Wafer detection and leveling device after dicing

Abstract

The utility model discloses a kind of cutting wafer detection leveling devices, the cutting wafer detection leveling device proposed by the utility model includes: support plate, guide pillar, pressing assembly, voice coil motor, jacking plate, base plate, linear bearing;Support plate is evenly distributed around base plate, pressing assembly is integrally locked in the both sides of base plate, linear bearing is evenly locked around base plate, one end of guide pillar is screw-locked with jacking plate;Voice coil motor stator end is locked on base plate, voice coil motor mobile end is locked on jacking plate, to drive jacking plate up and down movement;Cutting wafer is placed on support plate, voice coil motor actuation drives jacking plate to ascend along guide pillar, until cutting wafer outer ring iron ring and cutting wafer middle blue film are taut, to make the detection surface of cutting wafer flat, so that the entire wafer surface will have higher flatness, improve detection efficiency and detection effect.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a wafer inspection and leveling device after dicing. Background Technology

[0002] In the AOI (Automated Optical Inspection) section for wafer appearance defects after dicing, some diced wafers need to be inspected through a blue film on the back side. However, the principle that the blue film cannot be adhered to the front side of the wafer causes the blue film to be in a concave state when inspecting defects on the back side, thus affecting the inspection effect.

[0003] In post-diced wafer AOI inspection, some micron-sized defects place higher demands on the inspection hardware, generally requiring a precision inspection range and depth of field of less than 10µm. This is particularly challenging for scenarios where back-side defects need to be inspected after dicing, as the principle that front-side wafers often cannot be properly adsorbed presents a significant challenge to the inspection conditions.

[0004] Traditional post-dicing wafer backside inspection typically employs two methods:

[0005] The first approach involves adsorbing and fixing the iron ring on the front of the diced wafer, allowing the back side to face upwards for direct inspection. The entire wafer is in a concave state, and the inspection camera is used to take pictures and inspect the wafer through multiple long-stroke focusing. This increases the focusing stroke and the number of focusing attempts, resulting in very low inspection efficiency and thus affecting production efficiency.

[0006] The second approach involves using a glass suction cup to hold the entire bottom of the diced wafer, allowing the optical system to take pictures and inspect from the bottom up. However, this approach has several drawbacks. First, the glass suction cup will cause a certain degree of attenuation in the optical system's detection capabilities. Second, the bottom-up optical layout makes the entire structure extremely complex and restrictive. Third, after prolonged use, foreign objects and damage on the glass can lead to misjudgments in the inspection results.

[0007] The above content is only used to help understand the technical solution of this utility model and does not represent an admission that the above content is prior art. Utility Model Content

[0008] The main purpose of this invention is to provide a leveling device for wafer inspection after dicing, which aims to solve the technical problem in the prior art of AOI inspection of wafers after dicing, where the front wafer often cannot be adsorbed in scenarios where defects on the back side of the wafer need to be detected, resulting in very low detection efficiency and misjudgment of detection results.

[0009] To achieve the above objectives, this utility model provides a wafer inspection and leveling device after dicing, which includes: a support plate (100), a guide post (200), a pressing component (300), a voice coil motor (400), a lifting plate (500), a base plate (600), and a linear bearing (700).

[0010] The support plate (100) is evenly distributed around the base plate (600), the pressing component (300) is integrally locked to both sides of the base plate (600), the linear bearing (700) is evenly locked around the base plate (600), and one end of the guide post (200) is screwed to the lifting plate (500).

[0011] The stator end of the voice coil motor (400) is locked to the base plate (600), and the mover end of the voice coil motor (400) is locked to the lifting plate (500) to drive the lifting plate (500) to move up and down.

[0012] After dicing, the wafer is placed on the support plate (100). The voice coil motor (400) drives the lifting plate (500) to rise along the guide post (200) until the outer iron ring of the diced wafer is tightly stretched with the blue film in the middle of the diced wafer, so that the detection surface of the diced wafer is flat.

[0013] Preferably, the lifting plate (500) has a structure with a protruding outer ring and a recessed inner ring.

[0014] Preferably, the support plate (100) presses down on the outer iron ring of the cut wafer by the pressing components (300) on both sides.

[0015] Preferably, during the rising process of the lifting plate (500), the height of the wafer surface of the cut wafer is detected by the detection system. When the plane of the cut wafer reaches the optimal detection height, it is determined that the blue film is taut and the voice coil motor (400) is stopped.

[0016] Preferably, a corresponding detection height is set according to the product type of the cut wafer, and the voice coil motor (400) drives the lifting plate (500) to rise along the guide post (200) to the detection height.

[0017] Preferably, when the voice coil motor (400) drives the lifting plate (500) to rise along the guide post (200) to the detection height, the flatness of the cut wafer is calculated, and the blue film is judged to be taut based on the flatness.

[0018] Preferably, when the flatness difference is less than the required flatness for testing, the blue film is considered to be taut.

[0019] The wafer leveling device for post-diced wafer inspection proposed in this utility model includes: a support plate, guide pillars, a pressing assembly, a voice coil motor, a lifting plate, a base plate, and linear bearings. The support plate is evenly distributed around the base plate, the pressing assembly is locked to both sides of the base plate, the linear bearings are evenly locked to the base plate, and one end of the guide pillar is screwed to the lifting plate. The stator end of the voice coil motor is locked to the base plate, and the mover end of the voice coil motor is locked to the lifting plate to drive the lifting plate to move up and down. The diced wafer is placed on the support plate, and the voice coil motor drives the lifting plate to rise along the guide pillars until the outer iron ring of the diced wafer is taut with the blue film in the middle of the diced wafer, so that the inspection surface of the diced wafer is flat, thereby making the entire wafer surface have a higher flatness and improving the inspection efficiency and inspection effect. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of a wafer inspection and leveling device after dicing, according to one embodiment of the present invention.

[0022] Figure 2 This is a schematic diagram of a portion of the structure of a wafer inspection and leveling device after dicing, according to one embodiment of the present invention.

[0023] Figure 3 This is a schematic diagram of the support plate distribution structure of a wafer inspection and leveling device after dicing, according to one embodiment of the present invention.

[0024] Figure 4 This is a schematic diagram of the position structure of the voice coil unit and the lifting plate in the working process of a wafer inspection and leveling device after dicing, according to one embodiment of the present invention.

[0025] Explanation of icon numbers:

[0026] 100 support plate 200 Guide post 300 Press component 400 voice coil motor 500 Lifting board 600 base plate 700 linear bearings

[0027] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0030] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0031] Reference Figure 1 , Figure 1 This is a schematic diagram of an embodiment of a wafer inspection and leveling device after dicing according to the present invention.

[0032] like Figure 1 As shown, the wafer inspection and leveling device after dicing includes:

[0033] The wafer inspection and leveling device after dicing includes: a support plate 100, a guide post 200, a pressing component 300, a voice coil motor 400, a lifting plate 500, a base plate 600, and a linear bearing 700.

[0034] The support plate 100 is evenly distributed around the base plate 600, the pressing component 300 is integrally locked to both sides of the base plate 600, the linear bearing 700 is evenly locked around the base plate 600, and one end of the guide post 200 is screwed to the lifting plate 500.

[0035] The stator end of the voice coil motor 400 is locked to the base plate 600, and the mover end of the voice coil motor 400 is locked to the lifting plate 500, so as to drive the lifting plate 500 to move up and down.

[0036] After dicing, the wafer is placed on the support plate 100. The voice coil motor 400 drives the lifting plate 500 to rise along the guide post 200 until the outer iron ring of the diced wafer is tightly stretched with the blue film in the middle of the diced wafer, so that the detection surface of the diced wafer is flat.

[0037] It should be noted that, as Figure 2 As shown, the support plates 100 are evenly distributed around the base plate 600 and secured with screws; the pressing assembly 300 is integrally secured to both sides of the base plate; the linear bearings 700 are evenly secured around the base plate; the guide post 200 slides axially with the linear bearing 700, serving a guiding function, and one end is screwed to the lifting plate 500. The stator end of the voice coil motor 400 is screwed to the base plate 600, and the mover end is secured to the lifting plate 500, thus allowing the voice coil motor 400 to drive the lifting plate 500 to move up and down.

[0038] Furthermore, in this embodiment, the support plate 100 presses down on the outer iron ring of the cut wafer by the pressing components 300 on both sides.

[0039] It should be understood that the robotic arm places the diced wafer onto the support plate 100 of the diced wafer inspection and leveling device. For example... Figure 3 As shown, the support plate 100 is evenly distributed around the wafer inspection and leveling device after cutting, and the pressing components 300 on both sides of the wafer inspection and leveling device after cutting press the outer iron ring of the wafer after cutting.

[0040] Furthermore, in this embodiment, the lifting plate 500 has a structure with a protruding outer ring and a recessed inner ring.

[0041] Understandably, combined with Figure 4 The voice coil actuator 400 drives the lifting plate 500 to rise along the guide post 200. The lifting plate 500 is designed with a convex outer ring and a concave inner ring until the outer ring of the lifting plate 500 contacts the blue film area between the wafer and the diced wafer's iron ring. The action continues until the blue film is taut, resulting in a higher flatness of the entire wafer surface. This ensures a smoother overall wafer posture when inspecting the back side of the diced wafer, thus not affecting inspection efficiency or results.

[0042] Furthermore, in this embodiment, a corresponding detection height is set according to the product type of the cut wafer, and the voice coil motor 400 drives the lifting plate 500 to rise along the guide post 200 to the detection height.

[0043] Furthermore, in this embodiment, when the voice coil motor 400 drives the lifting plate 500 to rise along the guide post 200 to the detection height, the flatness of the cut wafer is calculated, and the flatness is used to determine whether the blue film is taut.

[0044] In practice, the lifting height is typically set according to the specified product's blue film. The height of various positions on the wafer surface after dicing is measured using a height measuring instrument to calculate the wafer's flatness. When the flatness difference is less than the required flatness for testing, the tensioning effect is considered achieved, and the testing requirements are met. For example, the flatness may be less than 10-20µm, and the setting varies depending on the product type. After debugging, each product type corresponds to a blue film tensioning height, i.e., the testing height. When testing the corresponding product type, the debugged testing height is used. In this embodiment, the blue film is considered tensioned when the flatness difference is less than the required flatness for testing.

[0045] Furthermore, in this embodiment, during the rising process of the lifting plate 500, the height of the wafer surface of the cut wafer is detected by the detection system. When the plane of the cut wafer reaches the optimal detection height, the voice coil motor 400 is stopped.

[0046] It should be noted that during the ascent of the lifting plate 500, the upper detection optical system monitors the height of the wafer surface. Once the wafer surface reaches the optimal detection height, the voice coil motor 400 is stopped. Finally, different detection heights are set according to the wafer after different cuts. The optimal detection height refers to the height at which the lifting plate 500 rises until the blue film is taut, ensuring the wafer surface flatness is within the required flatness for detection. Different types of products will have different optimal detection heights when debugging, as indicated by the height measuring instrument. The corresponding optimal detection height can be selected during leveling for different product types, thus flexibly adapting to changes in the blue film on wafers after different cuts to achieve the optimal detection height.

[0047] In this embodiment, the height of the lifting plate is precisely adjusted by a voice coil motor, which can tighten the blue film on the diced wafer after contact to make the detection surface of the diced wafer flat; it is suitable for use with different blue films on diced wafers; in non-adsorption scenarios for back-side detection, the flatness of the detection surface of the diced wafer is improved, thereby improving detection efficiency and detection effect.

[0048] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A wafer inspection and leveling device after dicing, characterized in that, The wafer inspection and leveling device after dicing includes: a support plate (100), a guide post (200), a pressing component (300), a voice coil motor (400), a lifting plate (500), a base plate (600), and a linear bearing (700). The support plate (100) is evenly distributed around the base plate (600), the pressing component (300) is integrally locked to both sides of the base plate (600), the linear bearing (700) is evenly locked around the base plate (600), and one end of the guide post (200) is screwed to the lifting plate (500). The stator end of the voice coil motor (400) is locked to the base plate (600), and the mover end of the voice coil motor (400) is locked to the lifting plate (500) to drive the lifting plate (500) to move up and down. After dicing, the wafer is placed on the support plate (100). The voice coil motor (400) drives the lifting plate (500) to rise along the guide post (200) until the outer iron ring of the diced wafer is tightly stretched with the blue film in the middle of the diced wafer, so that the detection surface of the diced wafer is flat.

2. The wafer inspection and leveling device after dicing as described in claim 1, characterized in that, The lifting plate (500) has a structure with a protruding outer ring and a recessed inner ring.

3. The wafer inspection and leveling device after dicing as described in claim 2, characterized in that, The support plate (100) presses down on the outer iron ring of the cut wafer by the pressing components (300) on both sides.

4. The wafer inspection and leveling device after dicing as described in claim 2, characterized in that, During the ascent of the lifting plate (500), the height of the wafer surface of the cut wafer is detected by the detection system. When the plane of the cut wafer reaches the optimal detection height, the blue film is identified as taut and the voice coil motor (400) is stopped from driving.

5. The wafer inspection and leveling device after dicing as described in any one of claims 1-4, characterized in that, The corresponding detection height is set according to the product type of the cut wafer, and the voice coil motor (400) drives the lifting plate (500) to rise along the guide post (200) to the detection height.

6. The wafer inspection and leveling device after dicing as described in claim 5, characterized in that, When the voice coil motor (400) drives the lifting plate (500) to rise along the guide post (200) to the detection height, the flatness of the cut wafer is calculated, and the blue film is judged to be tight based on the flatness.

7. The wafer inspection and leveling device after dicing as described in claim 6, characterized in that, When the flatness difference is less than the required flatness for testing, the blue film is considered to be taut.

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