Wafer inspection device and wafer loading apparatus

Abstract

The application provides a wafer detection device and a wafer loading equipment. The wafer detection device comprises a door plate mechanism, a first driving mechanism, a detection mechanism, a second driving mechanism and a lifting mechanism. The lifting mechanism is used as a main driving mechanism to drive other components to synchronously lift, so that vertical scanning detection of all wafers in a wafer box is realized. When detection is needed, the first driving mechanism drives a door body to move away from a mounting plate to open a window. Then, the second driving mechanism drives the detection mechanism to move, so that a detector passes through the window and approaches the wafers to perform detection. The design that the door body passes through the middle of a frame realizes staggered avoidance of the door body and the detection frame on a movement path, and ensures complete realization of functions in a compact space. After detection is completed, the detection mechanism is reset, and continues to move downward with the door body to make space for subsequent wafer taking. Through a highly integrated mechanical movement system, two functions of wafer box door opening and closing and wafer scanning detection are integrated into one, so that the equipment structure is simplified and the cost is reduced.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing equipment, and in particular to a wafer inspection device and a wafer loading device. Background Technology

[0002] In semiconductor wafer marking and dicing processes, the industry currently widely uses front-opening wafer cassettes (FOUPs) as the standard loading and transport containers for wafers. This ensures that wafers are protected from contamination during processing and meets high dust protection standards. The design of the wafer cassette is not only related to the physical protection of the wafers but also involves the automation compatibility of the entire manufacturing process. Especially in advanced processes, the precise positioning and identification of wafers directly affects process accuracy and yield.

[0003] In addition, before the wafers are transferred to the loading platform and ready for loading, the wafer cassettes need to be unlocked and mapped. Unlocking involves opening one side of the wafer cassette to expose the wafer, while mapping requires the use of specific sensors to scan the wafers. Conventional loading platforms typically rely on a robotic arm to drive sensors to map the wafers, which increases the equipment cost. Utility Model Content

[0004] This application proposes a wafer inspection device and a wafer loading device that can scan and inspect wafers using an internal mechanism, thereby reducing equipment costs.

[0005] This application proposes a wafer inspection device, comprising:

[0006] A door panel mechanism includes a vertically arranged mounting plate with a window on the mounting plate, and the door panel mechanism also includes a door body that matches the window;

[0007] A first driving mechanism is disposed on one side of the mounting plate and located below the window. The first driving mechanism is used to drive the door to move closer to or away from the mounting plate.

[0008] The detection mechanism includes a frame disposed on one side of the mounting plate and spaced apart from the mounting plate, and a detector disposed on the upper end of the frame;

[0009] The second drive mechanism is located on one side of the first drive mechanism and is used to drive the detection mechanism to move along a direction perpendicular to the mounting plate and to make the door pass through the middle of the frame;

[0010] A lifting mechanism is located on one side of the mounting plate and is used to drive the first driving mechanism and the second driving mechanism to lift synchronously.

[0011] In some embodiments, the first driving mechanism and the second driving mechanism are located on the same side of the mounting plate, and the driving ends of the first driving mechanism and the second driving mechanism are respectively disposed through the mounting plate and extend to the other side of the mounting plate; the driving directions of the first driving mechanism and the second driving mechanism are both perpendicular to the mounting plate.

[0012] In some embodiments, the frame is formed by four rods connected end to end to form a rectangular structure, the four sides of which correspond one-to-one with the four sides of the door in projection and are parallel and spaced apart.

[0013] In some embodiments, the first drive mechanism includes:

[0014] The first mounting base is driven to connect with the lifting mechanism;

[0015] The second mounting base is slidably connected to the first mounting base, and the sliding direction is perpendicular to the mounting plate. One end of the second mounting base passes through the mounting plate and is connected to the door panel on the other side of the mounting plate.

[0016] A first driving component is disposed in the first mounting base and is used to drive the second mounting base and the door body to move.

[0017] In some embodiments, the second mounting base includes a plurality of guide rods slidably connected to the first mounting base, a first connecting plate disposed at one end of the guide rods, and a second connecting plate disposed at the other end of the guide rods; the second connecting plate serves as the driving end of the second driving mechanism.

[0018] In some embodiments, the wafer inspection device further includes a connector on the second connecting plate and a connecting rod connecting the connector and the door body; the lower end of the second connecting plate is also provided with a recess for docking with the first driving member, the recess for accommodating the driving end of the first driving member to avoid the connecting rod.

[0019] In some embodiments, the second drive mechanism includes:

[0020] A connector is located below the second mounting base and is slidably connected to the first mounting base. The sliding direction is perpendicular to the mounting plate. One end of the connector passes through the mounting plate and serves as the driving end of the second driving mechanism, connecting to the frame.

[0021] The second driving component, disposed on the first mounting base, is used to drive the connecting component to move.

[0022] This application also proposes a wafer loading apparatus, including a wafer inspection device and a stage disposed on the side of the mounting plate away from the inspection mechanism, the stage being disposed near the lower end of the window.

[0023] In some embodiments, the wafer loading equipment further includes an unlocking device disposed on the door, the unlocking device comprising:

[0024] Two locking pins are rotatably mounted on the door and pass through the door.

[0025] Two cranks are located at the end of the locking pin away from the platform and are connected to the locking pin one by one;

[0026] A transmission component is provided on the door body and on the same side as the crank. Each end of the transmission component is provided with a sliding groove. The crank is connected to the sliding groove in a one-to-one correspondence, and the end of the crank can slide in the sliding groove.

[0027] The third driving component is used to drive the transmission component to move, thereby causing the crank and the locking pin to rotate.

[0028] In some embodiments, the wafer loading apparatus further includes a control module and a partition disposed below the stage, the partition being spaced apart from the mounting plate, the first drive mechanism, the second drive mechanism, and the lifting mechanism being disposed between the partition and the mounting plate, and the control module being disposed on the side of the partition away from the mounting plate.

[0029] This application proposes a wafer inspection device and a wafer loading device. The wafer inspection device includes a door mechanism, a first drive mechanism, an inspection mechanism, a second drive mechanism, and a lifting mechanism. The lifting mechanism acts as the main drive, synchronously raising and lowering other components to achieve vertical scanning inspection of all wafers within the wafer cassette. When inspection is required, the first drive mechanism moves the door away from the mounting plate to open the window. Subsequently, the second drive mechanism drives the inspection mechanism to move, allowing the detector to pass through the window and approach the wafer for inspection. The design of the door passing through the middle of the frame achieves staggered avoidance between the door and the inspection frame on the movement path, ensuring complete functionality within a compact space. After inspection, the inspection mechanism resets and continues to descend with the door, making room for subsequent wafer retrieval. Through a highly integrated mechanical motion system, the two major functions of wafer cassette door opening and closing and wafer scanning inspection are integrated into one, thereby simplifying the equipment structure and reducing costs. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of a wafer loading device in one embodiment of this application;

[0031] Figure 2 This is a schematic diagram of the structure of a wafer loading device in another embodiment of this application;

[0032] Figure 3 This is a schematic diagram of the structure of a wafer inspection device in one embodiment of this application;

[0033] Figure 4 This is a schematic diagram of the structure of the first driving mechanism and the second driving mechanism in one embodiment of this application.

[0034] Label Explanation:

[0035] 10. Mounting plate; 11. Window; 12. Door;

[0036] 20. First drive mechanism; 21. First mounting base; 22. Second mounting base; 221. Guide rod; 222. First connecting plate; 223. Second connecting plate; 224. Settling tank; 23. First drive component; 25. Connecting base; 26. Connecting rod; 31. Frame; 32. Detector; 40. Second drive mechanism; 41. Connecting component; 42. Second drive component; 51. Pin lock; 52. Crank; 53. Transmission component; 54. Third drive component; 60. Platform; 70. Lifting mechanism;

[0037] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0038] The solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments in this application, and not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0039] It should be noted that all directional indications in the embodiments of this application, such as up, down, left, right, front, back, etc., are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indication will also change accordingly.

[0040] It should also be noted that when a component is described as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intervening component present. When a component is described as "connected to" another component, it can be directly connected to the other component or there may be an intervening component present.

[0041] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed in this application.

[0042] This application provides a wafer inspection device, referring to... Figures 1 to 4 The wafer inspection device includes: a door panel mechanism, including a vertically mounted mounting plate 10 with a window 11 on it, and a door body 12 that matches the window 11; a first drive mechanism 20, located on one side of the mounting plate 10 and below the window 11, for driving the door body 12 to move closer to or away from the mounting plate 10; an inspection mechanism, including a frame 31 located on one side of the mounting plate 10 and spaced apart from it, and a detector 32 located on the upper end of the frame 31; a second drive mechanism 40, located on one side of the first drive mechanism 20, for driving the inspection mechanism to move along a direction perpendicular to the mounting plate 10 and for causing the door body 12 to pass through the middle of the frame 31; and a lifting mechanism 70, located on one side of the mounting plate 10, for driving the first drive mechanism 20 and the second drive mechanism 40 to lift synchronously.

[0043] In this embodiment, the lifting mechanism 70 acts as the main drive, synchronously raising and lowering other components to achieve vertical scanning and inspection of all wafers within the wafer cassette. When inspection is required, the first drive mechanism 20 drives the door 12 away from the mounting plate 10 to open the window 11. Subsequently, the second drive mechanism 40 drives the inspection mechanism to move, allowing the detector 32 to pass through the window 11 and approach the wafer for inspection. The door 12 passes through the middle of the frame 31, ensuring that the door 12 and the inspection frame 31 stagger and avoid each other on the movement path, thus ensuring complete functionality within a compact space. After inspection, the inspection mechanism resets and continues to descend with the door 12, making room for subsequent wafer retrieval. Through a highly integrated mechanical motion system, the two major functions of wafer cassette door opening and closing and wafer scanning and inspection are integrated into one, thereby simplifying the equipment structure and reducing costs.

[0044] In some embodiments, the mounting plate 10 is typically made of aluminum alloy or carbon steel and is anodized or powder-coated to ensure cleanliness. The window 11 has a sealing ring (such as silicone or fluororubber) embedded at its edge, and the interior of the door 12 may be filled with a honeycomb core material to achieve both rigidity and lightweight design. This mechanism forms a physical sealing interface between the wafer cassette and the inspection device. The window 11 is the wafer inspection channel, while the door 12 plays a crucial role in maintaining the cleanliness of the environment inside the wafer cassette. It effectively prevents external particulate contaminants from entering the wafer cassette, meeting the high cleanliness requirements of semiconductor manufacturing. The lightweight door 12 also reduces the load on the drive components.

[0045] The first drive mechanism 20 and the second drive mechanism 40 preferably employ servo electric cylinders or precision linear modules. These two mechanisms are responsible for the linear movement of the door body 12 (first drive mechanism 20) and the detection mechanism (second drive mechanism 40) along a direction perpendicular to the mounting plate 10, respectively. They typically share the same mounting base (first mounting base 21) and are synchronously raised and lowered by the lifting mechanism 70. This achieves precise and independent control of the opening and closing of the door body 12 and the feed of the detection mechanism, resulting in high repeatability.

[0046] The frame 31 can be constructed by welding or screwing together stainless steel or hard aluminum alloy profiles. The detector 32, depending on functional requirements, can be used for wafer presence detection and mapping infrared photoelectric sensors, or as a linear array camera for defect detection. The frame 31 provides stable support for the detector 32, and its hollow internal area serves as the passageway for the door 12 during its lifting and lowering process. The detector 32 is responsible for acquiring wafer images or signals. The frame 31 structure ensures the stability of the detector 32. The design of the door 12 passing through the middle of the frame 31 is key to enabling functional switching within a compact space, avoiding the need for separate movement spaces for the detection mechanism and the door 12, thus greatly optimizing the overall size and space utilization of the equipment.

[0047] The lifting mechanism 70 typically employs a servo motor-driven precision ball screw pair or synchronous belt transmission system, and is equipped with a high-precision linear guide rail. As the main drive, it drives the first drive mechanism 20 and the second drive mechanism 40, along with all their components, to move synchronously in the vertical direction, achieving wafer-by-wafer scanning and positioning within the wafer cassette. This ensures highly accurate positioning and smooth, vibration-free scanning during the inspection process. Synchronous lifting avoids the potential asynchrony issues that can arise from multiple independent lifting mechanisms, simplifying the control logic. Through highly integrated mechanical design, the two main functional modules—wafer cassette door opening and closing, and wafer scanning and inspection—are cleverly superimposed in space, and through orderly motion logic control, rapid function switching and maximum space utilization are achieved. This not only significantly reduces the overall manufacturing cost of the equipment (e.g., eliminating the need for a dedicated robotic arm for wafer scanning in traditional loading platforms), but its compact structure is also particularly suitable for deployment in space-constrained semiconductor equipment front-end modules, improving equipment space utilization and automation.

[0048] In some embodiments, the first drive mechanism 20 and the second drive mechanism 40 are located on the same side of the mounting plate 10. The driving ends of the first drive mechanism 20 and the second drive mechanism 40 respectively penetrate the mounting plate 10 and extend to the other side of the mounting plate 10. The driving directions of the first drive mechanism 20 and the second drive mechanism 40 are both perpendicular to the mounting plate 10. In this embodiment, the first drive mechanism 20 and the second drive mechanism 40 can be arranged side by side or stacked. Specifically, a servo motor or a linear motor can be used, and it can be directly connected to the driving end (such as a lead screw) through a coupling. The mounting plate 10 is provided with a vertically arranged elongated hole to allow the driving ends of the first drive mechanism 20 and the second drive mechanism 40 to move in the vertical direction. By arranging the first drive mechanism 20 and the second drive mechanism 40 on the same side and making their driving directions perpendicular to the mounting plate 10, this embodiment simplifies the transmission chain, reduces the error accumulation caused by multi-stage transmission, improves the synchronization and positioning accuracy of the door body 12 and the detection mechanism, and reduces the complexity and maintenance cost of the mechanism.

[0049] In some embodiments, the frame 31 is a rectangular structure formed by four rods connected end to end. The four sides of this rectangular structure correspond one-to-one with the four sides of the door 12 in projection and are parallel and spaced apart. The rods are made of aluminum alloy with rectangular or circular cross-sections and are fixed by angle brackets or welding to form a rigid frame. The projection interval between the frame 31 and the door 12 is controlled to be more than 5mm to ensure no interference when the door 12 is raised or lowered. The open structure of the frame 31 provides a passage for the door 12, while the parallel spacing avoids motion coupling. The effect is that the detection mechanism and the door 12 can reuse space, reducing the overall size of the equipment and ensuring the stability of the detector 32 when the door 12 passes through.

[0050] In some embodiments, the first drive mechanism 20 includes: a first mounting base 21, drivenly connected to the lifting mechanism 70; a second mounting base 22, slidably connected to the first mounting base 21, with its sliding direction perpendicular to the mounting plate 10, one end of the second mounting base 22 penetrating through the mounting plate 10 and connected to the door body 12 on the other side of the mounting plate 10; and a first drive member 23, disposed in the first mounting base 21, for driving the second mounting base 22 and the door body 12 to move. The first mounting base 21 is fixedly connected to the lifting mechanism 70 by bolts, and the second mounting base 22 is fitted to the first mounting base 21 by a linear guide or slide rail, with the sliding pair surface coated with a wear-resistant coating (such as polytetrafluoroethylene). The first drive member 23 can be a servo cylinder or a ball screw, and its output end is connected to the second mounting base 22. The layered installation structure decouples the lifting and translational movements, reducing mutual interference; the effect is to improve the stability and repeatability of the door body 12's movement, while reducing the load inertia of the lifting mechanism 70.

[0051] In some embodiments, the second mounting base 22 includes a plurality of guide rods 221 slidably connected to the first mounting base 21, a first connecting plate 222 disposed at one end of the guide rods 221, and a second connecting plate 223 disposed at the other end of the guide rods 221; the second connecting plate 223 serves as the driving end of the second driving mechanism 40. In this embodiment, the number of guide rods 221 is 2-4, the material is hardened stainless steel, and the surface is chrome-plated to reduce the coefficient of friction. The first connecting plate 222 is connected to the door body 12 by a hinge or quick-release joint, and the second connecting plate 223 is connected to the connecting member 41 of the second driving mechanism 40 by a slot or magnetic coupler. The technical principle is to distribute the driving stress evenly by using the structure of multiple guide rods 221 to avoid deformation due to single-point stress; the effect is to enhance the torsional stiffness of the second mounting base 22, ensure the posture stability of the door body 12 and the detection mechanism during high-speed movement, and facilitate quick disassembly and maintenance.

[0052] In some embodiments, the wafer inspection device further includes a connecting seat 25 disposed on the second connecting plate 223, and a connecting rod 26 connecting the connecting seat 25 and the door body 12; the lower end of the second connecting plate 223 is also provided with a recess 224 for docking with the first driving member 23, the recess 224 for accommodating the driving end of the first driving member 23 to avoid the connecting rod 26. The connecting seat 25 is usually made of L-shaped or U-shaped aluminum alloy casting or stainless steel forging, and is installed on the second connecting plate 223 by hexagonal screws. The upper end of the connecting rod 26 can also be connected to the door body 12 by angle brackets. The connecting seat 25, the connecting rod 26 and the door body 12 together form a rigid transmission chain, reliably transmitting the power of the first driving mechanism 20 to the door body 12. The first driving member 23 can be a cylinder, and its push rod extends upward with the lower edge of the second connecting plate 223 to form a notch for docking. The notch is set to facilitate the docking of the first driving member 23 with the second connecting plate 223, and has a certain installation margin in the vertical direction. The recess 224 is provided at the notch. The recessed groove 224 design achieves key three-dimensional spatial avoidance. Its principle is to provide a space for the driving end of the first driving component 23 (such as a push rod head) to be embedded within the second connecting plate 223. When installing the connecting rod 26, or adjusting the position of the connecting rod 26 to adjust the distance between the door body 12 and the second mounting base 22, the connecting rod 26 will not interfere with the driving end of the first driving component 23, thus safely providing the necessary installation space for the connecting rod 26 within a compact thickness space.

[0053] In some embodiments, the second drive mechanism 40 includes: a connector 41 disposed below the second mounting base 22 and slidably connected to the first mounting base 21, with the sliding direction perpendicular to the mounting plate 10; one end of the connector 41 passing through the mounting plate 10 and serving as the driving end of the second drive mechanism 40, connected to the frame 31; and a second drive member 42 disposed on the first mounting base 21 for driving the connector 41 to move. In this embodiment, the first mounting base 21 is similar to a box-shaped structure, and the connector 41 can be a long plate that is slidably connected to the inner bottom surface of the first mounting base 21 via a guide rail and a slider. The second drive member 42 is selected as a cylinder disposed on the aforementioned inner bottom surface, with the cylinder arranged parallel to the guide rail. The end of the connector 41 passes through the side plate of the box-shaped structure and the mounting plate 10, and is connected to the lower end of the frame 31 via a rod. The first drive mechanism 20 and the second drive mechanism 40 are arranged in two layers, which can make full use of the internal space of the first mounting base 21, while also ensuring that the door 31 and the door body 12 are spaced apart and do not interfere with each other.

[0054] This application also proposes a wafer loading device, including a wafer inspection unit and a stage 60 disposed on the side of the mounting plate 10 away from the inspection mechanism, with the stage 60 positioned near the lower end of the window 11. The stage 60 has positioning pins on its surface for engaging with a wafer cassette, and a locking cylinder and a pushing cylinder at its bottom. The locking cylinder locks the wafer cassette, and the pushing cylinder drives the stage 60 and the wafer cassette closer to the window 11, ensuring that the wafer cassette door is directly aligned with the inspection path after opening. Two RFID readers are also mounted on the stage 60, used to identify tags on the side and rear of the wafer cassette, respectively, which record wafer cassette carrying information.

[0055] In some embodiments, the wafer loading equipment further includes an unlocking device mounted on the door 12. The unlocking device includes: two locking pins 51 rotatably mounted on the door 12 and extending through the door 12; two cranks 52 located at the ends of the locking pins 51 away from the platform 60 and connected to the locking pins 51 one-to-one; a transmission member 53 mounted on the door 12 and on the same side as the cranks 52, with grooves at both ends of the transmission member 53, and the cranks 52 connected to the grooves one-to-one, allowing one end of the cranks 52 to slide in the grooves; and a third driving member 54 for driving the transmission member 53 to move, thereby rotating the cranks 52 and the locking pins 51. The transmission member 53 converts linear motion into rotation of the cranks 52, driving the locking pins 51 to complete the locking and unlocking action, realizing automatic opening and closing of the wafer box door without the need for an additional positioning mechanism.

[0056] In practical applications, the wafer cassette can be placed on the stage 60 via a conveyor crane or manual operation, and the bottom pin hole of the wafer cassette can be aligned with the positioning pin. This triggers the material detection sensor on the wafer stage 60 and the bottom wafer type identification probe. At this time, the locking cylinder activates, fixing the wafer cassette onto the stage 60. The stage 60 moves forward with the wafer towards the window, and the vacuum suction cup on the door adheres to the side plate of the wafer cassette. When the vacuum pressure reaches the set value for secure adhesion, the unlocking mechanism on the door 12 inserts into the wafer cassette's lock hole and rotates it. The first drive mechanism 20 opens the wafer cassette's side plate, which then moves with the door 12 and separates from the wafer cassette. The lifting mechanism 70 drives the door 12 down to the wafer scanning start position. The second drive mechanism 40 moves the frame 31 and the detector 32 (wafer scanning sensor) towards the mounting plate 10, allowing the detector 32 to pass through the window 11 and extend into the wafer cassette. The lifting mechanism 70 drives the door 12 and the scanning sensor to move from top to bottom to complete the scanning action. Then, the second driving mechanism 40 drives the detection mechanism to retract and exit from the window 11. The lifting mechanism continues to drive the door 12 and the detection mechanism to move below the window 11, so that the window 11 is fully opened. After completing the subsequent picking of the sheet, the lifting mechanism 70 drives the door 12 to move upward until the door 12 is opposite the window 11. The first driving mechanism 20 drives the door 12 to move and close the window 11. The unlocking mechanism resets, the material box closes and moves out with the platform.

[0057] In some embodiments, the wafer loading apparatus further includes a control module and a partition disposed below the stage 60. The partition is spaced apart from the mounting plate 10. The first drive mechanism 20, the second drive mechanism 40, and the lifting mechanism 70 are disposed between the partition and the mounting plate 10. The control module is disposed on the side of the partition away from the mounting plate 10. In this embodiment, the control module uses a PLC to control the first drive mechanism 20, the second drive mechanism 40, the lifting mechanism 70, the unlocking mechanism, and the detector 32. In addition, the electrical board corresponding to the PLC is disposed in the base below the stage 60 and is isolated from the drive mechanism and the lifting mechanism 70 by the partition to prevent particulate contamination and electromagnetic interference, thereby improving equipment reliability.

[0058] The working principle of the wafer inspection device and wafer loading equipment in this embodiment is as follows:

[0059] The wafer inspection device includes a door mechanism, a first drive mechanism 20, an inspection mechanism, a second drive mechanism 40, and a lifting mechanism 70. The lifting mechanism 70 acts as the main drive, synchronously raising and lowering other components to achieve vertical scanning inspection of all wafers within the wafer cassette. When inspection is required, the first drive mechanism 20 drives the door 12 away from the mounting plate 10 to open the window 11. Subsequently, the second drive mechanism 40 drives the inspection mechanism to move, allowing the detector 32 to pass through the window 11 and approach the wafer for inspection. The door 12 passes through the middle of the frame 31, allowing the door 12 and the inspection frame 31 to avoid each other on the movement path, ensuring complete functionality within a compact space. After inspection, the inspection mechanism resets and continues to descend with the door 12, making room for subsequent wafer retrieval. Through a highly integrated mechanical motion system, the two major functions of wafer cassette door opening and closing and wafer scanning inspection are integrated into one, thereby simplifying the equipment structure and reducing costs.

[0060] The above are only some or preferred embodiments of this application. Neither the text nor the drawings should limit the scope of protection of this application. All equivalent structural transformations made using the content of this application's specification and drawings under the overall concept of this application, or direct / indirect applications in other related technical fields, are included within the scope of protection of this application.

Claims

1. A wafer inspection device, characterized in that, include: A door panel mechanism includes a vertically arranged mounting plate with a window on the mounting plate, and the door panel mechanism also includes a door body that matches the window; A first driving mechanism is disposed on one side of the mounting plate and located below the window. The first driving mechanism is used to drive the door to move closer to or away from the mounting plate. The detection mechanism includes a frame disposed on one side of the mounting plate and spaced apart from the mounting plate, and a detector disposed on the upper end of the frame; The second drive mechanism is located on one side of the first drive mechanism and is used to drive the detection mechanism to move along a direction perpendicular to the mounting plate and to make the door pass through the middle of the frame; A lifting mechanism is located on one side of the mounting plate and is used to drive the first driving mechanism and the second driving mechanism to lift synchronously.

2. The wafer inspection apparatus according to claim 1, characterized in that, The first driving mechanism and the second driving mechanism are located on the same side of the mounting plate. The driving ends of the first driving mechanism and the second driving mechanism are respectively disposed through the mounting plate and extend to the other side of the mounting plate. The driving directions of the first driving mechanism and the second driving mechanism are both perpendicular to the mounting plate.

3. The wafer inspection apparatus according to claim 1, characterized in that, The frame is a rectangular structure formed by four rods connected end to end. The four sides of the rectangular structure correspond one-to-one with the four sides of the door in projection and are parallel and spaced apart.

4. The wafer inspection apparatus according to claim 2, characterized in that, The first driving mechanism includes: The first mounting base is driven to connect with the lifting mechanism; The second mounting base is slidably connected to the first mounting base, and the sliding direction is perpendicular to the mounting plate. One end of the second mounting base passes through the mounting plate and is connected to the door panel on the other side of the mounting plate. A first driving component is disposed in the first mounting base and is used to drive the second mounting base and the door body to move.

5. The wafer inspection apparatus according to claim 4, characterized in that, The second mounting base includes a plurality of guide rods slidably connected to the first mounting base, a first connecting plate disposed at one end of the guide rods, and a second connecting plate disposed at the other end of the guide rods; the second connecting plate serves as the driving end of the second driving mechanism.

6. The wafer inspection apparatus according to claim 5, characterized in that, The wafer inspection device further includes a connector on the second connecting plate and a connecting rod connecting the connector and the door body; the lower end of the second connecting plate is also provided with a recess for docking with the first driving member, the recess for accommodating the driving end of the first driving member, so as to avoid the connecting rod.

7. The wafer inspection apparatus according to claim 4, characterized in that, The second drive mechanism includes: A connector is located below the second mounting base and is slidably connected to the first mounting base. The sliding direction is perpendicular to the mounting plate. One end of the connector passes through the mounting plate and serves as the driving end of the second driving mechanism, connecting to the frame. The second driving component, disposed on the first mounting base, is used to drive the connecting component to move.

8. A wafer loading device, characterized in that, The wafer inspection apparatus includes any one of claims 1 to 7, and a stage disposed on the side of the mounting plate opposite to the inspection mechanism, the stage being disposed near the lower end of the window.

9. The wafer loading apparatus according to claim 8, characterized in that, The wafer loading equipment further includes an unlocking device disposed on the door, the unlocking device comprising: Two locking pins are rotatably mounted on the door and pass through the door. Two cranks are located at the end of the locking pin away from the platform and are connected to the locking pin one by one; A transmission component is provided on the door body and on the same side as the crank. Both ends of the transmission component are respectively provided with sliding grooves. The crank is connected to the sliding grooves one by one, and the end of the crank can slide in the sliding groove. The third driving component is used to drive the transmission component to move, thereby causing the crank and the locking pin to rotate.

10. The wafer loading apparatus according to claim 8, characterized in that, The wafer loading equipment also includes a control module and a partition disposed below the stage. The partition is spaced apart from the mounting plate. The first drive mechanism, the second drive mechanism, and the lifting mechanism are disposed between the partition and the mounting plate. The control module is disposed on the side of the partition away from the mounting plate.

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