A power module package structure

Abstract

The application provides a power module packaging structure. The packaging structure comprises a power unit, a support substrate, a heat dissipation plate and a heat conduction unit. The support substrate is located on one side of the power unit in a first direction, and at least one heat transfer unit is arranged on the side of the support substrate away from the power unit. The heat dissipation plate is located on the side of the support substrate away from the power unit in the first direction, and at least one heat dissipation unit is arranged on the side of the heat dissipation plate close to the power unit. The heat dissipation unit and the heat transfer unit are arranged in a preset direction perpendicular to the first direction. The heat conduction unit comprises at least one heat conduction column, the heat conduction column penetrates through the at least one heat transfer unit and the at least one heat dissipation unit, and at least part of the heat generated by the power unit is sequentially transferred to the heat dissipation unit through the heat transfer unit and the heat conduction unit. Based on the arrangement of the heat transfer unit, the heat dissipation unit and the heat conduction column, the packaging structure effectively increases the heat conduction area, expands the heat dissipation path, improves the heat dissipation efficiency and reduces the overall thermal resistance.

Description

Technical Field

[0001] This application belongs to the field of semiconductor module packaging technology, and relates to a power module packaging structure. Background Technology

[0002] Please see Figure 1 , Figure 1 A cross-sectional schematic diagram of a power module packaging structure in the related art is shown. This packaging structure includes a power module 101, a copper base plate 102, thermal grease 103, and a heat sink 104 stacked sequentially from top to bottom. The power module 101 includes multiple chips, and the heat generated by the chips passes sequentially through a solder layer and a DBC substrate to the copper base plate 102. The heat is then conducted through the copper base plate 102 and the thermal grease 103 into the heat sink 104, and finally dissipated to the external environment by the heat sink 104, ensuring that the chip's operating junction temperature is controlled within an allowable range. However, in the heat transfer path of the chips, the thermal conductivity of the thermal grease 103 is significantly lower than that of other components, and its thermal resistance accounts for the majority of the overall heat dissipation path. This results in a relatively high overall thermal resistance of the packaging structure, affecting the overall performance of the power module and the packaging structure.

[0003] Therefore, how to provide a power module packaging structure that reduces the thermal resistance of the power module packaging structure has become an important technical problem that needs to be solved by those skilled in the art.

[0004] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this application. Utility Model Content

[0005] In view of the shortcomings of the prior art described above, the purpose of this application is to provide a power module packaging structure to solve the technical problem of reducing the heat dissipation thermal resistance of the power module in the power module packaging structure of the related art.

[0006] To achieve the above and other related objectives, this application provides a power module packaging structure, including:

[0007] Power unit;

[0008] A supporting base plate is located on one side of the power unit in a first direction, and at least one heat transfer unit is provided on the side of the supporting base plate away from the power unit;

[0009] A heat sink is located on the side of the supporting base plate away from the power unit in the first direction. At least one heat dissipation unit is provided on the side of the heat sink close to the power unit. The heat dissipation unit and the heat transfer unit are arranged in a preset direction, which intersects with the first direction.

[0010] A heat-conducting unit includes at least one heat-conducting column, which passes through at least one heat transfer unit and at least one heat dissipation unit. At least a portion of the heat generated by the power unit is transferred to the heat dissipation unit via the heat transfer unit and the heat-conducting unit in sequence.

[0011] In an optional embodiment, the supporting base plate includes a plurality of heat transfer units, and the plurality of heat transfer units are divided into a plurality of heat transfer unit groups, the plurality of heat transfer unit groups are arranged at intervals in a second direction, and each heat transfer unit group includes at least one heat transfer unit.

[0012] The heat sink includes multiple heat dissipation units, which are further divided into multiple heat dissipation unit groups. These heat dissipation unit groups are spaced apart along the second direction. Each heat dissipation unit group includes at least one heat dissipation unit. The second direction intersects the first direction.

[0013] The heat transfer units in the plurality of heat transfer unit groups and the heat dissipation units in the plurality of heat dissipation unit groups are arranged in a one-dimensional array; or,

[0014] The heat transfer units in the plurality of heat transfer unit groups and the heat dissipation units in the plurality of heat dissipation unit groups are arranged in a two-dimensional array.

[0015] In an optional embodiment, at least one of the heat transfer unit groups includes a plurality of discrete heat transfer units, which are spaced apart in a third-party direction; the heat dissipation unit group includes a plurality of discrete heat dissipation units, which are spaced apart in a third-party direction; and / or,

[0016] At least one of the heat transfer unit groups includes an integrated heat transfer unit that extends upward in a third party; at least one of the heat dissipation unit groups includes an integrated heat dissipation unit that extends upward in a third party.

[0017] Wherein, the third direction intersects with the first direction, and the third direction intersects with the second direction.

[0018] In an optional embodiment, the heat transfer units in the plurality of heat transfer unit groups and the heat dissipation units in the plurality of heat dissipation unit groups are arranged in a two-dimensional array, including: each heat transfer unit group includes a plurality of discrete heat transfer units, and a first groove is formed between any two adjacent discrete heat transfer units.

[0019] Each heat dissipation unit group includes multiple discrete heat dissipation units, and a second groove is formed between any two adjacent discrete heat dissipation units.

[0020] The discrete heat transfer unit is embedded in the second groove, the discrete heat dissipation unit is embedded in the first groove, and the conductive post penetrates at least one discrete heat transfer unit and at least one discrete heat dissipation unit in the second direction or the third direction.

[0021] In an optional embodiment, the heat transfer units in the plurality of heat transfer unit groups and the heat dissipation units in the plurality of heat dissipation unit groups are arranged in a one-dimensional array, including:

[0022] Each heat transfer unit group includes an integrated heat transfer unit, with a first groove formed between any two adjacent integrated heat transfer units; each heat dissipation unit group includes an integrated heat dissipation unit, with a second groove formed between any two adjacent integrated heat dissipation units; wherein,

[0023] The integrated heat transfer unit is embedded in the second groove, the integrated heat dissipation unit is embedded in the first groove, and the conductive post penetrates at least one integrated heat transfer unit and at least one integrated heat dissipation unit in the second direction.

[0024] In an optional embodiment, the heat-conducting column and the heat transfer unit through which the heat-conducting column passes are interference-fitted together with the heat dissipation unit.

[0025] In an optional embodiment, the heat-conducting column is cylindrical, the diameter of the heat-conducting column is D, the interference of the interference fit connection is k, and the range of k / D is 0.001 to 0.01.

[0026] In an optional embodiment, the power module packaging structure further includes a thermally conductive material layer, which fills the gap between the supporting base plate and the heat sink.

[0027] In an optional embodiment, the thermal conductivity of the heat-conducting pillar is greater than that of the heat-conducting material layer.

[0028] In an optional embodiment, the power unit includes a packaging substrate and a chipset, wherein the chipset is disposed on the side of the packaging substrate away from the supporting base plate.

[0029] As described above, the power module packaging structure of this application, based on the arrangement of heat transfer and heat dissipation units, effectively increases the heat conduction area to reduce the overall thermal resistance. Furthermore, the arrangement of heat conduction pillars further expands the heat dissipation path within the packaging structure, thereby improving heat dissipation efficiency, effectively reducing the overall thermal resistance, and achieving a rapid decrease in the junction temperature of the power unit. This contributes to improving the operational stability and reliability of the power module. Attached Figure Description

[0030] Figure 1 This is a cross-sectional schematic diagram of the power module packaging structure in related technologies;

[0031] Figure 2 This is a cross-sectional schematic diagram of the power module packaging structure provided in the embodiments of this application;

[0032] Figure 3 This is a first cross-sectional schematic diagram of the power module packaging structure provided in the embodiments of this application;

[0033] Figure 4 This is a second cross-sectional schematic diagram of the power module packaging structure provided in the embodiments of this application.

[0034] Explanation of reference numerals in the attached figures:

[0035] 101-Power module, 102-Copper base plate, 103-Thermal grease, 104-Heat sink;

[0036] 10-Power unit, 11-Packaging substrate, 11a-DBC substrate, 111-First copper layer, 112-Insulating layer, 113-Second copper layer, 12-Chipset, 121-First chip, 122-Second chip, 13-First solder layer, 14-Second solder layer;

[0037] 20-Supporting base plate, 21-Heat transfer unit, 21a-Discrete heat transfer unit, 21b-Integrated heat transfer unit, 22-Supporting main body;

[0038] 30-Heat dissipation plate, 31-Heat dissipation unit, 31a-Discrete heat dissipation unit, 31b-Integrated heat dissipation unit, 32-Heat dissipation body;

[0039] 41 - Thermal conductive pillar; 50 - Thermal conductive material layer. Detailed Implementation

[0040] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application.

[0041] Please see Figures 1 to 4 It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this application. Therefore, the drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0042] After analyzing the technical issues mentioned in the background, it is understood that heat conduction occurs through conduction, convection, and radiation. In power module packaging structures, due to internal structure and mounting connections, the heat generated by the chips within the power module is primarily conducted via conduction and convection in the heat dissipation path; heat dissipated through radiation is minimal and negligible. Furthermore, the packaging substrate, needing to adapt to the structure and electrical connections of the power module, is difficult to significantly adjust. Therefore, improvements to the copper base plate and heat sink can be considered to reduce thermal resistance. Thus, while maintaining the material of each structural layer in the power module packaging structure, to reduce overall thermal resistance and improve thermal conductivity, it is possible to consider increasing the thermally conductive area and reducing contact resistance. Specific technical solutions are detailed below.

[0043] This application provides a power module packaging structure (hereinafter referred to as "packaging structure"). Please refer to [link to relevant documentation]. Figure 2 , Figure 2 A cross-sectional schematic diagram of the packaging structure is shown. The packaging structure includes a power unit 10, a support substrate, a heat dissipation substrate, and a heat-conducting unit.

[0044] Specifically, the support base plate 20 is located on one side of the power unit 10 in the first direction Z, and at least one heat transfer unit 21 is provided on the side of the support base plate 20 away from the power unit 10. The heat dissipation plate 30 is located on the side of the support base plate 20 away from the power unit 10 in the first direction Z, and at least one heat dissipation unit 31 is provided on the side of the heat dissipation plate 30 close to the power unit 10. The heat dissipation unit 31 and the heat transfer unit 21 are arranged in a preset direction, which intersects with the first direction Z. The heat conduction unit (not labeled) includes at least one heat conduction column 41, which penetrates at least one heat transfer unit 21 and at least one heat dissipation unit 31 (please refer to the relevant documentation). Figure 3 and Figure 4 At least a portion of the heat generated by the power unit 10 is transferred to the heat dissipation unit 31 via the heat transfer unit 21 and the heat conduction unit in sequence.

[0045] In this embodiment, a heat transfer unit 21 and a heat dissipation unit 31 are respectively provided on the surfaces of the supporting base plate 20 and the heat sink 30 facing each other (the heat transfer unit 21 protrudes towards the heat sink 30, and the heat dissipation unit 31 protrudes towards the supporting base plate 20). Compared with the packaging structure in related technologies, where the surfaces between the copper base plate, thermal grease and heat sink are planar structures, this effectively increases the heat conduction area, helps to reduce the thermal resistance between the supporting base plate 20 and the heat sink 30, thereby reducing the total thermal resistance and lowering the junction temperature of the power unit 10. Furthermore, a heat-conducting pillar 41 is provided to penetrate at least one heat transfer unit 21 and one heat dissipation unit 31, so that a portion (a relatively large portion) of the heat generated by the power unit 10 is sequentially transferred to the heat dissipation unit 31 via the heat transfer unit 21 and the heat conduction unit. Compared to the structure of related technologies, which relies solely on thermal grease to transfer the heat from the copper base plate to the heat sink (vertical heat dissipation path), this effectively expands the heat dissipation path (increases the lateral heat dissipation path), thereby improving heat dissipation efficiency and significantly reducing the overall thermal resistance. This allows for a rapid reduction in the junction temperature of the chip, thereby improving the operational stability (e.g., operational stability) and reliability of the power module. Moreover, the increased thermal conductivity area achieved by the above method does not increase the area of ​​the power package module, making it particularly suitable for electronic devices with stringent size and space requirements.

[0046] In some embodiments, please refer to Figure 3 and Figure 4 ,in, Figure 3 and Figure 4 Two cross-sectional schematic diagrams of the encapsulation structure are shown. The supporting base plate 20 includes multiple heat transfer units 21, which are divided into multiple heat transfer unit groups (not labeled). These groups are spaced apart in the second direction Y, and each group includes at least one heat transfer unit 21. The heat sink 30 includes multiple heat dissipation units 31, which are divided into multiple heat dissipation unit groups (not labeled). These groups are spaced apart in the second direction Y, and each group includes at least one heat dissipation unit 31. The second direction Y intersects the first direction Z (e.g., perpendicularly). The heat transfer units 21 in the multiple heat transfer unit groups and the heat dissipation units 31 in the multiple heat dissipation unit groups are arranged in a one-dimensional array. Alternatively, the heat transfer units 21 in the multiple heat transfer unit groups and the heat dissipation units 31 in the multiple heat dissipation unit groups are arranged in a two-dimensional array.

[0047] In this embodiment, by setting up regularly arranged heat transfer unit groups and heat dissipation unit groups, the heat distribution and heat dissipation path inside the packaging structure are made more regular, which is convenient for optimization and manufacturing. Furthermore, heat transfer unit groups, heat dissipation unit groups, and heat conduction pillars 41 with different distribution densities can be flexibly arranged according to the heat generation in different areas of the power unit 10, which can achieve enhanced heat dissipation in local areas and is more conducive to ensuring the reliability of the power unit 10.

[0048] In this embodiment, the specific structure of the heat transfer unit group and the heat conduction unit group includes one or a combination of the following two methods:

[0049] Method 1: For example Figure 3 As shown, where, Figure 3 It can also be regarded as along Figure 2 A cross-sectional schematic diagram at point I-I'. At least one heat transfer unit group includes multiple discrete heat transfer units 21a, which are spaced apart in the third direction X. The heat dissipation unit group includes multiple discrete heat dissipation units 31a, which are spaced apart in the third direction X.

[0050] Method 2: For example Figure 4 As shown, at least one heat transfer unit group includes an integrated heat transfer unit 21b extending in a third direction X, and at least one heat dissipation unit group includes an integrated heat dissipation unit 31b extending in a third direction X. The third direction X intersects (e.g., perpendicularly) the first direction Z, and intersects (e.g., perpendicularly) the second direction Y.

[0051] Furthermore, such as Figure 3 As shown, the heat transfer units 21 in the multiple heat transfer unit groups and the heat dissipation units 31 in the multiple heat dissipation unit groups are arranged in a two-dimensional array. Each heat transfer unit group includes multiple discrete heat transfer units 21a. The discrete heat transfer units 21a in any two adjacent heat transfer unit groups are staggered, and a first groove is formed between any two adjacent discrete heat transfer units 21a (this first groove is formed between any two adjacent discrete heat transfer units 21a in the second direction Y and between any two adjacent discrete heat transfer units 21a in the third direction X; the first groove is not labeled). Each heat dissipation unit group includes multiple discrete heat dissipation units 31a. The discrete heat dissipation units 31a in any two adjacent heat dissipation unit groups are staggered, and a second groove is formed between any two adjacent discrete heat dissipation units 31a (this second groove is formed between any two adjacent discrete heat dissipation units 31a in the second direction Y and between any two adjacent discrete heat dissipation units 31a in the third direction X; the second groove is not labeled). In this design, a discrete heat transfer unit 21a is embedded in the second groove, and a discrete heat dissipation unit 31a is embedded in the first groove. A conductive post 41 penetrates at least one discrete heat transfer unit 21a and at least one discrete heat dissipation unit 31a in the second direction Y or the third direction X. It should be noted that... Figure 3As shown, the conductive post 41 passes through multiple discrete heat transfer units 21a and multiple discrete heat dissipation units 31a in the second direction Y. In actual applications, multiple discrete heat transfer units 21a and multiple discrete heat dissipation units 31b can also pass through in the third direction X.

[0052] In this embodiment, by arranging multiple discrete heat transfer units 21a in the heat transfer unit group and multiple discrete heat dissipation units 31a in the heat dissipation unit group, the multiple discrete heat transfer units 21a and multiple discrete heat dissipation units 31a can be staggered and interlocked in the two-dimensional direction, maximizing the thermal conductivity area between the support base plate 20 and the heat dissipation plate 30. Simultaneously, this structure also helps improve the overall connection stability of the packaging structure.

[0053] Furthermore, such as Figure 4 As shown, the heat transfer units 21 in multiple heat transfer unit groups and the heat dissipation units 31 in multiple heat dissipation unit groups are arranged in a one-dimensional array. Each heat transfer unit group includes an integrated heat transfer unit 21b, with a first groove (not labeled) formed between any two adjacent integrated heat transfer units 21b. Each heat dissipation unit group includes an integrated heat dissipation unit 31b, with a second groove (not labeled) formed between any two adjacent integrated heat dissipation units 21b. The integrated heat transfer unit 21b is embedded in the second groove, and the integrated heat dissipation unit 31b is embedded in the first groove. A conductive post penetrates at least one integrated heat transfer unit 21b and at least one integrated heat dissipation unit 31b in the second direction Y.

[0054] In this embodiment of the application, by setting an integrated heat transfer unit 21b in the heat transfer unit group and an integrated heat dissipation unit 31b in the heat dissipation unit group, the processing difficulty can be reduced while satisfying the requirements of heat conduction area and heat conduction column 41 to reduce overall thermal resistance. It also helps to ensure the mechanical structural stability of the packaging structure (for example, it increases the bending and deformation resistance of the support base plate 20 and the heat dissipation plate 30).

[0055] In some embodiments, such as Figure 2 As shown, in a direction perpendicular to the second direction Y (e.g., the plane formed by the first direction Z and the third direction X), the heat transfer unit 21 has a rectangular or trapezoidal cross-section. And / or, the heat dissipation unit 31 has a rectangular or trapezoidal cross-section. The trapezoidal cross-section can serve as a guide to facilitate assembly, and after the heat-conducting pillar 41 is embedded in the heat transfer unit 21 and the heat dissipation unit 31, a relatively high stress distribution can be ensured. Compared to the trapezoidal cross-section, the rectangular cross-section of the heat transfer unit 21 or heat-conducting unit is easier to process, saving costs and improving yield.

[0056] In some embodiments, the heat-conducting column 41 is interference-fitted with the heat transfer unit 21 and the heat dissipation unit 31 through which the heat-conducting column 41 passes. Here, "interference-fitted connection" means that the cross-sectional area of ​​the through-hole in the heat transfer unit 21 and the heat dissipation unit 31 that allows the heat-conducting column 41 to pass through in its extending direction is smaller than the cross-sectional area of ​​the heat-conducting column 41 in that direction. This results in the heat-conducting column 41 being embedded in the heat transfer unit 21 and the heat dissipation unit 31 (e.g., by applying external force to press the heat-conducting column 41 into the through-hole), and pressure and friction are generated at the contact surface between the heat-conducting column 41 and the heat transfer unit 21 or the heat dissipation unit 31 due to their own elastic deformation, thereby securing the connection.

[0057] In this embodiment, the interference fit between the heat-conducting pillar 41 and the heat transfer unit 21 and the heat dissipation unit 31 squeezes out the air at their contact surfaces, ensuring close contact between the heat-conducting pillar 41 and the heat transfer unit 21 (and the heat dissipation unit 31). This significantly reduces the contact thermal resistance and interface thermal resistance between them, ensuring efficient heat transfer from the heat transfer unit 21 to the heat dissipation unit 31 and effectively reducing the overall thermal resistance of the packaging structure. Simultaneously, the interference fit also ensures the connection stability between the heat-conducting pillar 41 and the heat transfer unit 21 and the heat dissipation unit 31, thereby guaranteeing the overall structural stability of the packaging structure.

[0058] In some embodiments, the heat-conducting pillar 41 is cylindrical with a diameter of D. The interference fit of the heat-conducting pillar 41 is k, and the range of k / D is 0.001 to 0.01. For example, k / D can be 0.001, 0.005, 0.008, or 0.01. In practical applications, the specific value of k / D is adjusted within the above range based on the structural parameters of the heat transfer unit 21, the heat dissipation unit 31, and the heat-conducting pillar 41. If k / D is too small (e.g., less than 0.001), the contact between the heat-conducting pillar 41 and the heat transfer unit 21 and the heat dissipation unit 31 will be insufficient. In addition to affecting the connection stability, it will also lead to an insignificant reduction in thermal resistance, or even an increase in thermal resistance. If k / D is too large (e.g., greater than 0.01), it will increase the assembly difficulty of the heat-conducting pillar 41. After the heat-conducting pillar 41 is embedded in the heat transfer unit 21 or the heat dissipation unit 31, the heat transfer unit 21 or the heat dissipation unit 31 may be damaged due to excessive stress, or the supporting base plate 20 or the heat dissipation plate 30 may be deformed, thus affecting the overall performance of the packaging structure.

[0059] In some embodiments, such as Figures 2 to 4As shown, the supporting base plate 20 also includes a supporting body 22, with the heat transfer unit 21 connected to the supporting body 22. The heat sink 30 also includes a heat dissipation body 32, with the heat dissipation unit 21 connected to the heat dissipation body 32. On a plane perpendicular to the first direction, the projection of the functional unit 10 at least partially coincides with the projection of the area of ​​the supporting base plate 20 where the heat transfer unit 21 is located and the projection of the area of ​​the heat sink 30 where the heat dissipation unit 31 is located. In a specific example, the projection of the functional unit 10 on this plane is located inside the projection of the area of ​​the supporting plate 20 where the heat dissipation body 32 is located and the projection of the area of ​​the heat sink 30 where the heat dissipation unit 31 is located. That is, the supporting base plate 20 and the heat sink 30 are provided with heat transfer units 21 and heat dissipation units 31 in local areas for the functional unit 10 to achieve efficient heat dissipation for the functional unit 10. Other areas of the supporting base plate 20 mainly provide support for the functional unit, while other areas of the heat sink 30 mainly dissipate the heat transferred to its interior to the surrounding environment to ensure heat dissipation efficiency.

[0060] In some embodiments, such as Figures 2 to 4 As shown, the power module packaging structure also includes a thermally conductive material layer 50, which fills the gap between the support base plate 20 and the heat sink 30. For example, the thermally conductive material layer 50 can fill the gap between the support body 22 and the heat sink 31, the gap between the side wall of the heat transfer unit 21 and the side wall of the heat sink 31, and the gap between the heat transfer unit 21 and the heat sink body 32, etc.

[0061] In some embodiments, the thermal conductivity of the heat-conducting pillar 41 is greater than that of the heat-conducting material layer 50. Further, the ratio between the thermal conductivity of the heat-conducting pillar 41 and the thermal conductivity of the heat-conducting material layer 50 is greater than or equal to 50, to fully utilize the efficient heat conduction effect of the heat-conducting pillar 41. For example, the heat-conducting material layer 50 can be thermal grease, and the heat-conducting pillar 41 can be a metal pillar, such as a copper pillar or an aluminum pillar, or a copper pillar mixed with graphite, etc.

[0062] In this embodiment, the thermally conductive material layer 50 fills the gap between the support base plate 20 and the heat sink 21, eliminating the influence of air trapped in the microscopic unevenness of their surfaces on thermal resistance. In this embodiment, when a thermally conductive unit is provided (serving as the main heat dissipation path), the thermally conductive material layer 50 serves as an auxiliary heat dissipation path, transferring a small amount of heat from the support base plate 20 to the heat sink 30. This prevents heat from accumulating in the support base plate 20 and failing to dissipate in time, thus affecting the performance of the power unit 10.

[0063] In some embodiments, such as Figure 2As shown, the power unit 10 includes a packaging substrate 11 and a chipset 12, with the chipset 12 disposed on the side of the packaging substrate 11 away from the support base plate 20. In a specific example, the packaging substrate 11 includes a Direct Bonded Copper (DBC) substrate 11a, which includes a first copper layer 111, an insulating layer 112, and a second copper layer 113 stacked sequentially. The insulating layer 112 can be a ceramic layer. The chipset 12 includes multiple discretely disposed chips, such as a first chip 121 and a second chip 122 (the types of the first chip 121 and the second chip 122 can be the same or different). Furthermore, the chipset 12 is connected to the packaging substrate 11 via a first bonding layer 13. In addition, the power unit 10 can also be connected to the support base plate 20 via a second bonding layer 14.

[0064] In summary, the power module packaging structure of this application, based on the arrangement of heat transfer and heat dissipation units, effectively increases the heat conduction area to reduce the overall thermal resistance. Furthermore, the arrangement of heat conduction pillars further expands the heat dissipation path within the packaging structure, thereby improving heat dissipation efficiency, effectively reducing the overall thermal resistance, and achieving a rapid decrease in the junction temperature of the power unit. This contributes to improving the operational stability and reliability of the power module. Therefore, this application effectively overcomes the various shortcomings of the prior art and has high industrial applicability.

[0065] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this application should still be covered by the claims of this application.

Claims

1. A power module packaging structure, characterized in that, include: Power unit; A supporting base plate is located on one side of the power unit in a first direction, and at least one heat transfer unit is provided on the side of the supporting base plate away from the power unit; A heat sink is located on the side of the supporting base plate away from the power unit in the first direction. At least one heat dissipation unit is provided on the side of the heat sink close to the power unit. The heat dissipation unit and the heat transfer unit are arranged in a preset direction, which intersects with the first direction. A heat-conducting unit includes at least one heat-conducting column that passes through at least one heat transfer unit and at least one heat dissipation unit. At least a portion of the heat generated by the power unit is transferred to the heat dissipation unit via the heat transfer unit and the heat-conducting unit in sequence.

2. The power module packaging structure according to claim 1, characterized in that: The supporting base plate includes a plurality of heat transfer units, and the plurality of heat transfer units are divided into a plurality of heat transfer unit groups. The plurality of heat transfer unit groups are arranged at intervals in a second direction, and each heat transfer unit group includes at least one heat transfer unit. The heat sink includes multiple heat dissipation units, which are further divided into multiple heat dissipation unit groups. These heat dissipation unit groups are spaced apart along the second direction. Each heat dissipation unit group includes at least one heat dissipation unit. The second direction intersects the first direction. The heat transfer units in the plurality of heat transfer unit groups and the heat dissipation units in the plurality of heat dissipation unit groups are arranged in a one-dimensional array; or, The heat transfer units in the plurality of heat transfer unit groups and the heat dissipation units in the plurality of heat dissipation unit groups are arranged in a two-dimensional array.

3. The power module packaging structure according to claim 2, characterized in that: At least one of the heat transfer unit groups includes a plurality of discrete heat transfer units, the plurality of discrete heat transfer units being arranged at intervals in a third-party direction; the heat dissipation unit group includes a plurality of discrete heat dissipation units, the plurality of discrete heat transfer units being arranged at intervals in a third-party direction; and / or, At least one of the heat transfer unit groups includes an integrated heat transfer unit that extends upward in a third party; at least one of the heat dissipation unit groups includes an integrated heat dissipation unit that extends upward in a third party. Wherein, the third direction intersects with the first direction, and the third direction intersects with the second direction.

4. The power module packaging structure according to claim 3, characterized in that, The heat transfer units in the plurality of heat transfer unit groups and the heat dissipation units in the plurality of heat dissipation unit groups are arranged in a two-dimensional array, including: Each heat transfer unit group includes multiple discrete heat transfer units, with a first groove formed between any two adjacent discrete heat transfer units; each heat dissipation unit group includes multiple discrete heat dissipation units, with a second groove formed between any two adjacent discrete heat dissipation units; wherein, The discrete heat transfer unit is embedded in the second groove, the discrete heat dissipation unit is embedded in the first groove, and the conductive post penetrates at least one discrete heat transfer unit and at least one discrete heat dissipation unit in the second direction or the third direction.

5. The power module packaging structure according to claim 3, characterized in that, The heat transfer units in the plurality of heat transfer unit groups and the heat dissipation units in the plurality of heat dissipation unit groups are arranged in a one-dimensional array, including: Each heat transfer unit group includes an integrated heat transfer unit, with a first groove formed between any two adjacent integrated heat transfer units; each heat dissipation unit group includes an integrated heat dissipation unit, with a second groove formed between any two adjacent integrated heat dissipation units; wherein, The integrated heat transfer unit is embedded in the second groove, the integrated heat dissipation unit is embedded in the first groove, and the conductive post penetrates at least one integrated heat transfer unit and at least one integrated heat dissipation unit in the second direction.

6. The power module packaging structure according to claim 1, characterized in that: The heat transfer unit and the heat dissipation unit are connected by an interference fit through the heat-conducting column.

7. The power module packaging structure according to claim 6, characterized in that, The heat-conducting column is cylindrical with a diameter of D. The interference fit of the heat-conducting column is k, and the range of k / D is 0.001 to 0.

01.

8. The power module packaging structure according to claim 1, characterized in that, The power module packaging structure also includes a thermally conductive material layer, which fills the gap between the supporting base plate and the heat sink.

9. The power module packaging structure according to claim 8, characterized in that: The thermal conductivity of the heat-conducting column is greater than that of the heat-conducting material layer.

10. The power module packaging structure according to claim 1, characterized in that: The power unit includes a packaging substrate and a chipset, with the chipset disposed on the side of the packaging substrate away from the supporting base plate.

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