Semiconductor device housing, semiconductor module, and motor controller

Abstract

The utility model provides a kind of semiconductor device shell, semiconductor module and motor controller, the semiconductor device shell both sides are respectively used to with PCB and substrate fixed, to the side of semiconductor device shell towards PCB is A side, the side of substrate is B side, characterized in that, multiple guide holes are equipped on the semiconductor device shell, and the A side of semiconductor device shell is provided with first pre-lock structure;Wherein, the guide hole is used to for the pin on the substrate to pass through, and first pre-lock structure is used to with the PCB is fixed.The utility model discloses semiconductor device shell, semiconductor module and motor controller, by setting semiconductor device shell, to protect the substrate, reduce the influence of environment, improve the life of the motor controller;Make pin and the opening on PCB more easily align, to facilitate the semiconductor module and PCB are installed and fixed, improve assembly efficiency.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor devices, specifically to a semiconductor device housing, a semiconductor module, and a motor controller. Background Technology

[0002] In power electronic conversion topologies, two types of power devices are commonly used: general-purpose potted power modules and through-hole single-transistor devices. While power modules composed of single transistors are relatively complex to apply and assemble, they offer greater flexibility in power topology design. Furthermore, through-hole single-transistor devices have high technological maturity, high yield, lower profit margins for packaging and testing companies, and lower packaging and testing costs. Therefore, power modules composed of single-transistor devices generally have a lower cost than standard potted modules.

[0003] However, power modules composed of plug-in single-transistor devices have the following problems when used: it is difficult to align the openings on the PCB with the pins on the power module composed of a single transistor. When multiple power modules composed of single transistors are mapped onto a single PCB, the pin alignment difficulty doubles.

[0004] In view of this, it is necessary to improve existing semiconductor devices to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a semiconductor device housing to solve the problem of low assembly efficiency caused by the difficulty in aligning pins with openings on the PCB when assembling power modules composed of existing plug-in single-tube devices with the PCB.

[0006] To achieve the above objectives, this utility model provides a semiconductor device housing, wherein the two sides of the semiconductor device housing are respectively used for fixing to a PCB and a substrate, with the side of the semiconductor device housing facing the PCB as side A and the side facing the substrate as side B. The semiconductor device housing is provided with a plurality of guide holes, and a first pre-locking structure protrudes from side A of the semiconductor device housing. The guide hole is used for the pins on the substrate to pass through, and the first pre-locking structure is used to fix it to the PCB.

[0007] Optionally, a limiting member protrudes from side A of the semiconductor device housing, the limiting member being used to limit the movement of the PCB.

[0008] Optionally, the guide hole includes a guide portion that protrudes from side A of the semiconductor device housing. The guide portion is hollow and gradually decreases in size from side B toward side A.

[0009] Optionally, a second pre-locking structure protrudes from side B of the semiconductor device housing, the second pre-locking structure being used to fix it to the substrate.

[0010] Optionally, the second pre-locking structure is disposed in the edge region of the semiconductor device housing.

[0011] Optionally, the first pre-locking structure and / or the second pre-locking structure are snap-fits, which are used to engage with the PCB and / or the substrate.

[0012] Optionally, there may be multiple first pre-locking structures and multiple second pre-locking structures.

[0013] This utility model also provides a semiconductor module, which includes a substrate and a semiconductor device housing as described above, wherein a semiconductor device is disposed on the substrate. The semiconductor device includes pins, and the semiconductor devices on the substrate are electrically connected to form a power topology. The projection of the power topology along a direction perpendicular to the substrate falls into the housing of the semiconductor device.

[0014] Optionally, the substrate is one of an aluminum substrate, an IMS substrate, a ceramic substrate, or a metal composite substrate. This invention also provides a motor controller. The motor controller includes the semiconductor module, PCB and heat sink as described above. The heat sink is located below the semiconductor module and the PCB is located above the semiconductor module.

[0015] Optionally, the motor controller further includes fasteners, and the PCB, semiconductor device housing and the substrate are provided with corresponding connection holes. The semiconductor module and the PCB are fixed to the heat sink by the fasteners passing through the connection holes.

[0016] Optionally, the number of semiconductor modules may be multiple.

[0017] The beneficial effects of this utility model are as follows: The semiconductor device housing and semiconductor module of this utility model can protect the substrate of the semiconductor module by setting the semiconductor device housing, reducing the environmental impact on the substrate and the devices on the substrate, thereby improving the life of the motor controller; the semiconductor device housing is provided with a first pre-locking structure and a guide hole. The first pre-locking structure can realize the pre-assembly of the semiconductor module and the PCB, and the guide hole can guide the pins, making it easier to align the pins of the semiconductor module with the openings on the PCB, thereby facilitating the installation and fixing of the semiconductor module and the PCB and improving the assembly efficiency. Attached Figure Description

[0018] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a schematic diagram of the structure of a semiconductor device housing provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of another angle of the structure of a semiconductor device housing provided by an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of a semiconductor module provided in an embodiment of this utility model; Figure 4 This is a schematic diagram of another angle of the structure of a semiconductor module provided in an embodiment of this utility model; Figure 5 This is an exploded structural diagram of the semiconductor module provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of another semiconductor module provided in this embodiment of the present invention; Figure 7 This is an exploded structural diagram of another semiconductor module provided in this embodiment of the present invention; Figure 8 This is a schematic diagram of the semiconductor module and PCB provided in this embodiment of the utility model; Figure 9 This is a schematic diagram of the structure of the motor controller provided in this embodiment of the utility model; Figure 10 This is an exploded structural diagram of the motor controller provided in an embodiment of the present invention.

[0019] Figure label: 100. Motor controller; 1. Semiconductor module; 11. Semiconductor device housing; 1111. Guide hole; 111. Guide part; 112. First pre-locking structure; 113. Second pre-locking structure; 114. Limiting member; 12. Substrate; 121. Pin; 13. Connecting hole; 2. PCB; 3. Heat sink. Detailed Implementation

[0020] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0021] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0023] This application provides a semiconductor device housing, such as... Figures 1 to 10 As shown, the semiconductor device housing 11 has two sides for fixing to the PCB 2 and the substrate 12, respectively. The side of the semiconductor device housing 11 facing the PCB 2 is called side A, and the side facing the substrate 12 is called side B.

[0024] like Figures 1 to 5 As shown, the semiconductor device housing 11 is provided with a plurality of guide holes 1111, and a first pre-locking structure 112 protrudes from the A side of the semiconductor device housing 11.

[0025] The guide hole 1111 is used for the pins on the substrate to pass through, and the guide hole 1111 can guide and correct the pins on the substrate.

[0026] The first pre-locking structure 112 is used to fix the semiconductor device housing 11 and the PCB 2 during the assembly of the semiconductor device housing 11 and the PCB 2.

[0027] The semiconductor device housing 11 provided in this application embodiment allows pins on the substrate to pass through guide holes when assembled with a substrate to form a semiconductor module. The guide holes guide and correct the pins on the substrate. When the semiconductor device housing 11 and the PCB are assembled, a first pre-locking structure and a corresponding structure on the PCB are used for pre-locking and fixing, thereby achieving pre-assembly of the semiconductor module and the PCB. Since the guide holes guide and correct the pins on the substrate, the semiconductor device housing 11 is pre-locked and fixed to the PCB through the first pre-locking structure, making it easier to align the pins of the semiconductor module with the openings on the PCB, which is beneficial for rapid assembly and improves assembly efficiency.

[0028] Optionally, the first pre-locking structure 112 is a snap-fit.

[0029] When a buckle is provided on side A of the semiconductor device housing 11, a corresponding slot is provided on the PCB. The buckle on side A of the semiconductor device housing 11 and the slot on the PCB are engaged to achieve a pre-locking effect, which helps to improve the assembly efficiency of the semiconductor module and the PCB.

[0030] Optionally, a limiting member 114 protrudes from side A of the semiconductor device housing 11, the limiting member 114 being used to limit the movement of the semiconductor device housing 11 with respect to the PCB.

[0031] Optionally, the limiting member 114 provided on side A of the semiconductor device housing 11 can be a pin 114.

[0032] Optionally, the guide hole 1111 includes a guide portion 111, which protrudes from side A of the semiconductor device housing 11. The guide portion 111 is hollow, and the guide portion 111 and the guide hole 1111 are connected through each other. The guide portion 111 gradually decreases in size from side B towards side A. For example, as... Figure 1 or Figure 3 As shown, the guide portion 111 is funnel-shaped, and the cross-sectional dimensions of the guide portion 111 gradually decrease.

[0033] Optionally, a second pre-locking structure 113 is provided on the B side of the semiconductor device housing 11, which is used to fix it to the substrate.

[0034] In one example, the second pre-locking structure is a snap-fit; when the semiconductor device housing 11 is assembled with the substrate, the semiconductor device housing 11 and the substrate 12 snap together to form the semiconductor module 1.

[0035] Optionally, the second pre-locking structure 113 is disposed in the edge region of the semiconductor device housing 11.

[0036] By fixing the semiconductor device housing 11 and the substrate 12 with the edge of the second pre-locking structure 113 located in the edge region of the semiconductor device housing 11, it is ensured that the semiconductor device housing 11 and the substrate 12 are firmly engaged and do not fall off.

[0037] In some optional embodiments, a slot may also be provided on the substrate to cooperate with and fix it to the second pre-locking structure 113.

[0038] In optional embodiments of this application, the first pre-locking structure 112 and the second pre-locking structure 113 may be configured in other forms, such as double-sided adhesive, magnetic attraction, or elastic claws, as long as they can achieve relative fixation between the semiconductor device housing 11 and the PCB, and relative fixation between the semiconductor device housing 11 and the substrate 12.

[0039] In an optional embodiment of this example, there are multiple first pre-locking structures 112 and second pre-locking structures 113.

[0040] Optionally, the first pre-locking structure 112 and the second pre-locking structure 113 are disposed around the edge region of the semiconductor device housing 11.

[0041] In an optional embodiment of this application, the semiconductor device housing 11 has a protruding pin 114 on side A for positioning with the PCB2. When the semiconductor module 1 and PCB2 are mated, they are first positioned by the pin 114, and then the semiconductor module 1 is pre-mounted onto the PCB2 by the first pre-locking structure 112. The pins 121 are then soldered to the PCB2. Since the PCB2 and the pin 114 are matched and aligned, and the pins 121 are guided by the guide hole 1111, the alignment of the pins 121 and the openings of the PCB2 does not need to be considered during assembly. The alignment of the pins 114 on the semiconductor device housing 11 and the PCB2 is easier than the positioning of the pins 121 and the PCB2, making assembly simpler and improving assembly efficiency.

[0042] In some embodiments, the pin 114 may be omitted, and the first pre-locking structure 112 may serve as a guide to replace the pin 114.

[0043] This application provides a semiconductor module, such as... Figure 3 As shown, the semiconductor module includes a substrate 12 and a semiconductor device housing 11 as shown in the above embodiment.

[0044] Semiconductor devices are disposed on substrate 12. The semiconductor devices include pins 121. The semiconductor devices on substrate 12 are electrically connected to form a power topology. The projection of the power topology along the direction perpendicular to substrate 12 falls into the semiconductor device housing 11. The semiconductor device housing 11 can protect the power topology on substrate 12 from damage, environmental pollution, etc.

[0045] Optionally, the substrate 12 is one of an aluminum substrate 12, an IMS (Insulated Metal Substrate) substrate 12, a ceramic substrate, or a metal composite substrate.

[0046] In an optional embodiment of this application, there are multiple guide holes 1111. For each pin 121 on the substrate 12, a corresponding guide hole 1111 is provided on the semiconductor housing.

[0047] This utility model embodiment provides a motor controller 100, such as Figures 8 to 10 As shown, the motor controller 100 includes a semiconductor module 1, a PCB 2, and a heat sink 3.

[0048] Heat sink 3 is positioned below semiconductor module 1, and PCB 2 is positioned above semiconductor module 1.

[0049] Optionally, the motor controller 100 also includes fasteners, and corresponding connection holes 13 are provided on the PCB2, the semiconductor device housing 11 and the substrate 12. The semiconductor module 1 and the PCB2 are fixed to the heat sink 3 by the fasteners passing through the connection holes 13.

[0050] Optionally, the fastener is a screw.

[0051] Optionally, the number of semiconductor modules 1 in the motor controller 100 may be multiple. The multiple semiconductor modules in the motor controller 100 may be the same type of semiconductor module or multiple types of semiconductor modules. For example, the semiconductor modules in the motor controller 100 may include rectifier modules and inverter modules. The rectifier modules and inverter modules are fixed by fasteners, PCBs, and heat sinks.

[0052] After the semiconductor device is soldered onto the substrate, the pins on the substrate are easily bent or misaligned. In this embodiment, when the semiconductor device housing 11 is assembled with the substrate, the pins on the substrate pass through guide holes and are guided by the guide portion of the guide holes to correct any misaligned pins on the substrate. The substrate and the second pre-locking structure of the semiconductor device housing 11 are fixed together, and the semiconductor device housing 11 and the substrate are assembled into a semiconductor module. When assembling the semiconductor module onto the PCB, the first pre-locking structure on the semiconductor device housing 11 secures the semiconductor module onto the PCB and prevents it from falling off. Then, the PCB with the semiconductor module is mounted onto the heat sink, and fasteners are used to lock the PCB with the semiconductor module onto the heat sink. Furthermore, when a limiting member 114 is provided on the semiconductor device housing 11, the limiting member 114 can more easily and accurately guide the semiconductor module onto the PCB.

[0053] The semiconductor device housing 11 and semiconductor module 1 provided in this application embodiment can protect the substrate 12, reduce the environmental impact on the substrate and the devices on the substrate, and thus improve the lifespan of the motor controller 100. A first pre-locking structure 112 and a guide hole 1111 are provided on the semiconductor device housing 11. The first pre-locking structure 112 realizes the pre-assembly of the semiconductor module 1 and PCB2, and the guide hole 1111 guides the pin 121, making it easier to align the pin 121 with the opening on the PCB2, thereby facilitating the installation and fixing of the semiconductor module 1 and PCB2 and improving the assembly efficiency. When multiple semiconductor modules 1 and PCB2 are installed and fixed, the first pre-locking structure on the semiconductor device housing 11 has a more significant effect on improving the assembly efficiency.

[0054] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0055] The above embodiments only illustrate several implementation methods of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A semiconductor device housing, wherein two sides of the semiconductor device housing are respectively used for fixing to a PCB and a substrate, with the side of the semiconductor device housing facing the PCB designated as side A and the side facing the substrate designated as side B, characterized in that, The semiconductor device housing is provided with multiple guide holes, and a first pre-locking structure protrudes from side A of the semiconductor device housing; The guide hole is used for the pins on the substrate to pass through, and the first pre-locking structure is used to fix it to the PCB.

2. The semiconductor device housing according to claim 1, characterized in that, A limiting member is provided on side A of the semiconductor device housing, and the limiting member is used to limit the movement of the PCB.

3. The semiconductor device housing according to claim 1, characterized in that, The guide hole includes a guide portion that protrudes from side A of the semiconductor device housing. The guide portion is hollow and gradually decreases in size from side B toward side A.

4. The semiconductor device housing according to any one of claims 1 to 3, characterized in that, The semiconductor device housing has a second pre-locking structure protruding from side B, which is used to fix it to the substrate.

5. The semiconductor device housing according to claim 4, characterized in that, The second pre-locking structure is disposed on the edge region of the semiconductor device housing.

6. The semiconductor device housing according to claim 4, characterized in that, The first pre-locking structure and / or the second pre-locking structure are snap-fits, which are used to engage with the PCB and / or the substrate.

7. The semiconductor device housing according to claim 4, characterized in that, There are multiple first pre-locking structures and multiple second pre-locking structures.

8. A semiconductor module, characterized in that, The semiconductor module includes a substrate and a semiconductor device housing as described in any one of claims 1 to 7, wherein a semiconductor device is disposed on the substrate; The semiconductor device includes pins, and the semiconductor devices on the substrate are electrically connected to form a power topology. The projection of the power topology along a direction perpendicular to the substrate falls into the housing of the semiconductor device.

9. The semiconductor module according to claim 8, characterized in that, The substrate is one of aluminum substrate, IMS substrate, ceramic substrate, and metal composite substrate.

10. A motor controller, characterized in that, The motor controller includes a semiconductor module, a PCB, and a heat sink as described in claim 8 or 9, wherein the heat sink is disposed below the semiconductor module and the PCB is disposed above the semiconductor module.

11. The motor controller according to claim 10, characterized in that, The motor controller also includes fasteners, and the PCB, semiconductor device housing and the substrate are respectively provided with connection holes. The semiconductor module and the PCB are fixed to the heat sink by the fasteners passing through the connection holes.

12. The motor controller according to claim 10 or 11, characterized in that, The number of semiconductor modules is multiple.

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