A power module base plate, a power module, a controller, an automobile, and a power electronics device

Abstract

The application discloses a power module bottom plate, a power module, a controller, an automobile and a power electronic device. The power module bottom plate comprises a metal bottom plate, the metal bottom plate comprises oppositely arranged first and second surfaces, the first surface comprises a welding area, the second surface comprises a heat dissipation area and a mounting area, and the welding area, the heat dissipation area and the mounting area are respectively plated with nickel layers with different thicknesses. By plating the welding area, the heat dissipation area and the mounting area with nickel layers with different thicknesses, the welding performance and the heat conduction capacity of the bottom plate are enhanced while the corrosion resistance and the wear resistance of the bottom plate are improved.

Description

Technical Field

[0001] This application relates to the field of power electronics technology, and in particular to a power module baseboard, a power module, a controller, an automobile, and a power electronic device. Background Technology

[0002] The base plate is an essential part of the power module. It not only provides physical support for the entire module but also serves as a heat dissipation channel. For high-power automotive modules, due to significant power loss, the module generates a large amount of heat when operating at high power. Therefore, a cooling water tank must be installed outside the module. During operation, the heat generated by the module is dissipated through convection heat transfer between the base plate and the water in the cooling water tank.

[0003] Currently, copper and aluminum are commonly used materials for base plates. Since different areas of the base plate surface have different functions, the degree of oxidation and corrosion varies in different areas. Therefore, to avoid the effects of humid or high-temperature environments, it is necessary to design a base plate structure that can improve the performance of different areas to adapt to the application requirements of higher power and complex environments. Utility Model Content

[0004] This application aims to provide a power module baseboard, power module, controller, automotive and power electronic device, which solves at least one of the technical problems existing in the prior art through a differentiated nickel plating process.

[0005] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application.

[0006] The first aspect of this application provides a power module baseboard, characterized in that it includes: A metal base plate, comprising a first surface and a second surface disposed opposite to each other, the first surface including a welding area, and the second surface including a heat dissipation area and a mounting area, wherein the welding area, the heat dissipation area and the mounting area are respectively plated with nickel layers of different thicknesses.

[0007] Optionally, the nickel layer thickness of the heat dissipation area and the mounting area is greater than the nickel layer thickness of the welding area.

[0008] Optionally, the thickness of the nickel layer plated in the mounting area is greater than the thickness of the nickel layer plated in the heat dissipation area.

[0009] Optionally, the thickness of the nickel layer plated in the heat dissipation area ranges from 5 to 7 μm.

[0010] Optionally, the thickness of the nickel layer plated in the heat dissipation area ranges from 7 to 10 μm.

[0011] Optionally, the thickness of the nickel layer plated in the mounting area ranges from 7 to 15 μm.

[0012] Optionally, the metal base plate is bent into a curved shape, with the first surface being an arc-shaped concave structure and the second surface being an arc-shaped convex structure.

[0013] Optionally, the arcuate protrusion structure of the second surface has the highest point at the center of the second surface and gradually descends to the edge along two diagonals.

[0014] Optionally, along the first direction, the distance between the short edge of the metal base plate and the highest point is 0.9mm-1.0mm.

[0015] Optionally, along the first direction, the distance between the long edge of the metal base plate and the highest point is 1.0mm-2.0mm.

[0016] Optionally, the heat dissipation area is provided with a plurality of heat dissipation pins, which are arranged in an array. The cross-section of the heat dissipation pin is elliptical, and the ratio of the length of the major axis to the length of the minor axis of the cross-section is 3:1.

[0017] Optionally, along the long side of the second surface, reinforcement portions are provided on both sides of the heat dissipation area, and the reinforcement portions protrude from the second surface.

[0018] Optionally, the height of the reinforcing part protruding from the second surface is 2-4 mm.

[0019] Optionally, the width of the reinforcing part is 1-3 mm.

[0020] Optionally, the mounting area is provided with multiple mounting holes around the heat dissipation area for fixed connection with the external heat dissipation water tank and the outer frame of the power module.

[0021] By plating nickel layers of different thicknesses in the welding area, heat dissipation area, and installation area, the corrosion resistance and wear resistance of the base plate are improved, while its welding performance and heat conduction capacity are also enhanced.

[0022] A second aspect of this application provides a power module, including a power module base plate on which power devices are formed.

[0023] A third aspect of this application provides a controller, which is a motor drive controller and includes a power module.

[0024] The fourth aspect of this application provides a vehicle, which is a new energy vehicle, including a power module or controller.

[0025] The fifth aspect of this application provides a power electronic device, including a power module.

[0026] This application improves the corrosion resistance and wear resistance of the base plate by plating nickel layers of different thicknesses in the welding area, heat dissipation area and mounting area, while also enhancing its welding performance and heat conduction capacity.

[0027] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0028] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of the first surface structure of the power module base plate provided in an exemplary embodiment of this application. Figure 2 This is a schematic diagram of the second surface structure of the power module base plate provided in an exemplary embodiment of this application. Figure 3 This is a schematic diagram of the arc structure of the power module base plate provided in an exemplary embodiment of this application. Figure 4 This is a schematic diagram of the power module base plate installation provided in an exemplary embodiment of this application. Figure label: 00. Metal base plate; 10. First surface; 11. Welding area; 20. Second surface; 21. Heat dissipation area; 211. Heat dissipation pin; 212. Reinforcing part; 22. Mounting area; 221. Mounting hole; 222. Clearance hole; 3. Bolt; 4. Base plate; O. Highest point; A. First direction Detailed Implementation

[0029] To provide a more detailed understanding of the features and technical content of the embodiments of this application, the implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings. The accompanying drawings are for illustrative purposes only and are not intended to limit the embodiments of this application. In the following technical description, for ease of explanation, several details are used to provide a full understanding of the disclosed embodiments. However, one or more embodiments may still be implemented without these details. In other cases, well-known structures and devices may be simplified in their depiction to simplify the drawings.

[0030] The first aspect of this application provides a power module base plate, which includes a metal base plate 00. The metal base plate 00 includes a first surface 10 and a second surface 20 disposed opposite to each other. The first surface 10 includes a welding area 11, and the second surface 20 includes a heat dissipation area 21 and a mounting area 22. The welding area 11, the heat dissipation area 21, and the mounting area 22 are respectively plated with nickel layers of different thicknesses. Since different areas have different requirements for corrosion resistance, welding performance, and heat conduction, this application improves the corrosion resistance and wear resistance of the base plate while enhancing its welding performance and heat conduction capacity by plating nickel layers of different thicknesses in different areas.

[0031] Specifically, the base plate surface is coated with a nickel layer through a chemical plating process. Nickel easily forms a dense nickel oxide film (NiO) in the air. This film can effectively isolate external oxygen and moisture, prevent corrosive media from directly contacting the aluminum substrate, and thus protect the aluminum substrate. The nickel plating itself acts as a barrier, preventing corrosive substances (such as moisture, oxygen, acids and alkalis) from penetrating to the surface of the aluminum substrate, reducing the probability of corrosion.

[0032] Understandably, the first surface 10 is a smooth plane, and the welding area 11 is used to weld the DBC (Direct Bonded Copper) / AMB (Active Metal Brazed) substrate 4.

[0033] Furthermore, the nickel layer thickness of the heat dissipation area 21 and the mounting area 22 is greater than that of the nickel layer thickness of the welding area 11, that is, the nickel layer thickness of the second surface 20 is greater than that of the first surface 10. The heat dissipation area 21 and the mounting area 22 require higher wear resistance and corrosion resistance, and the thick nickel layer meets the requirements; the nickel layer thickness of the mounting area 22 is greater than that of the heat dissipation area 21, and the mounting area 22 needs to withstand higher mechanical loads (such as bolt fixing), and the thick nickel layer improves fatigue resistance.

[0034] In some embodiments, the nickel layer plated on the heat dissipation area 21 has a thickness ranging from 5 to 7 μm. This thickness ensures the corrosion resistance of the front side of the base plate without significantly increasing the thermal resistance, ensuring good thermal conductivity between the DBC / AMB substrate 4 and the base plate, and avoiding weak bonding or increased welding difficulty due to excessively thick nickel layers during the welding process.

[0035] In some embodiments, the nickel layer plated on the heat dissipation area 21 has a thickness ranging from 7 to 10 μm. Since Pinfin is usually used for heat dissipation, a nickel layer thickness of less than 10 μm will not significantly increase the thermal resistance. Furthermore, Pinfin structures are subject to water erosion and friction. Appropriately increasing the nickel layer thickness to more than 7 μm can improve the wear resistance of Pinfin.

[0036] In some embodiments, the nickel layer plated on the mounting area 22 has a thickness ranging from 7 to 15 μm. The mounting area 22 needs to withstand higher mechanical loads (such as bolt fixing), and the thicker nickel layer improves fatigue resistance and maintains corrosion resistance and wear resistance.

[0037] In some embodiments, the metal base plate 00 is bent into a curved shape, with the first surface 10 being a concave arc surface and the second surface 20 being a convex arc surface. The metal base plate 00 protrudes towards the second surface 20, i.e., the back side, to compensate for welding stress and to form a complete surface contact with the heat sink surface during the installation of the finished module, thereby achieving good heat dissipation.

[0038] In some embodiments, the arcuate protrusion structure of the second surface 20 has its highest point O at the center of the second surface 20 and gradually descends towards the edge along two diagonals. It is understood that the base plate body is designed with a curvature; this pre-curvature design can effectively alleviate the stress generated by thermal expansion, thereby reducing mechanical and thermal stress in the module and avoiding damage to solder joints or encapsulation materials due to thermal cycling. The pre-curvature design allows the base plate to better fit the heat sink during installation, ensuring a flatter contact surface after compression, which is beneficial for improving heat conduction efficiency and ensuring heat dissipation.

[0039] Furthermore, the arc-shaped protrusion structure can be one of the following: a spherical cross-section with the same radius, a non-spherical arc surface with different radii at different points on the arc surface, or a parabolic surface; no limitation is made here.

[0040] In some embodiments, along the first direction A, the distance h1 between the short edge of the metal base plate 00 and the highest point O is 0.9mm-1.0mm.

[0041] In some embodiments, along the first direction A, the distance h2 between the long edge of the metal base plate 00 and the highest point O is 1.0mm-2.0mm.

[0042] Specifically, the first direction A refers to the direction of the protrusion of the metal base plate 00. The distance h can also be understood as the distance between the edge of the base plate and the horizontal plane of the highest point O, i.e., the elevation difference. The elevation difference h1 in the short side direction of the metal base plate 00 is 0.9mm-1.0mm, and the elevation difference h2 in the long side direction is 1.0mm-2.0mm. By limiting the distance h between the highest point O and each edge of the base plate in the first direction A, the curvature of the base plate is limited, thermal expansion stress is alleviated, the risk of weld cracking is reduced, and the pressure distribution of the radiator contact surface is optimized, improving the tightness of the contact surface, which is conducive to improving heat conduction efficiency and ensuring heat dissipation effect.

[0043] In some embodiments, the heat dissipation area 21 is provided with a plurality of heat dissipation pins 211, which are arranged in an array. The cross-section of the heat dissipation pins 211 is elliptical, and the ratio of the length of the major axis to the length of the minor axis of the cross-section is 3:1.

[0044] Understandably, the 211 heat sink, or pinfin structure, addresses the issue of traditional cylindrical pinfins creating dead zones in flow. The base plate pinfin structure is designed as an elliptical cylinder, with the major axis of the ellipse aligned with the direction of the cooling water flow. This streamlined design of the elliptical pin reduces turbulence and dead zones compared to other structures, improving heat dissipation efficiency. Furthermore, the aspect ratio of the elliptical pin significantly impacts the heat dissipation surface area, fluid distribution and resistance, and heat transfer efficiency.

[0045] Furthermore, the elliptical cylindrical needle is designed with an aspect ratio of 3:1, which increases the heat dissipation area while keeping the flow resistance within a reasonable range, balancing the heat dissipation surface area and flow resistance, and optimizing fluid distribution.

[0046] As an optional implementation, the horizontal spacing between each ellipse is 4-7mm, and the vertical spacing is 4-7mm.

[0047] By using the elliptical cylindrical Pinfin heat sink 211 design, this solution improves heat dissipation efficiency while avoiding the flow dead zone defect that is easy to generate in traditional cylindrical Pinfins, thus resolving the contradiction between heat dissipation efficiency and flow resistance.

[0048] In some embodiments, reinforcement portions 212 are provided on both sides of the heat dissipation area 21 along the long side of the second surface 20, and the reinforcement portions 212 protrude from the second surface 20. The reinforcement portions 212 are stiffeners; multiple reinforcement portions 212 are provided on the back of the base plate, evenly distributed along the long side of the base plate. This is equivalent to adding an extra support structure to the base plate, which can prevent excessive deformation of the base plate and improve the bending stiffness and torsional performance of the plate. The reinforcement portions 212 can increase the natural frequency of the overall structure, reduce the risk of resonance in a vibration environment, and enhance the vibration resistance of the module, especially in the vibration conditions frequently encountered by automobiles during driving.

[0049] In some embodiments, the height of the reinforcing portion 212 protruding from the second surface 20 is 2-4 mm; the width of the reinforcing portion 212 is 1-3 mm. The reinforcing portion 212 increases the effective cross-sectional area of ​​the base plate, making it more difficult for the base plate to deform when facing bending forces, thus improving the bending resistance of the base plate. The presence of the reinforcing portion 212 can make the stress distribution on the base plate more uniform, reduce local stress concentration, thereby reducing the risk of damage to the base plate when subjected to mechanical loads and extending its service life.

[0050] In some embodiments, the length of the reinforcing part 212 is 160-170mm, the width is 1-3mm, and the height is 2-4mm.

[0051] In some embodiments, a plurality of mounting holes 221 are provided on the metal base plate 00 surrounding the heat dissipation unit for fixed connection with the external cooling water tank and the power module frame. The base plate has water tank mounting holes 221, and bolts 3 are used to fix the base plate to the external cooling water tank, ensuring a firm connection between the water tank and the base plate and reducing loosening caused by vibration, impact, etc.; it can evenly distribute the load of the water tank on the base plate, reducing stress concentration, avoiding damage caused by load concentration, and extending the service life of the base plate and the water tank; it can be used with sealing gaskets to ensure good sealing at the connection between the water tank and the base plate, preventing water or coolant leakage and improving the waterproof performance of the module. The position and size of the mounting holes 221 are precisely designed to ensure accurate alignment during installation and avoid improper installation leading to base plate misalignment or unstable fixation.

[0052] Furthermore, the base plate is provided with module mounting holes 221, which are connected by bolts 3, providing a high clamping force to ensure a firm connection between the module and the base plate, preventing loosening and displacement during operation. This is especially suitable for automotive-grade applications that require structural strength. It also provides good vibration and impact resistance and can adapt to the thermal expansion or contraction of materials, avoiding stress concentration or deformation due to temperature differences.

[0053] Furthermore, the base plate is also equipped with clearance holes 222 to prevent interference between the base plate structure and other structures such as positioning posts when installing power modules, ensuring a tight fit between the module and the base plate and enhancing the overall mechanical stability and reliability.

[0054] In some embodiments, the base plate of this application is integrally formed by CNC machining, which can achieve extremely high machining accuracy, ensure that the size and shape of the base plate meet the design requirements, reduce errors, and thus improve the performance and consistency of the product; it can avoid welding or bonding of different parts, reduce the weakness at the joints and the possible fatigue failure problem, and improve the overall mechanical strength and durability of the base plate; it can precisely cut and carve materials, reduce waste, improve the utilization rate of materials, and help reduce raw material costs.

[0055] This application improves the corrosion resistance and wear resistance of the base plate by plating nickel layers of different thicknesses in different areas, while also enhancing its weldability and heat conduction capacity.

[0056] A second aspect of this application provides a power module, including a power module base plate on which power devices are formed.

[0057] As a possible implementation method, the power device is, for example, but not limited to, an IGBT (Insulated Gate Bipolar Transistor) or a MOS (Metal-Oxide-Semiconductor).

[0058] A third aspect of this application provides a controller, which is a motor drive controller and includes a power module. This motor drive controller is used to control at least one of the motor's speed, output torque, and output power.

[0059] A fourth aspect of this application provides a vehicle, which is a new energy vehicle, including a power module or controller. The new energy vehicle can be a pure electric vehicle or a hybrid electric vehicle, and the hybrid electric vehicle has at least the capability to be driven by an electric motor, which can be driven solely by the electric motor or jointly by the electric motor and other power sources (such as an internal combustion engine).

[0060] The fifth aspect of this application provides a power electronic device, including a power module. This power electronic device may include any type of power electronic device known in the art, such as frequency converters, UPS (uninterruptible power supplies), induction cookers, welding machines, or any other power electronic products or devices, or it may be an intermediate product of the aforementioned power electronic devices, such as a motor drive controller having the power module mounting structure.

[0061] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. It should be noted that the terminology used herein is for describing particular implementations only and is not intended to limit the exemplary implementations according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0062] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0063] In the description of this application, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this application; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0064] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0065] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this application.

[0066] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A power module base plate, characterized in that, include: A metal base plate, comprising a first surface and a second surface disposed opposite to each other, the first surface including a welding area, the second surface including a heat dissipation area and a mounting area, wherein the welding area, the heat dissipation area and the mounting area are respectively plated with nickel layers of different thicknesses.

2. The power module base plate according to claim 1, characterized in that, The nickel layer thickness in the heat dissipation area and the mounting area is greater than that in the welding area.

3. The power module base plate according to claim 1, characterized in that, The thickness of the nickel layer plated in the mounting area is greater than the thickness of the nickel layer plated in the heat dissipation area.

4. The power module base plate according to claim 1, characterized in that, The thickness of the nickel layer plated in the heat dissipation area ranges from 5 to 7 μm.

5. The power module base plate according to claim 1, characterized in that, The thickness of the nickel layer plated in the heat dissipation area ranges from 7 to 10 μm.

6. The power module base plate according to claim 1, characterized in that, The thickness of the nickel plating in the mounting area ranges from 7 to 15 μm.

7. The power module base plate according to claim 1, characterized in that, The metal base plate is bent into a curved shape, with the first surface being a concave arc surface and the second surface being a convex arc surface.

8. The power module base plate according to claim 7, characterized in that, The arc-shaped protrusion structure on the second surface has its highest point at the center of the second surface and gradually descends to the edge along two diagonals.

9. The power module base plate according to claim 8, characterized in that, Along the first direction, the distance between the short edge of the metal base plate and the highest point is 0.9mm-1.0mm.

10. The power module base plate according to claim 8, characterized in that, Along the first direction, the distance between the long edge of the metal base plate and the highest point is 1.0mm-2.0mm.

11. The power module base plate according to claim 1, characterized in that, The heat dissipation area is provided with multiple heat dissipation pins, which are arranged in an array. The cross-section of each heat dissipation pin is elliptical, and the ratio of the length of the major axis to the length of the minor axis of the cross-section is 3:

1.

12. The power module base plate according to claim 1, characterized in that, Along the long side of the second surface, reinforcement portions are provided on both sides of the heat dissipation area, and the reinforcement portions protrude from the second surface.

13. The power module base plate according to claim 12, characterized in that, The height of the reinforcing part protruding from the second surface is 2-4 mm.

14. The power module base plate according to claim 13, characterized in that, The width of the reinforced part is 1-3mm.

15. The power module base plate according to claim 14, characterized in that, The mounting area has multiple mounting holes around the heat dissipation area for fixed connection with the external heat dissipation water tank and the outer frame of the power module.

16. A power module, characterized in that, The power module base plate includes any one of claims 1-15, wherein power devices are formed on the power module base plate.

17. A controller, characterized in that, The controller is a motor drive controller, including the power module as described in claim 16.

18. A car, characterized in that, The vehicle is a new energy vehicle, including the power module as described in claim 16 or the controller as described in claim 17.

19. A power electronic device, characterized in that, Includes the power module as described in claim 16.

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