Single-chip multi-level package fixing structure

Abstract

The utility model discloses a single chip multilayer encapsulation fixed structure, especially in chip packaging technical field, including: substrate, the upside of substrate is provided with a plurality of soldering pads, the upside of substrate is equipped with the locating frame, the outside of locating frame is wrapped with the protective cover, the inside nest of locating frame has the buffer seat, single chip, the single chip is inlayed in the buffer seat, the bottom of single chip is equipped with the solder ball with each soldering pad's position, the upside of single chip is equipped with the extrusion support ring, the heat dissipation subassembly, the heat dissipation subassembly includes the heat conduction board, the heat dissipation board and a plurality of heat conduction columns, be equipped with the heat conduction gum pad between heat conduction board and single chip, the heat dissipation board and heat conduction board are connected through a plurality of heat conduction columns between. The utility model discloses through the setting of locating frame, protective cover, buffer seat, extrusion support ring and heat dissipation subassembly, can realize single chip's high reliability mechanical fixation, improves single chip's heat dissipation effect, strengthens the encapsulation shock resistance.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, specifically to a single-chip multi-level packaging fixing structure. Background Technology

[0002] As integrated circuit manufacturing technology enters the nanometer era, the number of transistors and operating frequency of a single chip continue to increase, leading to a continuous increase in power consumption density. Currently, the power consumption of mainstream high-performance processors, power amplifiers, AI accelerator chips, and automotive / avionics control units exceeds 50 W, with local heat flux densities reaching 100 W / cm². 2 The above points illustrate the point. If heat cannot be dissipated in time, the chip junction temperature will rise exponentially, leading to performance degradation, increased leakage current, and even premature failure. On the other hand, in harsh environments such as automotive, airborne, and industrial control systems, electronic components must withstand random vibrations, mechanical shocks, thermal cycling, and damp heat stress. This requires the packaging structure to achieve efficient heat dissipation while also possessing sufficient mechanical strength and fatigue life.

[0003] Existing technologies typically employ the following approach for packaging and heat dissipation of single chips: pads are arranged on the upper surface of a substrate, the chip is interconnected with the pads via solder balls in a flip-chip configuration, and then the entire chip is injection molded or potted to form a molded enclosure. This structure is mature and low-cost, but the molding compound has low thermal conductivity, the chip's heat is mainly conducted outward from the bottom substrate, the heat dissipation path is singular, and its impact resistance is poor, making it difficult to meet the heat dissipation requirements of high-power devices. Utility Model Content

[0004] The purpose of this invention is to provide a single-chip multi-level packaging and fixing structure to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a single-chip multi-level packaging fixing structure, comprising: A substrate, wherein a plurality of pads are provided on the upper side of the substrate, a positioning frame is provided on the upper side of the substrate, the pads are located within the positioning frame, a protective cover is wrapped around the outside of the positioning frame, and a buffer seat is nested inside the positioning frame. A single chip is embedded in a buffer socket. Solder balls are provided at the bottom of the single chip corresponding to the positions of each of the pads. The solder balls are connected to the pads. A compression support ring is provided on the upper side of the single chip. A heat dissipation assembly includes a heat-conducting plate, a heat sink, and multiple heat-conducting pillars. The heat-conducting plate is disposed on an extrusion support ring. A heat-conducting pad is provided between the heat-conducting plate and the single chip. The heat sink is embedded on the upper side of a protective cover. The heat sink and the heat-conducting plate are connected by the multiple heat-conducting pillars.

[0006] Furthermore, a chip placement slot is provided on the upper side of the buffer seat, and through holes are provided on the bottom wall of the chip placement slot corresponding to the positions of each of the pads, and the single chip is nested in the chip placement slot.

[0007] Furthermore, the non-active area of ​​the single chip is bonded to the bottom of the chip placement groove with epoxy adhesive.

[0008] Furthermore, a stepped platform is fixed to the inner wall of the positioning frame at the position corresponding to the top edge of the buffer seat. The extrusion support ring overlaps and is bonded to the stepped platform. The bottom of the extrusion support ring is provided with an extrusion protrusion at the edge of the single chip. The lower side of the extrusion protrusion abuts against the edge of the single chip. The extrusion support ring applies uniform pressure to the edge of the single chip through the extrusion protrusion to prevent warping and solder ball fatigue.

[0009] Furthermore, the thermally conductive pad is nested within the extrusion support ring, and the heat sink is nested within the positioning frame.

[0010] Furthermore, the upper surface of the heat sink is integrally formed with parallel fins, which increases the heat dissipation area and improves the heat dissipation effect.

[0011] Furthermore, the heat-conducting column is a copper column with good thermal conductivity, which can effectively transfer the heat from the heat-conducting plate to the heat sink.

[0012] Furthermore, the buffer seat is made of polyimide-glass fiber composite material, and the outer wall of the buffer seat is bonded to the inner wall of the positioning frame by adhesive. The polyimide-glass fiber composite material has high heat resistance and low coefficient of thermal expansion, which effectively relieves thermal stress.

[0013] The technical effects and advantages provided by this utility model in the above technical solution are as follows: 1. By setting up a positioning frame, protective cover, buffer seat, compression support ring and heat dissipation components, a highly reliable mechanical fixation of the single chip can be achieved, the heat dissipation effect of the single chip can be improved, and the impact resistance of the package can be enhanced. 2. The design of the compression support ring provides continuous downward mechanical constraint, enhances the reliability of the solder joint, and effectively prevents single chips from floating. 3. The bottom of the single chip dissipates heat through the substrate, and the top dissipates heat through the heat dissipation component, achieving double-sided heat dissipation of the chip, which greatly improves the heat dissipation effect. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the appearance of the present utility model; Figure 3 This is a schematic diagram of the extrusion support ring of this utility model; Figure 4 This is a schematic diagram of the heat dissipation component of this utility model.

[0016] Explanation of reference numerals in the attached figures: 1. Substrate; 2. Pad; 3. Positioning frame; 4. Protective cover; 5. Buffer seat; 6. Extrusion support ring; 7. Single chip; 8. Solder ball; 9. Heat-conducting plate; 10. Heat sink; 11. Heat-conducting pillar; 12. Heat-conducting pad; 13. Chip placement slot; 14. Through hole; 15. Parallel fin; 16. Stepped platform; 17. Extrusion protrusion. Detailed Implementation

[0017] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0018] This utility model provides, for example Figures 1 to 4 The single-chip multi-level packaging fixed structure shown includes: The substrate 1 has multiple pads 2 on its upper side and a positioning frame 3 on its upper side. The pads 2 are located inside the positioning frame 3. A protective cover 4 is wrapped around the outside of the positioning frame 3, and a buffer seat 5 is nested inside the positioning frame 3. A single chip 7 is embedded in a buffer seat 5. Solder balls 8 are provided at the bottom of the single chip 7 corresponding to the positions of each pad 2. The solder balls 8 are connected to the pads 2. A compression support ring 6 is provided on the upper side of the single chip 7. The heat dissipation assembly includes a heat-conducting plate 9, a heat sink 10, and multiple heat-conducting pillars 11. The heat-conducting plate 9 is disposed on the extrusion support ring 6. A heat-conducting pad 12 is provided between the heat-conducting plate 9 and the single chip 7. The heat sink 10 is embedded on the upper side of the protective cover 4. The heat sink 10 and the heat-conducting plate 9 are connected by multiple heat-conducting pillars 11.

[0019] A chip placement slot 13 is provided on the upper side of the buffer seat 5. Through holes 14 are provided on the bottom wall of the chip placement slot 13 corresponding to the positions of each pad 2. A single chip 7 is nested in the chip placement slot 13.

[0020] The non-active area of ​​the single chip 7 is bonded to the bottom of the chip placement groove 13 with epoxy adhesive.

[0021] The inner wall of the positioning frame 3 is fixed with a stepped platform 16 at the position corresponding to the top edge of the buffer seat 5. The extrusion support ring 6 overlaps and is bonded to the stepped platform 16. The bottom of the extrusion support ring 6 is provided with an extrusion protrusion 17 corresponding to the edge of the single chip 7. The lower side of the extrusion protrusion 17 abuts against the edge of the single chip 7. The extrusion support ring 6 applies uniform pressure to the edge of the single chip 7 through the extrusion protrusion 17 to prevent warping and solder ball fatigue.

[0022] The thermally conductive pad 12 is nested inside the compression support ring 6, and the heat sink 10 is nested inside the positioning frame 3.

[0023] The upper surface of the heat sink 10 is integrally formed with parallel fins 15, which increases the heat dissipation area and improves the heat dissipation effect.

[0024] The heat-conducting column 11 is a copper column with good thermal conductivity, which can effectively transfer the heat from the heat-conducting plate 9 to the heat sink 10.

[0025] The buffer seat 5 is made of polyimide-glass fiber composite material. The outer wall of the buffer seat 5 is connected to the inner wall of the positioning frame 3 by adhesive. The polyimide-glass fiber composite material has high heat resistance and low coefficient of thermal expansion, which effectively relieves thermal stress.

[0026] In this invention, the buffer seat 5 is nested within the positioning frame 3, and the single chip 7 is embedded within the buffer seat 5, achieving lateral positioning of the single chip 7. At the same time, the buffer seat 5 absorbs mechanical impacts, such as those generated during drops or vibrations, preventing fatigue cracking of the solder balls. The non-active area of ​​the single chip 7 is bonded to the bottom of the chip placement groove 13 with epoxy adhesive, preventing the single chip 7 from moving within the chip placement groove 13 and improving the stability of the single chip 7 placement. The compression support ring 6 provides continuous downward mechanical constraint, enhancing the reliability of the solder joints and effectively preventing the single chip 7 from floating upwards, further ensuring the stability of the single chip 7 placement. The bottom of the single chip 7 dissipates heat through the substrate 1, and the top dissipates heat through the heat dissipation component, achieving double-sided heat dissipation of the chip and greatly improving the heat dissipation effect.

[0027] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A single-chip multi-level packaging fixing structure, characterized in that, include: The substrate (1) has multiple pads (2) on its upper side and a positioning frame (3) on its upper side. The pads (2) are located inside the positioning frame (3). The positioning frame (3) is wrapped with a protective cover (4) on its outer side and a buffer seat (5) is nested inside the positioning frame (3). A single chip (7) is embedded in a buffer seat (5). Solder balls (8) are provided at the bottom of the single chip (7) corresponding to the positions of each of the pads (2). The solder balls (8) are connected to the pads (2). A compression support ring (6) is provided on the upper side of the single chip (7). The heat dissipation assembly includes a heat-conducting plate (9), a heat sink (10), and multiple heat-conducting pillars (11). The heat-conducting plate (9) is disposed on the extrusion support ring (6). A heat-conducting pad (12) is provided between the heat-conducting plate (9) and the single chip (7). The heat sink (10) is embedded on the upper side of the protective cover (4). The heat sink (10) and the heat-conducting plate (9) are connected by multiple heat-conducting pillars (11).

2. The single-chip multi-level packaging fixing structure according to claim 1, characterized in that: The upper side of the buffer seat (5) is provided with a chip placement slot (13), and the bottom wall of the chip placement slot (13) is provided with through holes (14) corresponding to the positions of each of the pads (2). The single chip (7) is nested in the chip placement slot (13).

3. The single-chip multi-level packaging fixing structure according to claim 2, characterized in that: The non-active area of ​​the single chip (7) is bonded to the bottom of the chip placement groove (13) with epoxy adhesive.

4. The single-chip multi-level packaging fixing structure according to claim 1, characterized in that: The inner wall of the positioning frame (3) is fixed with a stepped platform (16) at the position of the top edge of the buffer seat (5). The extrusion support ring (6) overlaps and is bonded to the stepped platform (16). The bottom of the extrusion support ring (6) is provided with an extrusion protrusion (17) corresponding to the edge of the single chip (7). The lower side of the extrusion protrusion (17) abuts against the edge of the single chip (7).

5. The single-chip multi-level packaging fixing structure according to claim 1, characterized in that: The thermally conductive pad (12) is nested inside the compression support ring (6), and the heat sink (10) is nested inside the positioning frame (3).

6. The single-chip multi-level packaging fixing structure according to claim 1, characterized in that: The upper surface of the heat sink (10) is integrally formed with parallel fins (15).

7. The single-chip multi-level packaging fixing structure according to claim 1, characterized in that: The heat-conducting column (11) is a column made of copper.

8. The single-chip multi-level packaging fixing structure according to claim 1, characterized in that: The buffer seat (5) is made of polyimide-glass fiber composite material, and the outer wall of the buffer seat (5) is connected to the inner wall of the positioning frame (3) by adhesive.

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