Mechanical hand device and wafer transfer system

Abstract

The application provides a mechanical hand device and wafer transfer system, and relates to the technical field of semiconductors. The mechanical hand device comprises a mechanical hand main body, a connecting part and an optical fiber sensor. The end of the mechanical hand main body is connected with the connecting part. The optical fiber sensor is installed on the mechanical hand main body and is arranged close to the connecting part. A plurality of vacuum adsorption zones are arranged on the mechanical hand main body, and at least a first vacuum adsorption zone located in the middle region of the mechanical hand main body is included in the plurality of vacuum adsorption zones. The mechanical hand device and wafer transfer system provided by the application have the advantages that the mechanical hand main body and the wafer can be firmly adsorbed, and abnormalities can be found in time.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more specifically, to a robotic arm device and a wafer transfer system. Background Technology

[0002] Robotic arms are important core components in semiconductor transmission equipment, responsible for transporting materials such as wafers. The part of the robotic arm that directly contacts the wafer is called the blade (a sheet-like support structure used to support the wafer, also known as a "finger").

[0003] Currently, since wafers are picked up from the bottom up, requiring fingers to pass through a 4-inch sputtering stage, C-shaped fingers are generally used to pick up wafers.

[0004] However, with the improvement of the equipment, the sputtering stage has been upgraded to full size, and the wafer pick-up method has been changed to top-down. Furthermore, some warped products may fall off during the transfer and flipping process due to the lack of vacuum in the middle. Additionally, current methods of judging products by vacuum levels are ineffective if product fragments or static electricity remain above the fingers after vacuum release; relying solely on vacuum is insufficient to detect abnormalities.

[0005] In summary, existing robotic arms have poor handling capabilities for warped wafers and may not be able to detect abnormalities after wafer fragmentation. Utility Model Content

[0006] The purpose of this application is to provide a robotic arm device and a wafer transfer system to solve the problems in the prior art where the robotic arm has poor ability to transfer warped wafers and may not be able to detect abnormalities after wafer fragmentation.

[0007] To achieve the above objectives, the technical solutions adopted in the embodiments of this application are as follows:

[0008] On one hand, this application provides a robotic arm device, which includes a robotic arm body, a connecting part, and an optical fiber sensor. The end of the robotic arm body is connected to the connecting part, and the optical fiber sensor is mounted on the robotic arm body and disposed close to the connecting part.

[0009] The robotic arm body is provided with multiple vacuum adsorption zones, and the multiple vacuum adsorption zones include at least a first vacuum adsorption zone located in the middle region of the robotic arm body.

[0010] Optionally, a vacuum pipe is provided inside the main body of the robotic arm, and the vacuum pipe is connected to the vacuum adsorption area; the robotic arm device also includes a vacuum sensor, which is located inside the vacuum pipe, and both the vacuum sensor and the fiber optic sensor are used to connect to the controller.

[0011] Optionally, the plurality of vacuum adsorption zones further includes four second vacuum adsorption zones, which form a rectangle, and the first vacuum adsorption zone is located at the center of the rectangle.

[0012] Optionally, the plurality of vacuum adsorption zones further includes four second vacuum adsorption zones, which form a rhombus, and the first vacuum adsorption zone is located at the center of the rhombus.

[0013] Optionally, the adsorption force of the first vacuum adsorption zone is greater than or equal to the adsorption force of the second vacuum adsorption zone.

[0014] Optionally, each of the vacuum adsorption zones includes a matrix of vacuum suction holes.

[0015] Optionally, the vacuum suction holes are arranged in a 3*7 matrix.

[0016] Optionally, the main body of the robotic arm is circular.

[0017] Optionally, the connecting part is provided with a threaded hole, and the robotic arm device is used to connect to the transfer device through the threaded hole.

[0018] On the other hand, embodiments of this application also provide a wafer transfer system, which includes the aforementioned robotic arm device.

[0019] Compared with the prior art, this application has the following advantages:

[0020] This application provides a robotic arm device and a wafer transfer system. The robotic arm device includes a robotic arm body, a connecting part, and a fiber optic sensor. The end of the robotic arm body is connected to the connecting part, and the fiber optic sensor is mounted on the robotic arm body and positioned close to the connecting part. The robotic arm body has multiple vacuum adsorption zones, and at least one of these zones is a first vacuum adsorption zone located in the middle region of the robotic arm body. On one hand, because this application uses multiple vacuum adsorption zones for adsorption, the adsorption capacity is stronger. Furthermore, since the first vacuum adsorption zone is located in the middle region of the robotic arm body, it ensures a firm adsorption between the robotic arm body and the wafer during top-down wafer transfer. On the other hand, because the fiber optic sensor is located on the robotic arm body, abnormalities can be detected promptly when wafer fragmentation occurs.

[0021] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a top view of the robotic arm device provided in an embodiment of this application.

[0024] Figure 2 This is a schematic diagram showing the connection between the controller, the fiber optic sensor, and the vacuum sensor provided in an embodiment of this application.

[0025] Figure 3 A top view of another robotic arm device provided in an embodiment of this application.

[0026] Figure 4 This is a schematic diagram of the structure of the vacuum adsorption region provided in an embodiment of this application.

[0027] In the picture:

[0028] 100 - Robotic arm device; 110 - Robotic arm body; 111 - First vacuum adsorption zone; 112 - Second vacuum adsorption zone; 113 - Vacuum suction hole; 120 - Connecting part; 121 - Threaded hole; 130 - Fiber optic sensor; 140 - Vacuum sensor. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0030] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0031] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this application, terms such as "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0032] It should be noted that in this paper, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0033] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0034] As described in the background section, currently, C-type fingers cannot meet the requirements for transporting warped wafers, and after wafer fragments are sent, anomalies cannot be effectively detected.

[0035] In view of the above, embodiments of this application provide a robotic arm device, and the robotic arm device provided by this application will be described exemplarily below:

[0036] As one implementation method, please refer to Figure 1 The robotic arm device 100 includes a robotic arm body 110, a connecting part 120, and an optical fiber sensor 130. The end of the robotic arm body 110 is connected to the connecting part 120. The optical fiber sensor 130 is mounted on the robotic arm body 110 and is located close to the connecting part 120. The robotic arm body 110 is provided with multiple vacuum adsorption zones, and at least one of the multiple vacuum adsorption zones includes a first vacuum adsorption zone 111 located in the middle region of the robotic arm body 110.

[0037] On the one hand, because this application achieves adsorption by setting multiple vacuum adsorption zones, the adsorption capacity is stronger; and, since the first vacuum adsorption zone 111 is located in the middle region of the robotic arm body 110, it can ensure that the robotic arm body 110 and the wafer are firmly adsorbed during top-down wafer transfer. At the same time, for warped wafers, it can also ensure that at least the middle part is firmly adsorbed to the wafer, avoiding the generation of fragments during the transfer process. On the other hand, since the fiber optic sensor 130 is set on the robotic arm body 110, the abnormality can be detected in time when wafer fragments occur.

[0038] The main body 110 of the robotic arm can be circular. Of course, to adapt to the shape of the wafer, the shape of the main body 110 can also be consistent with the shape of the wafer. Furthermore, the main body 110 and the connecting part 120 are integrally formed, and the connecting part 120 is provided with a threaded hole 121. The robotic arm device 100 is used to connect to the transfer device through the threaded hole 121. The transfer device is used to move the robotic arm device 100 during movement, thereby realizing the transfer of the wafer.

[0039] In one implementation, a vacuum pipe is provided inside the robotic arm body 110, and the vacuum pipe is connected to a vacuum adsorption area; the robotic arm device 100 also includes a vacuum sensor 140, which is located inside the vacuum pipe, and as shown in the figure. Figure 2 As shown, both the vacuum sensor 140 and the fiber optic sensor 130 are used to connect to the controller.

[0040] Understandably, the other end of the vacuum pipe is directly connected to the vacuum pump. When wafers need to be adsorbed, the vacuum pump operates, generating negative pressure within the vacuum pipe, which then adsorbs the wafers through the vacuum adsorption zone. A vacuum sensor 140 installed inside the vacuum pipe can detect the vacuum value; typically, this sensor is a piezoresistive type. Theoretically, if wafer fragmentation occurs during transfer, the negative pressure within the vacuum pipe should change, allowing detection of fragmentation. However, in practical applications, if wafer fragments or static electricity remain above fingers after vacuum release, the vacuum value may not change. In this case, the system cannot detect the anomaly in time, potentially leading to secondary wafer stacking collisions.

[0041] Therefore, this application adds an optical fiber sensor 130 to the robotic arm device 100. The optical fiber sensor 130 is a sensor that uses optical fiber as a sensing element or signal transmission medium, capable of detecting various physical, chemical, or biological quantities and converting this information into measurable optical signals. Its core function is to accurately sense environmental parameters through changes in optical signals (such as intensity, wavelength, phase, polarization, etc.). In this application, the optical fiber sensor 130 can be used to measure whether a wafer is fragmented. By simultaneously measuring wafer fragmentation using the optical fiber sensor 130 and the vacuum sensor 140, the measurement accuracy can be improved, and the wafer's condition can be detected by the system in a timely manner, avoiding additional losses.

[0042] Furthermore, to ensure the stability of the adsorbed wafer and to enable wafer adsorption in different directions, the robotic arm body 110 provided in this application is provided with five vacuum adsorption zones, including one first vacuum adsorption zone 111 and four second vacuum adsorption zones 112, as follows: Figure 1As shown, four second vacuum adsorption zones 112 form a rectangle, and the first vacuum adsorption zone 111 is located at the center of the rectangle.

[0043] By setting the second vacuum adsorption region 112 in a rectangular shape, it can be ensured that, in addition to the wafer adsorbed by the first vacuum adsorption region 111, second vacuum adsorption regions 112 can also be set in different directions to adsorb the wafer. Understandably, with this arrangement, for wafers with warpage, it can be ensured that, in addition to the wafer being adsorbed in the middle position by the first vacuum adsorption region 111, at least one second vacuum adsorption region 112 can adsorb the wafer, achieving strong adsorption for warped wafers.

[0044] In another implementation, please refer to Figure 3 The four second vacuum adsorption zones 112 can also be arranged in a rhombus shape, with the first vacuum adsorption zone 111 located at the center of the rhombus.

[0045] In practical settings, the first vacuum adsorption region 111 and the second vacuum adsorption region 112 can employ different vacuum channels, and the adsorption force of the first vacuum adsorption region 111 is greater than or equal to the adsorption force of the second vacuum adsorption region 112. Preferably, the adsorption force of the first vacuum adsorption region 111 is greater than the adsorption force of the second vacuum adsorption region 112. This configuration ensures that the adsorption force in the middle region is the strongest, achieving firm adsorption for wafers with different warpages.

[0046] Furthermore, in this application, please refer to Figure 4 Each vacuum adsorption zone includes a matrix arrangement of vacuum suction holes 113. For example, the vacuum suction holes 113 are arranged in a 3*7 matrix.

[0047] Furthermore, to ensure a balanced adsorption force across different regions, the orientation of the vacuum adsorption zones can be adjusted based on the shape formed by the second vacuum adsorption zone 112. For example, each vacuum adsorption zone enclosed by the vacuum suction holes 113 can be rectangular, i.e., a 3x7 matrix arrangement forming a rectangle, such as... Figure 1 As shown, when the second vacuum adsorption region 112 forms a rectangle, the long side of each vacuum adsorption region is parallel to the horizontal direction; as Figure 3 As shown, when the second vacuum adsorption region 112 forms a rhombus, the long side of each vacuum adsorption region is perpendicular to the horizontal direction.

[0048] Based on the above implementation, this application embodiment also provides a wafer transfer system, which includes the above-described robotic arm device 100.

[0049] In summary, this application provides a robotic arm device and a wafer transfer system. The robotic arm device includes a robotic arm body, a connecting part, and a fiber optic sensor. The end of the robotic arm body is connected to the connecting part, and the fiber optic sensor is mounted on the robotic arm body and positioned close to the connecting part. The robotic arm body has multiple vacuum adsorption zones, and at least one of these zones is a first vacuum adsorption zone located in the middle region of the robotic arm body. On one hand, because this application achieves adsorption by setting multiple vacuum adsorption zones, the adsorption capacity is stronger; furthermore, since the first vacuum adsorption zone is located in the middle region of the robotic arm body, it ensures a firm adsorption between the robotic arm body and the wafer during top-down wafer transfer. On the other hand, because the fiber optic sensor is installed on the robotic arm body, abnormalities can be detected promptly when wafer fragmentation occurs.

[0050] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

[0051] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this application. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A robotic arm device, characterized in that, The robotic arm device includes a robotic arm body, a connecting part, and an optical fiber sensor. The end of the robotic arm body is connected to the connecting part, and the optical fiber sensor is mounted on the robotic arm body and is located close to the connecting part. The robotic arm body is provided with multiple vacuum adsorption zones, and the multiple vacuum adsorption zones include at least a first vacuum adsorption zone located in the middle region of the robotic arm body; The robotic arm body is provided with a vacuum pipe, which is connected to the vacuum adsorption area; the robotic arm device also includes a vacuum sensor, which is located inside the vacuum pipe, and both the vacuum sensor and the fiber optic sensor are used to connect to the controller.

2. The robotic arm device as described in claim 1, characterized in that, The plurality of vacuum adsorption zones also include four second vacuum adsorption zones, which form a rectangle, and the first vacuum adsorption zone is located at the center of the rectangle.

3. The robotic arm device as described in claim 1, characterized in that, The plurality of vacuum adsorption zones also include four second vacuum adsorption zones, which form a rhombus, with the first vacuum adsorption zone located at the center of the rhombus.

4. The robotic arm device as described in claim 2 or 3, characterized in that, The adsorption force of the first vacuum adsorption zone is greater than or equal to the adsorption force of the second vacuum adsorption zone.

5. The robotic arm device as described in claim 1, characterized in that, Each of the vacuum adsorption zones includes a matrix arrangement of vacuum suction holes.

6. The robotic arm device as described in claim 5, characterized in that, The vacuum suction holes are arranged in a 3*7 matrix.

7. The robotic arm device as described in claim 1, characterized in that, The main body of the robotic arm is circular.

8. The robotic arm device as described in claim 1, characterized in that, The connecting part is provided with a threaded hole, and the robotic arm device is used to connect to the transfer device through the threaded hole.

9. A wafer transfer system, characterized in that, The wafer transfer system includes the robotic arm device as described in any one of claims 1 to 8.

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