Optical package structure

Abstract

The present application discloses an optical packaging structure, in which an optical wafer with an optical element embedded in a packaging layer is stacked with a circuit structure and a semiconductor element in sequence on the packaging layer, and a heat sink with a light guide carrier is combined with the semiconductor element, so that the semiconductor element is directly connected with the optical wafer through the circuit structure to shorten the signal transmission path between them and improve the signal transmission rate, and the heat dissipation efficiency can be improved by setting the heat sink on the semiconductor element.

Description

Technical Field

[0001] This application relates to a semiconductor packaging structure, and more particularly to an optical packaging structure. Background Technology

[0002] With the booming development of the electronics industry, electronic products are gradually moving towards multifunctionality and high performance. The application of current fifth-generation (5G) communication technology has expanded to various fields such as the Internet of Things (IoT), Industrial Internet of Things (IIoT), cloud computing, artificial intelligence (AI), autonomous vehicles, and medical care. As applications expand, a massive amount of data is generated that needs to be efficiently transmitted, computed, and stored. In particular, the demand for data transmission is surging, leading the industry to replace electricity with light as the data transmission medium to improve transmission capacity, efficiency, and distance, while reducing energy consumption during transmission. Against this backdrop, co-packaged optical devices have become a future trend in semiconductor and packaging technology.

[0003] Please see Figure 1A and Figure 1B The diagram shows a top view and a partial cross-sectional view of the existing co-packaged optical device 1.

[0004] like Figure 1A As shown, in the existing co-packaged optical device 1, multiple optical engines 11 and a conversion chip 12 are integrated onto a circuit board 10. Figure 1B As shown, the conversion chip 12 is first disposed on a substrate 13, and then connected to the circuit board 10 through the substrate 13. Each optical engine 11 includes a semiconductor chip 112 formed in a package structure 111 and an optical chip 113 connected to the package structure 111. One end of the optical chip 113 is connected to an optical fiber 140 through a fiber array unit (FAU) 14. A shelf 15 is provided below the optical chip 113 and the fiber array unit 14 to enable the optical signal to be transmitted to the optical engine 11 for communication.

[0005] However, the optical chip and conversion chip in the aforementioned co-packaged optical device must transmit signals through the metal lines in the circuit board and substrate. Not only is the overall size of the device too large and too thick, which is not conducive to the miniaturization of electronic products, but its signal transmission path is also too long, which can easily lead to signal loss and cause problems in the application of end products. In addition, there is a risk of physical interference between the fiber array unit and the support and the circuit board.

[0006] Therefore, overcoming the problems of the existing technology has become an urgent issue that needs to be addressed. Utility Model Content

[0007] In view of the various deficiencies of the prior art, this application provides an optical packaging structure, including: a circuit structure having a first side and a second side opposite to each other; an optical chip disposed on the first side of the circuit structure and electrically connected to the circuit structure; a semiconductor element disposed on the second side of the circuit structure and electrically connected to the circuit structure; and a heat sink, which incorporates a light guide carrier and is disposed on the semiconductor element.

[0008] This application also provides a method for manufacturing an optical packaging structure, comprising: forming a circuit structure covering an optical wafer, wherein the circuit structure has opposing first and second sides, such that the optical wafer is disposed on the first side of the circuit structure and electrically connected to the circuit structure; disposing of and electrically connecting a semiconductor element on the second side of the circuit structure; and combining a heat sink with a light guide carrier to be disposed on the semiconductor element.

[0009] In the aforementioned optical packaging structure and its manufacturing method, the optical wafer is combined with a first optical element to change the optical signal transmission path.

[0010] In the aforementioned optical packaging structure and manufacturing method, the optical wafer has a first engaging portion and the first optical element has a second engaging portion, so that the first optical element is coupled to the first engaging portion of the optical wafer through the second engaging portion.

[0011] The aforementioned optical packaging structure and its manufacturing method further include a second optical element disposed on the second side of the circuit structure and sandwiched between the first optical element and the light guide carrier.

[0012] In the aforementioned optical packaging structure and its manufacturing method, the optical signal reaches the optical wafer via the light guide carrier and sequentially through the second optical element, the circuit structure and the first optical element.

[0013] The aforementioned optical packaging structure and its manufacturing method also include electronic components disposed on the second side of the circuit structure and electrically connected to the circuit structure.

[0014] The aforementioned optical packaging structure and its manufacturing method also include a first packaging layer covering the optical chip.

[0015] The aforementioned optical packaging structure and its manufacturing method also include a bridging chip disposed on the first side of the circuit structure and electrically connected to the circuit structure.

[0016] The aforementioned optical packaging structure and its manufacturing method also include a plurality of conductive pillars disposed on the first side of the circuit structure and electrically connected to the circuit structure.

[0017] The aforementioned optical packaging structure and its manufacturing method further include a second packaging layer formed on the second side of the circuit structure and covering the semiconductor element.

[0018] In the aforementioned optical packaging structure and its manufacturing method, the heat sink is formed with a groove to form a socket for accommodating the light guide carrier.

[0019] In the aforementioned optical packaging structure and its manufacturing method, the heat sink is combined with a socket for accommodating the light guide carrier.

[0020] As can be seen from the above, the optical packaging structure of this application mainly embeds an optical chip with a first optical element in the first packaging layer, and sequentially stacks a circuit structure, a semiconductor element, and an electronic element on the first packaging layer. Then, a heat sink with a light guide carrier is attached to the semiconductor element and the electronic element, so that the semiconductor element is directly electrically connected to the optical chip through the circuit structure to shorten the signal transmission path between them and improve the signal transmission rate. The heat sink can be placed on the semiconductor element to improve the heat dissipation efficiency. At the same time, the heat sink is combined with a socket to accommodate the light guide carrier, so that the light guide carrier is placed above the optical chip to reduce the interference problem of the light guide carrier placement. Attached Figure Description

[0021] Figure 1A and Figure 1B This is a plan view and a partial cross-sectional view of an existing co-packaged optical device.

[0022] Figures 2A to 2E This is a cross-sectional and top view of the optical packaging structure and its manufacturing method of this application.

[0023] Figures 3A to 3B This is a schematic diagram showing the combination and disassembly of the optical wafer and the first optical element in the optical packaging structure of this application.

[0024] Figures 4A to 4F This is a schematic diagram showing different combinations of the first optical element, the second optical element, and the light guide carrier in the optical packaging structure of this application.

[0025] Figure 5 This is a cross-sectional schematic diagram of the second embodiment of the optical packaging structure of this application.

[0026] Figure 6 This is a cross-sectional schematic diagram of the third embodiment of the optical packaging structure of this application.

[0027] Explanation of reference numerals in the attached figures 1. Co-packaged optical devices 10 circuit boards 11 optical engines 111 package structure 112 Semiconductor Wafer 113 optical chip 12 conversion chips 13 substrates 14 fiber optic array units 140 fiber optic cable 15 supports 2,5,6 Optical Packaging Structure 20 heat sinks 201 Groove 202 socket 203 opening 21 optical chips 210 First Card Unit 211 Action Surface 212 Non-acting surface 213 conductive bump 22-bridge chip 23 conductive pillars 241 First encapsulation layer 242 Second Encapsulation Layer 251 First Optical Element 2510 Second Card Unit 2511, 2521, 2531 Convex lenses 252 Second optical element 253 Light Guide Carrier 2522, 2532 concave lenses 26-line structure 261 First side 262 Second side 263 insulation layer 264 line layer 27 electronic components 28 semiconductor components 29 wiring layer 290 conductive element 30 fiber optic 40 bearing plate 41 Patterned resist layer 60 substrates. Detailed Implementation

[0028] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.

[0029] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," "third," and "one" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.

[0030] Please see Figures 2A to 2E This is a cross-sectional schematic diagram of the optical packaging structure and its manufacturing method of this application.

[0031] like Figure 2A As shown, a carrier plate 40 is provided, and an optical chip 21 and a bridging chip 22 are disposed on the carrier plate 40, and a plurality of conductive pillars 23 are formed thereon. Then, a first encapsulation layer 241 is formed to cover the optical chip 21, the bridging chip 22 and the plurality of conductive pillars 23.

[0032] The carrier plate 40 is, for example, a temporary carrier plate for a glass substrate. The plurality of conductive pillars 23 are made of, for example, metallic copper.

[0033] The optical chip 21, for example, is a photonic integrated circuit (PIC) element, having an opposing active surface 211 and a non-active surface 212, and having a plurality of conductive bumps 213 formed on the active surface, and the optical chip 21 is combined with a first optical element 251.

[0034] In this embodiment, the carrier plate 40 is provided with a plurality of optical crystals 21 and a plurality of bridging crystals 22, and the first optical element 251 is provided with a total internal reflection glass (TIR glass) or a lens with curvature to change the optical signal transmission path.

[0035] The first encapsulation layer 241 is, for example, an epoxy resin encapsulating colloid, and can be thinned by grinding to expose the end faces of the optical wafer 21 (conductive bumps 213), the bridging wafer 22, the plurality of conductive pillars 23, and the first optical element 251.

[0036] Please refer to the following at the same time. Figure 3A and Figure 3BThe optical wafer 21 has a first engaging portion 210 (e.g., multiple opposing engaging structures) formed on one side, and the first optical element 251 has a second engaging portion 2510 (e.g., multiple opposing engaging structures) formed, so that the first optical element 251 can be coupled to the first engaging portion 210 of the optical wafer 21 through the second engaging portion 2510.

[0037] like Figure 2B As shown, a circuit structure 26 covering the optical chip 21, the bridging chip 22 and a plurality of conductive pillars 23 is formed on the first packaging layer, and at least one electronic component 27 and at least one semiconductor component 28 are connected to the circuit structure 26. A patterned resist layer 41 is formed on the circuit structure 26, wherein the patterned resist layer 41 is disposed above the first optical component 251.

[0038] The circuit structure 26 has opposing first sides 261 and second sides 262 and includes an insulating layer 263 and a circuit layer 264 bonded to the insulating layer 263. The plurality of optical chips 21, the plurality of bridging chips 22, and the plurality of conductive pillars 23 are correspondingly disposed on the first side 261 of the circuit structure 26 and electrically connected to the circuit structure 26. The insulating layer 263 is made of, for example, a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), or a transparent material. The circuit layer 264 is, for example, a fan-out type redistributed circuit layer, and its material is, for example, metallic copper.

[0039] In this embodiment, an electronic component 27 and a plurality of semiconductor components 28 are disposed on the second side 262 of the circuit structure 26, and the electronic component 27 and the plurality of semiconductor components 28 are electrically connected to the circuit structure 26. Thus, the electronic component 27 and the semiconductor components 28 can be electrically connected to each other through the circuit structure 26 and the bridging chip 22. The electronic component 27 is, for example, a switch ASIC, and the semiconductor components 28 are, for example, electronic integrated circuits (EICs).

[0040] The patterned resist layer 41 is, for example, a photoresist, and the electronic component 27 and the semiconductor component 28 are exposed outside the patterned resist layer 41.

[0041] like Figure 2C As shown, a second encapsulation layer 242 is formed on the circuit structure 26 to cover the electronic component 27 and the semiconductor component 28. The second encapsulation layer 242 is, for example, an epoxy resin encapsulating colloid, and its material may be the same as or different from the first encapsulation layer 241.

[0042] like Figure 2D As shown, a wiring layer 29 electrically connecting the plurality of conductive pillars 23 is formed on the first encapsulation layer 241, and a plurality of conductive elements 290 are formed on the wiring layer 29. The second encapsulation layer 242 is then thinned by removing a portion of it, for example, through grinding, to expose the electronic element 27 and the semiconductor element 28. Next, the patterned resist layer 41 is removed, and a second optical element 252 is formed at the original location of the patterned resist layer 41, wherein the second optical element 252 is positioned above the first optical element 251.

[0043] The second optical element 252 is, for example, made of a light-transmitting material or a lens.

[0044] like Figure 2E As shown, a heat sink 20 is attached to the second encapsulation layer 242, and the heat sink 20 is combined with a light guide carrier 253, thereby obtaining the optical encapsulation structure 2 of this application, which includes an optical chip 21, a first optical element 251, a circuit structure 26, an electronic element 27, a semiconductor element 28, a second optical element 252, a heat sink 20, and a light guide carrier 253.

[0045] The light guide carrier 253 is disposed above the second optical element 252, so that the second optical element 252 is sandwiched between the first optical element 251 and the light guide carrier 253 to form a light channel.

[0046] In this embodiment, the heat sink 20 is, for example, a heat sink cover, which is placed on the second encapsulation layer 242 and thermally connected to the electronic component 27 and the semiconductor component 28. At the same time, the heat sink 20 has a groove 201 to form a socket 202 for accommodating the light guide carrier 253.

[0047] The light guide 253 is, for example, a fiber array unit (FAU) for connecting the optical fiber 30. In addition, the light guide 253 is provided with a total reflection mirror or lens to change the optical signal transmission path.

[0048] The bottom of the groove 201 of the heat sink 20 has an opening 203, through which the optical signal transmitted by the optical fiber 30 passes through the opening 203 via the light guide carrier 253 and sequentially passes through the second optical element 252, the circuit structure 26 and the first optical element 251 to reach the optical chip 21.

[0049] Please refer to the following at the same time. Figures 4A to 4F This demonstrates different combinations of the first optical element 251, the second optical element 252, and the light guide carrier 253 to enhance and alter the intensity and direction of the optical signal. For example... Figure 4A As shown, a convex lens 2511 may be formed in the first optical element 251; or as... Figure 4BAs shown, a concave lens 2532 can be optionally formed on the light guide carrier 253; or as shown in the figure. Figure 4C As shown, a concave lens 2522 can be formed on the second optical element 252; or as shown in the figure. Figure 4D As shown, a convex lens 2531 can be formed on the reflector within the light guide carrier 253; or as shown in the diagram... Figure 4E As shown, a convex lens 2521 may be formed in the second optical element 252; or as shown in the figure. Figure 4F As shown, a convex lens 2511 may be formed on the reflector within the first optical element 251.

[0050] Please see Figure 5 This is a cross-sectional schematic diagram of the second embodiment of the optical packaging structure 5 of this application. This embodiment is largely the same as the previous embodiment, the main difference being that no bridging chip is embedded in the first packaging layer 241, wherein the electronic components 27 and semiconductor components 28 disposed on the circuit structure 26 can be electrically connected to each other through the circuit layer 264 of the circuit structure 26.

[0051] Please see Figure 6 This is a cross-sectional schematic diagram of the third embodiment of the optical packaging structure 6 of this application. This embodiment is largely the same as the previous embodiments, with the main difference being that the heat sink and the socket for accommodating the light guide carrier are integrally formed in the previous embodiments, while in this embodiment, the heat sink 20 and the socket 202 for accommodating the light guide carrier 253 are manufactured separately and then combined. In addition, the optical packaging structure 6 may also include a substrate 60 for carrying the circuit structure 26, and the circuit structure 26 is electrically connected to the substrate 60 through a plurality of conductive elements 290.

[0052] In summary, the optical packaging structure of this application mainly embeds an optical chip with a first optical element in the first packaging layer, and sequentially stacks a circuit structure, semiconductor element and electronic element on the first packaging layer. Then, a heat sink with a light guide carrier is connected to the semiconductor element and electronic element, so that the semiconductor element is directly electrically connected to the optical chip through the circuit structure to shorten the signal transmission path between them and improve the signal transmission rate. The heat sink can be placed on the semiconductor element to improve the heat dissipation efficiency. At the same time, the heat sink is combined with a socket to accommodate the light guide carrier, so that the light guide carrier is placed above the optical chip to reduce the interference problem of the light guide carrier placement.

[0053] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.

Claims

1. An optical packaging structure, characterized in that, include: The circuit structure has a first side and a second side that are opposite to each other; An optical chip is disposed on the first side of the circuit structure and electrically connected to the circuit structure; A semiconductor element is disposed on the second side of the circuit structure and electrically connected to the circuit structure; as well as A heat sink is incorporated with a light guide and disposed on the semiconductor element.

2. The optical packaging structure as described in claim 1, characterized in that, The optical chip incorporates a first optical element to alter the path of optical signal transmission.

3. The optical packaging structure as described in claim 2, characterized in that, The optical wafer has a first engaging portion, and the first optical element has a second engaging portion, so that the first optical element is engaged with the first engaging portion of the optical wafer through the second engaging portion.

4. The optical packaging structure as described in claim 2, characterized in that, The optical packaging structure also includes a second optical element disposed on the second side of the circuit structure and sandwiched between the first optical element and the light guide carrier.

5. The optical packaging structure as described in claim 4, characterized in that, The optical signal reaches the optical chip via the light guide carrier and sequentially through the second optical element, the circuit structure, and the first optical element.

6. The optical packaging structure as described in claim 1, characterized in that, The optical packaging structure also includes electronic components disposed on the second side of the circuit structure and electrically connected to the circuit structure.

7. The optical packaging structure as described in claim 1, characterized in that, The optical packaging structure also includes a first packaging layer that covers the optical chip.

8. The optical packaging structure as described in claim 1, characterized in that, The optical packaging structure also includes a bridging chip disposed on the first side of the circuit structure and electrically connected to the circuit structure.

9. The optical packaging structure as described in claim 1, characterized in that, The optical packaging structure also includes a plurality of conductive pillars disposed on the first side of the circuit structure and electrically connected to the circuit structure.

10. The optical packaging structure as described in claim 1, characterized in that, The optical packaging structure also includes a second packaging layer formed on the second side of the circuit structure and covering the semiconductor element.

11. The optical packaging structure as described in claim 1, characterized in that, The heat sink has grooves formed to form a socket for accommodating the light guide carrier.

12. The optical packaging structure as described in claim 1, characterized in that, The heat sink is combined with a socket for accommodating the light guide carrier.

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