust port 113 under the driving action of the second drive member 15.

[0045] The second drive unit 15 serves as the power source for closing or opening the baffle, and can be driven by a cylinder, but is not limited to this.

[0046] This application provides a wafer processing apparatus 100. Please refer to [link / reference]. Figure 3 The wafer processing equipment 100 includes the exhaust structure 10 provided in any of the above embodiments. It also includes a negative pressure device (not shown), a processing tank 20, and a fan-filter unit. The negative pressure device is connected to the outlet 113 of the exhaust channel 111. The processing tank 20 is symmetrically arranged on both sides of the main pipe 11 and connected to the vent 112. The processing tank 20 can be connected to the vent 112 of the main pipe 11 via a flange 40. The fan-filter unit 30 is located above the processing tank 20 and is configured to input clean, dry air into the processing tank 20.

[0047] The negative pressure device is a device that generates a stable suction force. Specifically, it can be implemented using a vacuum pump or a centrifugal fan. Its function is to establish a continuous negative pressure environment within the exhaust channel 111, providing a power source for the gas discharge from the treatment tank 20. The FFU (Fan Filter Unit) is located above the treatment tank 20 and is used to input pressurized clean air into the treatment tank 20. Under the suction of the negative pressure device, the gas generated in the treatment tank 20 is discharged through the vent 112 into the exhaust channel 111.

[0048] During wafer processing, a negative pressure device establishes a stable negative pressure environment through exhaust channels 111. When the processing tank 20 needs to be vented, the symmetrically arranged vents 112 open simultaneously, ensuring that the exhaust paths of each processing tank 20 have equivalent resistance. The fan-filter unit 30 continuously supplies clean, dry air into the processing tank 20, forming an airflow barrier that prevents external contaminants from entering. Simultaneously, the generated directional airflow pushes volatile gases toward the vents 112. The suction effect of the negative pressure device and the airflow input of the fan-filter unit 30 form a dynamic balance, maintaining the internal pressure of each processing tank 20 within a set range. When multiple processing tanks 20 operate simultaneously, the symmetrical exhaust structure 10 ensures that the exhaust flow rate of each tank is evenly distributed, preventing gas leakage caused by pressure differences resulting from premature venting of a single tank.

[0049] Figure 3 The diagram shows two pairs of treatment tanks 20, located on either side of the main pipe 11. Of course, the treatment tanks 20 are not limited to two pairs; they can also be one, three, four, or five pairs.

[0050] In an optional embodiment, the wafer processing apparatus 100 further includes a second pressure sensor (not shown), located within the processing tank 20, configured to detect the gas pressure within the processing tank 20. The second pressure sensor functions identically to the first pressure sensor, both used to detect gas pressure. The sensing surface of the second pressure sensor is directly exposed to the gas environment inside the processing tank 20, and the second pressure sensor directly monitors the actual pressure inside the processing tank 20.

[0051] Furthermore, the FFU is also equipped with an electrically proportional airflow regulating valve, which is electrically connected to a second pressure sensor. The electrically proportional airflow regulating valve adjusts the gas flow rate of the FFU according to the pressure value detected by the second pressure sensor.

[0052] This application achieves precise monitoring of the internal pressure of each processing unit by independently installing pressure sensors inside each processing tank 20. This detection method eliminates the lag and error in pipeline pressure transmission, improves the pressure regulation response speed, and can more effectively prevent gas leakage and airflow interference caused by pressure imbalance.

[0053] It should be understood that the above embodiments are exemplary and are not intended to encompass all possible implementations included in the claims. Various modifications and changes can be made to the above embodiments without departing from the scope of this disclosure. Similarly, the various technical features of the above embodiments can be arbitrarily combined to form other embodiments of this application that may not be explicitly described. Therefore, the above embodiments only illustrate several implementations of this application and do not limit the scope of protection of this patent application.

Claims

1. An exhaust structure for a wafer processing apparatus (100), the wafer processing apparatus (100) comprising at least two processing tanks (20) for processing wafers; characterized in that, The exhaust structure (10) includes: The main pipe (11) has an exhaust channel (111) inside. One or more pairs of vents (112) are symmetrically arranged on both sides of the main pipe (11) and are connected to the exhaust channel (111). The vents (112) can be connected to the treatment tank (20). A door stop assembly (12) is rotatably connected to the vent (112) of the main pipe (11); The first drive assembly (13) is connected to the main pipe (11) and is connected to the multiple door stop assemblies (12) in a transmission connection. The multiple door stop assemblies (12) rotate synchronously at the same angle under the action of the first drive assembly (13).

2. The exhaust structure according to claim 1, characterized in that, The door stop assembly (12) includes: The rotating shaft (121) is connected to the first drive assembly (13) in a transmission manner; The door baffle (122) is adapted to the vent (112), and the rotating shaft (121) is connected to the door baffle (122). The door baffle (122) rotates with the rotating shaft (121) under the driving action of the first driving component (13).

3. The exhaust structure according to claim 1, characterized in that, The first driving component (13) includes: First drive unit (131); The transmission belt (132) is connected to the first driving member (131) in a transmission manner; The transmission wheel (133) is connected to the rotating shaft (121), and the transmission belt (132) is wound around the multiple transmission wheels (133). The multiple transmission wheels (133) rotate synchronously with the transmission belt (132) under the driving action of the first driving member (131).

4. The exhaust structure according to claim 3, characterized in that, The first drive assembly (13) also includes a plurality of tensioning shafts (134), which are rotatably connected to the main pipe (11) and configured to tension the drive belt (132).

5. The exhaust structure according to claim 3, characterized in that, The exhaust structure (10) also includes: An angle sensor, connected to the drive wheel (133), is configured to detect the rotation angle of the drive wheel (133).

6. The exhaust structure according to any one of claims 1 to 5, characterized in that, The exhaust structure (10) also includes: A first pressure sensor, connected to the main pipe (11) and located in the exhaust channel (111), is configured to detect the gas pressure in the exhaust channel (111).

7. The exhaust structure according to any one of claims 1 to 5, characterized in that, The exhaust structure (10) also includes: A separator (14) is connected to the main pipe (11) near the outlet (113) of the exhaust channel (111). The separator (14) divides the outlet (113) into a first outlet (1131) and a second outlet (1132). The first outlet (1131) and the second outlet (1132) are configured to be connected to different types of gas collection devices.

8. The exhaust structure according to claim 7, characterized in that, The exhaust structure (10) also includes; The second drive unit (15) is connected to the main pipe (11) near the outlet (113) of the exhaust channel (111); A baffle plate is movably connected to the air outlet (113) of the main pipe (11). The baffle plate can close or open the air outlet (113) under the driving action of the second driving member (15).

9. A wafer processing apparatus, characterized in that, Includes the exhaust structure according to any one of claims 1 to 8; further includes: A negative pressure device is connected to the outlet (113) of the exhaust channel (111); Processing tank (20), one or more pairs of processing tanks (20) are symmetrically arranged on both sides of the main pipe (11) and connected to the vent (112). A fan filter unit (30), located above the treatment tank (20), is configured to input clean and dry air into the treatment tank (20).

10. The wafer processing equipment according to claim 9, characterized in that, The wafer processing equipment (100) further includes: The second pressure sensor, located inside the processing tank (20), is configured to detect the gas pressure inside the processing tank (20).

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