A multi-functional platform and chip testing device

Abstract

This application provides a multifunctional stage and chip testing equipment, belonging to the field of semiconductor equipment technology. The multifunctional stage includes: a fixed base; a receiving structure with a horizontally arranged top surface and a bottom fixed to the fixed base; an adsorption platform located above the fixed base and including an adsorption plate, the adsorption plate having through holes and multiple adsorption holes, the through holes corresponding to the receiving structure and used for passing through the receiving structure, the multiple adsorption holes arranged in a rectangular array, and each vertical through hole connected to a vacuum system; and a motion mechanism for driving the adsorption platform to rise and fall. When the multifunctional stage is used to adsorb wafers, the top surface of the receiving structure is higher than the adsorption platform to receive the wafers, and the motion mechanism drives the adsorption platform to a position higher than the top surface of the receiving structure to receive and adsorb the wafers. When the multifunctional stage is used to adsorb chips, each adsorption hole of the adsorption platform corresponds to adsorbing one chip. This multifunctional stage can reduce the size of the equipment and simplify the structure.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and in particular to a multifunctional stage and chip testing equipment. Background Technology

[0002] In the chip manufacturing process, an adsorption platform is often used to position the chip, and then a transport mechanism moves the adsorption platform to various workstations.

[0003] Depending on the purpose, there may be wafer-level and chip-level positioning requirements in the chip manufacturing process. For example, before the wafer is cut into individual chips, the wafer needs to be inspected, and after the wafer is cut into chips, each chip needs to be inspected.

[0004] In the existing technology, the detection of these two types of products usually requires setting up different adsorption platforms or conducting special tests on different equipment, which leads to the problem of large equipment size and complex structure. Utility Model Content

[0005] One objective of the first aspect of this utility model is to provide a multifunctional platform that can reduce the size of the equipment and simplify the structure.

[0006] Another objective of this invention is to improve the temperature stability of the temperature control chip.

[0007] A further objective of this invention is to improve the thermal conductivity of the adsorption platform.

[0008] A second aspect of this invention aims to provide a chip testing device including the aforementioned multifunctional stage.

[0009] A further objective of the second aspect of this utility model is to save space occupied by the needle holder when it is not in use.

[0010] In particular, according to one aspect of the present invention, a multifunctional stage is provided, comprising: Fixed base; The receiving structure has a horizontally arranged top surface and a bottom fixed to the fixed base. An adsorption platform is located above the fixed base and includes an adsorption plate. The adsorption plate is provided with through holes that penetrate the adsorption plate vertically and multiple adsorption holes. The through holes are corresponding to the receiving structure and are used to pass through the receiving structure. The multiple adsorption holes are arranged in a rectangular array, and each adsorption hole is connected to a vacuum system. The motion mechanism is used to drive the adsorption platform to rise and fall; When the multifunctional stage is used to adsorb wafers, the top surface of the receiving structure is higher than the adsorption platform so as to receive the wafers. The motion mechanism is used to drive the adsorption platform to a position higher than the top surface of the receiving structure so as to receive and adsorb the wafers. When the multifunctional stage is used to adsorb chips, each adsorption hole of the adsorption platform adsorbs one chip.

[0011] Optionally, the receiving structure includes a plurality of top posts with flush top surfaces, and the through hole includes a through hole corresponding to each of the top posts.

[0012] Optionally, the adsorption platform further includes: A cooling plate is fixedly disposed on the lower side of the adsorption plate; A heating unit is disposed between the cooling plate and the adsorption plate; A heat insulation structure is provided on the underside of the cooling plate; A temperature control chip is used to control the temperature of the heating unit, and the temperature control chip is disposed on the lower side of the heat insulation unit.

[0013] Optionally, the heating unit includes multiple heating elements and multiple temperature sensors, each of the heating elements and each of the temperature sensors being provided with a first cable and a second cable for connecting to the temperature control chip; The temperature control chip and the cooling plate are respectively provided with an aligned first through slot and a second through slot for the first cable and the second cable to pass through; The temperature control chip includes pads for connecting the first cable and the second cable, the pads being disposed on the side of the temperature control chip away from the heat insulation plate.

[0014] Optionally, the adsorption plate has a groove on the side facing the cooling plate for accommodating the heating unit.

[0015] Optionally, the insulation structure includes a plurality of spaced-apart insulation panels.

[0016] In particular, according to another aspect of this application, a chip testing device is also provided, including a pin card stage, a pin card carrier, a transmission mechanism, and a multifunctional carrier as described in any one of the above. The needle card carrier is used to place needle cards; The transmission mechanism is used to move the pin card carrier to the pin card station; The transmission mechanism is also used to move the multifunctional stage below the pin card stage for testing.

[0017] Optionally, the needle card carrier includes a positioning platform for positioning and carrying the needle card, wherein the top surface of the positioning platform is provided with multiple position sensors to identify the current type of the needle card.

[0018] Optionally, the needle card carrier further includes: A first base, wherein the positioning platform is hinged to the first base and the hinge axis is arranged in the horizontal direction; A telescopic component is disposed on one side of the hinge shaft, and the two ends of the telescopic component are respectively connected to the first base and the positioning platform; The limiting component includes a first limiting structure and a second limiting structure respectively disposed at the positioning platform and the first base. When the positioning platform is in a horizontal state, the second limiting structure abuts against the first limiting structure to limit the rotation of the positioning platform.

[0019] Optionally, a quick-connect structure is provided between the pin card carrier and the multi-functional carrier to connect or disconnect the pin card carrier and the multi-functional carrier, so that the pin card carrier and the multi-functional carrier are synchronously driven by the transmission mechanism.

[0020] According to one aspect of this utility model, this application provides a multifunctional stage. The adsorption platform has adsorption holes arranged in a rectangular array on its adsorption plate. The regular spacing between the adsorption holes ensures that each hole can adsorb one chip, enabling batch chip adsorption and chip-level positioning. Furthermore, by setting a fixed receiving structure and a height-adjustable adsorption platform, wafer receiving and adsorption positioning can be achieved, thereby realizing wafer-level positioning. This improves the stage's versatility, helps reduce equipment size, and simplifies the structure.

[0021] Furthermore, this application places the temperature control chip below the cooling plate and separates it with a heat insulation structure, so that the temperature control chip is not easily affected by the temperature of the cooling plate and heating unit above, which is beneficial to provide temperature stability of the temperature control chip and prevents the solder joints or components on the temperature control chip from failing due to excessive temperature.

[0022] Furthermore, unlike existing technologies, this application does not directly install the temperature control chip on the adsorption plate, thus enabling the use of a thinner adsorption plate. A thinner adsorption plate can better transfer the heat from the heating unit to the adsorption plate, improving heat conduction efficiency.

[0023] According to another aspect of this utility model, this application also provides a chip testing device in which the pin card stage and the multi-functional stage can be quickly connected and separated through a quick-connect structure. When the two are connected, they can move synchronously, thus saving the number of drive mechanisms and reducing costs.

[0024] Furthermore, the pin card carrier of this application also has the function of identifying the pin card type.

[0025] Furthermore, the needle card carrier of this application can be rotated to a vertical position when docking with the needle card, so as to save the structural space and avoid interference with other mechanisms.

[0026] Furthermore, through the setting of the limiting component, the pin card carrier can be stably kept in a horizontal state. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the structure of a multifunctional platform according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of the adsorption platform of the multifunctional stage according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of a multifunctional platform (concealed adsorption platform) according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of a multifunctional platform and a robotic arm according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the motion process of a multifunctional platform according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the structure of the adsorption platform of the multifunctional stage according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the adsorption platform and heating unit of a multifunctional stage according to an embodiment of the present invention; Figure 8 for Figure 7 A magnified view of a section at point A in the middle; Figure 9 This is a schematic diagram of the bottom structure of the adsorption platform of a multifunctional stage according to an embodiment of the present invention; Figure 10 for Figure 9 A magnified view of a section at point B in the middle; Figure 11 This is a schematic diagram showing the distribution of the heat insulation structure of a multifunctional platform according to an embodiment of the present invention; Figure 12 This is a schematic diagram of a chip testing device according to an embodiment of the present invention; Figure 13 This is a schematic diagram of the pin tray stage of a chip testing device according to an embodiment of the present invention; Figure 14 for Figure 13 A magnified view of a section at point C; Figure label: Multifunctional stage 10, fixed base 11, receiving structure 12, adsorption platform 13, adsorption plate 131, adsorption hole 102, motion mechanism 14, wafer 200, chip 300, robot arm 400, top column 121, through hole 101, cooling plate 132, heating unit 133, heat insulation structure 134, temperature control chip 135, heating element 103, temperature sensor 104, first cable 105, second cable 106, second through groove 107, solder pad 108, groove 109, partition Hot plate 1341, chip testing equipment 100, pin card stage 20, pin card carrier 30, transmission mechanism 40, pin card 500, first horizontal slide rail mechanism 41, moving stage 42, second horizontal slide rail mechanism 43, positioning platform 31, position sensor 32, positioning pin 331, first base 33, telescopic component 34, limiting component 35, first limiting structure 351, second limiting structure 352, quick-connect structure 50, first sliding component 36, second base 37, second sliding component 38. Detailed Implementation

[0028] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0029] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.

[0030] Furthermore, to better illustrate this application, numerous specific details are provided in the following detailed description. Those skilled in the art should understand that this application can be implemented without certain specific details. In some instances, methods, means, components, and circuits well known to those skilled in the art have not been described in detail in order to highlight the spirit of this disclosure.

[0031] It should be understood that the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article indicates that the preceding and following related objects have an "or" relationship.

[0032] In this application's embodiments, "multiple" refers to two or more. The descriptions of "first," "second," etc., appearing in this application's embodiments are merely illustrative and for distinguishing the described objects; they have no order and do not indicate a specific limitation on the number in this application's embodiments, nor do they constitute any limitation on the embodiments of this application.

[0033] Figure 1 This is a structural schematic diagram of a multifunctional platform 10 according to an embodiment of the present invention. Figure 2 This is a schematic diagram of the adsorption platform 13 of the multifunctional stage 10 according to an embodiment of the present invention. Figure 3 This is a schematic diagram of the structure of a multifunctional platform 10 (with the adsorption platform 13 omitted) according to an embodiment of the present invention. Figure 1 As shown, in one embodiment, the multifunctional stage 10 includes a fixed base 11, a receiving structure 12, an adsorption platform 13, and a motion mechanism 14. The top surface of the receiving structure 12 is horizontally arranged, and its bottom end is fixed to the fixed base 11. The adsorption platform 13 is located above the fixed base 11 and includes an adsorption plate 131. The adsorption plate 131 has through holes that penetrate vertically through the adsorption plate 131 and multiple adsorption holes 102. The through holes are corresponding to the receiving structure 12 and are used to pass through the receiving structure 12. The multiple adsorption holes 102 are arranged in a rectangular array, and each adsorption hole 102 is connected to a vacuum system. Figure 3 As shown, the receiving structure 12 in this embodiment includes multiple top posts 121 with flush top surfaces, and through holes including through holes 101 corresponding to each top post 121. In other embodiments not shown, the receiving structure 12 may also be an integral structure, such as a frustum or annular frustum, etc., which is not limited here. The motion mechanism 14 is used to drive the adsorption platform 13 to rise and fall. The motion mechanism 14 can be a lifting mechanism commonly used in the prior art, such as a hydraulic mechanism, a motor, a cylinder, etc., or a combination of a motor and a transmission mechanism, such as a combination of a motor, a pulley and a lead screw mechanism, which is not limited here.

[0034] Figure 4 This is a schematic diagram of the structure of the multifunctional platform 10 and the robot arm 400 according to an embodiment of the present invention. Figure 5 This is a schematic diagram illustrating the movement process of a multifunctional platform 10 according to an embodiment of the present invention. Figure 4 As shown, when the multi-functional stage 10 is used to adsorb the wafer 200, the robot arm 400 supports the bottom of the wafer 200. At this time, the top surface of the receiving structure 12 is higher than the adsorption platform 13 to receive the wafer 200. After the robot arm 400 moves the wafer 200 above the adsorption platform 13, it descends until the wafer 200 contacts the receiving structure 12. (See diagram). Figure 5 In (a), the robotic arm 400 then moves horizontally out, allowing the wafer 200 to be carried by the receiving structure 12, as shown in the diagram. Figure 5(b) Then, control the adsorption platform 13 to move upward, that is, the motion mechanism 14 drives the adsorption platform 13 to rise to a position higher than the top surface of the receiving structure 12, so as to receive and adsorb the wafer 200. See the state. Figure 5 (c) in the middle.

[0035] like Figure 2 As shown, when the multifunctional stage 10 is used to adsorb chips, each adsorption hole 102 of the adsorption platform 13 corresponds to adsorbing one chip. Figure 2 The diagram schematically shows a chip 300 being adsorbed. It should be noted that in this embodiment, the spacing between adjacent adsorption holes 102 needs to be controlled to ensure that each adsorption hole 102 can effectively adsorb a chip. This embodiment uses a rectangular array to arrange the adsorption holes 102, which can easily achieve a regular arrangement of chips and arrange as many adsorption holes 102 as possible in the same rectangular area.

[0036] In this embodiment, adsorption holes 102 arranged in a rectangular array are provided on the adsorption plate 131 of the adsorption platform 13. The regular spacing between the adsorption holes 102 ensures that each adsorption hole 102 can adsorb one chip, enabling batch chip adsorption and chip-level positioning. Furthermore, by setting a fixed receiving structure 12 and a height-adjustable adsorption platform 13, the receiving and adsorption positioning of the wafer 200 can be achieved, thereby realizing wafer-level positioning. This improves the versatility of the platform, helps reduce equipment size, and simplifies the structure.

[0037] Figure 6 This is a schematic diagram of the adsorption platform 13 of the multifunctional stage 10 according to one embodiment of the present invention. In a further embodiment, such as... Figure 6 As shown, the adsorption platform 13 also includes a cooling plate 132, a heating unit 133, a heat insulation structure 134, and a temperature control chip 135. The cooling plate 132 is fixedly disposed below the adsorption plate 131. The cooling plate 132 is a structure with a cooling function; in this embodiment, the cooling plate 132 has a cooling channel inside for the flow of coolant. The heating unit 133 is disposed between the cooling plate 132 and the adsorption plate 131, and is used to provide the target solution. The heat insulation structure 134 is disposed below the cooling plate 132. The temperature control chip 135 is used to control the temperature of the heating unit 133 and is disposed below the heat insulation unit.

[0038] In this embodiment, the temperature control chip 135 is placed below the cooling plate 132 and separated by the heat insulation structure 134, so that the temperature control chip 135 is not easily affected by the temperature of the cooling plate 132 and the heating unit 133 above, which is beneficial to provide temperature stability of the temperature control chip 135 and prevent the solder joints or components on the temperature control chip 135 from failing due to excessive temperature.

[0039] In the prior art, the temperature control chip 135 and the heating unit 133 are generally mounted on the adsorption plate 131. Therefore, the adsorption plate 131 needs to be a relatively thick plate to provide sufficient installation space for the temperature control chip 135 and the heating unit 133. Generally, when the temperature control chip 135 is installed at the bottom of the adsorption plate 131, the thickness of the adsorption plate 131 is about 16mm.

[0040] Furthermore, unlike the prior art, this embodiment does not directly install the temperature control chip 135 on the adsorption plate 131. Therefore, a thinner adsorption plate 131 can be used. In this embodiment, an adsorption plate 131 with a thickness of about 12mm is used. The thinner adsorption plate 131 can better transfer the heat of the heating unit 133 to the adsorption plate 131, thus improving the heat conduction efficiency.

[0041] Figure 7 This is a schematic diagram of the adsorption platform 13 and heating unit 133 of the multifunctional stage 10 according to an embodiment of the present invention. Figure 8 for Figure 7 A magnified view of a portion of point A in the image. (See image below.) Figure 7 and 8 As shown, the heating unit 133 includes multiple heating elements 103 and multiple temperature sensors 104. The heating elements 103 and temperature sensors 104 can be arranged in groups to facilitate centralized cable routing. In this embodiment, the heating unit 133 includes multiple sub-units. Each sub-unit includes two symmetrically arranged heating elements 103. Each temperature sensor 104 is correspondingly located in the area heated by each heating element 103. Of course, in some special cases, it may be necessary to limit the placement of the heating elements 103. In this case, there may be individually set heating elements 103 and temperature sensors 104, which are not restricted here.

[0042] like Figure 8 As shown, each heating element 103 and each temperature sensor 104 are respectively provided with a first cable 105 and a second cable 106 for connecting to the temperature control chip 135. In this embodiment, the side of the adsorption plate 131 facing the cooling plate 132 is provided with a groove 109 for accommodating the heating unit 133, so that the structure of the heating unit 133 outside the first cable 105 and the second cable 106 is confined within the groove 109 and does not protrude from the bottom surface of the adsorption plate 131, so that the cooling plate 132 can be directly attached to the adsorption plate 131 in a planar contact manner.

[0043] Figure 9 This is a schematic diagram of the bottom structure of the adsorption platform 13 of the multifunctional stage 10 according to an embodiment of the present invention. Figure 10 for Figure 7 A magnified view of a section at point B. (See image below.) Figure 10As shown, the temperature control chip 135 and the cooling plate 132 are respectively provided with aligned first through slots and second through slots 107 for passing through the first cable 105 and the second cable 106. The temperature control chip 135 includes pads 108 for connecting the first cable 105 and the second cable 106, and the pads 108 are disposed on the side of the temperature control chip 135 away from the heat insulation plate 1341.

[0044] Figure 11 This is a schematic diagram showing the distribution of the heat insulation structure 134 of the multifunctional platform 10 according to an embodiment of the present invention. Figure 11 As shown, in one embodiment, the heat insulation structure 134 includes a plurality of spaced-apart heat insulation plates 1341. Each heat insulation plate 1341 is a strip-shaped plate, and the plurality of heat insulation plates 1341 are arranged along the length direction of the temperature control chip 135, and extend along the width direction of the temperature control chip 135. In other embodiments not shown, the shape and arrangement of the heat insulation plates 1341 may also be other, and are not limited herein.

[0045] Figure 12 This is a schematic diagram of the structure of a chip testing device 100 according to an embodiment of the present invention. Figure 12 As shown, this application also provides a chip testing device 100. In one embodiment, the device includes a pin card stage 20, a pin card carrier stage 30, a transmission mechanism 40, and the aforementioned multifunctional carrier stage 10. The pin card carrier stage 30 is used to hold pin cards 500. The transmission mechanism 40 is used to move the pin card carrier stage 30 to the pin card stage 20. The transmission mechanism 40 is also used to move the multifunctional carrier stage 10 below the pin card stage 20 for testing.

[0046] In this embodiment, a quick-connect structure 50 is provided between the needle card carrier 30 and the multi-functional carrier 10 for connecting or separating the needle card carrier 30 and the multi-functional carrier 10, so that the needle card carrier 30 and the multi-functional carrier 10 are synchronously driven by the transmission mechanism 40. The quick-connect structure 50 can be an automatic quick-connect device commonly used in the prior art, such as a pneumatic quick-change chuck or an electromechanical quick-change chuck. Such an automatic quick-connect device typically includes two chucks, one installed at the needle card carrier 30 and the other installed at the multi-functional carrier 10. The two chucks are quickly connected or separated by controlling a pneumatic circuit or a motor.

[0047] In this embodiment, the pin card carrier 30 and the multi-functional carrier 10 can be quickly connected and separated through the quick-connect structure 50. When they are connected, they can move synchronously, thus saving the number of drive mechanisms and reducing costs.

[0048] In this embodiment, the pin tray 30, multi-functional tray 10, and pin tray 20 are arranged sequentially along a first horizontal direction. The transmission mechanism 40 includes a first horizontal slide rail mechanism 41 arranged along the first horizontal direction, and a moving stage 42 is fixedly connected to the sliding portion of the first horizontal slide rail mechanism 41. The transmission mechanism 40 also includes a second horizontal slide rail mechanism 43 disposed between the moving stage 42 and the multi-functional tray 10, used to realize the movement of the multi-functional tray 10 relative to the moving stage 42 in a second horizontal direction, which is perpendicular to the first horizontal direction. This enables the multi-functional tray 10 to move in two horizontal directions, allowing the wafer or chip on the adsorption platform 13 to be aligned with the target position below the pin tray 20.

[0049] Figure 13 This is a schematic diagram of the pin tray 30 of a chip testing device 100 according to an embodiment of the present invention. Figure 14 for Figure 13 A magnified view of a section at point C. (See image below.) Figure 13 As shown, the needle card carrier 30 includes a positioning platform 31 for positioning and carrying needle cards 500. Multiple position sensors 32 are provided on the top surface of the positioning platform 31 to identify the type of the needle card 500. In this embodiment, six mechanical position sensors 32 are provided on the top surface of the positioning platform 31. When a needle card 500 is placed on the top surface of the positioning platform 31, the pins of the position sensors 32 are compressed and descended, thereby determining whether a needle card 500 is present at the position sensor 32. When the types of needle cards 500 are different, the areas they cover are different. For example, a 93K needle card is rectangular, while a 5833 needle card is circular. Through the design of the position sensors 32, the positions and / or numbers of the position sensors 32 triggered by the first type of needle card and the second type of needle card are different, thereby effectively identifying the current needle card type. If the currently identified needle card type is not compatible with this device, or the position of the needle card is inaccurate, an alarm can be triggered.

[0050] Furthermore, a positioning structure for the needle card can be set on the top surface of the positioning platform 31. In this embodiment, multiple positioning pins 331 are set to match the positioning holes at the bottom of the needle card to ensure the positional accuracy of the needle card.

[0051] In one embodiment, the needle holder stage 30 further includes a first base 33, a telescopic member 34, and a limiting assembly. The positioning platform 31 is hinged to the first base 33 with the hinge axis arranged horizontally. The telescopic member 34 is disposed on one side of the hinge axis, and its two ends are connected to the first base 33 and the positioning platform 31, respectively. The telescopic member 34 can be a commonly used telescopic mechanism such as a pneumatic cylinder, hydraulic cylinder, or electric cylinder. The limiting assembly includes a first limiting structure 351 and a second limiting structure 352 respectively disposed on the positioning platform 31 and the first base 33. When the positioning platform 31 is in a horizontal state, the second limiting structure 352 abuts against the first limiting structure 351 to restrict the rotation of the positioning platform 31.

[0052] like Figure 14 As shown, in one embodiment, the second limiting member is a vertically arranged plate and is configured to be movable relative to the first base 33. For example, a first sliding component 36 is provided between the second limiting member and the first base 33. The first limiting member is configured in an "L" shape, including a horizontal part and a vertical part. The horizontal part is fixedly connected to the positioning platform 31, and the vertical part cooperates with the second limiting member.

[0053] When the needle card is not needed, the second limiting member moves down to the first target position, controls the extension member 34 to extend, so that the positioning platform 31 flips to a vertical state, in order to save the space occupied by the structure and avoid interference with other mechanisms.

[0054] When the needle card needs to be transported, the telescopic member 34 retracts, causing the positioning platform 31 to flip to a horizontal state, and controlling the second limiting member to move upward to the second target position, so that the second limiting member stops the first limiting member on one side of the vertical plate, thereby limiting the positioning platform 31 to a horizontal state.

[0055] To further ensure the horizontal state of the positioning platform 31, the telescopic component 34 adopts a cylinder, and a pilot-operated one-way valve is installed in the air circuit to prevent the cylinder from operating after the air supply is cut off, so as to ensure that the position of the positioning platform 31 does not change.

[0056] Furthermore, the needle card stage 30 also includes a second base 37, and a second sliding component 38 is disposed between the second base 37 and the first base 33, so that the first base 33 can move vertically relative to the second base 37. Both the first sliding component 36 and the second sliding component 38 can be sliding mechanisms including slide rails and sliders. The second base 37 is connected to the multi-functional stage 10 via a quick-connect structure 50.

[0057] When the needle card carrier 30 moves to below the needle card platform 20, the first base 33 rises relative to the second base 37, so that the needle card can be smoothly installed at the installation position of the needle card platform 20. The connection between the needle card and the needle card platform 20 can adopt the existing connection method. This structure is a conventional structure in the field and will not be described in detail here.

[0058] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A multifunctional stage (10), characterized in that, include: Fixture (11); The receiving structure (12) has a horizontally arranged top surface and a bottom fixed to the fixed seat (11); An adsorption platform (13) is located above the fixed base (11) and includes an adsorption plate (131). The adsorption plate (131) is provided with through holes that penetrate the adsorption plate (131) vertically and multiple adsorption holes (102). The through holes are corresponding to the receiving structure (12) and are used to pass through the receiving structure (12). The multiple adsorption holes (102) are arranged in a rectangular array, and each adsorption hole (102) is connected to a vacuum system. The motion mechanism (14) is used to drive the adsorption platform (13) to rise and fall; When the multifunctional stage (10) is used to adsorb wafers (200), the top surface of the receiving structure (12) is higher than the adsorption platform (13) so as to receive the wafers (200). The motion mechanism (14) is used to drive the adsorption platform (13) to rise to a position higher than the top surface of the receiving structure (12) so as to receive and adsorb the wafers (200). When the multifunctional stage (10) is used to adsorb chips (300), each adsorption hole (102) of the adsorption platform (13) adsorbs one chip (300).

2. The multifunctional platform (10) according to claim 1, characterized in that, The receiving structure (12) includes a plurality of top posts (121) with flush top surfaces, and the through holes include through holes (101) corresponding to each of the top posts (121).

3. The multifunctional stage (10) according to claim 1 or 2, characterized in that, The adsorption platform (13) further includes: A cooling plate (132) is fixedly disposed on the lower side of the adsorption plate (131); A heating unit (133) is disposed between the cooling plate (132) and the adsorption plate (131); A heat insulation structure (134) is disposed on the lower side of the cooling plate (132); A temperature control chip (135) is used to control the temperature of the heating unit (133), and the temperature control chip (135) is disposed on the lower side of the heat insulation unit.

4. The multifunctional platform (10) according to claim 3, characterized in that, The heating unit (133) includes a plurality of heating elements (103) and a plurality of temperature sensors (104). Each heating element (103) and each temperature sensor (104) is provided with a first cable (105) and a second cable (106) for connecting to the temperature control chip (135). The temperature control chip (135) and the cooling plate (132) are respectively provided with an aligned first through slot and a second through slot (107) for passing through the first cable (105) and the second cable (106). The temperature control chip (135) includes pads (108) for connecting the first cable (105) and the second cable (106), the pads (108) being disposed on the side of the temperature control chip (135) away from the heat insulation plate (1341).

5. The multifunctional platform (10) according to claim 3, characterized in that, The adsorption plate (131) has a groove (109) on the side facing the cooling plate (132) for accommodating the heating unit (133).

6. The multifunctional stage (10) according to claim 3, characterized in that, The thermal insulation structure (134) includes a plurality of spaced thermal insulation panels (1341).

7. A chip testing device (100), characterized in that, It includes a needle card stage (20), a needle card carrier (30), a transmission mechanism (40), and a multifunctional carrier (10) as described in any one of claims 1-6. The needle card carrier (30) is used to place the needle card (500); The transmission mechanism (40) is used to move the needle card carrier (30) to the card holder; The transmission mechanism (40) is also used to move the multifunctional stage (10) below the pin card stage (20) for testing.

8. The chip testing equipment (100) according to claim 7, characterized in that, The needle card carrier (30) includes a positioning platform (31) for positioning and carrying the needle card, wherein the top surface of the positioning platform (31) is provided with multiple position sensors (32) to identify the current type of the needle card.

9. The chip testing equipment (100) according to claim 8, characterized in that, The needle card stage (30) also includes: The first base (33) is hinged to the positioning platform (31) with the hinge axis arranged in the horizontal direction; The telescopic component (34) is disposed on one side of the hinge shaft, and the two ends of the telescopic component (34) are respectively connected to the first base (33) and the positioning platform (31); The limiting component includes a first limiting structure (351) and a second limiting structure (352) respectively disposed on the positioning platform (31) and the first base (33). When the positioning platform (31) is in a horizontal state, the second limiting structure (352) abuts against the first limiting structure (351) to limit the rotation of the positioning platform (31).

10. The chip testing equipment (100) according to claim 7, characterized in that, A quick-connect structure (50) is provided between the needle card carrier (30) and the multi-functional carrier (10) for connecting or separating the needle card carrier (30) and the multi-functional carrier (10) so that the needle card carrier (30) and the multi-functional carrier (10) are synchronously driven by the transmission mechanism (40).

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