A high-density and high-reliability hybrid packaging structure

Abstract

The utility model discloses a kind of high-density high reliability hybrid packaging structure, including ceramic shell, ABF substrate, ceramic shell front is equipped with recess, recess is equipped with first chip group, ceramic shell cover has the cavity with receiving space formed by shielding element, ABF substrate is integrated with component, ABF substrate is located in the cavity in the front of ceramic shell and is interconnected with ceramic shell, the second chip group of ABF substrate front is bonded with the inner wall of shielding element, ceramic shell is connected with outer pin.This application uses the composite packaging scheme of "ceramic internal embedding ABF substrate" to become the key breakthrough idea of "high reliability" and "high density", take ceramic shell as packaging main body, it can be adapted to high reliable application scene such as high humidity, high temperature application environment, simultaneously, embedding customization ABF substrate in ceramic packaging, with the high-density wiring capability and flexible integration characteristics of ABF substrate, realize density leap in the limited space of ceramic packaging.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and more specifically to a hybrid packaging structure with high density and high reliability. Background Technology

[0002] In current advanced packaging technologies, ceramic shells are limited by their material properties and process bottlenecks, restricting the potential for increasing packaging density. Traditional three-dimensional ceramic packaging structures, such as... Figure 1 As shown in the figure, the markings indicate: ceramic housing 101, chipset 102, finished circuit 103, and metal cover 104. The main factors contributing to its defects are: firstly, while ceramics offer excellent dielectric properties and mechanical strength, the multilayer co-firing process typically struggles to overcome limitations in wiring precision, such as line width / spacing below 10μm and the number of stacked layers, resulting in a limited number of components and interconnect nodes that can be integrated per unit volume. Secondly, the heat dissipation design and internal space allocation of the ceramic housing further compress the space for density improvement, making its density performance far inferior to ABF substrates in high-density packaging applications.

[0003] The ABF substrate (Ajinomoto Build-up Film substrate) with its unique organic resin coating and multi-layer build-up process (a technology to manufacture complex solid objects by stacking materials layer by layer) can achieve fine line widths / spacings of up to 2-5μm at the micrometer level and more wiring layers. It also has more flexible spatial layout capabilities, can efficiently integrate chips, passive components and complex interconnect structures, and has a packaging density that is significantly better than that of ceramic shells.

[0004] High-precision packaging is the goal pursued in integrated circuit packaging. Therefore, combining ABF substrates with ceramic packaging would be a major breakthrough. How to apply ABF substrates to ceramic packaging structures to achieve reliable packaging is a current challenge to be solved. Summary of the Invention

[0005] To address the aforementioned issues, this invention provides a high-density, high-reliability hybrid packaging structure. By leveraging the high-density wiring and integration capabilities of the ABF substrate, the number of integrated components and interconnection density are significantly increased within the limited space of the ceramic package.

[0006] According to one aspect of the present invention, a high-density, high-reliability hybrid packaging structure is provided, comprising: A ceramic casing, wherein a groove is provided on the front side of the ceramic casing, and a first chipset is disposed in the groove; A shielding element, wherein the shielding element cover and the ceramic shell form a chamber with a receiving space; An ABF substrate, wherein the ABF substrate integrates components, and the ABF substrate is disposed in a cavity on the front side of the ceramic shell and interconnected with the ceramic shell; External pins: The ceramic housing is connected to external pins for connection to an external PCB board.

[0007] Furthermore, the components include a second chipset mounted on the front and back sides of the ABF substrate, and a third chipset mounted on the front side of the ABF substrate.

[0008] Furthermore, the components also include crystal oscillators and resistors / capacitors mounted on the ABF substrate.

[0009] Furthermore, the second chipset on the front side of the ABF substrate is bonded to the inner wall of the shield.

[0010] Furthermore, the ABF substrate and the ceramic housing are interconnected via solder balls.

[0011] Furthermore, a fourth chipset is attached to the back of the ceramic housing, and the fourth chipset is housed in the cavity formed by the ceramic housing and the shielding component. The fourth chipset is bonded to the inner wall of the shielding component.

[0012] Furthermore, the shielding component is a metal shielding cover, or a cofferdam and a metal cover plate.

[0013] Compared with the prior art, the beneficial effects of this utility model are: (I) This application discloses a high-density, highly integrated, and highly reliable packaging structure. Addressing the density bottleneck of ceramic shells and the performance limitations of ABF substrates (weak electromagnetic interference resistance and high-temperature resistance), this application presents a key breakthrough approach that combines high reliability with high density through a composite packaging scheme of "embedded ABF substrate inside the ceramic shell." This packaging structure uses a ceramic shell as the main packaging element, making it suitable for high-reliability applications such as those with high humidity and high temperature. Simultaneously, a customized ABF substrate is embedded within the internal cavity of the ceramic shell or in specific functional areas, such as densely interconnected chip areas. Leveraging the high-density wiring capabilities and flexible integration characteristics of the ABF substrate, a significant density increase is achieved within the limited space of the ceramic package.

[0014] (II) This composite solution can achieve three core values: First, it can improve the integration density of components. Through the fine wiring and multi-layer structure of the ABF substrate, multiple heterogeneous chips such as logic chips, memory chips and RF chips can be integrated in the ceramic shell, and passive components such as resistors and capacitors can be embedded and packaged inside the ABF substrate, which can significantly reduce the space occupied by components. Second, it can optimize signal transmission performance. The short-distance interconnection of the ABF substrate can shorten the signal transmission path between chips, reduce signal delay and loss, while the shielding performance of the ceramic shell can avoid external interference, thus balancing density and signal integrity. Third, it can balance heat dissipation and space. The ABF substrate can concentrate the heat-generating components near the heat dissipation channel of the ceramic shell, realizing the synergistic design of "high-density integration + high-efficiency heat dissipation".

[0015] (iii) High manufacturability: the ceramic shell and ABF substrate can be realized with current processing technology capabilities, and the packaging assembly has been changed from individual assembly to overall assembly, with low overall process risk.

[0016] (iv) The package involves a double-sided cavity structure and a chip stacking structure, which can effectively reduce the circuit size. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of ceramic packaging in the prior art; Figure 2 This is a schematic diagram of a high-density, high-reliability hybrid packaging structure according to this utility model. Detailed Implementation

[0018] The present invention will be further described below with reference to specific embodiments.

[0019] like Figure 2 As shown, this utility model discloses a high-density, high-reliability hybrid packaging structure, which is a high-density, high-integration, and high-reliability packaging structure. Facing the density bottleneck of the ceramic shell 1 and the performance shortcomings of the ABF substrate 4, such as weak electromagnetic interference resistance and high temperature resistance, the composite packaging scheme of "embedding the ABF substrate inside the ceramic shell" has become a key breakthrough idea that balances "high reliability" and "high density".

[0020] This packaging structure uses a ceramic shell 1 as the main body, which can adapt to high-reliability application scenarios such as high humidity and high temperature environments. At the same time, a customized ABF substrate 4 is embedded in the internal cavity or specific functional areas such as dense chip interconnect areas of the ceramic shell 1. With the help of the high-density wiring capability and flexible integration characteristics of the ABF substrate 4, a density leap can be achieved within the limited space of the ceramic package.

[0021] The hybrid packaging structure includes a ceramic housing 1 and an ABF substrate 4. The front of the ceramic housing 1 has a recess 11 that is recessed downward relative to its upper surface. A first chipset 2 is mounted in the recess 11. The ABF substrate 4 integrates components and is mounted on top of the first chipset 2 in the recess 11. The back of the ABF substrate 4 is interconnected with the ceramic housing 1 through solder balls 40. A shield 3 is mounted on the front of the ceramic housing 1. The ABF substrate 4 with integrated components is housed in a cavity 30 on the front of the ceramic housing 1. The ceramic housing 1 is connected to external pins 6 for connection to an external PCB board.

[0022] A fourth chip assembly 7 is attached to the back of the ceramic housing 1, and a shielding component 3 is also attached to the back of the ceramic housing 1 to form a receiving chamber 30. The fourth chip assembly 7 is housed in the chamber 30 formed by the ceramic housing 1 and the shielding component 3, and the fourth chip assembly 7 and the inner wall of the shielding component 3 are bonded together with thermally conductive adhesive.

[0023] The components include a second chipset 51 mounted on the front and back sides of the ABF substrate 4, a third chipset 52 mounted on the front side of the ABF substrate 4, a crystal oscillator 53 mounted on the ABF substrate 4, and a resistor-capacitor component 54. The second chipset 51 on the front side of the ABF substrate 4 is bonded to the inner wall of the shielding component 3 with thermally conductive adhesive.

[0024] The shielding component 3 is a metal shielding cover, the bottom surface of which is bonded to the surface of the ceramic shell 1. The structure of the metal shielding cover is not shown in the diagram. Alternatively, the shielding component 3 is a dike 31 and a metal cover plate 32. The bottom surface of the dike 31 is bonded to the surface of the ceramic shell 1 to enclose the ABF substrate 4, and the metal cover plate 32 covers the ABF substrate 4 and is bonded and fixed to the dike 31.

[0025] The hybrid packaging structure provided in this application significantly improves component integration density. Through the fine wiring and multi-layer structure of the ABF substrate 4, multiple heterogeneous chips, such as logic chips, memory chips, and RF chips, are integrated within the ceramic housing 1. Passive components such as resistors and capacitors are embedded and packaged inside the ABF substrate 4, greatly reducing the space occupied by components. Furthermore, it optimizes signal transmission performance. The short-distance interconnection of the ABF substrate 4 shortens the signal transmission path between chips, reducing signal delay and loss. Simultaneously, the shielding performance of the ceramic housing 1 avoids external interference, balancing density and signal integrity. In addition, it balances heat dissipation and space. The ABF substrate 4 can centrally arrange heat-generating components near the heat dissipation channels of the ceramic housing 1 (e.g., the back of the second chipset 51 is bonded to the metal cover plate 32 with thermally conductive adhesive, and the metal cover plate 32 dissipates heat), achieving a synergistic design of "high-density integration + efficient heat dissipation".

[0026] In addition, hybrid packaging structures, including double-sided cavity structures and chip stacking structures, can effectively reduce circuit size.

[0027] The packaging method for this packaging structure specifically includes the following steps: Step 1: Install the first chipset 2 into the groove 11 of the ceramic housing 1 using adhesive or solder.

[0028] Step 2: Connect the pads on the first chipset 2 to the ceramic housing 1 by wire bonding.

[0029] Step 3: Connect the second chipset 51, crystal oscillator 53, resistor and capacitor components 54, or the pre-packaged finished circuit to the ABF substrate 4.

[0030] Step 4: Mount the third chipset 52 onto the ABF substrate 4, and then electrically connect the pads on the chip to the ABF substrate 4 by wire bonding.

[0031] Step 5: Form solder balls 40 on the ABF substrate 4, and use the solder balls 40 to solder the ABF substrate 4 to the ceramic shell 1.

[0032] Step 6: On the front of the ceramic housing 1, attach the cofferdam 31 and seal the front circuit with the metal cover plate 32.

[0033] Step 7: Mount the fourth chipset 7 onto the back of the ceramic outer side.

[0034] Step 8: On the back of the ceramic housing 1, attach the cofferdam 31 and seal the back circuit with the metal cover plate 32.

[0035] Step 9: A post is installed on the back of the ceramic housing 1 to form external pins 6, which are used for connection to an external PCB during circuit applications. In practical applications, the external leads of the ceramic housing 1 can be in a leadless package (CLCC) or a package with leads (such as CBGA, CCGA, CPGA, CQFP, CSOP, etc.).

[0036] The hybrid packaging structure provided in this application has high manufacturability. Both the ceramic shell 1 and the ABF substrate 4 can be realized with current processing technology capabilities. The packaging assembly is from individual assembly to overall assembly, and the overall process risk is low.

[0037] The above descriptions are merely some embodiments of this utility model. It should be noted that those skilled in the art can make other modifications and improvements without departing from the inventive concept of this utility model, and these all fall within the protection scope of this utility model.

Claims

1. A high-density, high-reliability hybrid packaging structure, characterized in that, include: A ceramic shell (1) has a groove (11) on its front side, and a first chipset (2) is provided in the groove (11). The shielding component (3) covers the ceramic shell (1) to form a chamber with a receiving space; ABF substrate (4), the ABF substrate (4) integrates components, the ABF substrate (4) is disposed in the cavity on the front side of the ceramic shell (1) and interconnected with the ceramic shell (1); External pin (6): The ceramic housing (1) is connected to the external pin (6) for connection with an external PCB board.

2. The packaging structure according to claim 1, characterized in that, The components include a second chip group (51) mounted on the front and back of the ABF substrate (4), and a third chip group (52) mounted on the front of the ABF substrate (4).

3. The packaging structure according to claim 2, characterized in that, The components also include a crystal oscillator (53) and a resistor-capacitor component (54) mounted on the ABF substrate (4).

4. The packaging structure according to claim 3, characterized in that, The second chip group (51) on the front side of the ABF substrate (4) is bonded to the inner wall of the shield (3).

5. The packaging structure according to claim 1, characterized in that, The ABF substrate (4) and the ceramic shell (1) are interconnected by solder balls (40).

6. The packaging structure according to claim 1, characterized in that, The back of the ceramic shell (1) is fitted with a fourth chip group (7), which is housed in the cavity formed by the ceramic shell (1) and the shield (3). The fourth chip group (7) is bonded to the inner wall of the shield (3).

7. The packaging structure according to claim 1, characterized in that, The shielding component (3) is a metal shielding cover, or the shielding component (3) is a dike (31) and a metal cover plate (32).

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