An island structure for reducing the air gap between a chip and an optocoupler holder

Abstract

The utility model relates to a light coupling technical field especially relates to a base island structure for reducing the cavity between chip and light coupling support, through setting up the vacuum portion containing exhaust groove on the base island surface, and arranging the solder layer and light coupling chip above it, so that the molten solder can flow into the exhaust groove in the welding process, and the air between the chip and the base island is discharged through the exhaust groove, which significantly reduces the formation of welding cavity, by ensuring that the exhaust groove extends to at least one end of the chip projection, the effective export of air in the welding process is realized, gas is avoided to be trapped at the bottom of the chip, by controlling the ratio of the bottom area of the light coupling chip and the cross-sectional area of the exhaust groove below it is not less than 2, both enough exhaust passage volume is ensured, and the influence of structural strength and welding reliability due to the too large groove body is avoided, the technical problem that the chip bottom, soft solder and light coupling support are extremely easy to produce larger cavity after welding under the existing welding mode is solved.

Description

Technical Field

[0001] This utility model relates to the field of optocoupler technology, and in particular to a base island structure for reducing the void between the chip and the optocoupler support. Background Technology

[0002] In the manufacturing process of electronic components, the connection between chips and carriers (such as optocoupler brackets) often employs soft soldering technology. Traditional soft soldering methods, such as using soft soldering machines with solder wire, have serious problems. The main issue is that large voids are easily generated between the bottom of the chip and the soft solder or optocoupler bracket after soldering. The presence of these voids has many adverse effects on the performance and reliability of electronic components. On the one hand, voids hinder heat conduction between the chip and the optocoupler bracket, preventing the heat generated by the chip during operation from being effectively dissipated, thus affecting the chip's operational stability and potentially damaging the chip due to overheating. On the other hand, voids weaken the stability of electrical connections, increase resistance, affect the accuracy and efficiency of signal transmission, and reduce the overall quality and lifespan of the product. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides a base island structure for reducing the void between the chip and the optocoupler bracket, thus solving the technical problem that large voids are easily generated between the bottom of the chip and the soft solder and optocoupler bracket after welding in existing welding methods.

[0004] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a base island structure for reducing the void between the chip and the optocoupler support, comprising an optocoupler support as a welding carrier, a base island disposed on the optocoupler support, a vacuum section disposed on the base island, a solder layer as a welding material disposed on the vacuum section, the vacuum section including at least one venting groove formed on the surface of the base island, the venting groove being able to accommodate the solder at the molten solder layer, and an optocoupler chip for welding disposed on the solder layer.

[0005] Preferably, the projection of the optocoupler chip onto the base island is located on the vacuum section.

[0006] Preferably, at least one end of the exhaust groove is located outside the projection of the optocoupler chip on the base island.

[0007] Preferably, the ratio of the bottom area of ​​the optocoupler chip to the total cross-sectional area of ​​the exhaust groove located on the bottom surface of the optocoupler chip is greater than or equal to 2.

[0008] Preferably, the projection of the optocoupler chip on the base island is located within the projection of the solder layer on the base island.

[0009] By employing the above technical solution, this utility model provides a base island structure for reducing the void between the chip and the optocoupler support, which has at least the following beneficial effects: 1. This utility model provides a vacuum section with an exhaust groove on the surface of the base island, and arranges a solder layer and an optocoupler chip on top of it. During the welding process, the molten solder can flow into the exhaust groove, and the air between the chip and the base island can be discharged through the exhaust groove. This significantly reduces the formation of welding voids, thereby improving the heat conduction efficiency and electrical connection reliability between the chip and the bracket, and extending the service life of the components. It is suitable for electronic devices with high reliability requirements.

[0010] 2. This utility model achieves effective air extraction during the welding process by positioning the projection of the optocoupler chip on the base island onto the vacuum section and ensuring that at least one end of the exhaust groove extends beyond the chip projection. This avoids gas being trapped at the bottom of the chip, further reducing the void ratio, improving the integrity and uniformity of the welding surface, and enhancing the stability and durability of the product in harsh environments such as high temperature and high humidity.

[0011] 3. By controlling the ratio of the bottom area of ​​the optocoupler chip to the cross-sectional area of ​​the exhaust groove below it to be no less than 2, this utility model ensures sufficient exhaust channel volume and avoids affecting structural strength and welding reliability due to excessively large grooves. Thus, while optimizing the exhaust effect, it maintains good mechanical support and electrical connection performance, and improves the overall packaging quality and production efficiency. Attached Figure Description

[0012] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a schematic diagram of the present invention; Figure 2 This is a schematic diagram of the cross-section of the present invention.

[0013] In the diagram: 1. Optocoupler bracket; 2. Base island; 3. Vacuum section; 4. Solder layer; 5. Exhaust groove; 6. Optocoupler chip. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] To address the technical problem of large voids easily forming between the chip bottom and the solder joint and optocoupler support after soldering in existing methods, this invention provides a base island structure to reduce voids between the chip and the optocoupler support. By improving the base island structure, voids generated at the chip bottom during soldering are significantly reduced, thereby improving the connection quality between the chip and the carrier, enhancing the performance and reliability of electronic components, and meeting the growing demand for high-performance, high-reliability components in electronic devices. Figure 1 and Figure 2 As shown, a base island 2 is provided on the optocoupler support 1, which serves as the welding carrier. A vacuum section 3 is provided on the base island 2, and a solder layer 4, serving as the welding material, is provided on the vacuum section 3. The vacuum section 3 includes at least one exhaust groove 5 formed on the surface of the base island 2. The exhaust groove 5 can accommodate the solder at the melted solder layer 4, thereby accommodating part of the solder generated after melting during the welding process. An optocoupler chip 6 for welding is provided on the solder layer 4. Before welding, the optocoupler chip 6 and the solder layer 4 are sequentially stacked on the vacuum section 3 of the base island 2. During the welding process, the solder in the solder layer 4 melts and the optical coupler chip 6 is welded to the vacuum part 3 of the base island 2 by pressing the optical coupler chip 6 with the welding equipment. If there is a void between the optical coupler chip 6 and the surface of the base island 2, the air in the void will be squeezed into the exhaust groove 5. Then, as the optical coupler chip 6 squeezes the solder, the air in the exhaust groove 5 is gradually discharged into the outside air, thereby ensuring the fit between the bottom surface of the optical coupler chip 6 and the surface of the base island 2, so as to ensure the connection quality between the optical coupler chip 6 and the base island 2.

[0016] To ensure that the air between the optocoupler chip 6 and the base island 2 can be squeezed into the exhaust groove 5 during the welding process, so that the projection of the optocoupler chip 6 on the base island 2 is located on the vacuum section 3, and to further facilitate the air in the exhaust groove 5 to be discharged into the outside air, at least one end of the exhaust groove 5 is outside the projection of the optocoupler chip 6 on the base island 2, that is, at least one end of the exhaust groove 5 is not covered by the optocoupler chip 6, thereby ensuring that the air between the optocoupler chip 6 and the base island 2 can be discharged into the outside air through the exhaust groove 5.

[0017] The standard for evaluating the connection quality between the optocoupler chip 6 and the base island 2 is the ratio of the contact surface to the bottom surface of the optocoupler chip 6. When the area of ​​the contact surface is equal to the bottom area of ​​the optocoupler chip 6, the contact state between the optocoupler chip 6 and the base island 2 is the best. In order to ensure that the connection quality between the optocoupler chip 6 and the base island 2 meets the quality requirements of the optocoupler, the ratio of the bottom area of ​​the optocoupler chip 6 to the total cross-sectional area of ​​the exhaust groove 5 located on the bottom surface of the optocoupler chip 6 is set to be greater than or equal to 2. The exhaust groove 5 is provided on the surface of the base island 2, and the cross-sectional area of ​​the exhaust groove 5 is the area of ​​the base island 2 surface it occupies.

[0018] Since it is difficult to ensure that the opposing surfaces of the optocoupler chip 6 and the base island 2 are completely aligned, there will be a large number of tiny air voids. In order to ensure the connection quality between the optocoupler chip 6 and the base island 2, the projection of the optocoupler chip 6 on the base island 2 is made to fall within the projection of the solder layer 4 on the base island 2. This allows the solder after the solder layer 4 melts to fill the tiny gaps between the optocoupler chip 6 and the base island 2, and to expel as much air as possible between the optocoupler chip 6 and the base island 2, thereby improving the connection quality.

[0019] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0020] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A base island structure for reducing the void between a chip and an optocoupler support, comprising an optocoupler support (1) as a welding carrier, wherein a base island (2) is disposed on the optocoupler support (1), characterized in that, The base island (2) is provided with a vacuum section (3), and the vacuum section (3) is provided with a solder layer (4) as a welding material. The vacuum section (3) includes at least one exhaust groove (5) opened on the surface of the base island (2). The exhaust groove (5) can accommodate the solder at the melted solder layer (4). The solder layer (4) is provided with an optocoupler chip (6) for welding.

2. The base island structure according to claim 1, characterized in that, The projection of the optocoupler chip (6) on the base island (2) is located on the vacuum section (3).

3. The base island structure according to claim 1, characterized in that, At least one end of the exhaust groove (5) is outside the projection of the optocoupler chip (6) on the base island (2).

4. The base island structure according to claim 1, characterized in that, The ratio of the bottom area of ​​the optocoupler chip (6) to the total cross-sectional area of ​​the exhaust groove (5) located on the bottom surface of the optocoupler chip (6) is greater than or equal to 2.

5. The base island structure according to claim 1, characterized in that, The projection of the optocoupler chip (6) on the base island (2) is located within the projection of the solder layer (4) on the base island (2).

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