Heat generating body, heat generating assembly, and aerosol generating device

Abstract

The application belongs to the technical field of aerosol generating devices, and provides a heating body, a heating assembly and an aerosol generating device. The heating body comprises a base body, a conductive functional layer, a barrier layer and a protective layer. The conductive functional layer is arranged on one side of the base body and is used for connecting a lead wire. The barrier layer is arranged on the side of the conductive functional layer away from the base body, and the barrier layer and the conductive functional layer form a first step structure at the connection position. The protective layer continuously covers the conductive functional layer and the barrier layer, and covers the surface of the first step structure. The heating body provided by the application has the advantages of not being prone to breaking and high reliability, and can improve the user experience.

Description

Technical Field

[0001] This application belongs to the technical field of aerosol generating devices, and more specifically, relates to a heating element, a heating component, and an aerosol generating device. Background Technology

[0002] Taking a heated non-combustible aerosol generator as an example, the heating element, as one of the core components of the aerosol generator, generates heat and applies it to the aerosol generating matrix, causing the matrix to produce aerosols that can be inhaled by the user under heating. In related technologies, the heating element is easily corroded and may cause circuit failure when exposed to a sulfur-containing environment for a long time, affecting the user experience. Utility Model Content

[0003] This application provides a heating element, a heating component, and an aerosol generating device, aiming to improve the problem of heating elements in related technologies being prone to open-circuit failure due to corrosion in sulfur-containing environments, and to improve the user experience.

[0004] To achieve the above objectives, in a first aspect, this application provides a heating element, including a substrate, a conductive functional layer, a barrier layer, and a protective layer. The conductive functional layer is disposed on one side of the substrate and is used to connect leads. The barrier layer protrudes from the conductive functional layer on the side opposite to the substrate, and the barrier layer and the conductive functional layer form a first step structure at the connection point. The protective layer continuously covers the conductive functional layer and the barrier layer, and covers the surface of the first step structure.

[0005] In the heating element provided in this application embodiment, a protective layer can be used to cover and protect the conductive functional layer and the barrier layer, so as to initially isolate the conductive functional layer and the barrier layer from the external sulfur-containing environment, avoid the conductive functional layer from directly contacting the sulfur-containing environment and corroding. The first step structure formed on the barrier layer and the conductive functional layer can be used to prevent the cracks formed on the protective layer from continuing to extend along the extension direction of the protective layer, thereby further improving the protective effect of the protective layer on the conductive functional layer by improving the crack extension on the surface of the protective layer.

[0006] Optionally, the conductive functional layer includes a first sub-layer and a second sub-layer that are electrically connected. The first sub-layer is configured to generate heat when energized, and the second sub-layer is configured as an electrode. A conductive medium for connecting the lead is disposed on the second sub-layer, and the protective layer covers at least a portion of the surface of the conductive medium on the side opposite to the second sub-layer. At least a portion of the barrier layer is located on the side of the second sublayer facing away from the substrate.

[0007] Optionally, the first sublayer includes a connected main body and an overlapping portion. The main body and the second sublayer are disposed on the same side of the substrate at the same layer. At least a portion of the overlapping portion is located on the side of the second sublayer facing away from the substrate and is electrically connected to the second sublayer.

[0008] Optionally, the overlapping portion is spaced apart from the conductive medium, and at least a portion of the barrier layer is located on the side of the conductive medium facing the overlapping portion and is in contact with the surface of the second sub-layer facing away from the substrate; Alternatively, the overlap may be in contact with the conductive medium, and at least a portion of the barrier layer may be located on the side of the overlap facing away from the substrate.

[0009] Optionally, the conductive medium covers at least a portion of the surface of the barrier layer on the side opposite to the substrate, and the conductive medium is fixedly connected to the barrier layer.

[0010] Optionally, at least a portion of the surface of the barrier layer is provided with a metal layer, and the conductive medium is fixedly connected to the barrier layer through the metal layer.

[0011] Optionally, the barrier layer has a second step structure on the side facing away from the substrate, and the protective layer covers the surface of the second step structure.

[0012] Optionally, the second stepped structure is located on the side of the barrier layer facing the conductive medium.

[0013] Optionally, the second step structure includes a first surface, a second surface, and a first connecting surface, wherein the second surface is located on the side of the first surface facing the substrate, and the first connecting surface connects the first surface and the second surface; The conductive medium covers at least a portion of the second surface.

[0014] Optionally, the conductive medium is spaced apart from the first connection surface, and the protective layer is recessed with a groove opposite to the second surface, wherein the orthographic projection of the groove on the substrate at least partially coincides with the orthographic projection of the second surface on the substrate.

[0015] Optionally, the second sublayer has a first end for connecting the first sublayer and a second end for connecting the conductive medium. The second sublayer also includes a first sidewall and a second sidewall connecting the first end and the second end. The first sidewall and the second sidewall are disposed opposite to each other and both point towards the substrate. Wherein, at least a portion of the barrier layer is located between the first end and the second end and simultaneously covers at least a portion of the first sidewall and the second sidewall; or, the barrier layer is disposed around the conductive medium, and the orthographic projection of the conductive medium on the substrate is located within the outer contour of the orthographic projection of the barrier layer on the substrate.

[0016] Optionally, the number of second sub-layers is at least two and they are spaced apart on the substrate, and any one of the first sub-layers is connected to at least two of the second sub-layers.

[0017] Optionally, the second sublayer is a silver-containing electrode.

[0018] Optionally, the barrier layer is made of the same material as the first sub-layer, or the barrier layer is an insulating layer.

[0019] Optionally, the conductive functional layer includes a first top surface, and the barrier layer includes a first surface and a second connecting surface. The first surface is located on the side of the first top surface facing away from the substrate, and the second connecting surface connects the first top surface and the first surface to form the first stepped structure. The distance between the first top surface and the first surface is greater than or equal to 10 μm.

[0020] Optionally, the substrate includes a first insulating layer, and the conductive functional layer is connected to the substrate through the first insulating layer.

[0021] Optionally, the substrate further includes a first support layer located on the side of the first insulating layer opposite to the conductive functional layer, the first support layer including at least one of an insulating support layer and a thermally conductive support layer.

[0022] In a second aspect, embodiments of this application provide a heating component, including the heating element described in any of the above claims.

[0023] In a third aspect, embodiments of this application provide an aerosol generating apparatus, including the heating component described above.

[0024] Compared with related technologies, this application has at least the following beneficial effects: The heating element provided in this application embodiment can effectively protect the conductive functional layer through a protective layer, thereby isolating the conductive functional layer from the sulfur-containing environment. The barrier layer disposed between the conductive functional layer and the protective layer can help prevent cracks formed on the protective layer due to lead wire movement from extending outward from the conductive medium, thereby further improving the protective effect of the protective layer, reducing the possibility of corrosion and circuit breakage of the conductive functional layer due to cracks in the protective layer, helping to improve the reliability and service life of the heating element, and ultimately improving the user experience.

[0025] The heating element and aerosol generating device provided in this application embodiment have the beneficial effects of any one or more of the above-mentioned heating elements, which will not be repeated here. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 A schematic diagram of the structure of the heating element provided in the embodiments of this application. Figure 1 ; Figure 2 yes Figure 1 A schematic diagram showing the interaction between the barrier layer, the second sublayer, and the conductive medium. Figure 3 for Figure 1 Top view of the heating element shown; Figure 4 A schematic diagram of the structure of the heating element provided in the embodiments of this application. Figure 2 ; Figure 5 for Figure 4 Top view of the heating element shown; Figure 6 A schematic diagram of the structure of the heating element provided in the embodiments of this application. Figure 3 ; Figure 7 for Figure 6 A schematic diagram showing the interaction between the barrier layer, the second sublayer, and the conductive medium. Figure 8 A schematic diagram of the structure of the heating element provided in the embodiments of this application. Figure 4 ; Figure 9 A schematic diagram of the structure of the heating element provided in the embodiments of this application. Figure 5 ; Figure 10 A schematic diagram of the structure of the heating element provided in the embodiments of this application. Figure 6 ; Figure 11 A schematic diagram of the structure of the heating element provided in the embodiments of this application. Figure 7 .

[0028] The following are the labeling elements in the figure: 10. Heating element; 1. Substrate; 11. First insulating layer; 12. First supporting layer; 2. Conductive functional layer; 201. First top surface; 21. First sub-layer; 211. Main body; 212. Overlapping part; 22. Second sub-layer; 2201. First end; 2202. Second end; 2203. First sidewall; 2204. Second sidewall; 3. Barrier layer; 301. First surface; 302. Second surface; 303. First connecting surface; 304. Second connecting surface; 4. Protective layer; 41. Groove; 5. Lead wire; 6. Conductive medium; 7. Metal layer. Detailed Implementation

[0029] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0030] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0031] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0033] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0034] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0035] In this application, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0036] In the embodiments of this application, a heating element 10, a heating component, and an aerosol generating device are provided. Those skilled in the art will understand that the heating element 10 is a key component of the heating component, used to provide heat to the aerosol generating matrix, thereby heating the aerosol generating matrix and generating aerosols. The heating component installed within the aerosol generating device can be used to cooperate with the aerosol generating matrix or to form a receiving cavity for accommodating the aerosol generating matrix.

[0037] It should be noted that the aerosol generating matrix can be solid or liquid. The aerosol generating matrix can generate aerosols under heating conditions, and these aerosols can contain volatile compounds. The aerosol generating matrix can include, but is not limited to, materials used for medical, wellness, health, and beauty purposes. For example, the aerosol generating matrix can be prepared from plant-based materials, such as plant roots, stems, leaves, flowers, buds, and seeds.

[0038] Those skilled in the art should know that the structure of the aerosol generating matrix can refer to the existing structure in the related art, and the assembly structure and shape of each component in the aerosol generating device can refer to the existing structure in the related art. No further detailed description will be given in this application.

[0039] In related technologies, when the heating element 10 is exposed to a sulfur-containing environment for a long time, the conductive structure inside it may fail due to sulfur corrosion. This not only affects the service life and reliability of the heating element 10, but also affects the user experience to some extent.

[0040] To address the aforementioned issues, enhance the reliability and lifespan of the heating element 10, and improve the user experience, this application provides a heating element 10 with superior corrosion resistance, enabling it to better adapt to sulfur-containing environments.

[0041] The structure of the heating element 10 provided in the embodiments of this application will be described below with reference to the accompanying drawings.

[0042] In this embodiment, the heating element 10 includes a substrate 1, a conductive functional layer 2, a barrier layer 3, and a protective layer 4. The substrate 1 is a plate-like structure with a certain thickness and strength, providing good structural strength for the heating element 10. The conductive functional layer 2 is fixedly disposed on one side of the substrate 1. The barrier layer 3 is located on the side of the conductive functional layer 2 facing away from the substrate 1 and protrudes relative to the conductive functional layer 2 towards the side facing away from the substrate 1. A first step structure is formed at the surface connection between the barrier layer 3 and the conductive functional layer 2. The protective layer 4 can cover the conductive functional layer 2 and the barrier layer 3 through the surface of the first step structure. In addition, the conductive functional layer 2 is also used to connect the lead wire 5, which can extend outward through the protective layer 4.

[0043] Specifically, the substrate 1 can be a single-layer structure, in which case the substrate 1 is an insulating structure. For example, the substrate 1 includes a first insulating layer 11, and the conductive functional layer 2 is connected to the substrate 1 through the first insulating layer 11. The first insulating layer 11 can be made of an insulating material (e.g., a ceramic material). Alternatively, the substrate 1 can also be a multilayer structure. For example, the substrate 1 includes a first insulating layer 11 and a first support layer 12 stacked together. The structure of the first insulating layer 11 can be referred to above. The first support layer 12 can be a single-layer structure or a multilayer structure. When the first support layer 12 is a multilayer structure, the first support layer 12 can include at least one of an insulating material or a metallic material. That is, the first support layer 12 includes an insulating support layer made of an insulating material, or it can include a thermally conductive support layer made of a metallic material. Taking the first support layer 12 including a thermally conductive support layer as an example, the thermally conductive support layer is located on the side of the first insulating layer 11 opposite to the conductive functional layer 2. At least part of the heat generated when the conductive functional layer 2 is working is dissipated through the thermally conductive support layer and acts on the aerosol generation matrix.

[0044] In this embodiment, the heating element 10 can cover and protect the conductive functional layer 2 and the barrier layer 3 through the protective layer 4, so as to initially isolate the conductive functional layer 2 and the barrier layer 3 from the external sulfur-containing environment and prevent the conductive functional layer 2 from directly contacting the sulfur-containing environment and corroding.

[0045] The protective layer 4 is a continuous film layer that can cover the barrier layer 3 and the conductive functional layer 2 through the first step structure, and maintains the integrity of the film layer when covering the first step structure.

[0046] In some embodiments, the material of the protective layer 4 includes glass glaze (ceramic glaze), which has good corrosion resistance and high temperature resistance, and can effectively protect the conductive functional layer 2 in high-temperature environments. However, the protective layer 4 made of materials such as glass glaze has relatively poor toughness and is easily cracked by tensile stress or impact load. Of course, the protective layer 4 can also be other high-temperature resistant insulating materials disclosed in other related technologies, which will not be elaborated here.

[0047] When the protective layer 4 cracks due to external force, the first step structure formed at the connection between the barrier layer 3 and the conductive functional layer 2 can be used to prevent the cracks formed on the protective layer 4 from continuing to extend along the extension direction of the protective layer 4, thereby further improving the protective effect of the protective layer 4 on the conductive functional layer 2 by improving the crack extension and distribution range on the surface of the protective layer 4.

[0048] To better utilize the barrier layer 3 to protect the conductive functional layer 2, in some embodiments, the conductive functional layer 2 includes a first sub-layer 21 and a second sub-layer 22 that are electrically connected. The first sub-layer 21 is configured to generate heat when energized, and the second sub-layer 22 is configured as an electrode. A conductive medium 6 for connecting the lead 5 is disposed on the second sub-layer 22, and a protective layer 4 covers at least a portion of the surface of the conductive medium 6 on the side opposite to the second sub-layer 22. In this case, at least a portion of the barrier layer 3 is located on the side of the second sub-layer 22 opposite to the substrate 1, so as to cooperate with the surface of the conductive functional layer 2 to form a first stepped structure.

[0049] During subsequent operations (such as assembly, handling, and testing) or during equipment operation, the lead wire 5 of the heating element 10 may be bent or pulled. This external force will be transmitted to the adjacent protective layer 4, causing the protective layer 4 to crack and be damaged under the tensile or shearing action of the external force. In this embodiment, the barrier layer 3 located on the side of the second sub-layer 22 facing away from the substrate 1 can disperse the stress of the protective layer 4, thereby stopping the propagation of stress-induced cracks in the protective layer 4 at the first step. The barrier layer 3 can help prevent cracks from extending from the conductive medium 6 through the second sub-layer 22 to the first sub-layer 21, thereby effectively limiting the cracks formed on the protective layer 4 to only be located between the barrier layer 3 and the conductive medium 6. By limiting crack propagation and reducing the crack distribution range, the reliability and corrosion resistance of the heating element 10 are improved.

[0050] In this embodiment, the first sublayer 21 is used to generate heat when energized, and the second sublayer 22 is used to guide the external current input through the lead 5 into the first sublayer 21. Generally, the second sublayer 22 has better conductivity, and correspondingly, the second sublayer 22 is more susceptible to corrosion in sulfur-containing environments.

[0051] Specifically, the second sublayer 22 can be a silver electrode containing silver or a copper electrode containing copper. The following description uses the example of a silver electrode containing silver as the second sublayer 22 to illustrate the structure of the heating element 10.

[0052] Please see Figure 1At this time, the first sublayer 21 includes a connected main body 211 and an overlapping portion 212, wherein the main body 211 and the second sublayer 22 are disposed on the same side of the substrate 1 in the same layer, and at least a portion of the overlapping portion 212 is located on the side of the second sublayer 22 facing away from the substrate 1, for connecting the second sublayer 22 and the main body 211, thereby realizing the electrical connection between the first sublayer 21 and the second sublayer 22. The second sublayer 22 has a first end 2201 and a second end 2202, the overlapping portion 212 is connected to the first end 2201 of the second sublayer 22, and the second end 2202 is disposed opposite to the first end 2201. The second end 2202 or the area surrounding the second end 2202 is used to provide a conductive medium 6, so as to realize the electrical connection with the lead 5 (that is, the conductive medium 6 can be located exactly at the end of the second end 2202 of the second sublayer 22, or it can be located around and adjacent to the second end 2202 of the second sublayer 22). The overlap portion 212 and the conductive medium 6 are spaced apart on the upper surface (the surface facing away from the substrate 1) of the second sublayer 22. At least a portion of the barrier layer 3 is located on the side of the conductive medium 6 facing the overlap portion 212 and is in contact with the upper surface of the second sublayer 22. At least a portion of the surface of the conductive medium 6 facing away from the second sublayer 22 is covered with a protective layer 4, so as to cover and protect the surface of the conductive medium 6 through the protective layer 4 without affecting the normal use of the lead 5.

[0053] In this embodiment, the first step structure is formed between the second sub-layer 22 and the barrier layer 3, and the barrier layer 3 and the overlapping portion 212 are spaced apart.

[0054] Specifically, the surface of the second sub-layer 22 facing away from the substrate 1 is the first top surface 201. The overlapping portion 212 is connected to the second sub-layer 22 through the first top surface 201, and the barrier layer 3 is connected to the second sub-layer 22 through the first top surface 201. The barrier layer 3 also includes a first surface 301 and a second connecting surface 304, wherein the first surface 301 is located on the side of the first top surface 201 facing away from the substrate 1, and the second connecting surface 304 connects the first top surface 201 and the first surface 301 to form a first stepped structure. Please refer to [link / reference]. Figure 2 .

[0055] There is a significant height difference between the first top surface 201 and the first surface 301, which is greater than or equal to 7 μm.

[0056] In some embodiments, the height difference is set to be greater than or equal to 10 μm. For example, the height difference between the first top surface 201 and the first surface 301 is set to be in the range of 10 μm-30 μm. In this case, the height difference can be set to any value among 10 μm, 14 μm, 15 μm, 16 μm, 20 μm, 21 μm, 22 μm, 25 μm, 26 μm, 27 μm, 28 μm, 29 μm, and 30 μm.

[0057] Under the action of the first step structure, the crack formed on the protective layer 4 will be affected by the height change of the first step structure after extending along the barrier layer 3 to above the first surface 301, thus breaking the stress field distribution on the protective layer 4 and effectively preventing the crack from continuing to extend along the protective layer 4 through the area opposite to the surface of the second connecting surface 304.

[0058] The relative structural relationship between the barrier layer 3 and the second sublayer 22 will be further explained below.

[0059] Please see Figure 3 In addition to the first end 2201 and the second end 2202, which are positioned opposite each other, the second sub-layer 22 also includes a first sidewall 2203 and a second sidewall 2204 on its periphery in the thickness direction. The first sidewall 2203 and the second sidewall 2204 are positioned opposite each other and are both used to connect the first end 2201 and the second end 2202. One end of the first sidewall 2203 and the second sidewall 2204 points towards the substrate 1, and the other end points away from the protective layer 4. The barrier layer 3 is a strip structure and is at least partially located between the first end 2201 and the second end 2202. This strip-shaped barrier layer 3 covers a portion of the first sidewall 2203 and the second sidewall 2204 to separate the first end 2201 and the second end 2202 of the second sub-layer 22. When a crack occurs in the protective layer 4, which is positioned opposite the first end 2201 of the second sub-layer 22, the crack can and can only extend to the area corresponding to the first step structure. At this time, the barrier layer 3 can effectively prevent the crack from extending to the second end 2202 through the first step structure. Under the blocking effect of the barrier layer 3, cracks formed on the protective layer 4 can be effectively prevented from extending through the barrier layer 3 and the first step structure toward the second end 2202 of the second sub-layer 22. This reduces the possibility of cracks appearing in the part of the protective layer 4 corresponding to the second sub-layer 22 located between the barrier layer 3 and the second end 2202, as well as in the part of the protective layer 4 corresponding to the first sub-layer 21. It also improves the integrity and sealing of the protective layer 4 in this area, and enhances the protective effect on the second sub-layer 22 and the first sub-layer 21 in the aforementioned area.

[0060] It should be noted that the distribution range and relative size of the barrier layer 3, the second sub-layer 22 and the first sub-layer 21 in the figure are for illustration only and are not intended to limit their actual distribution range or actual proportion.

[0061] It should be noted that the aforementioned conductive structure layer includes at least two spaced-apart second sub-layers 22, which are spaced apart on the substrate 1, and any one of the first sub-layers 21 is connected to at least two second sub-layers 22. The two second sub-layers 22 are respectively used to connect leads 5 to form a complete conductive loop for connection to an external power supply circuit. For ease of demonstration, Figure 1 , Figure 2 and Figure 3 Only one second sublayer 22 is drawn in the middle.

[0062] It is understood that the conductive structure layer may include one first sublayer 21 or at least two first sublayers 21, and any one of the first sublayers 21 is electrically connected to the two second sublayers 22.

[0063] To further improve the protective effect of the barrier layer 3 on the second sub-layer 22 and prevent the second sub-layer 22 from being corroded and damaged due to cracks in the protective layer 4, the barrier layer 3 can be made to contact and be fixedly connected to the surface of the conductive medium 6.

[0064] For details, please refer to Figure 1 and Figure 3 The conductive medium 6 covers at least a portion of the surface of the barrier layer 3 on the side opposite to the substrate 1, thereby achieving a fixed connection with the barrier layer 3. At this time, the top surface of the second sub-layer 22 and the area corresponding to the potential cracks in the protective layer 4 are both covered and protected by the barrier layer 3. When a crack appears in the area of ​​the protective layer 4 located between the barrier layer 3 and the conductive medium 6, the second sub-layer 22, protected by the barrier layer 3, can always remain isolated from the external sulfur-containing environment, thus avoiding the possibility of corrosion and wire breakage due to the sulfur-containing environment.

[0065] In some embodiments, the lead 5 can be connected to the second sub-layer 22 by brazing, and in this process, brazing material is applied to form the conductive medium 6. The conductive medium 6 formed by welding can be in contact with the barrier layer 3 as an integral structure, at which time the barrier layer 3 and the surface of the conductive medium 6 are in firm contact without gaps.

[0066] Brazing is a metal joining process that involves heating at a temperature below the melting point of the workpieces being joined (in this embodiment, the second sublayer 22 and the lead wire 5). The filler metal (brazing filler metal), with a melting point lower than the base metal, melts and fills the joint gap, diffusing with the base metal to form a metallurgical bond, thus achieving the connection between the workpieces. Its core characteristic is that the base metal does not melt.

[0067] In this design, the barrier layer 3 may include either a metallic material or a non-metallic material. To further enhance the bond strength between the barrier layer 3 and the surface of the conductive medium 6, a metal layer 7 may be provided on at least a portion of the surface of the barrier layer 3, through which the conductive medium 6 is fixedly connected to the barrier layer 3. The metal layer 7 formed on the surface of the conductive medium 6 effectively increases the high-temperature wettability and bonding force between the solder and the barrier layer 3, thereby achieving a high-strength bond between the conductive medium 6 and the barrier layer 3 and enhancing the bond strength.

[0068] The aforementioned metal layer 7 can be formed by local metallization. For example, the metal layer 7, which is attached to at least a portion of the surface of the barrier layer 3, can be prepared by physical vapor deposition (including metal sputtering and metal evaporation deposition), electroplating, or other methods.

[0069] In other similar embodiments, the barrier layer 3 can be a hollow structure, such as an annular structure, in the thickness direction of the conductive functional layer 2. In this case, the barrier layer 3 surrounds the conductive medium 6. Please refer to [link to previous document]. Figure 4 The barrier layer 3 is partially located between the conductive medium 6 and the overlap portion 212, and partially located on the side of the conductive medium 6 opposite to the overlap portion 212.

[0070] Please see Figure 5 The barrier layer 3 is a continuous film structure and can be disposed around the conductive medium 6. The orthographic projection of the conductive medium 6 onto the substrate 1 is located within the outer contour of the orthographic projection of the barrier layer 3 onto the substrate 1.

[0071] like Figure 5 As shown, at this time, the conductive medium 6 covers a portion of the first surface 301 of the barrier layer 3; of course, in other similar embodiments, a certain gap may exist between the conductive medium 6 and the barrier layer 3, or the conductive medium 6 may only cover a portion of the sidewall of the barrier layer 3 facing the conductive medium 6. This embodiment does not limit this.

[0072] With the cooperation of the barrier layer 3 surrounding the conductive medium 6, cracks generated at the protective layer 4 corresponding to the conductive medium 6 can only be confined to the area corresponding to the barrier layer 3, and are unlikely to extend to the area outside the barrier layer 3 through the first step structure. Therefore, this structure can reduce the possibility of cracks appearing in the protective layer 4 in this area by preventing cracks from extending through the barrier layer 3 to the second sub-layer 22 and the first sub-layer 21 on the side of the barrier layer 3 facing away from the conductive medium 6, and improve the integrity and sealing of the protective layer 4 in this area, thereby enhancing the protective effect on the second sub-layer 22 and the first sub-layer 21 in this area.

[0073] It should be noted that the outer contour of the barrier layer 3 surrounding the conductive medium 6 can be a rectangular structure, or a circular, elliptical or approximately circular structure. Accordingly, the barrier layer 3 as a whole is a hollow rectangle, annular ring, elliptical annular ring or approximately annular structure, which is not limited in this embodiment. Correspondingly, the first step structure formed at the connection between the barrier layer 3 and the second sub-layer 22 corresponds to the shape of the barrier layer 3.

[0074] In order to further reduce the extension of cracks formed on the protective layer 4 to the first surface 301 of the barrier layer 3, in some embodiments, the barrier layer 3 may be provided with a second step structure, the second step structure being located on the side of the barrier layer 3 facing away from the substrate 1, and the protective layer 4 covering the surface of the second step structure.

[0075] Please see Figure 6 and Figure 7 The second step structure is located on the side of the barrier layer 3 facing the conductive medium 6.

[0076] Specifically, the barrier layer 3 is also provided with a second surface 302 and a first connecting surface 303. The second surface 302 is located on the side of the first surface 301 facing the substrate 1, and the first connecting surface 303 connects the first surface 301 and the second surface 302 to form a second step structure.

[0077] There is a certain height difference between the first surface 301 and the second surface 302. This height difference can help prevent cracks from extending from the second surface 302 to the first connecting surface 303 and the first surface 301 to a certain extent. This reduces the extension of cracks on the protective layer 4 from the area corresponding to the conductive medium 6 to the area corresponding to the first surface 301 of the barrier layer 3, thereby further enhancing the blocking effect of the barrier layer 3 on cracks formed on the protective layer 4.

[0078] Please see Figure 7 The conductive medium 6 covers at least a portion of the second surface 302 to be fixedly connected to the barrier layer 3.

[0079] When the conductive medium 6 only covers the end of the second surface 302 away from the first connecting surface 303, the conductive medium 6 and the first connecting surface 303 are spaced apart. The protective layer 4, attached to the surfaces of the conductive medium 6 and the barrier layer 3, is recessed at the position corresponding to the aforementioned area and forms a groove 41 corresponding to the second surface 302. (See also...) Figure 7 .

[0080] The orthographic projection of the groove 41 on the substrate 1 at least partially coincides with the orthographic projection of the second surface 302 on the substrate 1.

[0081] Under the action of the groove 41, the stress of the protective layer 4 at the groove 41 changes, which helps to further suppress the extension of cracks through the groove 41 to the top of the first surface 301.

[0082] In some embodiments, please refer to Figure 8 One end of the barrier layer 3 located on the side of the second sublayer 22 facing away from the substrate 1 is connected to the conductive medium 6, and the other end extends to contact the overlapping portion 212 of the first sublayer 21.

[0083] At this time, the barrier layer 3 can cover the surface of the second sub-layer 22 facing away from the substrate 1 and provide better coverage and protection for the top surface of the second sub-layer 22, so as to further reduce the possibility of corrosion and circuit breakage of the side of the second sub-layer 22 near the overlap 212 due to contact with sulfur in the environment.

[0084] In other similar embodiments, the overlap 212 of the first sublayer 21 is in contact with the conductive medium 6, and at least a portion of the barrier layer 3 is located on the side of the overlap 212 facing away from the substrate 1.

[0085] Since the first sublayer 21 is used for heating by electricity, in some embodiments, the material of the first sublayer 21 may also include metals that are easily corroded by sulfur, such as silver and copper. In order to prevent the first sublayer 21 from being corroded, a barrier layer 3 needs to be provided on the top surface of the first sublayer 21 (i.e., the surface facing away from the substrate 1) to provide coverage and protection for the first sublayer 21. At this time, the second sublayer 22 is covered by the first sublayer 21, and the first sublayer 21 can provide good coverage and protection for the second sublayer 22.

[0086] Please see Figure 9 The overlapping portion 212 of the first sublayer 21 is located on the side of the second sublayer 22 facing away from the substrate 1 and is connected to the conductive medium 6. The barrier layer 3 is located on the surface of the overlapping portion 212 facing away from the substrate 1 and is in contact with the conductive medium 6.

[0087] In this embodiment, the first step structure is formed between the overlap 212 of the first sub-layer 21 and the barrier layer 3.

[0088] Specifically, the surface of the overlapping portion 212 of the first sublayer 21 facing away from the substrate is the first top surface 201. The barrier layer 3 is connected to the overlapping portion 212 through the first top surface 201. The first surface 301 and the second connecting surface 304 of the barrier layer 3 cooperate with the first top surface 201 to form a first step structure.

[0089] The height difference between the first top surface 201 and the first surface 301 can be referred to in the previous text, and will not be repeated here.

[0090] Of course, in other similar embodiments, the first top surface 201 may also be the side surface of the main body 211 of the first sublayer 21 facing away from the substrate, in which case the barrier layer 3 completely covers the overlapping portion 212.

[0091] and Figure 1 compared to, Figure 9 The length of the second sublayer 22 is significantly shortened.

[0092] In other similar embodiments, the barrier layer 3 may also have a second step structure; please refer to [reference needed]. Figure 10The second step structure consists of a first connecting surface 303, a first surface 301, and a second surface 302. Similarly, the protective layer 4 forms the aforementioned groove 41 in the area corresponding to the second surface 302 to further inhibit the extension of cracks through the groove 41 to the top of the first surface 301 of the barrier layer 3.

[0093] In other similar embodiments, the barrier layer 3 may be spaced apart from the conductive medium 6; please refer to [reference needed]. Figure 11 At this time, the barrier layer 3 is located on the side surface of the overlap 212 facing away from the substrate 1, and the orthographic projection of the barrier layer 3 on the substrate 1 at least partially overlaps with the orthographic projection of the second sublayer 22 on the substrate 1.

[0094] In this embodiment, the first sub-layer 21 is used to cover and protect the second sub-layer 22 to ensure that the second sub-layer 22 can be isolated from the external sulfur-containing environment when cracks appear in the protective layer 4. At the same time, the barrier layer 3 can prevent cracks from extending toward the main body 211 of the first sub-layer 21, ensuring that cracks formed on the protective layer 4 can only be distributed between the barrier layer 3 and the conductive medium 6, and will not extend beyond the barrier layer 3 toward the location of the main body 211.

[0095] The heating element 10 described above can be prepared by thin film process or thick film process.

[0096] Taking thick film technology as an example, at least one of the first sublayer 21, the second sublayer 22 and the barrier layer 3 can be printed onto the surface of the substrate and then fixed onto the substrate by sintering.

[0097] To ensure a sufficient height difference between the barrier layer 3 and the conductive functional layer 2, the barrier layer 3 can be fabricated using one or at least two thick-film printing processes. Taking the barrier layer 3 fabricated using a two-layer thick-film printing process as an example, the first thick-film printing forms the second surface 302, and the second thick-film printing forms the first surface 301 and the first connecting surface 303 by reducing the printing area. At this time, the barrier layer 3 simultaneously has a first step structure and a second step structure.

[0098] In the heating element 10 provided in this application, the barrier layer 3 may be made of the same material as the first sub-layer 21, or the barrier layer 3 may be an insulating layer.

[0099] In some embodiments, the barrier layer 3 can be made of the same or similar material as the first sub-layer 21: after the substrate 1 is prepared, the second sub-layer 22 can be prepared by printing and sintering, and then the first sub-layer 21 and the barrier layer 3 are printed and sintered to prepare the first sub-layer 21 and the barrier layer 3; subsequently, the lead wire 5 can be fixed to the second sub-layer 22 by brazing through the conductive medium 6, and finally the protective layer 4 is prepared to complete the processing and preparation of the heating element 10.

[0100] In other similar embodiments, the barrier layer 3 can be made of the same or similar material as the first insulating layer 11. After the substrate 1 is prepared, the second sub-layer 22 can be prepared by printing and sintering. Then, the first sub-layer 21 and the barrier layer 3 are printed and sintered in sequence (the specific preparation order is not limited) to prepare the first sub-layer 21 and the barrier layer 3. Subsequently, the lead wire 5 can be fixed to the second sub-layer 22 by brazing through the conductive medium 6. Finally, the protective layer 4 is prepared to complete the processing and preparation of the heating element 10.

[0101] The aforementioned protective layer 4 can be prepared by spraying or coating.

[0102] In some embodiments, the protective layer 4 is a film or layered structure with a certain thickness. For example, the protective layer 4 can be made of layered or sheet-like glass-ceramic materials. The protective layer 4 made of glass-ceramic materials has good high-temperature resistance and can remain stable in high-temperature environments, which helps the heating element 10 maintain normal operation in high-temperature working environments.

[0103] It is understood that the heating element 10 provided in this application embodiment can effectively protect the conductive functional layer 2 through the protective layer 4, so as to isolate the conductive functional layer 2 from the sulfur-containing environment; the barrier layer 3 disposed between the conductive functional layer 2 and the protective layer 4 can help prevent cracks formed on the protective layer 4 due to the movement of the lead wire 5 from extending outward from the conductive medium 6, thereby further improving the protective effect of the protective layer 4, reducing the possibility of corrosion and circuit breakage of the conductive functional layer 2, especially the second sub-layer 22, due to cracks in the protective layer 4, and helping to improve the reliability and service life of the heating element 10, and ultimately improving the user experience.

[0104] Based on the same concept, in a second aspect, embodiments of this application provide a heating component, including the heating element 10 described in any of the above claims.

[0105] Based on the same concept, in a third aspect, embodiments of this application provide an aerosol generating apparatus, including the heating component described above.

[0106] The description of the various embodiments above tends to emphasize the differences between the various embodiments. The similarities or similarities between them can be referred to, and for the sake of brevity, they will not be repeated here.

[0107] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A heating element, characterized in that, include: Matrix (1); A conductive functional layer (2) is disposed on one side of the substrate (1), and the conductive functional layer (2) is used to connect the lead wire (5). A barrier layer (3) is provided on the side of the conductive functional layer (2) facing away from the substrate (1), and the barrier layer (3) and the conductive functional layer (2) form a first step structure at the connection point; The protective layer (4) continuously covers the conductive functional layer (2) and the barrier layer (3), and also covers the surface of the first step structure.

2. The heating element according to claim 1, characterized in that, The conductive functional layer (2) includes a first sub-layer (21) and a second sub-layer (22) that are electrically connected. The first sub-layer (21) is configured to generate heat when energized, and the second sub-layer (22) is configured as an electrode. A conductive medium (6) for connecting the lead (5) is disposed on the second sub-layer (22). The protective layer (4) covers at least a portion of the surface of the conductive medium (6) on the side opposite to the second sub-layer (22). At least a portion of the barrier layer (3) is located on the side of the second sublayer (22) facing away from the substrate (1).

3. The heating element according to claim 2, characterized in that, The first sublayer (21) includes a connected main body (211) and an overlapping part (212). The main body (211) and the second sublayer (22) are disposed on the same side of the substrate (1) in the same layer. At least a portion of the overlapping part (212) is located on the side of the second sublayer (22) facing away from the substrate (1) and is electrically connected to the second sublayer (22).

4. The heating element according to claim 3, characterized in that, The overlapping portion (212) is spaced apart from the conductive medium (6), and at least a portion of the barrier layer (3) is located on the side of the conductive medium (6) facing the overlapping portion (212) and is in contact with the surface of the second sublayer (22) facing away from the substrate (1). Alternatively, the overlap (212) is in contact with the conductive medium (6), and at least a portion of the barrier layer (3) is located on the side of the overlap (212) facing away from the substrate (1).

5. The heating element according to claim 4, characterized in that, The conductive medium (6) covers at least a portion of the surface of the barrier layer (3) on the side opposite to the substrate (1), and the conductive medium (6) is fixedly connected to the barrier layer (3).

6. The heating element according to claim 5, characterized in that, At least a portion of the surface of the barrier layer (3) is provided with a metal layer (7), and the conductive medium (6) is fixedly connected to the barrier layer (3) through the metal layer (7).

7. The heating element according to claim 4, characterized in that, The barrier layer (3) has a second step structure on the side facing away from the substrate (1), and the protective layer (4) covers the surface of the second step structure.

8. The heating element according to claim 7, characterized in that, The second step structure is located on the side of the barrier layer (3) facing the conductive medium (6).

9. The heating element according to claim 7, characterized in that, The second step structure includes a first surface (301), a second surface (302) and a first connecting surface (303). The second surface (302) is located on the side of the first surface (301) facing the substrate (1), and the first connecting surface (303) connects the first surface (301) and the second surface (302). The conductive medium (6) covers at least a portion of the second surface (302).

10. The heating element according to claim 9, characterized in that, The conductive medium (6) is spaced apart from the first connecting surface (303), and the protective layer (4) is recessed with a groove (41) opposite to the second surface (302). The orthographic projection of the groove (41) on the substrate (1) at least partially overlaps with the orthographic projection of the second surface (302) on the substrate (1).

11. The heating element according to claim 2, characterized in that, The second sublayer (22) has a first end (2201) for connecting the first sublayer (21) and a second end (2202) for connecting the conductive medium (6). The second sublayer (22) also includes a first sidewall (2203) and a second sidewall (2204) connecting the first end (2201) and the second end (2202). The first sidewall (2203) and the second sidewall (2204) are disposed opposite to each other and both point towards the substrate (1). Wherein, at least a portion of the barrier layer (3) is located between the first end (2201) and the second end (2202) and simultaneously covers at least a portion of the first sidewall (2203) and the second sidewall (2204); or, the barrier layer (3) is disposed around the conductive medium (6), wherein the orthographic projection of the conductive medium (6) on the substrate (1) is located within the outer contour of the orthographic projection of the barrier layer (3) on the substrate (1).

12. The heating element according to claim 2, characterized in that, The number of the second sublayer (22) is at least two and they are spaced apart on the substrate (1), and any one of the first sublayers (21) is connected to at least two of the second sublayers (22).

13. The heating element according to claim 2, characterized in that, The second sublayer (22) is a silver-containing electrode.

14. The heating element according to claim 2, characterized in that, The barrier layer (3) is made of the same material as the first sub-layer (21), or the barrier layer (3) is an insulating layer.

15. The heating element according to claim 1, characterized in that, The conductive functional layer (2) includes a first top surface (201), and the barrier layer (3) includes a first surface (301) and a second connecting surface (304). The first surface (301) is located on the side of the first top surface (201) facing away from the substrate (1), and the second connecting surface (304) connects the first top surface (201) and the first surface (301) to form the first stepped structure. The distance between the first top surface (201) and the first surface (301) is greater than or equal to 10 μm.

16. The heating element according to any one of claims 1-15, characterized in that, The substrate (1) includes a first insulating layer (11), and the conductive functional layer (2) is connected to the substrate (1) through the first insulating layer (11).

17. The heating element according to claim 16, characterized in that, The substrate (1) further includes a first support layer (12), which is located on the side of the first insulating layer (11) facing away from the conductive functional layer (2). The first support layer (12) includes at least one of an insulating support layer and a thermally conductive support layer.

18. A heating element, characterized in that, Includes the heating element (10) according to any one of claims 1-17.

19. An aerosol generating device, characterized in that, Includes the heating component as described in claim 18.

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