Graphene foam electronic encapsulation cofferdam

Abstract

The utility model discloses a kind of graphene foam electronic packaging cofferdams, the cofferdam includes graphene foam sheet, single-sided tape and double-sided tape body, through groove is set on graphene foam sheet, overflow groove is symmetrically equipped in the both sides of through groove, through groove is communicated with two overflow grooves respectively, double-sided tape body is formed by double-sided tape removing release layer, double-sided tape body is bonded and seals one side and side wall of graphene foam sheet, single-sided tape is bonded and seals another side of graphene foam sheet, and single-sided tape is bonded on the double-sided tape body located on the outside of graphene foam sheet side wall, through groove on graphene foam sheet, single-sided tape and double-sided tape body form accommodating cavity, single-sided tape and double-sided tape body form the edge of graphene foam sheet periphery. The packaging cofferdam reserves liquid metal expansion space, significantly reduces the risk of overflow of packaging material, thereby significantly improves the sealing property.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor packaging technology, specifically relating to a graphene foam electronic packaging dike. Background Technology

[0002] In the field of electronic packaging, dikes are mainly used to restrict the flow range of packaging materials. Based on the layout and packaging requirements of the chip or component, the shape, size, and location of the dike are determined. Computer-aided design (CAD) tools are used to draw the outline of the dike and generate corresponding process parameters. Simultaneously, suitable packaging materials, such as epoxy resin, silicone, and liquid metal, are prepared, and their performance is ensured to meet requirements.

[0003] In the field of mobile phone packaging, dikes are mainly used to restrict the flow range of packaging materials (such as resin, adhesive and liquid metal) to ensure packaging accuracy, protect critical areas, improve production efficiency and enhance sealing performance.

[0004] In the existing technology, the materials used for liquid metal cofferdams include thermally conductive gel cofferdams and foam cofferdams. Thermally conductive gel cofferdams have poor resilience and too large gaps. After stress relaxation, the cofferdam will break and the liquid metal will overflow. Foam cofferdams have poor thermal conductivity, low support force, and reduced contact area. After the temperature rises, the fluidity of the liquid metal increases, which poses a risk of overflow. Utility Model Content

[0005] To address the problems existing in the prior art, this invention provides a graphene foam electronic encapsulation dam that reserves space for liquid metal expansion, significantly reducing the risk of encapsulation material spillage and thus significantly improving sealing performance.

[0006] The technical solution adopted to achieve the above-mentioned objectives of this invention is as follows: A graphene foam electronic encapsulation dam includes a substrate, a single-sided adhesive tape, and a double-sided adhesive tape body. A through groove is formed on the substrate, extending through the thickness direction of the substrate. Overflow grooves are symmetrically arranged on both sides of the through groove, and the through groove is connected to the two overflow grooves respectively. The double-sided adhesive tape body is formed by removing the release layer from the double-sided adhesive tape. The double-sided adhesive tape body bonds and seals one side and sidewall of the substrate. The single-sided adhesive tape bonds and seals the other side of the substrate, and the single-sided adhesive tape is bonded to the double-sided adhesive tape body located on the outside of the sidewall of the substrate. The substrate, the single-sided adhesive tape, and the double-sided adhesive tape body form a receiving cavity for accommodating encapsulation material. The single-sided adhesive tape and the double-sided adhesive tape body form the perimeter of the substrate.

[0007] The substrate is a graphene foam sheet.

[0008] Both the substrate and the through groove are square, and the volume of the through groove is 10-30% of the volume of the substrate.

[0009] The substrate and the through groove have the same plane of symmetry.

[0010] The two overflow channels are symmetrically distributed on both sides of the through channel along its length, and the length direction of each overflow channel is parallel to the length direction of the through channel.

[0011] The through groove is provided with overflow ports symmetrically on both sides along its length, and each overflow port is connected to the through groove and the corresponding overflow groove.

[0012] The overflow port is square, and the two overflow ports are located at the exact middle position on both sides of the through groove along the length of the through groove, and the symmetry plane of the two overflow ports is the same as that of the substrate.

[0013] Both the overflow port and the overflow groove extend through the thickness direction of the substrate.

[0014] The single-sided tape mentioned is black single-sided tape.

[0015] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows: 1. The encapsulation dike has an overflow groove reserved on the outside of the cavity containing the encapsulation material, which allows the encapsulation material to overflow into the overflow groove, greatly reducing the risk of overflow of the encapsulation material.

[0016] 2. The encapsulation dam seals the substrate with single-sided and double-sided tape, forming an edge on the sidewall of the substrate. The edge further reduces the risk of overflow from the encapsulation dam.

[0017] 3. The encapsulation dam uses graphene foam sheet as the substrate. Due to the advantages of graphene foam sheet such as low density, high thermal conductivity, high resilience, high temperature resistance and good electromagnetic shielding, the encapsulation dam made has good thermal conductivity, resilience, high temperature resistance and electromagnetic shielding performance, thus meeting the stringent requirements of electronic component encapsulation.

[0018] 4. The encapsulation dike is made of graphene foam sheets, single-sided tape, and double-sided tape, which is inexpensive and has a simple manufacturing process, making it suitable for industrial application. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of a graphene foam electronic encapsulation dike.

[0020] Figure 2 for Figure 1 The main view.

[0021] Figure 3 for Figure 2 Sectional view along the AA direction.

[0022] Figure 4 for Figure 2 Sectional view along the BB direction.

[0023] Among them, 1-substrate, 2-single-sided tape, 3-double-sided tape body, 4-through groove, 5-overflow groove, 6-overflow port, 7-edge wrapping. Detailed Implementation

[0024] To facilitate understanding and implementation of the present invention by those skilled in the art, the present invention will be further described in detail below with reference to embodiments. It should be understood that the embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0025] Example 1 The graphene foam electronic encapsulation dike structure provided in this embodiment is as follows: Figure 1-2 As shown, it includes a substrate 1, a single-sided adhesive tape 2, and a double-sided adhesive tape body 3.

[0026] like Figure 3 As shown, substrate 1 is a graphene foam sheet. Substrate 1 is square, with a length of 8 mm, a width of 6 mm, and a thickness of 200 µm. A through groove 4 is formed on substrate 1, extending through the thickness direction of the graphene foam sheet. The through groove 4 is square, and its plane of symmetry is the same as that of substrate 1. In this embodiment, the through groove 4 has a width of 2 mm and a length of 4 mm.

[0027] Graphene foam sheets are three-dimensional porous materials constructed using two-dimensional graphene as the basic unit. Through the interlacing of graphene sheets, a connected network structure is formed, combining the intrinsic properties of graphene with the lightweight and high-strength advantages of porous materials. The structure and composition of graphene foam sheets determine their advantages such as low density, high thermal conductivity, high resilience, high temperature resistance, and good electromagnetic shielding.

[0028] like Figure 3 As shown, overflow grooves 5 are symmetrically arranged on both sides of the through groove 4 along its length, extending through the thickness direction of the stone substrate 1. The overflow grooves 5 are square strips, and their lengths are parallel to the length of the through groove 4. In this embodiment, the overflow groove 5 has a width of 1 mm and a length of 4 mm.

[0029] Overflow ports 6 are symmetrically provided at the midpoint of both sides of the through groove 4 along its length. The overflow ports 6 are square and the overflow groove 6 extends through the thickness direction of the graphene foam sheet 1. In this embodiment, the length and width of the overflow ports 6 are both 1 mm. Each overflow port 6 has the same symmetry plane as the substrate 1, and each overflow port 6 is connected to the through groove 4 and the corresponding overflow groove 5.

[0030] By setting the overflow port 6 and the overflow groove 5, when the temperature of the electronic component rises, the fluidity of the encapsulation material increases and it needs to overflow. At this time, it can overflow into the overflow groove 5 through the overflow port 6, which significantly reduces the risk of encapsulation material overflow, thereby significantly reducing the damage to the electronic component caused by the overflow of encapsulation material.

[0031] like Figure 3-4 As shown, the double-sided tape body 3 is formed by removing the release layer from the double-sided tape. One adhesive surface of the double-sided tape body 3 is bonded to and seals one side and sidewall of the substrate 1, and the other adhesive surface of the double-sided tape body 3 is bonded to and seals electronic components (such as mobile phone chips).

[0032] like Figure 3-4 As shown, the single-sided tape 2 is black to prevent the graphene foam sheet structure from loosening and the circuit from becoming conductive. The single-sided tape 2 bonds and seals the other side of the substrate 1, and at the same time, the single-sided tape 2 is bonded to the double-sided tape body 3 located on the outer sidewall of the graphene foam sheet 1.

[0033] The through-groove 4 on the substrate 1, the single-sided adhesive tape 2, and the double-sided adhesive tape body 3 form a receiving cavity, which is used to contain encapsulation materials (such as resin, glue, and liquid metal). The single-sided adhesive tape 2 and the double-sided adhesive tape body 3 form a perimeter 7 (approximately 2 mm thick) around the substrate 1, which further reduces the risk of encapsulation material damage.

Claims

1. A graphene foam electronic encapsulation dike, characterized in that: The device includes a substrate, a single-sided adhesive tape, and a double-sided adhesive tape body. The substrate has a through groove that runs through the thickness direction of the substrate. Overflow grooves are symmetrically arranged on both sides of the through groove, and the through groove is connected to the two overflow grooves respectively. The double-sided adhesive tape body is formed by removing the release layer from the double-sided adhesive tape. The double-sided adhesive tape body bonds and seals one side and sidewall of the substrate. The single-sided adhesive tape bonds and seals the other side of the substrate, and the single-sided adhesive tape is bonded to the double-sided adhesive tape body located on the outside of the sidewall of the substrate. The substrate, the single-sided adhesive tape, and the double-sided adhesive tape body form a cavity for accommodating the encapsulation material. The single-sided adhesive tape and the double-sided adhesive tape body form the outer edge of the substrate.

2. The graphene foam electronic encapsulation dike according to claim 1, characterized in that: The substrate is a graphene foam sheet.

3. The graphene foam electronic encapsulation dike according to claim 1, characterized in that: Both the substrate and the through groove are square, and the volume of the through groove is 10-30% of the volume of the substrate.

4. The graphene foam electronic encapsulation dike according to claim 3, characterized in that: The substrate and the through groove have the same plane of symmetry.

5. The graphene foam electronic encapsulation dike according to claim 3, characterized in that: The two overflow channels are symmetrically distributed on both sides of the through channel along its length, and the length direction of each overflow channel is parallel to the length direction of the through channel.

6. The graphene foam electronic encapsulation dike according to claim 5, characterized in that: The through groove is provided with overflow ports symmetrically on both sides along its length, and each overflow port is connected to the through groove and the corresponding overflow groove.

7. The graphene foam electronic encapsulation dike according to claim 6, characterized in that: The overflow port is square, and the two overflow ports are located at the exact middle position on both sides of the through groove along the length of the through groove, and the symmetry plane of the two overflow ports is the same as that of the substrate.

8. The graphene foam electronic encapsulation dike according to claim 6, characterized in that: Both the overflow port and the overflow groove extend through the thickness direction of the substrate.

9. The graphene foam electronic encapsulation dike according to claim 1, characterized in that: The single-sided tape mentioned is black single-sided tape.

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