Suction nozzle and pick-and-place head

Abstract

A nozzle and a pick-and-place head, the pick-and-place machine having a nozzle, the nozzle comprising a flat contact surface, a nozzle body, a nozzle tip, and a support structure. The flat contact surface is configured to form a fluid-tight seal with an electronic component; the nozzle body comprises a suction chamber; the nozzle tip comprises a proximal end attached to the nozzle body, an opposing distal end forming part of the contact surface, and a nozzle chamber extending from the opposing distal end to the suction chamber; and the support structure extends from the opposing distal end into the nozzle chamber, the support structure forming part of the contact surface.

Description

Technical Field

[0001] This disclosure relates to a suction nozzle. More specifically, this disclosure relates particularly to a suction nozzle having a support structure. Background Technology

[0002] The semiconductor industry continues to grow as the integration density of various electronic components (such as transistors, diodes, resistors, capacitors, etc.) continues to improve. In most cases, the improvement in integration density comes from the continuous reduction of the smallest feature size, which allows more components to be integrated into a given area (i.e., the footprint).

[0003] Beyond smaller electronic components, improvements in component packaging seek to provide smaller packages that occupy less area than previous packages. Examples of semiconductor package types include quad flat packs (QFP), pin grid arrays (PGA), ball grid arrays (BGA), flip chips (FC), three-dimensional integrated circuits (3DICs), wafer-level packages (WLPs), package-on-package (PoP), system-on-chip (SoC), or system-on-integrated circuit (SoIC) devices. Some three-dimensional devices (e.g., 3DICs, SoCs, and SoICs) are fabricated by placing a wafer on a wafer at the semiconductor wafer level.

[0004] Semiconductor devices can be assembled using pick-and-place machines (e.g., pick-and-place apparatuses), which may include complex robots with dispensing heads that assemble unfinished products along one or more axes. The dispensing head is capable of picking up and / or placing a component from one surface to another. In pick-and-place apparatuses, for example, the dispensing head is often configured to receive multiple different spindle and nozzle assemblies to efficiently pick up, place, and assemble various different parts. The dispensing head typically includes a spindle assembly for generating rotation within the nozzle and the ability to move the nozzle along the Z-axis.

[0005] Furthermore, the pick-and-place device may include multiple spindles or multiple nozzle dispensing heads. For example, these dispensing heads may be configured to pick up multiple components from multiple feed hoppers and then move them to placement positions to place the components. Compared to pick-and-place devices that include a single spindle or a single nozzle, these devices that include multiple spindles or multiple nozzle dispensing heads reduce assembly time. This is because a single spindle and nozzle configuration typically requires multiple back-and-forth movements between the feed hoppers and the placement positions for each component to be placed. Utility Model Content

[0006] The purpose of this disclosure is to provide a suction nozzle and a pick-up / drop-off head to solve at least one of the above-mentioned problems.

[0007] This disclosure provides a suction nozzle for picking up and placing equipment. The suction nozzle may include: a flat contact surface configured to form a fluid tight-fit seal with an electronic component; a suction body including a suction chamber; a suction tip including a proximal end attached to the suction body, a opposite distal end forming a portion of the contact surface, and a suction chamber extending from the opposite distal end into the suction chamber; and a support structure extending from the opposite distal end into the suction chamber, the support structure forming a portion of the contact surface.

[0008] According to one embodiment of this disclosure, the opposite distal end forms a surrounding portion of the contact surface; and the support structure forms an inner portion of the contact surface.

[0009] According to one embodiment of this disclosure, the support structure extends from two opposite sides of the opposite distal end into the mouthpiece chamber to form two mouthpiece chamber openings, or the support structure extends from three sides of the opposite distal end into the mouthpiece chamber to form three mouthpiece chamber openings, or the support structure extends from four opposite sides of the opposite distal end into the mouthpiece chamber to form four mouthpiece chamber openings.

[0010] According to one embodiment of the present disclosure, the support structure includes two support elements extending from two opposite sides of the opposite distal end into the mouthpiece chamber to form a partially divided mouthpiece chamber opening, or the support structure includes four support elements extending from four opposite sides of the opposite distal end into the mouthpiece chamber to form a partially divided mouthpiece chamber opening.

[0011] According to one embodiment of this disclosure, the support structure includes at least two support elements having a circular horizontal cross-section.

[0012] According to one embodiment of this disclosure, the at least two support elements are directly connected to each other, or the at least two support elements have different diameters.

[0013] This disclosure also provides a suction nozzle for picking up and placing a device, comprising: a suction nozzle body including a suction chamber; a suction nozzle tip including a proximal end attached to the suction nozzle body, an opposite distal end, and a suction nozzle chamber extending from the opposite distal end to the suction chamber; and a support structure extending into the suction nozzle chamber to form at least two suction nozzle chamber openings.

[0014] According to one embodiment of the present disclosure, the opposite distal end and the support structure form a flat contact surface configured to form a fluid tight fit seal with an electronic component disposed in contact with the contact surface.

[0015] According to one embodiment of this disclosure, a spring is also included, biasing between the nozzle tip and the nozzle body.

[0016] This disclosure also provides a pick-and-place device, including: a spindle; and a suction nozzle fluidly connected to one end of the spindle. The suction nozzle includes: a flat contact surface configured to form a fluid-tight seal with an element; a suction nozzle body including a suction chamber; a suction nozzle tip including a proximal end attached to the suction nozzle body, a distal end forming a portion of the contact surface, and a suction nozzle chamber extending from the distal end to the suction chamber; and a support structure disposed in the suction nozzle chamber and forming a portion of the contact surface. Attached Figure Description

[0017] This disclosure will be better understood in conjunction with the following detailed description and the accompanying drawings. It should be noted that, in accordance with industry standard practice, the various components in the drawings are not necessarily drawn to scale. In fact, the dimensions of various components may be arbitrarily enlarged or reduced for clarity.

[0018] Figure 1 This is a perspective view of the pick-and-place device according to various embodiments of the present disclosure.

[0019] Figure 2A To show Figure 1 A 3D view showing the removal of the cover by the pick-and-place mechanism.

[0020] Figure 2B To show Figure 2A A magnified 3D view of part A in the image.

[0021] Figure 3 This is a perspective view of the main shaft according to various embodiments of the present disclosure.

[0022] Figure 4A A flowchart is provided to illustrate a method for picking up and placing electronic components according to various embodiments of the present disclosure.

[0023] Figure 4B and Figure 4C According to various embodiments of this disclosure, it is shown that in Figure 4AThe diagram illustrates the process of taking and placing the head during the procedure.

[0024] Figure 5A This is a plan view of the suction nozzle.

[0025] Figure 5B This is a cross-sectional view of the nozzle that is attached to the semiconductor die.

[0026] Figure 5C A transparent stereoscopic image of the warping of the semiconductor grains attached to the tip of the nozzle was drawn.

[0027] Figure 5D This is a schematic diagram of the nozzle and semiconductor die.

[0028] Figure 6A This is a plan view of a suction nozzle according to various embodiments of the present disclosure.

[0029] Figure 6B For along Figure 6A A cross-sectional view of line segment L1.

[0030] Figure 6C To show Figure 6A A cross-sectional view of the nozzle attached to the semiconductor die.

[0031] Figure 6D This is a planar view showing the contact surfaces disposed on the semiconductor die.

[0032] Figure 7A This is a plan view of a suction nozzle having an alternative support structure according to various embodiments of the present disclosure.

[0033] Figure 7B For along Figure 7A A cross-sectional view of line segment L2.

[0034] Figure 8A This is a plan view of a suction nozzle having an alternative support structure according to various embodiments of the present disclosure.

[0035] Figure 8B For along Figure 8A A cross-sectional view of line segment L3.

[0036] Figure 9A This is a plan view of a suction nozzle having an alternative support structure according to various embodiments of the present disclosure.

[0037] Figure 9B For along Figure 9A Sectional view of line segment L4

[0038] Figures 10A to 10J A plan view of the contact surface formed by an alternative support structure is shown for various embodiments of the present disclosure.

[0039] The attached figures are labeled as follows: 10: Picking and placing equipment 12: Framework 14: Main Body 16a, 16b: Cover 18a: Material Supply Warehouse / First Material Supply Warehouse 18b: Material supply warehouse / Second material supply warehouse 18c: Material supply warehouse / Third material supply warehouse 18d: Material Supply Warehouse / Fourth Material Supply Warehouse 22: Plate operation opening / opening 24: Panel Operation Track / Track 26a, 26b: Operator interface and control display 28: Internal 30: Placement Station 32: Moving axis / First moving axis 34: Moving axis / Second moving axis 36: Moving axis / Third moving axis 38: Moving axis / Fourth moving axis 40: First side 42: Second side 100, 100a, 100b: Take and put the head 110: Base 112: Support system 114a, 114b, 114c, 114d, 114e, 114f, 114g, 114h: Installation location 200a, 200b, 200c, 200d, 200e, 200f, 200g, 200h: Spindle Module 210: Modular Main Structure 212: First Main Structure 214: Second Main Structure 216: First receiving position 218: Second receiving position 220: First Z-axis motor 222: Second Z-axis motor 224: First Theta Motor 226: Second Theta Motor 228: Valve / First Valve 230: Valve / Second Valve 236: Airflow tube 238: External Subject 240a, 240b: Ports 242a, 242b: Electronic Distribution Port / Distribution Port 246a: First threaded screw 246b: Second threaded screw 250: First motion control chip / motion control chip 251: Second circuit board assembly 252: Electronic connector 254: Electronic connectors / connectors 256: Pneumatic connector 257: Electronic Connector 300: Spindle 300a: First spindle / spindle 300b: Second spindle / spindle 300c: Spindle 311: Inserting / Removing the nozzle / Mouth 321: Suction nozzle body 331: Suction tip 333: Suction nozzle opening 401: Operation 402: Operation 403: Operation 404: Operation 405: Operation 410: Semiconductor die 410r: Vacuum exposed surface area 412: Frame Tape 414: Paste Layer 416: Thimble 418:Substrate 600, 600a, 600b, 600c: Suction nozzles 610, 610a, 610b, 610c, 610d, 610e, 610f, 610g, 610h, 610i, 610j: Contact surfaces 616: Optical Spring / Spring 620: Nozzle body 622: Suction Chamber 630, 630a: Suction tip 632: Proximal 634: Opposite distal / distal 636: Tip chamber of the mouthpiece / mouthpiece chamber 636a, 636b, 636c, 636d, 636e, 636f: Suction nozzle chamber openings 640: Support Structure 642: Support Structure 644: Support Structure 644a: First support element 644b: Second support element 646: Support Structure 646a: First support element 646b: Second support element 648: Support Structure 648a, 648b, 648c: Supporting components 650: Support Structure 652: Support Structure 652a, 652b, 652c, 652d: Supporting components 654: Support Structure 656: Support Structure 658: Support Structure 658a, 658b: Supporting components 660: Support Structure 660a, 660b, 660c, 660d: Supporting components 662: Support Structure 662a, 662b: Supporting components 664: Support Structure 664a, 664b, 664c, 664d: Supporting components 666: Support Structure 666a, 666b, 666c, 666d: Supporting components A: Circle / Part D: Distance L1: Line segment L2: Line segment L3: Line segment L4: Line segment P: any point T: Thickness X: x-axis Y: y-axis Z: z-axis θ: axis of rotation Detailed Implementation

[0040] The following disclosure provides numerous different embodiments or examples to implement the various features of this application. The following disclosure describes specific examples of the various components and their arrangements for simplification. Of course, these specific examples are not intended to be limiting. For example, if this disclosure describes a first feature formed on or above a second feature, it indicates that it may include embodiments where the first and second features are in direct contact, or embodiments where an additional feature is formed between the first and second features, so that the first and second features may not be in direct contact. Furthermore, the same reference numerals and / or designations may be repeated in different examples of the following disclosure. These repetitions are for simplification and clarity and are not intended to limit any specific relationship between the different embodiments and / or structures described.

[0041] Furthermore, to facilitate the description of the relationship between one element or feature and another (plural) element or feature in the accompanying drawings, spatially related terms such as "below," "below," "under," "above," "above," and similar terms may be used. In addition to the orientations shown in the drawings, spatially related terms cover different orientations of the device during use or operation. The device may also be positioned otherwise (rotated 90 degrees or in other orientations), and the spatially related descriptions used herein may be interpreted accordingly. Unless otherwise expressly stated, each element with the same reference numerals is assumed to have the same material composition and thickness within the same thickness range.

[0042] Pick-and-place machines play a crucial role in moving electronic components from one location to another. For example, they are used to pick up electronic components, such as semiconductor chips, resistors, and capacitors, from reels, wafers, trays, or frames and place them onto a printed circuit board (PCB). For instance, pick-and-place machines can be equipped with various types of nozzles designed to pick up different electronic components. Automation of pick-and-place machines increases productivity and allows for the rapid assembly of large numbers of printed circuit boards.

[0043] Currently manufactured semiconductor dies are becoming increasingly smaller in size. For example, advanced SoIC dies may have smaller thicknesses and may be more susceptible to warping or damage due to rough handling by pick-and-place equipment. Specifically, nozzles used in relevant pick-and-place equipment may warp and / or damage relatively fragile advanced semiconductor dies, for example, when the pick-and-place equipment uses suction to pick up and move the semiconductor die. The application of suction force to the relevant nozzle (e.g., negative vacuum pressure) may cause deformation of the semiconductor die attached thereto. Warping of the semiconductor die may create internal stress on the semiconductor die, which may lead to internal damage to the semiconductor die. In addition, the warping of the semiconductor die may result from friction between the nozzle tip and the semiconductor die. This may scratch and / or damage (e.g., form notches) the semiconductor die. Therefore, semiconductor die warping can reduce product yield and the reliability of pick-and-place processes. The various embodiments disclosed herein provide reinforced support structures that can be configured to reduce and / or avoid die warping.

[0044] Figure 1 This is a perspective view of a pick-and-place device 10. Please refer to [the original text]. Figure 1 The pick-and-place machine 10 can be configured to assemble a printed circuit board (PCB) in the illustrated embodiment. For example, the pick-and-place machine 10 can be an advanced packaging pick-and-place machine, a component pick-and-place machine, or the like. In other embodiments, the elements described herein can be applied to a variety of other pick-and-place machines, such as odd form pick-and-place machines (OFAs), or the like. The pick-and-place machine 10 includes a frame 12 providing a structure for a body 14 having covers 16a, 16b. The frame 12 may include multiple legs, to which the pick-and-place machine 10 can be configured to stand. The pick-and-place machine 10 may include multiple feed magazines 18a, 18b. Frame tape (in...) Figure 4A (As indicated in the text) can be installed in each of the feeder bins 18a, 18b. Each frame tape may include a pick-and-place device 10 configured to pick up and place electronic components on the printed circuit board for assembling or at least partially assembling the printed circuit board.

[0045] The pick-and-place device 10 may also include a plate operation opening 22. A plate operation track 24 may extend within the body 14 of the pick-and-place device 10, extending between the opening 22 and another opening (not shown) on the opposite side of the pick-and-place device. The plate operation track 24 may be configured to receive printed circuit boards or other unfinished products and to convey the printed circuit boards to a placement position within the body of the pick-and-place device 10 for assembly. Figure 1The pick-and-place device 10 shown may include an operator interface and control displays 26a and 26b, one on each side. The displays (i.e., 26a and 26b) may be configured to receive input from a user or operator and display necessary or useful information to the user or operator. While the features of the pick-and-place device 10 shown are of an exemplary embodiment, the inventive ideas described herein are applicable to various other types of pick-and-place devices that will be apparent to those skilled in the art.

[0046] Please see now Figure 2A This is shown as a pick-and-place device 10 that removes covers 16a and 16b. Therefore, Figure 2A The pick-and-place device 10 shown depicts its exposed interior 28. The pick-and-place device 10 may include two additional feed magazines 18c, 18d, positioned opposite the main body 14 of the feed magazines 18a, 18b. A board handling track 24 may be located between the feed magazines 18a, 18b and 18c, 18d. The board handling track 24 may be configured to deliver unfinished products (e.g., printed circuit boards) to a placement station 30 located along the track 24.

[0047] The pick-and-place device 10 facilitates movement of components along three axes: the x-axis, y-axis, and z-axis. Hereinafter, the x-axis may be an axis extending parallel to the plate operating track 24. The y-axis may be perpendicular to the x-axis and the plate operating track 24. The z-axis may be a vertical or up-down axis. The pick-and-place device 10 may include multiple axes 32, 34, 36, and 38 to facilitate movement along the x-axis and y-axis. Specifically, the pick-and-place device 10 may include a first axis 32 and a second axis 34 configured to facilitate movement along the y-axis. The pick-and-place device 10 may include a third axis 36 and a fourth axis 38, each configured to facilitate movement along the x-axis. The first axis 32 and the second axis 34 may extend along the depth of the machine between a first side 40 and a second side 42. The first side 40 is the side of the pick-and-place device 10 adjacent to the first feed magazine 10a and the second feed magazine 18b. The second side 42 is the side of the pick-and-place device 10 that is close to the third feed bin 18c and the fourth feed bin 18d. The third moving shaft 36 and the fourth moving shaft 38 are both shown to be connected to the first moving shaft 32 and the second moving shaft 34 and extend between them.

[0048] During operation of the pick-and-place device 10, the third movable axis 36 and the fourth movable axis 38 are configured to move independently along the first movable axis 32 and the second movable axis 34 to provide movement along the y-axis. Pick-and-place heads 100a and 100b are movably attached to the third movable axis 36 and the fourth movable axis 38, respectively. Pick-and-place heads 100a and 100b may each be configured to move along the x-axis by moving along the third movable axis 36 and the fourth movable axis 38, respectively. In other embodiments, the pick-and-place device 10 may be a machine with a single movable axis. For example, it may be connected to a single x-axis or a single y-axis.

[0049] The pick-and-place heads 100a and 100b within the pick-and-place device 10 can be configured to have both x-axis and y-axis operational freedom within the internal 28 via the first, second, third, and fourth movement axes 32 and 34, respectively. This allows the pick-and-place heads 100a and 100b to move back and forth between the feed bins 18a, 18b, 18c, 18d and the placement station 30. This is achieved by simultaneously moving the pick-and-place heads 100a and 100b along the respective third and fourth movement axes 36 and 38, and by moving the third and fourth movement axes 36 and 38 along the first and second movement axes 32 and 34, respectively. Other forms of x-axis and y-axis movement within the pick-and-place device 10 can be anticipated; the movement axes shown are for illustrative purposes.

[0050] Please see now Figure 2B The image shows the pick-and-place device 10 in circle A (from...). Figure 2A The enlarged perspective view shows a portion of the pick-and-place head 100a having a base 110 and a support system 112. The base 110 may be a body, housing, structure, or the like. The base 110 may include multiple mounting positions 114a, 114b, 114c, 114d, 114e, 114f, 114g, 114h, each configured to receive spindle modules 200a, 200b, 200c, 200d, 200e, 200f, 200g, 200h (collectively referred to as spindle modules). The spindle modules described herein may be pick-and-place spindle modules specifically configured to receive a combination of a spindle and a nozzle, the latter being configured to pick up, place, or otherwise manipulate electronic components used in printed circuit board assembly and pick-and-place processes. The spindle module described herein can also be used to perform other processes, wherein one or more rotatable and / or descentable operating spindles are necessary to perform at least a portion of an assembly process to assemble an unfinished product.

[0051] The support system 112 may be a system for providing movement of the pick-and-place head 100a along the third moving axis 36. The support system 112 may include wheels to facilitate movement between the pick-and-place head 100a and the moving axis 36. In other embodiments, the support system 112 may include magnets to facilitate magnetic movement between the pick-and-place head 100a and the third moving axis 36. The third moving axis 36 may include a track structure on its underside (not shown) that may engage with the track structure support system of the pick-and-place head 100a. For example, the pick-and-place head 100a may include track runner bearings configured to engage with the track of the third moving axis 36. A motor or other motion-generating mechanism may be provided to control the powered movement of the pick-and-place head 100a along the third moving axis 36. The motor may be located on the pick-and-place head 100a itself or on the third moving axis 36. Therefore, the pick-and-place head 100a may include one or more electronic ports, connectors, or the like to connect to the power system of the pick-and-place device 10, thereby providing power to the pick-and-place head 100a. The pick-and-place head 100a may use this power to power a motor or other means to provide movement, shifting, or acceleration of the pick-and-place head 100a relative to the third moving axis 36.

[0052] Mounting positions 114a, 114b, 114c, 114d, 114e, 114f, 114g, and 114h provide modularity for the pick-and-place head 100a, allowing it to operate as either having individual spindle modules 200a, 200b, 200c, 200d, 200e, 200f, 200g, and 200h attached, or as a single spindle module. In other words, the pick-and-place head 100a remains operational regardless of the number of spindle modules 200a, 200b, 200c, 200d, 200e, 200f, 200g, and 200h installed at mounting positions 114a, 114b, 114c, 114d, 114e, 114f, 114g, and 114h. In other embodiments, the pick-and-place head 100a may include mounting locations with different physical attachment characteristics to provide module attachment with different attachment mechanisms or characteristics to other attachable modules at other mounting locations on the pick-and-place head 100a.

[0053] Please see now Figure 3 This shows an enlarged view of a spindle module. The spindle module can be used with... Figure 2BThe spindle modules 200a, 200b, 200c, 200d, 200e, 200f, 200g, and 200h shown are identical. Each spindle module includes a modular body structure 210. The modular body structure may include a first body structure 212 and a second body structure 214, with the second body structure 214 mounted or attached to the first body structure 212. The second body structure 214 may include a first receiving position 216 configured to receive a first spindle 300a and a second receiving position 218 configured to receive a second spindle 300b.

[0054] The spindle module also includes a first z-axis motor 220 and a second z-axis motor 222, each mounted to the second main body structure 214. The first z-axis motor 220 is configured to move the first spindle 300a in the z-axis direction. Similarly, the second z-axis motor 222 is configured to move the second spindle 300b in the z-axis direction. The spindle module also includes a first θ-axis motor 224 and a second θ-axis motor 226. The first θ-axis motor 224 is configured to rotate the first spindle 300a along the θ-axis. The second θ-axis motor 226 is configured to rotate the second spindle 300b along the θ-axis. The first θ-axis motor 224 and the second θ-axis motor 226 are configured to provide θ-axis rotation in either direction. Therefore, the spindle module can provide both z-axis movement and θ-axis rotational movement. The spindle module can provide independent movement for each of the first spindle 300a and the second spindle 300b.

[0055] The spindle module may also include an air distribution system comprising one or more valves 228, 230 and two airflow conduits 236 (one shown), each providing vacuum-generated airflow to the first spindle 300a and the second spindle 300b. The air distribution system may also include a pneumatic connector 256 (one shown) on each side. An internal airflow conduit (not shown) provides this airflow to the pneumatic connector 256. The airflow conduit 236 can be connected to the pneumatic connector 256 by elongating the conduit or using other conduits that connect the pneumatic connector 256 to the airflow conduit 236. In the illustrated embodiment, the first valve 228 is located within a widened portion of the first body structure 214 and provides air-kiss forward air pressure. The second valve 230 is also shown located within a widened portion of the first body structure 214 and may be a valve for providing vacuum pressure to pick up components with the first spindle 300a and the second spindle 300b.

[0056] The spindle module 200 may have an outer body 238, which is mounted to the first main body structure 212 by a plurality of screws or other fasteners. The outer body 238 may be a circuit board. As shown, the spindle module 200 may include an electronic distribution system including a second circuit board assembly 251 containing a plurality of electronic distribution ports 242a, 242b configured to receive current from the pick-and-place device 10 and / or pick-and-place head 100a or 100b, for example, wherein the pick-and-place head 100a or 100b is attached to and delivers the received current to a first z-axis motor 220 and a second z-axis motor 222, and a first theta motor 224 and a second theta motor 226. In embodiments where the spindle module is attached to the pick-and-place device 10, each electronic distribution port 242a and 242b may be attached to an electronic connector of the pick-and-place device 10 or a pick-and-place head 100a or 100b.

[0057] In one embodiment, ports 240a and 240b are configured to deliver power from distribution ports 242a and 242b to the outer body 238 and electronic connectors 252, 254, and 257. It should be understood that electronic connectors 252, 254, and 257 may be located on one side of the spindle module, the other side of the spindle module, and / or both sides of the spindle module. Therefore, power can be delivered through distribution port 242a, port 240a, outer body 238, electronic connector 257, and a cable (not shown) to the first z-axis motor 220. Similarly, current can be delivered through distribution port 242a, through port 240, electronic connector 252, and a cable (not shown) to the first θ-axis motor 224. Connector 254 can be used to connect a spindle module optical detector (not shown) to the motion control chip 250.

[0058] The spindle module may include one or more mechanical attachment mechanisms to facilitate attachment of the spindle module to the pick-and-place tool 10, thereby forming one of the attachment heads 100a, 100b. In the illustrated embodiment, the mechanical attachment mechanism includes a first threaded screw 246a and a second threaded screw 246b. Other fastening devices may also be contemplated.

[0059] The spindle module 200 may also include a first motion control chip 250 attached to the first main structure 212, close to the second main structure 214 and the first z-axis motor 22, the second z-axis motor 222, the first theta motor 224, and the second theta motor 226. A second motion control chip (not shown) may be included on the opposite side of the first main structure 212, located mirrored to the first motion control chip 250. The first motion control chip 250 may be configured to control the first z-axis motor 220 and the first theta motor 224. The motion control chip 250 may therefore be a dedicated control chip, processor, or the like, configured to control only one of the two spindles 300a and 300b included in the spindle module, specifically the first spindle 300a. The second motion control chip may be a dedicated control chip, processor, or the like, configured to control the second spindle 300b. The first motion control chip 250 and the second motion control chip (not shown) can be configured to control the speed, acceleration, and position of each of the first z-axis motors 220 and the second z-axis motors 222, as well as the first theta motor 224 and the second theta motor 226.

[0060] Figure 4A This is a flowchart of a method for picking up and placing electronic components according to various embodiments of the present disclosure. Figure 4B and Figure 4C This is a schematic diagram illustrating the operation of the pick-and-place head 100 during the aforementioned method, according to various embodiments of this disclosure. Please refer to... Figure 4A and Figure 4B The pick-and-place head 100 may include at least one spindle 300, such as spindles 300a, 300b, 300c, etc. However, in other embodiments, the pick-and-place head 100 may include a single spindle 300 or additional spindles 300. A nozzle 600 may be attached to each spindle 300. Each nozzle 600 may include a nozzle body 620, a nozzle tip 630, and an optical spring 616. The nozzle 600 may have a contact surface 610 configured to establish a fluid-tight connection with an electronic component, such as a semiconductor die 410.

[0061] In operation 401 of the method, the pick-and-place head 100 may be positioned on a component carrier, such as frame tape 412. Frame tape 412 can be... Figure 1 The shown feeders provide (e.g., feeders 18a, 18b). For example, multiple electronic components of semiconductor die 410 can be attached to frame tape 412, for example, via adhesive layer 414.

[0062] The pick-and-place head 100 can be operated to position the spindle 300 over a selected semiconductor die 410. For example, the spindle 300a can be moved along the x-axis, y-axis, and / or z-axis such that the spindle 300a is perpendicularly overlapped with the semiconductor die 410. The semiconductor die 410 can be positioned over a ejector pin 416. The ejector pin 416 can be moved vertically upwards such that the semiconductor die 410 also moves vertically upwards toward the spindle 300 and is positioned over an adjacent semiconductor die 410 attached to the frame tape 412.

[0063] In some embodiments, the spindle 300a may also extend downward in a vertical direction toward the semiconductor die 410, so that the nozzle 600 moves to contact the semiconductor die 410. Through the movement of the ejector pin 416 and / or the spindle 300a, the nozzle tip 630 will contact the top surface of the semiconductor die 410.

[0064] In operation 402 of the method, suction force is applied to the spindle 300a via the pick-and-place head 100 to attach the semiconductor die 410 to the nozzle 600. For example, a partial vacuum can be created within the nozzle 600 and applied to the top surface of the semiconductor die 410. In other words, the semiconductor die 410 can be held in place by suction force (vacuum force). The nozzle tip 630 can be formed of a compliant material, such as rubber or a flexible polymer. In this way, the nozzle tip 630 can be configured to form a gas-tight seal on the top surface of the semiconductor die 410.

[0065] In operation 403 of the method, the semiconductor die 410 may then be separated from the frame tape 412. For example, the pick-and-place head 100 may be moved upward away from the frame tape 412 and / or the spindle 300a may be retracted into the pick-and-place head 100. For example, spindles 300b and 300c are shown in the retracted position, while spindle 300a is shown in the extended position.

[0066] In other embodiments, the semiconductor die 410 may be removed from a substrate other than the frame tape 412. For example, the semiconductor die 410 may be removed from a semiconductor wafer, a wafer frame, or a box or container.

[0067] Please see Figure 4A and Figure 4C In operation 404 of the method, the semiconductor die 410 may be moved to a new location. For example, the pick-and-place head 100 may move in the X, Y, and / or Z directions to place the semiconductor die 410 on a substrate 418. In various embodiments, the substrate 418 may be a printed circuit board, a semiconductor die, a semiconductor wafer, a housing or container, or a wafer frame.

[0068] After the semiconductor die 410 is positioned at the desired location, in operation 405 of the method, the semiconductor die 410 can be released from the nozzle tip and placed on the substrate 418. Specifically, the suction force (i.e., vacuum) in the spindle 300a can be released to release the semiconductor die 410 from the nozzle tip 630. The method may also include repeating operations 401-405 one or more times to pick up and place additional components.

[0069] Semiconductor die protection: Currently manufactured semiconductor dies are becoming increasingly smaller. For example, advanced SoIC dies can be about 100 micrometers thick, while C4 bump dies can be about 800 micrometers thick. As a result, modern semiconductor dies may be less robust, making their handling more complex. Specifically, the following... Figures 5A to 5D In detail, the associated nozzle may warp and / or damage the relatively fragile advanced semiconductor die.

[0070] Figure 5A This is a plan view of the associated pick-and-place nozzle 311. Figure 5B To show a cross-sectional view of the associated suction nozzle 311 attached to the semiconductor die, Figure 5C A transparent stereoscopic view of the warping of the semiconductor die 410 attached to the tip 331 of the associated suction nozzle was drawn, and Figure 5D This is a schematic diagram of the nozzle 311 and the semiconductor die 410.

[0071] Please see Figure 5A The nozzle 311 includes a nozzle tip 331 attached to a nozzle body 321. The nozzle tip 331 may be generally cylindrical or conical in shape. Other nozzle tip shapes are also included within the scope of this disclosure. The nozzle tip 331 may have a circular nozzle opening 333.

[0072] like Figures 5B to 5D As shown, the application of suction force (e.g., negative vacuum pressure) to the nozzle 311, as indicated by the "suction" arrow, can cause deformation of the semiconductor die 410 attached thereto. Warping of the semiconductor die 410 can generate internal stress on the semiconductor die 410, which may cause internal damage to the semiconductor die 410. Additionally, the warping of the semiconductor die 410 can result in the nozzle tip 331 rubbing against the semiconductor die 410. This may scratch and / or damage (e.g., form notches) the semiconductor die 410. Therefore, semiconductor die warping can reduce product yield and the reliability of the pick-and-place process. Therefore, this disclosure provides an improved nozzle tip configured to reduce and / or avoid die warping.

[0073] Figure 6A This is a plan view of the pick-up and drop-off nozzle 600 according to various embodiments of the present disclosure. Figure 6BFor along Figure 6A A cross-sectional view of the midline segment L1. Figure 6C A cross-sectional view of the nozzle 600 in the operating position and attached to the semiconductor die 410 is shown. Figure 6D This is a plan view showing the contact plane disposed on the semiconductor die 410.

[0074] Please see Figure 4A , Figure 6A ,as well as Figure 6B The suction nozzle 600 can be coupled to the spindle 300 of the pick-and-place head 100. The suction nozzle 600 may include a contact surface 610, a suction nozzle body 620, a suction nozzle tip 630, and an optical spring 616 biasing between portions of the suction nozzle tip 630 and the suction nozzle body 620. The suction nozzle body 620 may include a suction chamber 622. The suction nozzle body 620 may be configured to be removably attached to the spindle 300. The suction nozzle body 620 may be formed of any suitable material, such as metal or plastic. Other suitable materials for the suction nozzle body 620 are also included within the scope of this disclosure.

[0075] The nozzle tip 630 may be generally cylindrical in shape. However, the nozzle tip 630 is not limited to a particular shape and may be, for example, conical, prismatic, or similar in shape. Other suitable shapes for the nozzle tip 630 are also included within the scope of this disclosure. The nozzle tip 630 may be formed of a flexible rubber or plastic material and may be attached to the nozzle body 620. Other suitable materials for the nozzle tip 630 are also included within the scope of this disclosure.

[0076] The nozzle tip 630 may include a nozzle tip chamber 636 fluidly connected to the suction chamber 622. The nozzle tip 630 may include a proximal end 632 and an opposite distal end 634 attached to the nozzle body 620. The opposite distal end 634 may have an external flat surface facing away from the nozzle body 620.

[0077] A support structure 640 may be disposed within the mouthpiece chamber 636 at the opposite distal end 634 of the mouthpiece tip 630. The support structure 640 may have an external flat surface facing away from the mouthpiece body 620. The support structure 640 may have a prismatic shape, such as a rectangular prism or a triangular prism. However, other shapes also fall within the scope of this disclosure. The support structure 640 may extend into the mouthpiece chamber 636 to form separate mouthpiece chamber openings 636a, 636b.

[0078] The outer surfaces of the support structure 640 and the opposite distal end 634 may be coplanar and may form the contact surface 610 of the suction nozzle 600. Specifically, the distal end 634 may form the peripheral portion of the contact surface 610, and the support structure 640 may form the inner portion of the contact surface. In other words, the support structure 640 may be disposed within the opposite distal end 634.

[0079] Contact surface 610 may be configured to establish a fluid-fit vacuum connection with an electronic component, such as semiconductor die 410. Specifically, support structure 640 may be configured to support the electronic component within an attraction (i.e., negative pressure vacuum) region defined around nozzle chamber 636 to limit the stress applied to the electronic component by the suction force. For example, support structure 640 may be configured to reduce bending stress applied to the electronic component, which is attached to nozzle tip 630 by generating a partial vacuum within attraction chamber 622 and nozzle chamber 636.

[0080] like Figure 6C As shown, when negative pressure is generated in the suction chamber 622, suction connects the semiconductor die 410 to the nozzle 600. Specifically, suction is applied to a portion of the upper surface of the semiconductor die 410 via the nozzle chamber 636 at the distal end 634, causing the semiconductor die 410 to be pressed against the contact surface 610. Because the support structure 640 supports the semiconductor die 410, the stress applied to the semiconductor die 410 is reduced compared to the associated nozzle tip 331 which lacks a support structure (e.g., support structure 640). Therefore, the support structure 640 used in the various embodiments disclosed herein can be configured to reduce or avoid warping and / or damage to electronic components.

[0081] like Figure 6B As shown, the support structure 640 may have a thickness T sufficient to minimize or prevent warping of electronic components (e.g., semiconductor die 410). For example, the thickness T may be between about 1 mm and about 10 mm, such as between about 2 mm and about 5 mm. However, other thicknesses are also possible, depending on the strength of the material used to form the support structure 640. In various embodiments, the support structure 640 and the nozzle tip 630 may be formed of the same material, such as a flexible rubber material. In other embodiments, the support structure 640 and the nozzle tip 630 may be formed of different materials.

[0082] Please see Figure 6C and Figure 6D In some embodiments, the contact surface 610 may have a radius based on the size of the element to be picked up by the nozzle tip 630. For example, the aforementioned radius may be between about 0.5 mm and about 300 mm, such as between about 10 mm and about 200 mm, or between about 50 mm and about 100 mm. The support structure 640 may be configured such that the distance D between any point P on the vacuum-exposed surface region 410r of the electronic component (e.g., semiconductor die 410) and the nearest portion of the contact surface 610 is no greater than a predetermined distance, to support the semiconductor die 410 and limit the warpage of the semiconductor die 410. For example, the distance D may be between about 0 mm and about 0.9 times the radius (i.e., 0.9). (Radius). In some embodiments, the distance D may be between 0.01 and 0.01. Radius approximately 0.5 The radius, for example, is between approximately 0.1 Radius approximately 0.4 Radius, or approximately 0.2 Radius approximately 0.3 radius.

[0083] Figure 7A This is a plan view of a suction nozzle 600a having an alternative support structure 642 according to various embodiments of the present disclosure. Figure 7B For along Figure 7A A cross-sectional view of line segment L2 in the image. The nozzle 600a can be similar to... Figures 6A to 6C The nozzle is 600. Therefore, only the differences between the two will be explained in detail.

[0084] Please see Figure 7A and Figure 7B A support structure 642 may be disposed at the opposite distal end 634 of the mouthpiece tip 630. The support structure 642 may be connected only to one side of the mouthpiece tip 630. The support structure 642 may have a linear horizontal profile. The support structure 642 may have a triangular vertical profile to provide additional strength to the support structure 642. However, in other embodiments, the support structure 642 may have a rectangular vertical profile. In still other embodiments, the support structure may have a semi-circular or quarter-circular vertical profile. The support structure 642 may extend from one side of the opposite distal end 634 into the mouthpiece chamber 636 to form a partially divided mouthpiece chamber opening 636a. In some embodiments, the length of the support structure 642 may be at least about half the inner diameter of the distal end 634; however, shorter or longer lengths may also be used. In other words, the support structure 642 may extend across more than half of the mouthpiece chamber opening 636a. In some embodiments, the support structure 642 may extend across half or less than half the width of the mouthpiece chamber opening 636a. For example, the length of the support structure 642 may be between about 45% and about 75% of the diameter of the nozzle tip 630.

[0085] Figure 8A This is a plan view of a suction nozzle 600b having an alternative support structure 644 according to various embodiments of the present disclosure. Figure 8B For along Figure 8A A cross-sectional view of line segment L3 in the image. The nozzle 600b is similar to... Figures 6A to 6C The nozzle is 600. Therefore, only the differences between the two will be explained in detail.

[0086] Please see Figure 8A and Figure 8BThe mouthpiece 600b may include a tapered mouthpiece tip 630a disposed on the mouthpiece body 620. A support structure 644 may be disposed at the opposite distal end 634 of the mouthpiece tip 630a. The support structure 644 may include a first support element 644a and an intersecting second support element 644b. In other words, the support structure 644 may include a horizontally cross-sectional "X-shape" or cross shape. The first support element 644a and the second support element 644b may each extend from the opposite side of the opposite distal end 634 into the mouthpiece chamber 636 to form a first mouthpiece chamber opening 636a, a second mouthpiece chamber opening 636b, a third mouthpiece chamber opening 636c, and a fourth mouthpiece chamber opening 636d.

[0087] Figure 9A This is a plan view of a suction nozzle 600c having an alternative support structure 646 according to various embodiments of the present disclosure. Figure 9B For along Figure 9A A cross-sectional view of line segment L4 in the image. The nozzle 600c is similar to... Figures 8A to 8B The nozzle is 600b. Therefore, only the differences between the two will be explained in detail.

[0088] Please see Figure 9A and Figure 9B The nozzle 600c may include a tapered nozzle tip 630a disposed on the nozzle body 620. A support structure 646 may be disposed at the opposite distal end 634 of the nozzle tip 630a. The support structure 646 may include a first support element 646a and an opposite second support element 646b.

[0089] A first support element 646a and an opposite second support element 646b may extend from opposite sides of opposite distal ends 634 into the mouthpiece chamber 636 to form a partially divided mouthpiece chamber opening 636a. The terminating ends of the first support element 646a and the opposite second support element 646b may be rounded or tapered. However, in other embodiments, the terminating ends of the first support element 646a and the opposite second support element 646b may be flat. In some embodiments, the terminating ends of the first support element 646a and the opposite second support element 646b may have different shapes. Figure 9B As shown, the first support element 646a and the opposite second support element 646b can extend in the vertical direction from the opposite distal end 634 of the nozzle tip 630a to one end of the nozzle body 620.

[0090] Figures 10A to 10J A horizontal sectional view of the contact surfaces 610a-610j formed by alternative support structures has been drawn according to various embodiments of this disclosure. The contact surfaces 610a-610j can be applied in any of the nozzles described herein.

[0091] Please see Figure 10AThe contact surface 610a may be formed by the opposite distal end 634 of the nozzle tip 630 and a support structure 648 disposed therein. The support structure 648 may include three support elements 648a, 648b, and 648c, intersecting at the center of the nozzle chamber 636. The support elements 648a, 648b, and 648c may extend from corresponding portions of the opposite distal end 634 and intersect at the center of the opposite distal end 634. In other words, the support structure 648 may be Y-shaped and may extend into the nozzle chamber 636 from three sides of the opposite distal end 634 to form three nozzle chamber openings 636a, 636b, and 636c. In some embodiments, the three support elements 648a, 648b, and 648c may have different widths, such that some, but not all, of the three support elements 648a, 648b, and 648c intersect at the center of the nozzle chamber 636.

[0092] Please see Figure 10B The contact surface 610b may be formed by the opposite distal end 634 of the nozzle tip 630 and a support structure 650 disposed therein. The support structure 650 may extend from the opposite side of the nozzle tip 630 and may have a curved or sinusoidal shape. The support structure 650 may extend from the opposite side of the opposite distal end 634 into the nozzle chamber 636 to form two nozzle chamber openings 636a, 636b.

[0093] Please see Figure 10C The contact surface 610c may be formed by the opposite distal end 634 of the nozzle tip 630 and a support structure 652 disposed therein. The support structure 652 may include four support elements 652a, 652b, 652c, and 652d extending from the nozzle tip 630 toward the center of the nozzle chamber 636. In various embodiments, the support elements 652a, 652b, 652c, and 652d may have curved, flat, or tapered terminating ends. In one embodiment, the widths of the four support elements 652a, 652b, 652c, and 652d may be the same. In other embodiments, the widths of the four support elements 652a, 652b, 652c, and 652d may vary. In some embodiments, the width of one pair of the four support elements 652a, 652b, 652c, and 652d may be the same, but may differ from the width of another pair of the four support elements 652a, 652b, 652c, and 652d. For example, support elements 652a and 652d may have the same width, and support elements 652b and 652c may have the same width, but the widths of support elements 652a and 652d may differ from the widths of support elements 652b and 652c. In other embodiments, some support elements 652a, 652b, 652c, and 652d may have the same width, but the widths of other support elements 652a, 652b, 652c, and 652d may differ.

[0094] Please see Figure 10D The contact surface 610d may be formed by the opposite distal end 634 of the nozzle tip 630 and a support structure 654 disposed therein. The nozzle tip 630 may have a rectangular cross-section. The support structure 654 may extend from the opposite distal end 634 into the nozzle chamber 646 to form four nozzle chamber openings 636a, 636b, 636c, and 636d. In some embodiments, such as Figure 10D The four nozzle chamber openings 636a, 636b, 636c, and 636d may have a horizontal cross-sectional shape. In other embodiments, the nozzle chamber openings 636a, 636b, 636c, and 636d may have a square, rectangular, triangular, or other horizontal cross-sectional shape.

[0095] Please see Figure 10E The contact surface 610e may be formed by the opposite distal end 634 of the nozzle tip 630 and a support structure 656 disposed therein. The support structure 656 may be disposed at the center of the nozzle chamber 636. The support structure 656 may have the following characteristics as described in the first paragraph. Figure 10E The circular horizontal cross-section is shown. In other embodiments, the support structure 656 may have a square, rectangular, triangular, elliptical, or other horizontal cross-section. In other embodiments, a plurality of circular support structures may be concentrically arranged around the center of the nozzle tip 630.

[0096] Please see Figure 10F The contact surface 610f may be formed by the opposite distal end 634 of the nozzle tip 630 and a support structure 658 disposed therein. The support structure 658 may include two circular support elements 658a and 658b that are directly interconnected and connected to opposite sides of the opposite distal end 634. The support elements 658a and 658b may have the same or substantially the same diameter. The support structure 658 may extend from the distal end 634 into the nozzle chamber 636 to form four nozzle chamber openings 636a, 636b, 636c, and 636d.

[0097] Please see Figure 10GThe contact surface 610g may be formed by the opposite distal end 634 of the nozzle tip 630 and a support structure 660 disposed therein. The support structure 660 may include four support elements 660a, 660b, 660c, 660d connected to each other and connected to the nozzle tip 630. The support elements 660a, 660b, 660c, 660d may have the same or substantially the same diameter. The support structure 660 may divide the distal end of the nozzle chamber to form four nozzle chamber openings 636a, 636b, 636c, 636d. In other embodiments, the four support elements 660a, 660b, 660c, 660d may have circular, square, rectangular, triangular, elliptical, or other horizontal cross-sections. In some embodiments, the four support elements 660a, 660b, 660c, 660d may have different horizontal cross-sections from each other.

[0098] Please see Figure 10H The contact surface 610h may be formed by the opposite distal end 634 of the nozzle tip 630 and a support structure 662 disposed therein. The support structure 662 may include two support elements 662a, 662b connected to each other and connected to the nozzle tip 630. The support elements 662a, 662b may have different diameters. The support elements 662 may divide the distal end of the nozzle chamber to form four nozzle chamber openings 636a, 636b, 636c, 636d. In other embodiments, the support elements 662a, 662b may have a square, rectangular, triangular, elliptical, or other horizontal cross-section. In other embodiments, the support elements 662a, 662b may have different horizontal cross-sections.

[0099] Please see Figure 10I The contact surface 610i may be formed by the opposite distal end 634 of the nozzle tip 630 and a support structure 664 disposed therein. The support structure 664 may include four support elements 664a, 664b, 664c, 664d connected to the nozzle tip 630 but not directly connected to each other. The support elements 664a, 664b, 664c, 664d may have the same or substantially the same width / diameter. The support structure 664 may divide the distal end of the nozzle chamber to form five nozzle chamber openings 636a, 636b, 636c, 636d, 636e. In various embodiments, the four support elements 664a, 664b, 664c, 664d may have circular, square, rectangular, triangular, elliptical, or other horizontal cross-sections. In some embodiments, the four support elements 664a, 664b, 664c, 664d may have different horizontal cross-sections from each other.

[0100] Please see Figure 10JThe contact surface 610j may be formed by a flat surface of the opposite distal end 634 of the nozzle tip 630 and a flat surface of a support structure 666 disposed therein. The support structure 666 may include five support elements 666a, 666b, 666c, 666d, and 666e connected to each other at the nozzle tip 630. Support elements 666a, 666b, 666c, and 666d may have the same or substantially the same width / diameter. Support element 666e may have a larger diameter and may be disposed within support elements 666a, 666b, 666c, and 666d. The support structure 666 may divide the distal end of the nozzle chamber to form nozzle chamber openings 636a, 636b, 636c, 636d, 636e, 636f, 636g, 636h, and 636i. In various embodiments, the five support elements 666a, 666b, 666c, 666d, and 666e may have circular, square, rectangular, triangular, elliptical, or other horizontal cross-sections. In some embodiments, the five support elements 666a, 666b, 666c, 666d, and 666e may have different horizontal cross-sections from each other.

[0101] According to various embodiments, a suction nozzle 600 for picking up and placing a device 10 is provided. The suction nozzle 600 may include: a flat contact surface 610 configured to form a fluid tight-fit seal with an electronic component (e.g., a semiconductor die 410); a suction body 620 including a suction chamber 622; a suction tip 630 including a proximal end 632 attached to the suction body 620, a opposite distal end 634 forming a portion of the contact surface 610, and a suction chamber 636 extending from the opposite distal end 634 into the suction chamber 622; and a support structure 640 extending from the opposite distal end 634 into the suction chamber 636, the support structure 640 forming a portion of the contact surface 610.

[0102] In various embodiments, the opposite distal end 634 forms the peripheral portion of the contact surface 610, and the support structure 640 forms the internal portion of the contact surface 610. In various embodiments, the support structure 640 extends from two opposite sides of the opposite distal end 634 into the mouthpiece chamber 636 to form two mouthpiece chamber openings 636a, 636b. In various embodiments, the support structure 648 extends from three sides of the opposite distal end 634 into the mouthpiece chamber 636 to form three mouthpiece chamber openings 636a, 636b, 636c. In some embodiments, the support structure 644 extends from opposite sides of the opposite distal end 634 into the mouthpiece chamber 636 to form four mouthpiece chamber openings 636a, 636b, 636c, 636d. In some embodiments, support structure 646 includes two support elements 646a and 646b extending from two opposite sides of opposite distal end 634 into mouthpiece chamber 636 to form a partially divided mouthpiece chamber opening 636a. In various embodiments, support structure 652 includes four support elements 652a, 652b, 652c, and 652d extending from four opposite sides of opposite distal end 634 into mouthpiece chamber 636 to form a partially divided mouthpiece chamber opening 636a. In various embodiments, support structure 654 forms four mouthpiece chamber openings 636a, 636b, 636c, and 636d. In some embodiments, support structure 658 includes at least two support elements 658a and 658b having a horizontal cross-section.

[0103] In various embodiments, the suction nozzle for picking up and placing the device includes: a suction nozzle body 620, including a suction chamber 622; a suction nozzle tip 630, including a proximal end 632 attached to the suction nozzle body 620, an opposite distal end 634, and a suction nozzle chamber 636 extending from the opposite distal end 634 to the suction chamber 622; and a support structure 640 extending to the suction nozzle chamber 636 to form at least two suction nozzle chamber openings 636a, 636b.

[0104] In various embodiments, the opposite distal end 634 and the support structure 640 form a flat contact surface 610, configured to form a fluid-tight seal with the electronic component disposed in contact with the contact surface 610. In various embodiments, the suction nozzle 600 includes a spring 616 biased between the suction nozzle tip 630 and the suction nozzle body 620. In some embodiments, the support structure 640 is configured to reduce the amount of bending stress applied to the electronic component, which is attached to the suction nozzle tip 630 by creating a partial vacuum in the suction chamber 622 and the suction nozzle chamber 636.

[0105] In various embodiments, a pick-and-place device 100 is provided, comprising: a main shaft 300; and a suction nozzle 600 fluidly connected to one end of the main shaft 300. The suction nozzle 600 includes: a flat contact surface 610 configured to form a fluid-tight seal with an element; a suction nozzle body including a suction chamber 622; a suction nozzle tip including a proximal end 632 attached to the suction nozzle body 620, a distal end 634 forming a portion of the contact surface 610, and a suction nozzle chamber 636 extending from the distal end 634 to the suction chamber 622; and a support structure 640 disposed in the suction nozzle chamber 636 and forming a portion of the contact surface 610.

[0106] In various embodiments, the support structure 640 is configured to reduce the amount of bending stress applied to the electronic components, which are attached to the nozzle tip 630 by means of a partial vacuum generated in the suction chamber 622 and the nozzle chamber 636 by the pick-and-place head 100.

[0107] The foregoing outlines the features of several embodiments of this disclosure, enabling those skilled in the art to more clearly understand various aspects of this disclosure. Those skilled in the art should understand that this disclosure can serve as the basis for the design or modification of other structures or processes to achieve the same purpose and / or obtain the same advantages as the embodiments of this disclosure. Those skilled in the art will also understand that equivalent structures or processes described above do not depart from the spirit and scope of this disclosure, and that modifications, substitutions, and refinements can be made without departing from the spirit and scope of this disclosure.

Claims

1. A suction nozzle for use in a pick-and-place machine, characterized in that, The suction nozzle includes: A flat contact surface is configured to form a fluid-tight seal with an electronic component; A suction nozzle body, including a suction chamber; A suction tip includes a proximal end attached to the suction body, a opposite distal end forming the contact surface, and a suction chamber extending from the opposite distal end into the suction chamber; and A support structure extends from the opposite distal end into the mouthpiece chamber, the support structure forming a portion of the contact surface.

2. The suction nozzle as described in claim 1, characterized in that: The opposite distal end forms a surrounding portion of the contact surface; and The support structure forms an internal portion of the contact surface.

3. The suction nozzle as described in claim 1, characterized in that, The support structure extends from two opposite sides of the opposite distal end into the mouthpiece chamber to form two mouthpiece chamber openings, or The support structure extends from the three sides of the opposite distal end into the mouthpiece chamber to form three mouthpiece chamber openings, or The support structure extends from the four opposite sides of the opposite distal end into the mouthpiece chamber to form four mouthpiece chamber openings.

4. The suction nozzle as described in claim 1, characterized in that, The support structure includes two support elements extending from two opposite sides of the opposite distal end into the mouthpiece chamber to form a partially divided mouthpiece chamber opening, or The support structure includes four support elements extending from four opposite sides of the opposite distal end into the mouthpiece chamber to form a partially divided mouthpiece chamber opening.

5. The suction nozzle as described in claim 1, characterized in that, The support structure includes at least two support elements with a circular horizontal cross-section.

6. The suction nozzle as described in claim 5, characterized in that, The at least two support elements are directly connected to each other, or the at least two support elements have different diameters.

7. A suction nozzle for use in a pick-and-place machine, characterized in that, The suction nozzle includes: A suction nozzle body, including a suction chamber; A suction tip, including a proximal end attached to the suction body, a opposite distal end, and a suction chamber extending from the opposite distal end into the suction chamber; and A support structure extends into the mouthpiece chamber to form at least two mouthpiece chamber openings.

8. The suction nozzle as described in claim 7, characterized in that, The opposite distal end and the support structure form a flat contact surface configured to form a fluid tight-fit seal with an electronic component disposed in contact with the contact surface.

9. The suction nozzle as described in claim 7, characterized in that, It also includes a spring that biases between the tip of the nozzle and the body of the nozzle.

10. A pick-and-place head, characterized in that, include: One main axis; as well as A suction nozzle, fluidly connected to one end of the main shaft, the suction nozzle comprising: A flat contact surface is configured to form a fluid-tight seal with an electronic component; A suction nozzle body, including a suction chamber; A suction tip includes a proximal end attached to the suction body, a distal end forming the contact surface, and a suction chamber extending from the distal end into the suction chamber; and A support structure is disposed in the mouthpiece chamber and forms part of the contact surface.

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