Heating element assembly and aerosol-generating device

Abstract

The application belongs to the technical field of aerosol generating devices, and provides a heating element assembly and an aerosol generating device. The heating element assembly comprises a base, a solder pad and a thermocouple. The base is internally formed with a containing cavity for containing at least part of an aerosol generating substrate. The solder pad is combined with the outer surface of the base. The hot end of the thermocouple is welded to the solder pad. The solder pad comprises a combination layer and a welding layer. The combination layer is at least in contact with the outer surface of the base. The welding layer is in contact with the hot end of the thermocouple. The heating element assembly provided by the application can improve the technical problem of low reliability of temperature detection function in the related art.

Description

Technical Field

[0001] This application belongs to the technical field of aerosol generating devices, and more specifically, relates to a heating element assembly and an aerosol generating device. Background Technology

[0002] Aerosol generating devices heat an aerosol-generating matrix to produce aerosols that can be inhaled by users. In related technologies, a temperature-sensing element, such as a thermocouple, needs to be connected to the substrate of the heating element assembly to detect its temperature. Due to the mismatch and significant difference in the thermal expansion coefficients of the two materials, as well as their different physical properties, the connection between the substrate and the thermocouple suffers from problems such as poor connection strength and susceptibility to cracking. Ultimately, this leads to low reliability and frequent failures in the temperature detection function of the heating element assembly, negatively impacting the user experience to some extent. Utility Model Content

[0003] This application provides a heating element assembly and an aerosol generating device, aiming to improve the technical problem of low reliability of the temperature detection function of the heating element assembly in related technologies.

[0004] To achieve the above objectives, in a first aspect, embodiments of this application provide a heating element assembly, including a substrate, pads, and a thermocouple. The substrate has a cavity formed therein for accommodating at least a portion of an aerosol-generating matrix. The pads are bonded to the outer surface of the substrate. The hot junction of the thermocouple is welded to the pads. The pads include a bonding layer and a welding layer, the bonding layer being at least in contact with the outer surface of the substrate, and the welding layer being in contact with the hot junction of the thermocouple.

[0005] In the heating element assembly provided in this application embodiment, the substrate can be welded to the thermocouple via pads disposed on its outer surface. The pads include a bonding layer for bonding with the substrate and a welding layer for welding to the thermocouple. By controlling the pads to include at least two different structural layers, the problem of poor connection reliability caused by the different materials of the substrate and the thermocouple can be improved. Ultimately, by improving the connection strength between the substrate and the thermocouple, the reliability of the temperature measurement function of the heating element assembly is improved.

[0006] Optionally, the substrate and the bonding layer are both components comprising a first metal, and the thermocouple and the welding layer are both components comprising a second metal, wherein the thermal conductivity of the first metal is greater than that of the second metal.

[0007] Optionally, the first metal includes any one of copper, copper alloys, aluminum, and aluminum alloys.

[0008] Optionally, the second metal includes any one of nickel, nickel alloys, and stainless steel.

[0009] Optionally, the thermocouple includes two thermocouple wires, one end of which is welded to the pad.

[0010] Optionally, the thermocouple wire includes at least one of type K, type N, and type E.

[0011] Optionally, the pad further includes a composite layer located between the bonding layer and the solder layer, and the composite layer includes a first metal and a second metal; At least a portion of the weld layer is located on the side of the composite layer opposite to the substrate.

[0012] Optionally, the thickness of the pad is greater than or equal to 0.1 mm.

[0013] Optionally, the number of solder pads is at least two and they are arranged at intervals on the outer surface of the substrate, and the number of thermocouples is the same as the number of solder pads and they are set in a one-to-one correspondence.

[0014] Optionally, the outer contour of the pad's orthographic projection onto the outer surface of the substrate is a closed shape that includes at least a partial curve.

[0015] Optionally, the substrate includes peripheral side plates, which enclose a hollow tubular structure.

[0016] Optionally, at least one of the circumferential side surface and the bottom surface of the substrate is provided with the pad.

[0017] Optionally, the substrate further includes a base plate, which is connected to one axial end of the peripheral side plate; The base plate and the peripheral side plate are connected to the solder pads.

[0018] In a second aspect, embodiments of this application provide an aerosol generating apparatus, including the heating element assembly described in any of the above claims, and a controller connected to the cold junction of the thermocouple.

[0019] Compared with the prior art, this application includes at least the following beneficial effects: The heating element assembly provided in this application provides a bonding pad for connecting a thermocouple on the outside of the substrate, and the bonding pad includes a bonding layer of the same or similar material as the substrate and a welding layer of the same or similar material as the thermocouple. The bonding pad can be used to improve the connection between the substrate and the thermocouple, so as to firmly weld and fix the thermocouple on the substrate, thereby improving the reliability of the temperature measurement function of the heating element assembly and ultimately improving the user experience.

[0020] The aerosol generating apparatus provided in this application includes the beneficial effects of any one or more of the heating element components described above, which will not be repeated here. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of a heating element assembly provided in one embodiment of this application; Figure 2 A side view of a heating element assembly provided in one embodiment of this application; Figure 3 for Figure 2 Enlarged view of the structure of region A in the middle; Figure 4 for Figure 2 Another enlarged view of the structure of region A in the middle; Figure 5 for Figure 2 Another enlarged view of the structure of area A in the middle; Figure 6 This is a schematic diagram of the structure of a heating element assembly provided in another embodiment of this application; Figure 7 A schematic diagram illustrating the use of an aerosol generating apparatus provided in a certain embodiment of this application; Figure 8 for Figure 7 A schematic diagram of the cross-sectional structure; Figure 9 for Figure 7 A schematic diagram showing the connection between the heating element component and the controller.

[0023] The following are the labeling elements in the figure: 10. Heating element assembly; 1. Substrate; 11. Peripheral side plate; 12. Base plate; 101. Receiving cavity; 2. Solder pad; 21. Bonding layer; 22. Welding layer; 23. Composite layer; 3. Thermocouple; 31. Thermocouple wire; 301. Hot end; 302. Cold end; 20. Controller; 100. Aerosol generating device; 200. Aerosol generating matrix. Detailed Implementation

[0024] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0025] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0026] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0028] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0029] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0030] In this application, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0031] In related technologies, aerosol generating devices can generate aerosols by heating an aerosol generating matrix. It is understood that the key component of an aerosol generating device for generating aerosols is the heating element assembly. The heating element assembly not only contains and confines the aerosol generating matrix to be heated, but also, under energized conditions, provides heat to the aerosol generating matrix confined within it, enabling the aerosol generating matrix to be heated and atomized, thus generating aerosols. The heating element assembly includes a substrate, within which a receiving cavity is formed for containing at least a portion of the aerosol generating matrix. The substrate can be used to directly heat the aerosol generating matrix located within the receiving cavity, or it can be used to conduct heat generated when the heating element is energized to the aerosol generating matrix located within the receiving cavity through a thermally conductive connection with a related heating element.

[0032] To facilitate control of aerosol generation rates, the heating element assembly incorporates a temperature-sensing structure. In related technologies, this temperature-sensing structure can be a thermocouple. However, when a thermocouple is welded to a substrate, the connection's strength is relatively low due to the materials of both components. During use, the thermocouple is prone to detaching from the substrate, leading to malfunctions in the heating element assembly's temperature measurement function and reducing its reliability. All of these factors affect the reliability and lifespan of the heating element assembly, and consequently, the user experience.

[0033] To address the aforementioned issues and improve the low reliability of the temperature measurement function of the heating element assembly 10, this application provides a heating element assembly 10 and an aerosol generating device 100. The heating element assembly 10 can improve the reliability of the temperature measurement function of the aerosol generating device 100 with the heating element assembly 10 through structural improvements, and can also help extend the service life of the heating element assembly 10 within a certain range, ultimately achieving the goal of improving the user experience.

[0034] It should be noted that the aerosol generating matrix 200 can generate aerosols under heating conditions, and the aerosols may contain volatile compounds. The aerosol generating matrix 200 may include, but is not limited to, materials used for medical, health, and cosmetic purposes. For example, the aerosol generating matrix 200 may use plant-based materials, such as plant roots, stems, leaves, flowers, buds, and seeds. Those skilled in the art should understand that the structure of the aerosol generating matrix 200 can refer to existing structures in related technologies, and the assembly structure and shape of the components in the aerosol generating device 100 can refer to existing structures in related technologies; further detailed descriptions are not provided in this application.

[0035] In the embodiments of this application, the aerosol generating matrix 200 can be a solid matrix or a liquid matrix. Taking the aerosol generating matrix 200 as a solid matrix as an example, those skilled in the art will understand that the aerosol generating matrix 200 is a stable solid and does not flow. The solid aerosol generating matrix 200 obtained after molding can have a stable structure and porosity, or it can be a moist solid paste structure, as long as its structure is stable and can release aerosols under heating conditions without the risk of leakage.

[0036] Figure 1 This is a schematic diagram of the structure of a heating element assembly 10 provided in a certain embodiment of this application. Figure 2 This is a side view of a heating element assembly 10 provided in one embodiment of this application. Figure 3 for Figure 2 Enlarged view of the structure of region A in the middle.

[0037] Please see Figure 1 , Figure 2 and Figure 3This application provides a heating element assembly 10, which includes a substrate 1, a pad 2, and a thermocouple 3. The substrate 1 has a cavity 101 formed within it for accommodating at least a portion of an aerosol generating matrix 200. At least a portion of the aerosol generating matrix 200 located within the cavity 101 can be atomized and generate aerosols, such as flavor substances, under the heat provided by the substrate 1. The thermocouple 3 is welded to and fixed to the outer surface of the substrate 1. The hot end 301 of the thermocouple 3 is welded to the pad 2, thereby enabling the thermocouple 3 to be firmly fixed to the outside of the substrate 1 via the pad 2, ultimately improving the bonding strength between the thermocouple 3 and the substrate 1.

[0038] Please see Figure 1 The outer surface of the substrate 1 is a plane or curved surface that is basically smooth to the naked eye. The pad 2 protrudes relative to the outer surface of the substrate 1. The hot end 301 of the thermocouple 3 is fixedly connected to the substrate 1 by welding through the pad 2 that protrudes relative to the outer surface of the substrate 1.

[0039] Please see Figure 1 and Figure 2 The matrix 1 can be a hollow structure as a whole.

[0040] Specifically, the substrate 1 includes peripheral side plates 11, which enclose a hollow structure. Along the extending direction of the substrate 1, the hollow portion of the substrate 1 can be circular or elliptical, etc. For example, the substrate 1 can be a tubular structure, and its shape can be cylindrical or prismatic, etc. The hollow structure can be used to form the aforementioned receiving cavity 101. At least one of the circumferential side surface and the bottom surface at one axial end of the substrate 1 formed by the peripheral side plates 11 is provided with the aforementioned solder pads 2.

[0041] Please see Figure 1 and Figure 2 The outer contour of the pad 2 fixed on the outer surface of the substrate 1, as projected onto the outer surface of the substrate 1, is a closed shape that includes at least a portion of a curve. The overall shape of this closed shape can be similar to a rectangle, or approximately circular, elliptical, or other structures. The closed shape can be entirely composed of curves, or it can be composed of a portion of curves and a portion of straight lines. This embodiment does not limit the overall shape of the pad 2.

[0042] Thermocouple 3 includes two thermocouple wires 31, one end of which is soldered to pad 2. Please refer to [link / reference]. Figure 1 and Figure 2Both thermocouple wires 31 have a hot junction 301 at one end, which can be connected to the pad 2 by soldering. The other end serves as the cold junction 302, connecting to the controller 20 with data processing capabilities. The two thermocouple wires 31 form a closed loop, allowing the thermocouple 3 to connect with the corresponding controller 20 for temperature detection. During use, the thermocouple 3 generates a thermoelectric potential signal by comparing the temperature difference between the hot junction 301 and the cold junction 302. After receiving the thermoelectric potential signal, the controller 20 converts the detected signal into a specific temperature according to a preset calibration curve, thus completing the temperature detection function of the thermocouple 3.

[0043] In some embodiments, the ends of the two thermocouple wires 31 are welded together and welded to the same pad 2.

[0044] It should be noted that the pad 2 comprises a bonding layer 21 and a solder layer 22 in the thickness direction. The bonding layer 21 is at least in contact with the outer surface of the substrate 1, and the solder layer 22 is in contact with the hot junction 301 of the thermocouple 3. The pad 2 can be prepared from an integrated layered structure (composite tape) manufactured by a hot-pressing composite process. The composite tape comprises at least one first functional layer and one second functional layer in the thickness direction, wherein the first functional layer corresponds to the bonding layer 21 of the pad 2, and the second functional layer corresponds to the solder layer 22 of the pad 2. The thermal conductivity of the first functional layer is greater than that of the second functional layer, and the melting point of the first functional layer is lower than that of the second functional layer. The first functional layer and the second functional layer are bonded by hot-pressing diffusion. When preparing pad 2, firstly, the composite tape can be placed on the surface of the area of ​​the substrate 1 used to prepare pad 2, with the first functional layer of the composite tape facing the substrate 1 and the second functional layer facing away from the substrate 1. Then, spot welding is performed on the surface of the composite tape using the second functional layer. Taking laser spot welding as an example, the laser can focus heat on a portion of the second functional layer, while the heat can be conducted through the second functional layer to a portion of the first functional layer. Part of the first functional layer melts and firmly bonds with the substrate 1 to form the bonding layer 21 of pad 2. Correspondingly, the portion of the second functional layer focused by the laser can detach from the composite tape as the first functional layer melts and bonds with the bonding layer 21 to form the welding layer 22 of pad 2. The remaining portion of the composite tape that is not melted can be used to prepare the next pad 2, etc.

[0045] In the above process, the second functional layer used to form the welding layer 22 can be completely melted to form the welding layer 22, or it can be only partially melted to form the welding layer 22. In addition, in the thickness direction of the pad 2, the thickness of the bonding layer 21 and the welding layer 22 formed by the first functional layer and the second functional layer respectively can be consistent with the thickness on the composite strip, or it can be varied to a certain extent. This embodiment does not limit it.

[0046] However, since pad 2 is formed by melting a portion of the composite strip structure, the thickness of pad 2 should generally be consistent with the thickness of the composite strip. For example, when the thickness of the composite strip is 0.1 mm, the thickness of pad 2 should also be approximately 0.1 mm. Generally, assuming the molten metal does not flow along the surface of the substrate 1, the final thickness of pad 2 should be consistent with or slightly greater than the thickness of the composite strip. When the thickness of the composite strip is 0.1 mm, the thickness of pad 2 should be greater than or equal to 0.1 mm.

[0047] It should be noted that the solder layer 22 may cover the entire surface of the bonding layer 21 on the side facing away from the substrate 1, or it may only cover a portion of the surface of the bonding layer 21 on the side facing away from the substrate 1. Furthermore, both the bonding layer 21 and the solder layer 22 constituting the pad 2 may be relatively flat layered structures, or the solder layer 22 may be a hemispherical or approximately hemispherical structure with a central protrusion relative to the edge in the thickness direction. Please refer to [link / reference]. Figure 4 , Figure 4 for Figure 2 An enlarged view of another structure in area A.

[0048] like Figure 4 As shown, the thickness of the bonding layer 21 is basically consistent at various positions in the thickness direction, while the thickness of the middle part of the welding layer 22 is greater than that of the edge, so that the surface of the welding layer 22 is a curved surface that bulges outward relative to the bonding layer 21.

[0049] In other similar embodiments, the middle portion of the weld layer 22 may be recessed relative to the edge portion, so that the surface of the weld layer 22 is a recessed curved surface that is recessed inward relative to the bonding layer 21.

[0050] In some embodiments, the pad 2 prepared in the manner described above further includes a composite layer 23. Please refer to... Figure 5 , Figure 5 for Figure 2 Another enlarged view of the structure in area A.

[0051] Please see Figure 5 Along the thickness direction of pad 2, composite layer 23 is located between bonding layer 21 and solder layer 22, and at least a portion of solder layer 22 is located on the side of composite layer 23 facing away from substrate 1.

[0052] The composite layer 23 can be formed by melting a portion of the first functional layer and a portion of the second functional layer. It is located between the bonding layer 21 and the welding layer 22 and can be used to connect the bonding layer 21 and the welding layer 22. At the same time, the composition within the composite layer 23 can continuously change from the bonding layer 21 to the welding layer 22, thereby effectively improving the connection strength between the bonding layer 21 and the welding layer 22.

[0053] Alternatively, the composite strip described above may include at least three functional layers. For example, the composite strip may also include a third functional layer located between the first and second functional layers. The metal material in the third functional layer may include some of the same metal material as the first functional layer and some of the same metal material as the second functional layer. After the composite strip is melted to prepare the pad 2, the third functional layer constitutes the composite layer 23 described above.

[0054] In some embodiments, the substrate 1 and the bonding layer 21 may both be components comprising a first metal, and the thermocouple 3 and the welding layer 22 may both be components comprising a second metal, wherein the thermal conductivity of the first metal is greater than that of the second metal.

[0055] Accordingly, the composite layer 23 includes both a first metal and a second metal.

[0056] Taking the second metal as an example, which includes any one of nickel, nickel alloy, and stainless steel, all of the above-mentioned metal materials include nickel. In this case, the thermocouple wire 31 can be at least one of type K, type N, and type E. The solder layer 22 in the solder pad 2 also includes nickel.

[0057] Taking thermocouple 31 of type K as an example, this thermocouple 31 has the advantage of high stability, with a temperature measurement range of -200℃ to 1200℃. The positive electrode of thermocouple 31 is a Ni-Cr alloy, and the negative electrode is a Ni-Si alloy. Taking thermocouple 31 of type N as an example, this thermocouple 31 has better high-temperature resistance, higher oxidation and corrosion resistance, and a temperature measurement range of -200℃ to 1300℃. It can withstand a high temperature of 1400℃ for a short time. The positive electrode of thermocouple 31 is a nickel-chromium-silicon alloy (Ni-Cr-Si), and the negative electrode is a nickel-silicon-magnesium alloy (Ni-Si-Mg). Taking thermocouple 31 of type E as an example, this thermocouple 31 has the advantages of large thermoelectric potential and fast response speed, with a temperature measurement range of -40℃ to 850℃. The positive electrode of thermocouple 31 is a Ni-Cr alloy, and the negative electrode is a Cu-Ni alloy. All of the above thermocouple wires 31 belong to nickel-based thermocouple wires 31.

[0058] Taking aluminum or an aluminum alloy as an example, the substrate 1 can be made of aluminum or an aluminum alloy, and the bonding layer 21 can also be made of aluminum or an aluminum alloy. This embodiment does not limit the specific content of aluminum or the type of alloy in the substrate 1 and the bonding layer 21, as long as both are made of aluminum-containing materials.

[0059] Because aluminum has poor wettability with other materials and a large difference in thermal expansion coefficients with nickel, direct welding of the aluminum substrate 1 and thermocouple 3 results in the formation of a brittle intermetallic compound at the joint. Furthermore, internal stress is generated at the joint after cooling, ultimately leading to cracking of the bonded portion. In this embodiment, the welding layer 22, made of a second metal, effectively overcomes these problems and improves the weld strength and reliability between the aluminum substrate 1 and the thermocouple 3.

[0060] Taking copper or a copper alloy as an example, the substrate 1 can be made of copper or a copper alloy, and the bonding layer 21 can also be made of copper or a copper alloy. This embodiment does not limit the specific content of copper or the type of alloy in the substrate 1 and the bonding layer 21, as long as both are made of copper-containing materials.

[0061] Because copper readily forms a solid solution at the connection point with thermocouple wire 31, the weld strength is reduced. Furthermore, the copper surface oxidizes relatively quickly, making it prone to oxidation during welding, which in turn affects the stability of the weld. In this embodiment, by adding a weld layer 22 to cover the bonding layer 21, the above problems can be effectively overcome. This achieves the goal of improving the weld strength and reliability between the copper substrate 1 and the thermocouple 3.

[0062] It should also be noted that the above welding (including at least one of the welding process for preparing pad 2 and the welding process between pad 2 and thermocouple wire 31) can be carried out under the protection of argon gas to reduce the probability of oxidation during the welding process and at the same time help to improve the structural strength of the weld.

[0063] Of course, in other similar embodiments, other welding methods such as arc welding can also be selected for welding. This embodiment does not limit the specific welding process.

[0064] In some embodiments, at least two pads 2 may be provided on a substrate 1 simultaneously. All pads 2 are arranged at intervals on the outer surface of the substrate 1, and the number of thermocouples 3 is the same as the number of pads 2 and is arranged in a one-to-one correspondence.

[0065] For example, taking the substrate 1 as a hollow columnar structure, different pads 2 can be spaced apart along the axial direction of the substrate 1 to detect the temperature of the substrate 1 at different positions in the axial direction; or, at least two pads 2 can be spaced apart along the circumferential direction of the substrate 1 to detect the temperature of the substrate 1 at different positions in the circumferential direction.

[0066] Figure 6 This is a schematic diagram of the structure of the heating element assembly 10 provided in another embodiment of this application.

[0067] Please see Figure 6 ,and Figure 1 In contrast, the substrate 1 in the heating element assembly 10 provided in this embodiment has a barrel-shaped structure.

[0068] Specifically, in addition to the peripheral side plate 11, the base 1 also includes a bottom plate 12. The bottom plate 12 is connected to one end of the peripheral side plate 11 in the axial direction to enclose and form a barrel-shaped base 1. At this time, the receiving cavity 101 of the base 1 is jointly enclosed by the peripheral side plate 11 and the bottom plate 12.

[0069] In this embodiment, the pads 2 can be soldered to the peripheral side plate 11 of the substrate 1 or to the bottom plate 12 of the substrate 1. When there are at least two pads 2, different pads 2 can be respectively set on the peripheral side plate 11 and the bottom plate 12 of the substrate 1 to realize simultaneous temperature detection of the peripheral side and the bottom plate 12 in the axial direction of the substrate 1.

[0070] It should be noted that the base plate 12 and the side plate 11 can be connected by means of gluing, snap-fitting, or integral molding.

[0071] It is understood that the heating element assembly 10 provided in this application embodiment, by adding a solder pad 2 for connecting the thermocouple 3 on the outside of the base 1 and controlling the solder pad 2 to include a bonding layer 21 of the same or similar material as the base 1 and a welding layer 22 of the same or similar material as the thermocouple 3, can improve the connection between the base 1 and the thermocouple 3 by using the solder pad 2, so as to realize the firm welding and fixing of the thermocouple 3 on the base 1, thereby improving the reliability of the temperature measurement function of the heating element assembly 10 and ultimately improving the user experience.

[0072] Based on the same concept, in a second aspect, embodiments of this application also provide an aerosol generating apparatus 100, including the heating element assembly 10 described in any of the above claims, and a controller 20 connected to the cold junction 302 of the thermocouple 3.

[0073] The aerosol generating matrix 200 can be inserted into the receiving cavity 101 of the heating element assembly 10 and generate aerosol under the heating action of the heating element assembly 10. At the same time, the thermocouple 3 can cooperate with the controller 20 to realize the temperature detection of the matrix 1 in the heating element assembly 10.

[0074] Figure 7 This is a schematic diagram illustrating the use of an aerosol generating apparatus 100 provided in one embodiment of this application. Figure 8 for Figure 7 A cross-sectional structural diagram. Figure 9 for Figure 7 A schematic diagram showing the connection between the heating element assembly 10 and the controller 20.

[0075] Please see Figure 7 and Figure 8 The aerosol generating device 100 includes a heating element assembly 10. When using the aerosol generating device 100, the user can insert one end of the aerosol generating matrix 200 (shown as a columnar structure in the figure) into the receiving cavity 101 of the aerosol generating device 100, so that the aerosol generating matrix 200 contacts the inner wall of the substrate 1. When powered on, the heating element assembly 10 heats the aerosol generating matrix 200 to generate aerosol. The user can draw in the generated aerosol through the end of the aerosol generating matrix 200 located outside the aerosol generating device 100 while the aerosol is being generated.

[0076] Please see Figure 7 and Figure 8 In this embodiment, the aerosol generating device 100 heats a solid aerosol generating matrix 200 at low temperatures, causing the corresponding components within the aerosol generating matrix 200 to atomize and form inhalable aerosols. When operating, this device can generate aerosols containing specific components without producing an open flame, making them easy for users to inhale. Inhalation refers to the process of inhaling the aerosol into the user's mouth, nasal cavity, or lungs through the mouth or nose. The aerosol generating device 100 generates aerosols through low-temperature heating rather than combustion, i.e., it utilizes Heat-Not-Burn (HNB) technology to generate aerosols.

[0077] It should be noted that, Figure 8 Controller 20 is not labeled. Please refer to [link / reference]. Figure 9 A controller 20, located within the aerosol generating device 100, is connected to a thermocouple 3 disposed on the outer surface of the substrate 1, for detecting the temperature of the substrate 1. The controller 20 may include a control module and a storage module. The control module may be a central processing unit (CPU), or other general-purpose processors, microcontrollers, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), programmable logic controllers (PLCs), discrete gate or transistor logic devices, discrete hardware components, etc. The storage module may be a memory containing a computer program that can run on the processing module. The processing module can execute the computer program to cooperate with the thermocouple 3 to achieve its temperature measurement function. Additionally, the storage module can also be used to temporarily store data that has been output or will be output.

[0078] In some embodiments, the aerosol generating device 100 is further provided with a battery assembly, which is electrically connected to the heating element assembly 10 and the controller 20, and is used to provide the electrical energy required for the operation of the heating element assembly 10 and the controller 20.

[0079] The specific structure of the heating element assembly 10 can be found in the embodiments described above. Since the aerosol generating device 100 adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of each of the above embodiments, and will not be described in detail here.

[0080] The description of the various embodiments above tends to emphasize the differences between the various embodiments. The similarities or similarities between them can be referred to, and for the sake of brevity, they will not be repeated here.

[0081] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A heating element assembly, characterized in that, include: The matrix has a containment cavity formed therein for accommodating at least a portion of the aerosol generation matrix; The pads are bonded to the outer surface of the substrate; Thermocouple, the hot junction of which is welded to the pad; The pad includes a bonding layer and a soldering layer. The bonding layer is at least in contact with the outer surface of the substrate, and the soldering layer is in contact with the hot junction of the thermocouple.

2. The heating element assembly according to claim 1, characterized in that, The substrate and the bonding layer are both components comprising a first metal, and the thermocouple and the welding layer are both components comprising a second metal, wherein the thermal conductivity of the first metal is greater than that of the second metal.

3. The heating element assembly according to claim 2, characterized in that, The first metal includes any one of copper, copper alloys, aluminum, and aluminum alloys; and / or, the second metal includes any one of nickel, nickel alloys, and stainless steel.

4. The heating element assembly according to claim 2 or 3, characterized in that, The thermocouple includes two thermocouple wires, one end of which is welded to the pad.

5. The heating element assembly according to claim 4, characterized in that, The thermocouple wires include at least one of type K, type N and type E.

6. The heating element assembly according to claim 2 or 3, characterized in that, The pad further includes a composite layer located between the bonding layer and the solder layer, and the composite layer includes a first metal and a second metal; At least a portion of the weld layer is located on the side of the composite layer opposite to the substrate.

7. The heating element assembly according to any one of claims 1-3, characterized in that, The thickness of the pad is greater than or equal to 0.1 mm.

8. The heating element assembly according to any one of claims 1-3, characterized in that, The number of solder pads is at least two and they are arranged at intervals on the outer surface of the substrate. The number of thermocouples is the same as the number of solder pads and they are set in a one-to-one correspondence.

9. The heating element assembly according to any one of claims 1-3, characterized in that, The outer contour of the orthographic projection of the pad on the outer surface of the substrate is a closed shape that includes at least a partial curve.

10. The heating element assembly according to any one of claims 1-3, characterized in that, The substrate includes peripheral side plates, which enclose a hollow tubular structure.

11. The heating element assembly according to claim 10, characterized in that, The pad is provided on at least one of the circumferential side surface and the bottom surface of the substrate.

12. The heating element assembly according to claim 10, characterized in that, The substrate also includes a base plate, which is connected to one axial end of the peripheral side plate; The base plate and the peripheral side plate are connected to the solder pads.

13. An aerosol generating device, characterized in that, The heating element assembly included in any one of claims 1-12 further includes a controller connected to the cold junction of the thermocouple.

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