A glue filling machine for electronic component packaging
Patent Information
- Application Number
- CN202522008929.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-18
- Publication Date
- 2026-10-13
- Estimated Expiration
- 2035-09-18
AI Technical Summary
[0004]针对现有技术的不足，本实用新型提供了一种电子元件封装用灌胶机，解决了灌胶机在对电子元件进行封装时，灌胶完成后，不能够快速的使灌入的胶水快速的干燥凝固，从而在对灌胶后的电子元件进行取出时，容易使胶水因工作人员晃动而导致胶水漏出等风险，降低该装置的使用效率的问题
[0012]1、该一种电子元件封装用灌胶机，在使用灌胶机时，通过设置的烘干装置能够快速的灌入的胶水进行烘干，使其固化，提高灌胶机的使用效率；
Smart Images
Figure CN224846260U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of dispensing machines, specifically a dispensing machine for electronic component packaging. Background Technology
[0002] Electronic component encapsulation potting machines are automated equipment used in the electronics manufacturing industry for potting, sealing, insulating, or moisture-proofing electronic components, circuit boards, sensors, connectors, and other products.
[0003] However, existing dispensing machines cannot quickly dry and solidify the glue after it has been applied to encapsulate electronic components. This can lead to glue leakage when the electronic components are removed due to shaking by the operator, thus reducing the efficiency of the device. Utility Model Content
[0004] To address the shortcomings of existing technologies, this utility model provides a dispensing machine for electronic component packaging. It solves the problem that when dispensing electronic components, the glue cannot be dried and solidified quickly after dispensing, which can lead to glue leakage when the electronic components are removed due to shaking by the operator, thus reducing the efficiency of the device.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a dispensing machine for electronic component packaging, comprising a base and a drying device. Support frames are symmetrically fixedly mounted on the upper end of the base. A first linear motor is fixedly mounted between the upper ends of the two support frames. An L-shaped support frame is fixedly mounted on the moving end of the first linear motor. A lifting plate is slidably connected inside the L-shaped support frame. A first cylinder is fixedly mounted on the upper end of the L-shaped support frame. The output shaft of the first cylinder is fixedly connected to the upper end of the lifting plate through the interior of the upper end of the L-shaped support frame. A liquid inlet pipe is fixedly mounted on the front side wall of the lifting plate. Multiple dispensing tubes are fixedly mounted at equal intervals inside the bottom of the liquid inlet pipe. A support plate is fixedly mounted on the right side wall of the L-shaped support frame. A second cylinder is fixedly mounted on the upper end of the support plate, and a drying device is provided at the lower end of the support plate. The output shaft of the second cylinder is fixedly connected to the upper end of the drying device through the interior of the support plate.
[0006] Preferably, a second linear motor is symmetrically fixedly installed on the upper end of the base, and a placement frame is fixedly installed on the moving end of each of the second linear motors. The space inside the placement frame is larger than the size of the electronic component, and a controller is fixedly installed on the front side wall of the support frame. The first linear motor, the second linear motor, and the second cylinder are all electrically connected to the controller. The placement frame is located at the lower end of the drying device, which facilitates the placement of the electronic component that needs to be potted and its movement.
[0007] Preferably, clamping plates are symmetrically slidably connected to both ends of the placement frame, and sliders are fixedly installed on the bottom surface of each clamping plate. A moving groove is provided inside the bottom surface of the placement frame, and a bidirectional screw is rotatably connected inside the moving groove. The front ends of the bidirectional screws pass through the front side wall of the moving groove and extend to the outside of the placement frame, and are fixedly connected to handwheels. The sliders are slidably connected inside the moving groove and threadedly sleeved on both ends of the bidirectional screws, thereby facilitating the positioning of electronic components that need to be potted.
[0008] Preferably, the length of the drying device is greater than the length of the placement frame, thereby facilitating the thorough drying of the electronic components to be coated with adhesive.
[0009] Preferably, the width of the lifting plate is smaller than the width of the L-shaped support frame, and the width of the drying device is equal to the width of the support plate, thereby preventing the lifting plate from rubbing against the side wall of the support plate when it moves.
[0010] Preferably, the top surface of the clamping plate is lower than the top surface of the placement frame, which facilitates the placement and clamping of electronic components and also prevents obstruction of the liquid inlet pipe above.
[0011] This invention provides a potting machine for encapsulating electronic components. It has the following advantages:
[0012] 1. The glue dispensing machine for electronic component packaging has a drying device that can quickly dry the glue dispensed during use, thereby improving the efficiency of the glue dispensing machine.
[0013] 2. The electronic component encapsulation dispensing machine, when used, can clamp the device to be dispensed by the set clamping plate, which can effectively stabilize the position of the material to be dispensed and prevent the device from shifting during dispensing. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0015] Figure 2 This is a side view of the present invention;
[0016] Figure 3 This utility model Figure 2 Enlarged structural diagram of section A.
[0017] In the diagram, 1. Base; 2. Support frame; 3. Controller; 4. First linear motor; 5. L-shaped support frame; 6. First cylinder; 7. Lifting plate; 8. Second linear motor; 9. Placement frame; 10. Bidirectional screw; 11. Handwheel; 12. Liquid inlet pipe; 13. Glue dispensing pipe; 14. Clamping plate; 15. Drying device; 16. Support plate; 17. Second cylinder; 18. Moving groove; 19. Slider. Detailed Implementation
[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0019] Please see Figure 1-3This utility model provides a potting machine for electronic component packaging, including a base 1 and a drying device 15. Support frames 2 are symmetrically fixedly mounted on the upper end of the base 1. A first linear motor 4 is fixedly mounted between the upper ends of the two support frames 2. An L-shaped support frame 5 is fixedly mounted on the moving end of the first linear motor 4. A lifting plate 7 is slidably connected inside the L-shaped support frame 5. A first cylinder 6 is fixedly mounted on the upper end of the L-shaped support frame 5. The output shaft of the first cylinder 6 is fixedly connected to the upper end of the lifting plate 7 through the upper end of the L-shaped support frame 5. A liquid inlet pipe 12 is fixedly mounted on the front side wall of the lifting plate 7. Multiple liquid inlet pipes 12 are fixedly mounted at equal intervals inside the bottom of the liquid inlet pipe 12. A dispensing tube 13 and an L-shaped support frame 5 are fixedly mounted on the right side wall of a support plate 16. A second cylinder 17 is fixedly mounted on the upper end of the support plate 16, and a drying device 15 is provided at the lower end of the support plate 16. The output shaft of the second cylinder 17 is fixedly connected to the upper end of the drying device 15 through the interior of the support plate 16. A second linear motor 8 is symmetrically fixedly mounted on the upper end of the base 1. Each moving end of the second linear motor 8 is fixedly mounted with a placement frame 9. The space inside the placement frame 9 is larger than the size of the electronic components. A controller 3 is fixedly mounted on the front side wall of the support frame 2. The first linear motor 4, the second linear motor 8, and the second cylinder 17 are all electrically connected to the controller 3. The placement frame 9 is located at the lower end of the drying device 15. Two clamping plates 14 are symmetrically slidably connected to both ends of the placement frame 9. Slider 19s are fixedly installed on the bottom surface of each clamping plate 14. A moving groove 18 is provided inside the bottom surface of the placement frame 9. A bidirectional screw 10 is rotatably connected inside the moving groove 18. The front ends of the bidirectional screw 10 pass through the front sidewall of the moving groove 18 and extend to the outside of the placement frame 9. Each screw 10 is fixedly connected to a handwheel 11. The sliders 19 are slidably connected inside the moving groove 18 and threadedly sleeved onto the two ends of the bidirectional screw 10. The length of the drying device 15 is greater than the length of the placement frame 9. The width of the lifting plate 7 is less than... The width of the L-shaped support frame 5, the width of the drying device 15, and the width of the support plate 16 are all equal. The top surface of the clamping plate 14 is lower than the top surface of the placement frame 9. The devices that need to be glued are placed inside the placement frame 9. By rotating the handwheel 11, the bidirectional screw 10 is rotated, thereby adjusting the position of the clamping plate 14 so that it can firmly clamp electronic components of different sizes. The inner side of the clamping plate 14 is provided with anti-slip pads to prevent the electronic components from shifting during the glue filling process. After clamping is completed, the controller 3 starts the first linear motor 4 and the second linear motor 8 to control the horizontal and vertical movement of the glue filling tube 13, respectively, to ensure that it can be accurately aligned with the position that needs to be glued.
[0020] It should be noted that, in this embodiment, as Figure 1-3As shown, during the glue dispensing process, the devices to be dispensed are placed inside the placement frame 9. The handwheel 11 is rotated to drive the bidirectional screw 10 to rotate, thereby adjusting the position of the clamping plate 14 so that it can firmly clamp electronic components of different sizes. The inner side of the clamping plate 14 is provided with anti-slip pads to prevent the electronic components from shifting during the glue dispensing process. After clamping is completed, the controller 3 starts the first linear motor 4 and the second linear motor 8 to control the horizontal and vertical movement of the glue dispensing tube 13, respectively, to ensure that it can be accurately aligned with the position to be dispensed.
[0021] Before the glue dispensing begins, the liquid inlet pipe 12 delivers the glue to the glue dispensing pipe 13. The controller 3 adjusts the glue flow rate and dispensing speed according to preset parameters to ensure the uniformity and stability of the glue dispensing process. After the glue dispensing is completed, the lifting plate 7 descends under the action of the first cylinder 6, allowing the glued electronic components to enter the working area of the drying device 15. The drying device 15 adopts hot air circulation technology, which can quickly heat the glue and promote its curing, avoiding the risk of glue overflow due to human operation.
[0022] In addition, the L-shaped support frame 5 and the support plate 16 provide stable structural support for the entire dispensing machine, while the flexible sliding of the slider 19 in the moving groove 18 further enhances the stability of the equipment operation. Through the above design, the dispensing machine not only improves dispensing efficiency, but also significantly improves dispensing quality, meeting the needs of modern electronic manufacturing for high-precision packaging.
[0023] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It will be apparent to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and thus all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this utility model. No reference numerals in the claims should be construed as limiting the scope of the claims.
[0024] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. A potting machine for encapsulating electronic components, characterized in that: The device includes a base (1) and a drying device (15). Support frames (2) are symmetrically fixedly installed on the upper end of the base (1). A first linear motor (4) is fixedly installed between the upper ends of the two support frames (2). An L-shaped support frame (5) is fixedly installed at the moving end of the first linear motor (4). A lifting plate (7) is slidably connected inside the L-shaped support frame (5). A first cylinder (6) is fixedly installed at the upper end of the L-shaped support frame (5). The output shaft of the first cylinder (6) passes through the upper end of the L-shaped support frame (5) and connects to the lifting plate (7). The upper end is fixedly connected, and the front side wall of the lifting plate (7) is fixedly installed with an inlet pipe (12). Multiple glue-filling pipes (13) are fixedly installed at equal intervals inside the bottom of the inlet pipe (12). The right side wall of the L-shaped support frame (5) is fixedly installed with a support plate (16). The upper end of the support plate (16) is fixedly installed with a second cylinder (17), and the lower end of the support plate (16) is provided with a drying device (15). The output shaft of the second cylinder (17) is fixedly connected to the upper end of the drying device (15) through the interior of the support plate (16).
2. The potting machine for electronic component packaging according to claim 1, characterized in that: The upper end of the base (1) is symmetrically fixedly equipped with a second linear motor (8), and the moving end of the second linear motor (8) is fixedly equipped with a placement frame (9). The space inside the placement frame (9) is larger than the size of the electronic components, and the front side wall of the support frame (2) is fixedly equipped with a controller (3). The first linear motor (4), the second linear motor (8) and the second cylinder (17) are all electrically connected to the controller (3). The placement frame (9) is located at the lower end of the drying device (15).
3. The potting machine for electronic component packaging according to claim 2, characterized in that: The two ends of the placement frame (9) are symmetrically slidably connected to clamping plates (14). The bottom surface of each clamping plate (14) is fixedly installed with a slider (19). The bottom surface of the placement frame (9) is provided with a moving groove (18). The moving groove (18) is rotatably connected to a bidirectional screw (10). The front end of the bidirectional screw (10) passes through the front side wall of the moving groove (18) and extends to the outside of the placement frame (9). Each of them is fixedly connected with a handwheel (11). The sliders (19) are slidably connected to the inside of the moving groove (18) and are threadedly sleeved on both ends of the bidirectional screw (10).
4. The potting machine for electronic component packaging according to claim 2, characterized in that: The length of the drying device (15) is greater than the length of the placement frame (9).
5. The potting machine for electronic component packaging according to claim 1, characterized in that: The width of the lifting plate (7) is less than the width of the L-shaped support frame (5), and the width of the drying device (15) is equal to the width of the support plate (16).
6. The potting machine for electronic component packaging according to claim 3, characterized in that: The top surface of the clamping plate (14) is lower than the top surface of the placement frame (9).