Semiconductor wafer inspection apparatus

Abstract

The embodiment of the present application provides a semiconductor wafer detection device, which comprises a first chamber, a second chamber, a first swing arm and a second swing arm. The second chamber is connected to one side of the first chamber along a first direction, an opening is arranged between the first chamber and the second chamber, the first swing arm is arranged in the second chamber, the first swing arm comprises a first rotating shaft and a first arm part, the second swing arm is arranged in the second chamber, the second swing arm comprises a second rotating shaft and a second arm part, and the axial directions of the first rotating shaft and the second rotating shaft are parallel to a third direction; wherein the first rotating shaft and the second rotating shaft are arranged on the side of the second chamber close to the opening, the first rotating shaft and the second rotating shaft are arranged on the two sides of the opening along a second direction, the first arm part is swingably arranged around the axial direction of the first rotating shaft and is used for transferring wafers between the first chamber and the second chamber, the second arm part is swingably arranged around the axial direction of the second rotating shaft and is used for transferring wafers between the first chamber and the second chamber, so that the detection efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor wafer inspection equipment technology, and more particularly to a semiconductor wafer inspection equipment. Background Technology

[0002] Semiconductor quality inspection equipment is a key piece of equipment used to monitor and control process quality in semiconductor manufacturing. Its function is to inspect semiconductor wafers, chips, etc., in terms of size, morphology, electrical performance, etc., to ensure that semiconductor products meet design requirements and quality standards. The inspection efficiency of current inspection equipment needs to be improved. Utility Model Content

[0003] This application provides a semiconductor wafer inspection device, which aims to improve the inspection efficiency of the inspection device.

[0004] An embodiment of the first aspect of this application provides a semiconductor wafer inspection device, including: a first chamber, a second chamber, a first swing arm, and a second swing arm. The second chamber is connected to one side of the first chamber along a first direction, and an opening is provided between the first chamber and the second chamber, connecting them through the opening; the first swing arm is disposed in the second chamber, and includes a first rotating shaft and a first arm portion, the axial direction of the first rotating shaft being parallel to a third direction; the second swing arm is disposed in the second chamber, and includes a second rotating shaft and a second arm portion, the axial direction of the second rotating shaft being parallel to a third direction; wherein, the first rotating shaft and the second rotating shaft are disposed on the side of the second chamber near the opening, and the first rotating shaft and the second rotating shaft are respectively disposed on opposite sides of the opening along a second direction; the first arm portion is swayable about the axial direction of the first rotating shaft for transferring the wafer between the first chamber and the second chamber; the second arm portion is swayable about the axial direction of the second rotating shaft for transferring the wafer between the first chamber and the second chamber; the first direction, the second direction, and the third direction intersect each other.

[0005] According to an embodiment of this application, a first chamber includes a proximal end and a distal end disposed opposite to each other along a first direction, and a second chamber is located on the proximal end side of the first chamber, wherein the width of the distal end along the second direction is smaller than the width of the proximal end along the second direction.

[0006] According to the embodiments of this application, the minimum distance between the first rotating shaft and the second rotating shaft along the second direction is the first distance, the width of the opening along the second direction is the first width, and the first distance is greater than or equal to half of the first width.

[0007] According to an embodiment of this application, the semiconductor wafer inspection device further includes a first driving component and a second driving component. The first driving component is connected to a first rotating shaft and is used to drive the first rotating shaft to rotate and cause the first arm to swing. The second driving component is connected to a second rotating shaft and is used to drive the second rotating shaft to rotate and cause the second arm to swing.

[0008] According to the embodiments of this application, the semiconductor wafer inspection equipment further includes a first lifting component and a second lifting component. The first lifting component is connected to a first rotating shaft and is used to drive the first rotating shaft and the first arm to move in a third direction. The second lifting component is used to drive the second rotating shaft and the second arm to move in a third direction.

[0009] According to the embodiments of this application, a plurality of transfer platforms are provided in the first chamber, and the plurality of transfer platforms are spaced apart along a third direction, each transfer platform being used to place a wafer.

[0010] According to an embodiment of this application, the second chamber includes a top wall and a bottom wall, which are spaced apart along a third direction. A first rotating shaft is connected to the top wall, and a second rotating shaft is connected to the bottom wall. A first arm is connected to the end of the first rotating shaft opposite to the top wall, and a second arm is connected to the end of the second rotating shaft opposite to the bottom wall.

[0011] According to an embodiment of this application, a working platform is provided in the second chamber. The working platform is located on the bottom wall and is situated on the side of the first swing arm and the second swing arm away from the first chamber along a first direction.

[0012] According to an embodiment of this application, the first chamber is located in the second chamber along a third direction near the top wall.

[0013] According to an embodiment of this application, the height of the first chamber along a third direction is less than the height of the second chamber along a third direction.

[0014] In the embodiments of this application, a first arm and a second arm are used to clamp wafers. The first and second arms are swayably configured to transfer wafers between a first chamber and a second chamber. By configuring a dual-arm structure with a first and a second arm, wafer pick-and-place operations can be performed simultaneously or alternately, significantly shortening the wafer transfer time and thus increasing the equipment's hourly output. The first arm is connected to a first rotating shaft, and the second arm is connected to a second rotating shaft. The first and second arms operate independently. If one arm fails, the other arm can still complete the wafer transfer, reducing equipment downtime due to a single arm failure, minimizing the risk of manual intervention, and ensuring wafer safety. Independent control of the first and second arms allows for flexible adjustment of the wafer transfer sequence and rhythm to adapt to different process requirements and improve the overall adaptability of the equipment. The first and second rotating shafts are respectively positioned on both sides of the opening along the second direction. The first and second rotating shafts are spaced apart relative to the center of the opening along the second direction. The swing angle of the first and second arms is smaller, and the swing areas of the first and second arms are fan-shaped. This reduces the spatial dimensions of the first chamber along the second direction, thereby reducing the vacuum volume of the first chamber, accelerating the vacuuming speed, and further improving detection efficiency. The coordinated operation of the dual swing arms reduces the frequency of opening or closing the opening and vacuuming operations, thus reducing the interference of equipment vibration on the wafer detection process and improving detection accuracy and stability. Attached Figure Description

[0015] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, wherein the same or similar reference numerals denote the same or similar features.

[0016] Figure 1 This is a schematic diagram of the structure of a semiconductor wafer inspection device provided in an embodiment of this application;

[0017] Figure 2 This is a schematic diagram of another semiconductor wafer inspection device provided in an embodiment of this application;

[0018] Figure 3 This is a schematic diagram of the first chamber structure of a semiconductor wafer inspection device provided in an embodiment of this application.

[0019] Explanation of reference numerals in the attached drawings: 10, wafer; 100, first chamber; 101, proximal end; 102, distal end; 110, transfer platform; 200, second chamber; 201, top wall; 202, bottom wall; 210, working platform; 300, first swing arm; 310, first rotating shaft; 320, first arm; 400, second swing arm; 410, second rotating shaft; 420, second arm; 500, first drive assembly; 510, first lifting assembly; 600, second drive assembly; 610, second lifting assembly; 700, opening; X, first direction; Y, second direction; Z, third direction. Detailed Implementation

[0020] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples. In the accompanying drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the application; and, for clarity, the dimensions of some structures may be exaggerated. Furthermore, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0021] In the description of this application, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," etc., indicating orientation or positional relationships are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] The directional terms appearing in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of the embodiments of this application. It should also be noted in the description of this application that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0023] like Figure 1 and Figure 2As shown in the embodiment of this application, a semiconductor wafer inspection device includes: a first chamber 100, a second chamber 200, a first swing arm 300, and a second swing arm 400. The second chamber 200 is connected to one side of the first chamber 100 along a first direction X. An opening 700 is provided between the first chamber 100 and the second chamber 200, and the first chamber 100 and the second chamber 200 are connected through the opening 700. The first swing arm 300 is disposed within the second chamber 200 and includes a first rotating shaft 310 and a first arm portion 320. The axial direction of the first rotating shaft 310 is parallel to a third direction Z. The second swing arm 400 is disposed within the second chamber 200 and includes a second rotating shaft 410 and a second arm portion 420. The axial direction of the second rotating shaft 410 is parallel to a third direction Z. The direction is Z; wherein, the first rotating shaft 310 and the second rotating shaft 410 are disposed on the side of the second chamber 200 near the opening 700, and the first rotating shaft 310 and the second rotating shaft 410 are respectively disposed on both sides of the opening 700 along the second direction Y, the first arm 320 is oscillating about the first rotating shaft 310 for transferring the wafer 10 between the first chamber 100 and the second chamber 200; the second arm 420 is oscillating about the second rotating shaft 410 for transferring the wafer 10 between the first chamber 100 and the second chamber 200; the first direction X, the second direction Y and the third direction Z intersect each other.

[0024] In this embodiment, the first arm 320 and the second arm 420 are used to clamp the wafer 10. The first arm 320 and the second arm 420 are swingably configured to transfer the wafer 10 between the first chamber 100 and the second chamber 200. By setting up a dual swing arm structure of the first swing arm 300 and the second swing arm 400, the wafer 10 can be picked up and placed simultaneously or alternately, significantly shortening the wafer transfer time and thus increasing the hourly output of the equipment. The first arm 320 is connected to the first rotating shaft 310, and the second arm 420 is connected to the second rotating shaft 410. The first arm 320 and the second arm 420 work independently. If one swing arm fails, the other swing arm can still complete the wafer 10 transfer, reducing equipment downtime due to single swing arm failure, reducing the risk of manual intervention, and ensuring the safety of the wafer 10. The independent control of the first swing arm 300 and the second swing arm 400 allows for flexible adjustment of the wafer transfer sequence and rhythm to adapt to different process requirements and improve the overall adaptability of the equipment. The first rotating shaft 310 and the second rotating shaft 410 are disposed on both sides of the opening 700 along the second direction Y. The first rotating shaft 310 and the second rotating shaft 410 are spaced apart along the second direction Y relative to the middle of the opening 700. The swing angle of the first arm 320 and the second arm 420 is smaller, and the swing area of ​​the first arm 320 and the second arm 420 is a fan-shaped area, which can reduce the spatial dimension of the first chamber 100 along the second direction Y, thereby reducing the vacuum volume of the first chamber 100, accelerating the vacuuming speed, and further improving efficiency. The coordinated operation of the dual swing arms can reduce the number of times the opening 700 is frequently opened or closed and the number of vacuuming operations, thereby reducing the interference of equipment vibration on the wafer 10 detection process and improving detection accuracy and stability.

[0025] Optionally, the first direction X, the second direction Y, and the third direction Z are all perpendicular to each other.

[0026] Optionally, the first rotating shaft 310 and the second rotating shaft 410 are symmetrically arranged with respect to the opening 700 along the second direction Y, and the first rotating shaft 310 and the second rotating shaft 410 are located on both sides of the middle part of the opening 700 along the second direction Y.

[0027] In some alternative embodiments, the second chamber 200 includes a top wall 201 and a bottom wall 202, which are spaced apart along a third direction Z. The first rotating shaft 310 and the second rotating shaft 410 are both connected to the top wall 201, or the first rotating shaft 310 and the second rotating shaft 410 are both connected to the bottom wall 202.

[0028] The first chamber 100 is a pre-sample exchange chamber, which can switch between a vacuum environment and an atmospheric environment. The second chamber 200 is a detection chamber, which is in a vacuum environment.

[0029] In some alternative embodiments, the semiconductor wafer inspection apparatus also includes a valve for sealing the opening 700.

[0030] In these alternative embodiments, when the wafer 10 in the atmospheric space enters the first chamber 100, the valve is closed to isolate the first chamber 100 and the second chamber 200. After the first chamber 100 is evacuated, the valve is opened to connect the first chamber 100 and the second chamber 200 through the opening 700, so that the first swing arm 300 and the second swing arm 400 can extend into the first chamber 100 through the opening 700.

[0031] like Figure 1 and Figure 2 As shown, in some optional embodiments, the first chamber 100 includes a proximal end 101 and a distal end 102 disposed opposite to each other along a first direction X, and the second chamber 200 is located on one side of the proximal end 101 of the first chamber 100. The width of the distal end 102 along the second direction Y is smaller than the width of the proximal end 101 along the second direction Y.

[0032] In these optional embodiments, the first chamber 100 adopts a trapezoidal structure design with a wider proximal end 101 and a narrower distal end 102, effectively reducing the internal space of the first chamber 100 and the time required for vacuuming, thereby improving the overall operating efficiency of the equipment. The wider proximal end 101 facilitates connection with the second chamber 200 and reduces obstruction of the proximal end 101 to the first swing arm 300 and the second swing arm 400; the narrower distal end 102 reduces unnecessary vacuuming space. The first swing arm 300 and the second swing arm 400 are disposed on both sides of the opening 700 along the second direction Y. The swing paths of the first swing arm 300 and the second swing arm 400 are both through the opening 700, swinging to the middle of the first chamber 100 along the second direction Y for reciprocating motion. The first swing arm 300 and the second swing arm 400 do not swing to be parallel to the first direction X. The swing angle of the first arm 320 and the second arm 420 is less than 180 degrees, so that the first chamber 100 can be set as a trapezoidal structure to reduce the volume of the first chamber 100.

[0033] like Figure 1 and Figure 2 As shown, in some optional embodiments, the minimum distance between the first rotating shaft 310 and the second rotating shaft 410 along the second direction Y is a first distance a, and the width of the opening 700 along the second direction Y is a first width b, wherein the first distance a is greater than or equal to half of the first width b.

[0034] In these optional embodiments, the first arm 320 reciprocates about the first pivot 310 as the center of rotation, and the second arm 420 reciprocates about the second pivot 410 as the center of rotation. The minimum distance between the first pivot 310 and the second pivot 410 along the second direction Y is a first distance a, and the width of the opening 700 along the second direction Y is a first width b, where a ≥ b / 2. This facilitates increasing the extension length of the first arm 320 and the second arm 420 along the direction perpendicular to the third direction Z. Optionally, the first distance a is equal to or close to the first width b, thereby facilitating the increase of the extension length of the first arm 320 and the second arm 420 along the direction perpendicular to the third direction Z.

[0035] like Figure 2 As shown, in some optional embodiments, the semiconductor wafer inspection device further includes a first driving component 500 and a second driving component 600. The first driving component 500 is connected to the first rotating shaft 310 and is used to drive the first rotating shaft 310 to rotate and cause the first arm 320 to swing. The second driving component 600 is connected to the second rotating shaft 410 and is used to drive the second rotating shaft 410 to rotate and cause the second arm 420 to swing.

[0036] In these optional embodiments, the first drive component 500 and the second drive component 600 independently control the movement of the first swing arm 300 and the second swing arm 400, respectively. This allows the first swing arm 300 and the second swing arm 400 to operate synchronously or asynchronously, adapting to different wafer 10 transfer requirements and improving the flexibility and efficiency of equipment operation. The dual drive component design ensures that the first swing arm 300 and the second swing arm 400 are independent of each other. Even if one drive component fails, the other can continue to operate, ensuring safe wafer 10 transfer and reducing equipment downtime risk. The first drive component 500 is dedicated to the first swing arm 300, and the second drive component 600 is dedicated to the second swing arm 400. The rotational speed, torque, and swing angle of the first swing arm 300 and the second swing arm 400 can be independently adjusted, improving the positioning accuracy of wafer 10 transfer, reducing errors, and ensuring smooth wafer 10 transfer between chambers. The dual drive components allow both swing arms to perform pick-and-place actions simultaneously, shortening wafer 10 exchange time and significantly increasing the equipment's hourly output.

[0037] like Figure 2 As shown, in some optional embodiments, the semiconductor wafer inspection device further includes a first lifting assembly 510 and a second lifting assembly 610. The first lifting assembly 510 is connected to the first rotating shaft 310 and is used to drive the first rotating shaft 310 and the first arm 320 to move along a third direction Z. The second lifting assembly 610 is used to drive the second rotating shaft 410 and the second arm 420 to move along a third direction Z.

[0038] In these optional embodiments, the first lifting assembly 510 is connected to the first rotating shaft 310. The first lifting assembly 510 is used to drive the first rotating shaft 310 and the first arm 320 to move along the third direction Z. The second lifting assembly 610 is used to drive the second rotating shaft 410 and the second arm 420 to move along the third direction Z. During the swinging process, the lifting height of the two arms can be independently controlled, which can reduce the collision between the two arms during rotation and ensure the coordination and safety of the plate transfer action. By adjusting the height difference between the first arm 320 and the second arm 420 along the third direction Z through the first lifting assembly 510 and the second lifting assembly 610, the first arm 320 and the second arm 420 can be misaligned along the third direction Z, which is beneficial for the first arm 300 and the second arm 400 to be positioned more compactly.

[0039] The first lifting assembly 510 and the second lifting assembly 610 enable the first swing arm 300 and the second swing arm 400 to not only rotate horizontally, but also to lift along the third direction Z, realizing the precise positioning and transmission of the wafer 10 in three-dimensional space. The lifting function enables the first swing arm 300 and the second swing arm 400 to accurately grasp and place wafers 10 at different heights along the third direction Z, improving the flexibility and adaptability of the semiconductor wafer inspection equipment.

[0040] like Figure 2 and Figure 3 As shown, in some optional embodiments, a plurality of transfer platforms 110 are provided in the first chamber 100, and the plurality of transfer platforms 110 are arranged at intervals along the third direction Z, and each transfer platform 110 is used to place the wafer 10.

[0041] In these optional embodiments, multiple transfer platforms 110 are arranged along the third direction Z. Each transfer platform 110 is used to hold the wafer 10. The multiple transfer platforms 110 are arranged in layers along the third direction Z, which can store multiple wafers 10 at the same time. The first lifting component 510 and the second lifting component 610 enable the first swing arm 300 and the second swing arm 400 to lift and grab the wafers 10 on the transfer platforms 110 at different heights along the third direction Z. The multi-layer design allows multiple wafers 10 to be loaded at one time, processed sequentially after vacuuming, reducing the frequency of vacuuming, reducing energy consumption and reducing the interference of vibration on detection, and significantly improving the working efficiency of the equipment.

[0042] like Figure 2 As shown, in some optional embodiments, the second chamber 200 includes a top wall 201 and a bottom wall 202, which are spaced apart along a third direction Z. A first rotating shaft 310 is connected to the top wall 201, a second rotating shaft 410 is connected to the bottom wall 202, a first arm 320 is connected to the end of the first rotating shaft 310 away from the top wall 201, and a second arm 420 is connected to the end of the second rotating shaft 410 away from the bottom wall 202.

[0043] In these optional embodiments, the second chamber 200 includes a top wall 201 and a bottom wall 202, with a side wall connecting the top wall 201 and the bottom wall 202. The top wall 201, the bottom wall 202, and the side wall enclose the receiving cavity of the second chamber 200. The top wall 201 and the bottom wall 202 are spaced apart along a third direction Z. A first rotating shaft 310 is connected to the top wall 201, and a second rotating shaft 410 is connected to the bottom wall 202. This design can effectively disperse the vibration interference between the first swing arm 300 and the second swing arm 400 during movement. The design of the first rotating shaft 310 and the second rotating shaft 410 belonging to the top wall 201 and the bottom wall 202 respectively allows for independent disassembly and maintenance of individual first swing arms 300 and second swing arms 400, significantly reducing maintenance difficulty and time costs.

[0044] Optional, such as Figure 2 As shown, the first drive assembly 500 is located outside the second chamber 200 on the side near the top wall 201, and the second drive assembly 600 is located outside the second chamber 200 on the side near the bottom wall 202.

[0045] Optional, such as Figure 2 As shown, the first drive assembly 500 is located outside the second chamber 200 and connected to the top wall 201, and the second drive assembly 600 is located outside the second chamber 200 and connected to the bottom wall 202.

[0046] Optionally, the first drive assembly 500 includes a motor that drives the first rotating shaft 310 to swing the first arm 320.

[0047] Optionally, the second drive assembly 600 includes a motor that drives the second shaft 410 to swing the second arm 420.

[0048] like Figure 1 and Figure 2 As shown, in some optional embodiments, the second chamber 200 is provided with a working platform 210, which is disposed on the bottom wall 202 and is located on the side of the first swing arm 300 and the second swing arm 400 away from the first chamber 100 along the first direction X.

[0049] In these optional embodiments, the working platform 210 is disposed on the bottom wall 202 and located on the side opposite to the first chamber 100 along the first direction X of the first swing arm 300 and the second swing arm 400. The first arm 320 uses the first rotating shaft 310 as the swing center and the opening 700 to clamp and transfer the wafer 10 on the transfer platform 110 in the first chamber 100 to the working platform 210 in the second chamber 200. After the wafer 10 is inspected, the first arm 320 uses the first rotating shaft 310 as the swing center and the opening 700 to clamp and transfer the wafer 10 on the working platform 210 to the transfer platform 110 in the first chamber 10. The second arm 420, with the second pivot 410 as the swing center, clamps and transfers the wafer 10 on the transfer platform 110 in the first chamber 100 to the working platform 210 in the second chamber 200 through the opening 700. After the wafer 10 is inspected, the second arm 420, with the second pivot 410 as the swing center, clamps and transfers the wafer 10 on the working platform 210 to the transfer platform 110 in the first chamber 10 through the opening 700.

[0050] like Figure 2 As shown, in some alternative embodiments, the first chamber 100 is located on the side of the second chamber 200 along the third direction Z near the top wall 201.

[0051] In these optional embodiments, the first chamber 100 is connected to the second chamber 200 along the first direction X, and the first chamber 100 is located on the side of the second chamber 200 near the top wall 201. The first chamber 100 and the working platform 210 have a height difference along the third direction Z. When the first arm 320 and the second arm 420 rotate to the first chamber 100 and to the working platform 210 respectively, they are staggered along the third direction Z, thereby reducing interference and collision between the first arm 320 and the second arm 420, which is beneficial to improving the working efficiency of the first swing arm 300 and the second swing arm 400 and reducing mutual interference.

[0052] like Figure 2 As shown, in some optional embodiments, the height of the first chamber 100 along the third direction Z is less than the height of the second chamber 200 along the third direction Z.

[0053] In these alternative embodiments, the height of the first chamber 100 along the third direction Z is relatively small, which helps to reduce the volume of the first chamber 100, thereby helping to increase the vacuuming speed and further improve efficiency.

[0054] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A semiconductor wafer inspection device, characterized in that, include: First chamber; The second chamber is connected to the first chamber on one side along the first direction, and an opening is provided between the first chamber and the second chamber, and the first chamber and the second chamber are connected through the opening; A first swing arm is disposed in the second chamber. The first swing arm includes a first rotating shaft and a first arm portion. The axial direction of the first rotating shaft is parallel to a third direction. The second swing arm is disposed in the second chamber. The second swing arm includes a second rotating shaft and a second arm portion. The axial direction of the second rotating shaft is parallel to the third direction. The first and second rotating shafts are disposed in the second chamber near the opening, and are respectively disposed on both sides of the opening along the second direction. The first arm is oscillating about the axial direction of the first rotating shaft to transfer the wafer between the first and second chambers; the second arm is oscillating about the axial direction of the second rotating shaft to transfer the wafer between the first and second chambers. The first direction, the second direction, and the third direction intersect each other.

2. The semiconductor wafer inspection equipment according to claim 1, characterized in that, The first chamber includes a proximal end and a distal end disposed opposite to each other along the first direction, and the second chamber is located on the proximal end side of the first chamber, wherein the width of the distal end along the second direction is smaller than the width of the proximal end along the second direction.

3. The semiconductor wafer inspection equipment according to claim 1, characterized in that, The minimum distance between the first rotating shaft and the second rotating shaft along the second direction is the first distance, the width of the opening along the second direction is the first width, and the first distance is greater than or equal to half of the first width.

4. The semiconductor wafer inspection equipment according to claim 1, characterized in that, The semiconductor wafer inspection equipment further includes a first driving component and a second driving component. The first driving component is connected to the first rotating shaft and is used to drive the first rotating shaft to rotate and cause the first arm to swing. The second driving component is connected to the second rotating shaft and is used to drive the second rotating shaft to rotate and cause the second arm to swing.

5. The semiconductor wafer inspection equipment according to claim 1, characterized in that, The semiconductor wafer inspection equipment further includes a first lifting component and a second lifting component. The first lifting component is connected to the first rotating shaft and is used to drive the first rotating shaft and the first arm to move along the third direction. The second lifting component is used to drive the second rotating shaft and the second arm to move along the third direction.

6. The semiconductor wafer inspection equipment according to claim 5, characterized in that, The first chamber is provided with multiple transfer platforms, which are spaced apart along the third direction, and each transfer platform is used to place the wafer.

7. The semiconductor wafer inspection equipment according to claim 1, characterized in that, The second chamber includes a top wall and a bottom wall, which are spaced apart along the third direction. The first rotating shaft is connected to the top wall, and the second rotating shaft is connected to the bottom wall. The first arm is connected to the end of the first rotating shaft opposite to the top wall, and the second arm is connected to the end of the second rotating shaft opposite to the bottom wall.

8. The semiconductor wafer inspection equipment according to claim 7, characterized in that, The second chamber is provided with a working platform, which is located on the bottom wall and is situated on the side of the first swing arm and the second swing arm away from the first chamber along the first direction.

9. The semiconductor wafer inspection equipment according to claim 8, characterized in that, The first chamber is located in the second chamber on the side closer to the top wall along the third direction.

10. The semiconductor wafer inspection equipment according to claim 8, characterized in that, The height of the first chamber along the third direction is less than the height of the second chamber along the third direction.

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