Electronic device and line structure
Patent Information
- Application Number
- CN202522063874.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2025-09-17
- Filing Date
- 2025-09-25
- Publication Date
- 2026-10-09
- Estimated Expiration
- 2035-09-25
AI Technical Summary
然而，此电流回流路径可能对重要信号造成干扰
[0015]由上可知，本申请主要在线路结构中设有第一导电孔、第二导电孔及信号线路，以供电子元件接置于该线路结构上并电性连接该第一导电孔及第二导电孔，使该电子元件及该第一导电孔与第二导电孔形成电流回流路径，且令该信号线路位于电流回流路径范围外，可有效避免信号线路受干扰。
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Figure CN224844756U_ABST
Abstract
Description
Technical Field
[0001] This application relates to a semiconductor device, and more particularly to an electronic device and circuit structure. Background Technology
[0002] With the advancement of integrated circuit manufacturing technology, the design and manufacturing of electronic packages continue to trend towards miniaturization. As they possess larger-scale and more integrated electronic circuits, their functions are also more complete than those of the application products.
[0003] Therefore, passive components are currently placed on the packaging substrate in electronic packages to improve their electrical performance. The current return path of these passive components depends on the circuit design and connection method. Simply put, current flows from the power source, through the passive component, and then returns to the other end of the power source to form a closed loop. However, this current return path can interfere with critical signals.
[0004] Therefore, overcoming the problems of the existing technology has become an urgent issue that needs to be addressed. Utility Model Content
[0005] In view of the various deficiencies of the prior art, this application provides an electronic device, including: a circuit structure including a first conductive hole, a second conductive hole and a signal line; and an electronic component disposed on the circuit structure and electrically connected to the first conductive hole and the second conductive hole, such that the electronic component and the first conductive hole and the second conductive hole form a current return path, and the signal line is located outside the current return path.
[0006] This application also provides a circuit structure for connecting electronic components and forming a current return path with the electronic components, including: an insulating layer; a first conductive hole incorporated in the insulating layer and electrically connected to the electronic components; a second conductive hole incorporated in the insulating layer and electrically connected to the electronic components; and a signal line incorporated in the insulating layer for transmitting electronic signals, and the signal line is located outside the current return path range.
[0007] In the aforementioned electronic device and circuit structure, the first conductive hole is a conductive blind hole and is used for grounding.
[0008] In the aforementioned electronic device and circuit structure, the second conductive hole is a conductive blind hole and is used to provide power.
[0009] In the aforementioned electronic device and circuit structure, the diameter of the first conductive hole is larger than the diameter of the second conductive hole.
[0010] The aforementioned electronic device and circuit structure also includes an extension circuit that extends outward from the first conductive hole or the second conductive hole and is electrically connected to the electronic component.
[0011] In the aforementioned electronic device and circuit structure, the circuit structure is a redistributed circuit structure.
[0012] In the aforementioned electronic device and circuit structure, the electronic component is a passive component.
[0013] In the aforementioned electronic device and circuit structure, the electronic component has a first contact pad and a second contact pad, and the first contact pad and the second contact pad are electrically connected to the first conductive hole and the second conductive hole, respectively.
[0014] In the aforementioned electronic device and circuit structure, the first conductive hole and the second conductive hole are located directly below the first contact pad and the second contact pad, respectively, to form a minimum current return path.
[0015] As can be seen from the above, this application mainly provides a first conductive hole, a second conductive hole, and a signal line in the circuit structure, so that electronic components can be placed on the circuit structure and electrically connected to the first conductive hole and the second conductive hole, so that the electronic components and the first conductive hole and the second conductive hole form a current return path, and the signal line is located outside the current return path range, which can effectively avoid interference to the signal line. Attached Figure Description
[0016] Figure 1 This is a top view schematic diagram of the circuit structure of this application.
[0017] Figure 2 This is a cross-sectional schematic diagram of the circuit structure of this application.
[0018] Figure 3 This is a cross-sectional schematic diagram of the electronic device of this application.
[0019] Explanation of reference numerals in the attached figures
[0020] 1. Circuit Structure
[0021] 10 Insulation layer
[0022] 11 First conductive hole
[0023] 12 Second conductive hole
[0024] 13 Signal lines
[0025] 14. Extension Line
[0026] 2 Electronic components
[0027] 21 First contact pad
[0028] 22 Second contact pad
[0029] 3 Electronic devices
[0030] S Current return path. Detailed Implementation
[0031] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.
[0032] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are solely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the implementability of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementability.
[0033] Please see Figure 1 and Figure 2 This is a top view and cross-sectional view of the circuit structure of this application.
[0034] The circuit structure 1 is a redistribution layer (RDL) structure or substrate structure, which is used to mount electronic components (such as...). Figure 1 (shown by dashed lines) and forms a current return path with the electronic component, including an insulating layer 10, a first conductive hole 11, a second conductive hole 12 and a signal line 13.
[0035] The insulating layer 10 is, for example, polybenzoxazole (PBO), polyimide (PI), prepreg (PP), epoxy resin, benzocyclobutene (BCB), or dielectric material.
[0036] The first conductive hole 11, the second conductive hole 12, and the signal line 13 are integrated into the insulating layer 10, and the material of the insulating layer is, for example, copper or other metals.
[0037] In this embodiment, the first conductive hole 11 is, for example, a conductive blind hole used for grounding; the second conductive hole 12 is, for example, a conductive blind hole adjacent to the first conductive hole 11 and used to provide power, and the diameter of the first conductive hole 11 may be larger than the diameter of the second conductive hole 12; the signal line 13 is located outside the area enclosed by the first conductive hole 11 and the second conductive hole 12 and is used to transmit electronic signals.
[0038] In addition, the circuit structure 1 may also include an extension line 14 that extends outward from the first conductive hole 11 or the second conductive hole 12 and is electrically connected to the electronic component.
[0039] Please refer to the following at the same time. Figure 3 This is a cross-sectional schematic diagram of electronic device 3 of this application.
[0040] The electronic device 3 includes the aforementioned circuit structure 1 and an electronic component 2 disposed on the circuit structure 1 and electrically connected to the first conductive hole 11 and the second conductive hole 12.
[0041] The electronic component 2 is, for example, a passive component (such as a resistor, capacitor, and inductor) and has a first contact pad 21 and a second contact pad 22. The first contact pad 21 and the second contact pad 22 are electrically connected to the first conductive hole 11 and the second conductive hole 12, respectively. The first conductive hole 11 is used for grounding, and the second conductive hole 12 is used for providing power. This allows the electronic component 2 to form a current return path S with the first conductive hole 11, the second conductive hole 12, and the ground terminal and power terminal (not shown) of the circuit structure 1. At the same time, the signal line 13 of the circuit structure 1 is located outside the current return path S, so that the signal line 13 is not disturbed.
[0042] In one embodiment, the first conductive hole 11 and the second conductive hole 12 are located directly below the first contact pad 21 and the second contact pad 22, respectively, to form a minimum current return path S.
[0043] In summary, this application mainly provides a first conductive hole, a second conductive hole, and a signal line in the circuit structure, so that electronic components (passive components) can be placed on the circuit structure and electrically connected to the first conductive hole and the second conductive hole, so that the electronic components and the first conductive hole and the second conductive hole form a current return path, and the signal line is located outside the current return path range to avoid interference to the signal line.
[0044] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.
Claims
1. An electronic device, characterized in that, include: The circuit structure includes a first conductive hole, a second conductive hole, and signal lines; as well as An electronic component is placed on the circuit structure and electrically connected to the first conductive hole and the second conductive hole, so that the electronic component and the first conductive hole and the second conductive hole form a current return path, and the signal line is located outside the range of the current return path.
2. The electronic device as claimed in claim 1, characterized in that, The first conductive via is a conductive blind via and is used for grounding.
3. The electronic device as claimed in claim 1, characterized in that, The second conductive hole is a conductive blind hole and is used to provide power.
4. The electronic device as claimed in claim 1, characterized in that, The diameter of the first conductive hole is larger than the diameter of the second conductive hole.
5. The electronic device as claimed in claim 1, characterized in that, The electronic device also includes an extension line that extends outward from the first conductive hole or the second conductive hole and is electrically connected to the electronic component.
6. The electronic device as claimed in claim 1, characterized in that, The line structure is a redistributed line structure.
7. The electronic device as claimed in claim 1, characterized in that, This electronic component is a passive component.
8. The electronic device as claimed in claim 1, characterized in that, The electronic component has a first contact pad and a second contact pad, and the first contact pad and the second contact pad are electrically connected to the first conductive hole and the second conductive hole, respectively.
9. The electronic device as claimed in claim 8, characterized in that, The first conductive hole and the second conductive hole are located directly below the first contact pad and the second contact pad, respectively, to form a minimum current return path.
10. A circuit structure for connecting electronic components and forming a current return path with the electronic components, characterized in that... include: Insulating layer; The first conductive hole is incorporated into the insulating layer and electrically connected to the electronic component; The second conductive hole is incorporated into the insulating layer and electrically connected to the electronic component; as well as The signal line is incorporated into the insulating layer and used to transmit electronic signals, and the signal line is located outside the current return path.
11. The circuit structure as described in claim 10, characterized in that, The first conductive via is a conductive blind via and is used for grounding.
12. The circuit structure as described in claim 10, characterized in that, The second conductive hole is a conductive blind hole and is used to provide power.
13. The circuit structure as described in claim 10, characterized in that, The diameter of the first conductive hole is larger than the diameter of the second conductive hole.
14. The circuit structure as described in claim 10, characterized in that, The circuit structure also includes an extension circuit that extends outward from the first conductive hole or the second conductive hole and is electrically connected to the electronic component.
15. The circuit structure as described in claim 10, characterized in that, The line structure is a redistributed line structure.